talimrojgar.gujarat.gov.intalimrojgar.gujarat.gov.in/2014/pdf/26dec2019043227pm.pdf1...

1

INDUSTRIAL TRAINING INSTITUTE, ......................................... F: TRG: 07

LIST OF DEMONSTRATIONTRADE: ELECTRONIC MECHENIC NAME OF S.I.:SEMESTER NO. 3 SYLLABUS YEAR: 2017 (NSQF)

SR.NO. NAME OF DEMODEMONSTRATION TIME

(MIN.)

SY.WEEKNO.

ACTUALWEEKNO.

1 Identify the different front panel of a DSO.

2Measure the Amplitude, Frequency and time period oftypical electronic signals using DSO.

3Take a print of signal from DSO by connecting it to aprinter.

4 Construct and test function generator using IC 8038.

5Identification of 2,3,4 terminal SMD ( SurfacemountedDevice ) Cpmponent.

6 Solder the SMD components in the PCB.7 De solder the SMD components from the given PCB.8 Check for the cold continuity for PCB.9 Identification of broken tracks on printed wired assembly.

10Identify various connections and the set up required forSMD soldering station.

11Identification of crimping tools for various IC packages &perform baking & preheating.

12Make the necessary settings on SMD soldering station tode solder various ICs of different packages by choosingproper clamping tools.

13Make the necessary settings on SMD soldering station tosolder various ICs of different packages by choosingproper clamping tools.

14Checked and repair PCB single, double layer, andimportant tests for PCB.

15 Rework Of PCB.16 Perform replacement of coating.17 Repair damage pad.18 Identify different types of fuses along with fuse holder.19 Connection and testing of MCBs.20 Connection and testing of ELCBs.21 Measure the coil winding resistance of the given motor.

22Prepare the setup & control an induction motor using DOLStarter.

23Construct a direction control circuit to change direction ofan induction motor.

24Connect an overload relay and test for its properfunctioning.

25 Identification of various types of cables.

2

SR.NO. NAME OF DEMODEMONSTRATION TIME

(MIN.)

SY.WEEKNO.

ACTUALWEEKNO.

26 Identify suitable connectors, solder/crimp/terminate.27 Test the cable sets and continuity.

28Identify and select various connector and cable inside theCPU cabinet of PC.

29Identify cable and connector to connect a computer witha network switch.

30Modulation and Demodulation of various signals usingAM & FM on the trainer kit.

31Construct and test IC based AM Receiver, FM transmitter,FM receiver.

32Construct and test IC based AM & test transmitter, FMreceiver.

33Construct and test IC based AM transmitter and test thetransmitter power. Calculate the modulation index.

34Dismantle the given FM Receiver set and identify differentstages.

35Modulate two signals using AM kit, draw the waveformand calculate percentage of modulation.

36Modulate and Demodulate a signal using PAM,PPM,PWMTechniques.

37 Identify ICs & their functions on Microcontroller kit.38 Identify the address range of RAM & ROM.

39Measure the crystal frequency, connect it to thecontroller.

40 Identify the port pins of the controller.

41Use 8051 microcontroller, connect LED to the port, blinkthe LED with a switch.

42 Perform interface of 18*2 LCD with 8051 microcontroller

43Identify sensors used in process industries such as RTDs,Temperature Ics ,Thermocouples ,proximity switches, loadcells, strain gauge, LVDT.

44Measure temperature of a lit fire using a Thermocoupleand record the readings referring to data chart.

45Measure temperature of a lit fire using a thermocouple,RTD and record the readings referring to data chart.

46Measure the DC voltage of a LDTV. Detect differentobjectives using capacitive, inductive and photoelectricproximity sensor.

47Detect different objectives using capacitive, inductive andphotoelectric proximity sensors.

48 Construct and test the Laptop Protector.49 Construct and test the Dancing LEDs circuit.

3

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

: 1 :1

: 5 Hrs. . . :

: Identify the different front panel of a DSO

1.

1:1 : : 1:1:1 Able to identify the different panel of DSO.

