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*Trademarks property of respective companiesONEWIRE Confidential
ONEWIRECommunications, Inc.
Networking at 1st Meter™
Corporate Overview
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Introducing ONEWIRE Communications
• Launched October, 2001• Headquarters Portland, Oregon• Status Privately held• Financing Founders
• Business Silicon, software and board products
• Objective Provide solutions for 1st Meter
connectivity
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Introducing Ourselves
• Vikas Aditya – More than 12 years of proven industry experience in Network Interfaces,
switches and software solution– Director of SW Engineering for World Wide Packets (1+ year)– Manager/Technologist for Technology and Architecture Development –
Intel Network and Communications group (7+ years)
• Jing-Fan Zhang– More than 15 years of experience in silicon and ASIC design for
Networking and Communication systems– Team leader for system on a chip solution for World Wide Packets– ASIC Manager/Team Leader for Intel’s Gigabit and ADSL silicon design
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Introducing Ourselves
• Jie Ni– More than 12 years of experience in ASIC and System design – HW Engineering Manager and Chief Architect for Advance Component
Division of Intel Server Group– Team Leader/Architect for Intel Networking System Division
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Connectivity for 1st Meter
• ONEWIRE - One Architecture for– 10/100/1000 Ethernet, 1G/10G Ethernet and 1G/2G Fiber Channel– Server, desktop and mobile platform connectivity– Fabric for computing and communication systems
• Unique solution– Leverages expertise in analog and digital design, and software– Flexible to handle existing and new protocols, future proof– Highly integrated, cost effective
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What’s the Problem
PCI/PCI-X
USB2.0
ATA Local I/O
AGP
Hub Link
Processor Bus
CPUCPU
HDHD I/O BridgeI/O Bridge
Memory Bridge
Memory Bridge MemoryMemoryGraphicsGraphics
LANInterface
LANInterface
Storage HBA
Storage HBA
ClusterInterface
ClusterInterface
Processor and Memory bandwidths growing rapidly
Connectivity requirements increasing. 1G->10G, 2G FC
Bottleneck
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More about the problem
• Attempts to solve the problem– Use more wires (PCI-X) or different buses (HyperTransport, RapidIO)– Scale PCI using fabric from vendors such as StarGen and PLX– Offloading Protocol stacks into Network silicon (FC, TOE)
• Changing Dynamics– 3GIO (a high speed serial bus) proposed to replace PCI– Storage networks and IP/Ethernet networks are converging
• FC and Ethernet share the similar physical layer• ISCSI, IFCP protocols being implemented
– Ethernet is the de-facto interconnect technology • 1G to desktop and 10G in data center coming very soon
No general solution, each addressing a niche market segment, more expensive, and often proprietary
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Background on 3GIO
• Serial bus enabling high-speed connection between components– Offers increased bandwidth for emerging applications– Universal replacement for PCI
• Announced 8/3/2001 – Approved by PCI-SIG– Proposed by Intel – Endorsed by Compaq, Dell, IBM and Microsoft– Several companies rush to join the working group
• 3Com, 3DLabs, Adaptec, Agilent, Altera, AMD, ASUSTeK, ATI, Emulex, Foxconn, LSI Logic, Molex, NEC, NVIDIA, Phoenix, Radisys, SMSC, ServerWorks, SiS, Tektronix, TI and Xilinx
The technology has staying power, 10 years would be its minimum life, and you probably imagine it going well beyond that" Roger Tipley, PCI-SIG president
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Opportunity to ride a major transitionB
andw
idth
Time (Relative)
1Gbps
4Gbps
8Gbps
16Gbps
PCI to 3GIO transition
• Cost players (Asante, Dlink) not expected to keep up
• Bigger players (Intel, 3Com) likely to develop products but slow (reluctant) to cannibalize their cash cow businesses
EISA to PCI transition –
• Intel emerged as a strong player in the NIC market
• SMC, AMD, National and many small players suffered
32Gbps
64Gbps
3GIO 2.5Gbps x1 10Gbps x4
PCI-X 133Mhz/64bit 8Gb/s
PCI-X 66Mhz/64bit 4Gb/s
PCI 64bit 2Gb/s
EISA
ISA
PCI 32bit 1Gb/s
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The Opportunity
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2001 2005
Ultra Dense Servers (KU)(DataQuest 5/17/01)
0%
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60%
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100%
1999 2001
3U High 1U High
• Trend towards dense server is clear– Total rack mounted share as % of total servers increased from 6% to 37%– 3U servers share decreased from 62% in Q1’99 to 16% in Q1’01– 1U servers share increased from 2% to 40% for the same period– Ultra dense servers units to grow from 50K in 2001 to 2M in 2005 ($4.5B revenue)
Need for high performance in a low footprint/low power package.