1:2 / :1:2:1 DSO and related Probe

1:3 :

1:4 :1:4:1 Practical Book of Electronics Mechanic

2. / : :

2:1 ( ) ( ): We are going to study the most common equipment of electronicsmechanic lab DSO and working function of switches of its front panel.

2:2 : Work function of different switches on front panel of DSO.

3. / :

. /

1 Identification of different switches and their function of frontpanel of DSO.

DISPLAY AREA:1) Memory bar2)Trigger Position indicator3)Viewable Area4) Run/Stop indicator5)Trigger status6)Trigger level Indicator7) Channel Position Indicator8) Delay trigger Indicator9) Status display for channel 1&2

10) Sample rate status readout11) Horizontal status readout12) Trigger source and status readout13) Trigger type and mode readout14) Acquisition status15) Interface type Indicator

4

. /

16) Trigger Frequency Counter.VERTICAL CONTROLS:

1) Channel 1, 2 POSITION KNOBS.2) CH1 CH2 Menu Pushbuttons3) MATH Function Pushbutton4) VOLTS/DIV Knobs.

HORIZONTAL MENU:1) HORI Menu.2) Horizontal Position Knobs.3) TIME/DIV Knobs.

MISCELLANEOUS CONTROLS :

1) Acquire mode2) Display mode3) Utility function4) Program mode5) Cursor type6) VARIABLE Knob7) Measurement knob8) Auto set push button9) HARD COPY

10) RUN/STOP11) SAVE/RECALL12) ERASE13) HELP14) AUTO TEST/STOP

BNC INPUT:

1) CH1 CH2 BNC input2) Ground3) EXT TRIG

4. ( ): :

Knowledge of different switches on front panel of DSO and their working function.

5. / : :

Work function of different switches on front panel of DSO.

6. ( ) : :

To list out switches of front panel of DSO with their function.

7. : :

Measure the Amplitude ,Frequency and time period of typical electronic signals using DSO

5

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:2 :1

: 7 Hrs. . . :

: Measure the Amplitude ,Frequency and time period of typical electronic signals using DSO

1.

1:1 : : 1:1:1 Able to measure Amplitude of signal

1:1:2 Able to measure Frequency of signal 1:1:3 Able to measure Time period of signal 1:2 / :

1:2:1 DSO1:2:2 Prob

1:3 :


2. / : :

2:1 ( ) ( ): we have studied working function of switches of front panel of DSO.Now we will study to measure Amplitude, Frequency and time period of typical electronic signals using theseswitches of DSO.

2:2 : To measure Amplitude, Frequency and time period of typicalelectronic signals using switches of front panel of DSO.

3. / :

. /

1 Measure Amplitude, Frequency and Timeperiod.

1 Switch ON DSO.2 Rotate intensity control clockwise.3 After sometime you will see either a bright spot or a lineon screen.4 If you see none adjust X POS and Y POS controls to getdisplay in the center of the screen.5 To operate the INTEN and FOCUS controls and observethe effect on SPOT (OR LINE). Adjust them suitabley.6 To measure the voltage of the signal generator, adjustthe vertical amplifier sensitivity suitably.so as to get a largedisplay. Read on the calibratedgraticule,the vertical lengthof display.This corresponds to peak to peak value of thesignal.Multiply this length by sensitivity(in V/cm) Dividingthe result by 2 2 gives the RMS value of the signal

6

. /

voltage.Repeat the measurement procedure for two orthree other values of the output signal voltages.7 For measuring the frequency of the signal, feed theunknown signal to the Y input terminal. Take a standardsignal generator, and connect its output to the X INPUTterminals. Put the TIME BASE or HORIZONTAL AMPLIFIERknob at EXT position.8 Put the TIME BASE control at EXT Position.Adjust thevertical and horizontal amplifier gains so as to get anellipse of suitable size.

4. ( ): :

To measure Amplitude, Frequency and time period of typical electronic signals using switches of front panel of DSO.

5. / : :

To measure Amplitude, Frequency and time period of various typical electronic signals using switches of front panelof DSO.

6. ( ) : :

To draw different electronics signal sawing Amplitude, Frequency and Time period.

7. : :

Take a print of signal from DSO by connecting it to a printer.

7

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 3 : 1

: 6 Hrs. . . :

: Take a print of signal from DSO by connecting it to a printer

1.

1:1 : : 1:1:1 Able to print stored input signal.

1:2 / :1:2:1 DSO,Probe1:2:2 Printer

1:3 :

1:4 :1:4:1 Practical book of Electronics Mechanic.

2. / : :

2:1 ( ) ( ): We have studied to Store a portion of signal waveform using AUTOSTORE Function of DSO .Now we will study to take a print of stored signal from DSO.

2:2 : Take a print of signal from DSO by connecting it to a printer

3. / :

. /

1 Take a print of signal from DSO by connecting it to a printer

Switch ON DSO.- Rotate intensity control clockwise

After sometime you will see either a bright spot or aline on screen.If you see none adjust X POS and Y POS controls toget display in the center of the screen.To operate the INTEN and FOCUS controls andobserve the Effect on SPOT (OR LINE).Adjust them suitably.

Now using function generatorSelect appropriate signal.

- Now use AUTO STORE feature to store the inputsignal.Now connect PRINTER to DSO and take a print ofstored signal.

8

4. ( ): :

Take a print of signal from DSO by connecting it to a printer

5. / : :

To connect Printer with DSO and take a print of stored signal in DSO.

6. ( ) : :

Take a print of signal from DSO by connecting it to a printer

7. : :

Construct and test function generator using IC 8038.

9

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

: 4 : 1

: 7 Hrs. . . :

: Construct and test function generator using IC 8038

1.

1:1 : : 1:1:1 Able to Construct and test function generator using IC 8038

1:2 / :1:2:1 Precision Waveform Generator/ Voltage Controlled Oscillator

1:3 :1:3:1 Resistors size 1/4W 5% R1 2.2K, R2 10K, VR1 10K Single potentiometer

1:3:2 C1, IC1 IC8038, Socket IC, The Universal PCB Board1:4 :

1:4:1 Practical book of Electronics Mechanic.

2. / : :

2:1 ( ) ( ): We have studied to take a print of signal from DSO by connectingit to a printer. Now we will study to Construct and test function generator using IC 8038. 2:2 : Construct and test function generator using IC 8038

3. / :

. /

1) Construct and test function generator using IC 8038:This is a function generator circuit using IC number of IC8038.

Generate the waveform are Sine wave signal, the triangle, andsquare wave signals.

You can build this circuit onuniversal PCB board on Figure thewiring, and various components canview carefully for the polarity of theelectrolytic capacitors,potentiometer, resistors and Pin ofthe IC is not an error.

The output of IC1 If the waveformis not symmetrical

10

4. ( ): :

Construct and test function generator using IC 8038

5. / : :

As per circuit diagram, solder different components on PCB and make FUNCTION GENERATOR.

6. ( ) : :

To draw circuit diagram of FUNCTION GENERATOR and list out its application.

7. : :

Identification of 2,3,4 terminal SMD (Surface Mounted Device) Components

11

.......................... F: TRG : 08

: 2018(NSQF) : 3

: ETN :

: 5 : 2

: 5 Hrs. . . :

: Identification of 2,3,4 terminal SMD (Surface Mounted Device) Components

1.

1:1 : : 1:1:1 Able to identify SMD Components

1:2 / :1:2:1 Different SMD Components with 2,3,4 terminal

1:3 :1:3:1 Different SMD Components with 2,3,4 terminal


2. / : :

2:1 ( ) ( ): We are going to study different SMD Components with 2,3,4 terminal

2:2 : Identification of Different SMD Components with 2,3,4 terminal

3. / :

. /

1. Identification of Different SMD Components with 2,3,4 terminal:

S.NO. No. of terminals

Name of component

Application

Table-1

- Pick any one of the given SMD component and identify it. - Record your observation in the table-1. - Repeat the above step for remaining components. - Get the work checked by your instructor.

12

4. ( ): :

Knowledge of different SMD Components with 2,3,4 terminal

5. / : :

SMD Components with 2,3,4 terminals

6. ( ) : :

To list out SMD Components with 2,3,4 terminal

7. : :

Solder the SMD components in the PCB

13

.......................... F: TRG : 08

: 2018(NSQF) : 3

: ETN :

:6 :2

: 5 Hrs. . . :

: Solder the SMD components in the PCB

1.