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0
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10
15
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2001 2005
Appliance ServersRevenue ($B)
• Appliance Servers growing at a rapid 56% Year to Year growth rate– Revenues jump from $3.8B in 2001 to $31.4 in 2005– NAS (Network Attached Storage) accounts for 55% share of appliance servers in
2005
High throughput and flexible Network/Storage Interface needed.
NAS Appliances Share in 2005
Others45%
NAS55%
The Opportunity
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The Opportunity
• 1GE and 10GE drive bulk of revenue– Total 1GE adapter market expected to grow from $168M in 2001 to $1.7B in 2005
1GE at desktop and 10GE at servers offers a broad market potential
$0
$200
$400
$600
$800
$1,000
$1,200
$1,400
$1,600
$1,800
2001 2005
GE NIC TAM ($M)(Cahners Instat)
$-
$200,000
$400,000
$600,000
$800,000
$1,000,000
$1,200,000
$1,400,000
$1,600,000
$1,800,000
1999 2000 2001 2002 2003 2004
Sili
con
TA
M (
$K)
Silicon TAM (Dell’Oro)
10/100 Managed
1GE
10GE
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Market Segments
• Mid to high range ServersNext generation (10G), High Throughput, Low CPU overhead, Investment Protection
• Ultra-Dense (Blade) ServersSmall form factor, Low Power, High speed internal interconnect
• Business DesktopLow cost gigabit connectivity, High Performance
• Business MobileSmall form factor, Low Power
• Server AppliancesHigh Throughput, Low CPU overhead, Unique features
• Telecom/Network Systems1G/10G network interfaces, rugged connectors, high speed fabric interconnect
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Products
• 3GIO Port Logic IPRevenue and Partnerships
• 3GIO + 1G/10G Ethernet ControllerFlexible, High Performance, solution for Server market segment
• 3GIO + Wireless LAN ControllerLow Power and small form factor for wireless LAN adapter
• 3GIO + 1G/2G Fibre Channel ControllerHigh Performance solution for Fibre channel market segment
• 3GIO + 10/100/1G Ethernet ControllerSmall footprint, integrated product for desktop/mobile market segments
• 3GIO Switch siliconFor desktops/servers and communication chassis markets
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ONEWIRE Network Interface
Packet Processor and Data Mover
Packet Processor and Data Mover
3GIO Port Logic(Multiple Ports)
3GIO Port Logic(Multiple Ports)
Intelligent Packet Processor and Data Mover Logic
Supports multiple logical flows
Same Architecture blueprint leveraged across multiple products
Flexible Wire Interface(10/100/1000)(1G/10G/FC)
Flexible Wire Interface(10/100/1000)(1G/10G/FC)
BufferBuffer BufferBuffer
SERDESSERDESSERDESSERDES
Multi-Port 3GIO Port Logic
Flexible Network Interface
Integrated SERDES
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ONEWIRE Switch Silicon
Packet Processor and Data Mover
Packet Processor and Data Mover
3GIO Port Logic(Multiple Ports)
3GIO Port Logic(Multiple Ports)
Intelligent Packet Processor and Data Mover Logic
Supports multiple logical flowsBufferBuffer
Multi-Port 3GIO Port Logic
Integrated SERDESSERDESSERDES
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ONEWIRE Software
NDIS interfaceNDIS interface
Device DriverDevice Driver
ApplicationsApplications
TCP/IPTCP/IP
Socket Service Provider
Socket Service Provider
LANInterface
LANInterface
Traditional Data Transfer
TDI interfaceTDI interface
SOCKETS interfaceSOCKETS interface
ONEWIRE Software
ONEWIRE Software
ONEWIRE Data Transfer
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ONEWIRE Solution for End Stations
PCISLOT
...SLOT
USB2.0
Local I/O
Processor Bus
CPU Subsystem
I/O Subsystem
MemoryMemory
CPUCPU CPUCPU
Configurable LAN/Storage Interface
Configurable LAN/Storage Interface
Memory Bridge
Memory Bridge
GraphicsGraphics I/O BridgeI/O Bridge3GIO Switch
3GIO Switch
ONEWIRE - One Architecture
• Flexible, Standards based
• Future Proof
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ONEWIRE Solution for Communication Systems
Line Blade (1)Fabric
Blade(s)
Control Blade
Processor Bus
MemoryMemory
CPUCPU CPUCPU
3GIO Switch
3GIO Switch
Memory Bridge
Memory Bridge
LAN Interface
LAN Interface
LAN Interface
LAN Interface
3GIO Switch
3GIO Switch
3GIO Switch
3GIO Switch
LAN Interface
LAN Interface
LAN Interface
LAN Interface
3GIO Switch
3GIO Switch
3GIO Switch
3GIO Switch
Line Blade (N)
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Who will buy ONEWIRE solution
• Server OEMs– IBM, HP, Compaq, Dell etc.