1:1 : : 1:1:1 Able to Solder the SMD components in the PCB.

1:2 / :1:2:1 ESD mat or tabletop and ESD wrist strap1:2:2 Soldering work station ( temperature controller) 1:2:3 Soldering Work station ( hot air temperature/Flow controller)1:2:4 magnifier with lamp1:2:5 vacuum pen1:2:6 Tweezers with pointed (not flat) tips

1:3 :1:3:1 Solder flux pen/ liquid flux , Solder wick , IPA(Isopropyl alcohol), Cleaning brush1:3:2 Solder flux paste with lead1:3:3 Prototype SMD PCB suitable assemble SMD components1:3:4 SMD components

1:3:5 Flexible PCB tape1:4 :

1:4:1 Practical Book of Electronics Mechanic1:4:2

2. / : :

2:1 ( ) ( ): We are going to study how to Solder the SMD components in the PCB.

2:2 : Solder the SMD components in the PCB.

3. / :

. /

1. Identify the suitable SMD PCB for soldering. 1. Pick the SMD component using thevacuum pen.

2. Check the suitable of the componentpitch.

3. Place the component in the suitablepitch of the PCB.

4. Get the work checked by theinstructor.

14

. /

2. Soldering SMD Component using temperature controllersoldering work station.

1. Set the temperature of the solderingiron in the range of 250 280 C.

2. Apply the flux on the pads.3. Pick the SMD component using the

vacuum pen and place on the pad.4. Align the SMD component using

tweezers.5. Add a small drop of solder to the tip of

a soldering iron bit.6. Solder one terminal of SMD

component first.7. Check the alignment is correct through

the magnifier.8. If not re solder the terminal for the

proper alignment.9. Solder other terminals of SMD

component one by one, recheck thealignment.

10. Apply the liquid flux over all theterminals of SMD component.

11. Verify the solder joint using magnifierfor the perfect joints.

12. Clean the PCB using IPA and brush.13.Get the work checked by your

instructor.

4. ( ): :

Solder the SMD components in the PCB.

5. / : :

Solder the SMD components in the PCB.

6. ( ) : :

To list out method of Solder the SMD components in the PCB.

7. : :

De-solder the SMD components from the given PCB.

15

.......................... F: TRG : 08

: 2018(NSQF) : 3

: ETN :

: 7 :2

: 5 Hrs. . . :

: De solder the SMD components from the given PCB.

1.

1:1 : : 1:1:1 Able to De solder the SMD components from the given PCB.

1:2 / :1:2:1 ESD mat or tabletop and ESD wrist strap1:2:2 Soldering work station ( temperature controller)1:2:3 Soldering Work station ( hot air temperature/Flow controller)1:2:4 magnifier with lamp1:2:5 vacuum pen

1:3 :1:3:1 Solder flux pen/ liquid flux , Solder wick , IPA(Isopropyl alcohol), Cleaning brush1:3:2 Solder flux paste with lead1:3:3 Prototype SMD PCB suitable assemble SMD components1:3:4 SMD components


2. / : :

2:1 ( ) ( ): We are going to study how to De solder the SMD components from thegiven PCB

2:2 : De solder the SMD components from the given PCB

3. / :

. /

1.

2.

Identify the SMD component remove from printed circuitboard

De solder SMD component using soldering work station (soldering iron type)

1. Selected the damaged SMDcomponent the PCB board.2. Mask the kapton tapes on thother component.3. Check the it in proper maskingor not4. Get the work checked by theinstructor.

2.1. Apply flux all leads withsupplied syring.2. Take the solder iron at lowtemperature alloy the uniformly to

16

. /

3. Disordering of SMD component using soldering work stationusing hot air

1. all the pins.3. Lift chip or IC from the boardusing vacuum pen or TweezersUsing tweezers & vacuum pen.4. Removing the chip orcomponent or pad after some ofthe solder flux on pad.5. Remove the solder fluxsoldering wick .6. Clean the flux usingisopropanol, antistatic brush, andlint free tissue.7. Get the work checked by yourinstructor.

1. Selected the blower tip.2. Apply the solder flux over the SMDcomponent or chip.3. Apply the hot air to removing SMD chipor component.4. Slowly trying to remove the de solderedcomponent from the PCB using vacuumpen5. Removing SMD component usingvacuum pen or Tweezers6. Removing any excess solder rover thepads using de solder wick7. Clean the Solder pads using IPA.8. Pad is cleaned completely afterdisordering.9. Get the work checked by your instructor.

4. ( ): :

Knowledge of how to De solder the SMD components from the given PCB

5. / : :

De solder the SMD components from the given PCB

6. ( ) : :

To list out method of De solder the SMD components from the given PCB

7. : :

Check for the cold continuity for PCB

17

.......................... F: TRG : 08

: 2018(NSQF) : 3

: ETN :

: 8 :2

: 3 hrs. . . :

: Check for the cold continuity for PCB

1.

1:1 : : 1:1:1 Able to check the cold continuity for PCB.

1:2 / :1:2:1 Digital multimeter

1:3 :1:3:1 PCB


2. / : :

2:1 ( ) ( ): We are going to study how to check for the cold continuity for PCB.

2:2 : What is cold continuity for PCB.

3. / :

. /

1. Steps to check cold continuity of PCB: Take the PCB of which you want to test the continuity.

Map the traced tracks and corresponding electronic components soldered on them.

Turn the knob on the multimeter towards the continuity section

Testing leads should be connected to the multimeter in the same manner as shown in the image below.

Select the metallic path of which you want to check the continuity and placeone testing lead at the starting terminal

18

. /

and another at the other.

After placing the leads on their position the multimeter will produce a continuous beep sound indicating that track is continuous and there is no breakage in the track.

4. ( ): :

Knowledge of cold continuity for PCB.

5. / : :

Check the cold continuity for PCB.

6. ( ) : :

To list out method to check the cold continuity for PCB.

7. : :

Identification of broken tracks on printed wired assembly.

19

.......................... F: TRG : 08

: 2018(NSQF) :3

: ETN :

: 9 :2

:7 hrs. . . :

: Identification of broken tracks on printed wired assembly.

1.

1:1 : : 1:1:1 Able to Identification of broken tracks on printed wired assembly.

1:2 / :

1:3 :


2. / : :

2:1 ( ) ( ): We are going to study Identification of broken tracks on printed wired assembly.

2:2 : Identification of broken tracks on printed wired assembly.

3. / :

. /

1. How to Identify broken tracks on printed wired assembly?

A traditional method assessing reliability has been to use electrical continuity test measurement, which provides a technique in which a large number of joints can be measured.

However the technique is depends on complete electrical failure accruing before any defect is registered, Which can be a severe disadvantage when 200-5000 may be required to reach a failure. A method based on shear testing for the evolution of accelerated thermal cycling is one that has been used recently for reliability assessment and lifetime prediction. In this best practice guide the use of both electrical continuity testing and shear strength measurements are recommended.

20

4. ( ): :

Knowledge of Identification of broken tracks on printed wired assembly

5. / : :

Identify broken tracks on printed wired assembly

6. ( ) : :

To list out methods to Identify of broken tracks on printed wired assembly

7. : :

Identify various connections and the set up required for SMD soldering station

21

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:10 : 3

: 5 hrs. . . :

: Identify various connections and the set up required for SMD soldering station

1.

1:1 : : 1:1:1 Able to identify various connections of SMD Soldering. 1:1:2 Able to set up various connections of SMD Soldering. 1:2 / : 1:2:1 SMD soldering iron 1:2:2 solder, soldering stand1:3 :


2. / : :

2:1 ( ) ( ):We are going to study Identify various connections and the set up requiredfor SMD soldering station

2:2 : identify various connections of SMD Soldering and set up variousconnections of SMD Soldering.

3. / :

. /

1) Identify various connections of SMD Soldering:The general shape of some common SMDs areshown in Table .Note that many components arenot routinely labeled. This is why the SMD testtweezers are so useful.