• PC and Mobile Platform OEMs– IBM, Compaq, HP, Dell, Toshiba, Sony etc.
• Server and Network appliance vendors– Network Appliance, Cisco, Checkpoint etc.
• Ultra Dense server vendors– IBM, Compaq and many new players (RLX, Egenera) etc.
• Communication system vendors– In SAN and Voice Gateway space
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Why will they buy ONEWIRE solution
• Industry focus is shifting towards serial interconnects for several reasons– Low pin count – Smaller board space– Low power– High Performance
• ONEWIRE solution provides– High levels of integration – analog/digital– Complete optimized solution with best in class software– Time to market
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Why will we win
• Right Timing– 3GIO based products expected in later 2003– We expect to tape out in fall 2002 coinciding with 3GIO specification release
giving us a market leadership position• Right Team with relevant expertise and experience
– Solid experience with Ethernet, LAN controllers, PCI and switching– Solid experience in building teams and delivering winning products
• Right Location– Strong connections with Intel product and lab groups
• Right Focus– Focused team skilled at solving this problem
• Right Strategy– We are addressing a broad market that already exists– We plan to partner with right manufacturing vendors– We plan to target a few but large design wins by focusing on key customers
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Competition
• Legacy Bus architectures– PCI and PCI-X
• Alternative Bus architectures– HyperTransport, RapidIO, StarGen
• Incumbents– Intel – Market leader in Ethernet NIC space– Broadcom – Aggressively pursuing Ethernet NIC market– Qlogic, Emulex – Market leaders in FC and SAN space
• Other emerging startups
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Where are we so far
• Engineering– Completed design of critical blocks– Finishing up rough area requirements for silicon– C level simulation started
• Business– Market data collected indicating that there is a broad market potential– Feature level requirement definition started
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Financial Plan
• Seed Money (Target November’01)– Will allow us to demonstrate our design - Simulation model of silicon
and working Software stack– Engage with early customers and fine tune the business model
• Series A (Target June’02)– Will allow early manufacturing of silicon and boards– Put a working product in customer hands and go for design wins
• Series B (Target March’03)– Ramp up volume manufacturing
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Seed Money Requirements
• Seeking $2M Seed financing
• Expected to allow ONEWIRE to hire additional talent, procure tools and working space and demonstrate a working design in Q2’02
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Backup
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Motivation for a new Serial bus
• I/O bus hasn’t kept up to date with increase in processor speeds and Network speed– Processor subsystems going to 2Ghz and beyond– Networks scaling to 1Gbps for desktop and 10Gbps for servers
• Requirements for I/O bandwidth are increasing– Network speed– Disk speed and Video bandwidth
• Many point solution in place to solve a single set of problem– AGP, S-ATA, LPC, PCI-X
• Serial interconnect within system is the solution– Concept already validated by many activities such as HyperTransport, StarGen,
PLX, even switched Ethernet• 3GIO to bring a single/common solution around which industry is
converging– Strong PCI roots– SW investment protected
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Key Goals for 3GIO
• Goals:– Broadly adopted industry solution
• Spanning multiple segments: Desktop, Mobile, Server, Workstation, embedded and Communications
• Chip-to-chip, board-to-board (plug-in adapters), docking• Industry leading performance and price/performance
– Enable first product introductions in 2H ’03• Provide Evolutionary path to future• Boot/run Windows* XP* without any changes
• Non Goals:– Coherent interconnect for processors– Memory interconnect– Cable interconnect for cluster solutions
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Key Requirements
• Low cost, high volume– Cost at or below PCI cost structure at system level
• Supports multiple market segments– Unifying I/O interconnect technology for Desktop, Mobile, Server, Communication
platforms, Workstations and Embedded
• PCI compatible software model– Boot Operating Systems, Configuration/Device Driver Interfaces
• Advanced Features– Power management, QoS, Hot Attach/Detach, RAS
• Performance– Scalable performance– High Bandwidth/pin, Low overhead and Low latency