22

. /

2) Set up various connections of SMD Soldering:One of the simplest ways to solder SMDs is tofirst glue the components in position on a PCboard, then solder the connections. Theprocedure is:

Clean the copper side of the board with anonconductive abrasive pad until it is shinny.Wipe off any residue with a tissue and denaturedalcohol.

Glue the components into position usingDuco cement. Apply the cement to the end of atoothpick, and then use the toothpick to apply adrop of cement to the circuit board. Do not getany glue on the pads or any place where youwant the solder to flow.

Using self locking tweezers, position thecomponents on the board. Let the adhesive dry.

Gently nudge the components sidewayswith a toothpick. If the component moves, trygluing it again.

Apply RMA type paste flux to thecomponent terminals and pads using a toothpick.Apply the flux where you want solder to flow. Thefunction of the flux is to conduct heat from thesoldering tip uniformly to the pad andcomponent. The flux also removes surface oxides,which can prevent solder wetting.

Touch the soldering tip TO THE PAD. Don’tapply heat directly to the component

Apply small diameter 63/37 solder(0.020" works well) to the pad adjacent to thecomponent terminal. The solder will flow to thecomponent and will form a fillet between thecomponent and pad.

Let the solder cool and remove the fluxwith denatured alcohol. Inspect with a 4xwatchmakers loupe or magnifying glass. Thesolder joint should be a concave fillet, bright andmirror smooth with no pits as shown in Figure.

4. ( ): :

Identify various connections and the set up required for SMD soldering station

5. / : :

To Identify various connections and the set up required for SMD soldering station

6. ( ) : :

List out various connection for SMD Soldering.

7. : :

Identification of crimping tools for various IC packages

23

.......................... F: TRG : 08

: 2017 (NSQF) : 3

: ETN :

: 11 : 3

: 8 hrs. . . :

: Identification of crimping tools for various IC packages

1.

1:1 : : 1:1:1 IC

.

1:1:2 IC .

1:1:3 .

1:1:4 Able to Identify of crimping tools for various IC packages

1:2 / : ( )

1:2:1 .RJ45(6-PIN) AND RJ 45(8-PIN)CRIMPING TOOLS 2. station,wire stepper

3. ,

4.tweezer bent trip,PCB holder

1:3 :

1:3:1 ( wrap 3 , )

1:3:2 ,

1:4 :1:4:1 Practical book of Electronics Mechanic.1:4:2

2. / : :

2:1 ( ) ( ): station .

2:2 : , IC

.

24

3. / :

. /

1) Identification of different crimping tools for various ICPackages:1. IC IC PCB ,

IC .

2. IC ,

IC

3. stripper cutter

(15 )

4. (LIQUID)

.

5.

.

6. heat

.

7. ic

(REPEAT) .

8. .

IC

PCB

S.M.D.

CRIMPING .

4. ( ): :

,

pcb ic

5. / : :

1. .

2. IC .

3.

6. ( ) : :

1. PCB .

7. : :

Make the necessary settings on SMD soldering station to de-solder various ICs of different packages by

choosing proper clamping tools

25

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 12 : 4

: 15 hrs. . . :

: Make the necessary settings on SMD soldering station to de-solder various ICs of different

packages by choosing proper clamping tools

1.

1:1 : : 1:1:1 Able to de solder various ICs by SMD Soldering station.

1:2 / :1:2:1 SMD Soldering station1:2:2 clamping tools

1:3 :


2. / : :

2:1 ( ) ( ): We have studied about different crimping tools and now we will studyabout de soldering of different ICs.

2:2 : we will study how to de solder di erent ICs using climping tools

and SMD Soldering sto on.

3. / :

. /

1) De solder various ICs of different packages by choosing properclamping tools :

SMD ICs can be divided in a few groups considering the way theycan be de soldered. One group is the ICs with J leads. These are the ICsthat have leads formed like letter J, going from the side of IC andbended all the way down to the underside of an IC. It is difficult to desolder these ICs without special equipment (hot air gun). You can try tode solder these by cleaning as much solder as possible from the pads.First add some fresh solder to all the pins. This will help by making thesolder more fluid and easier to suck in by de soldering wick. Now take ade soldering wick and try to clean as much solder as you can. Do it intwo passes. First clean all the pins off of the excess solder that you'vejust added, and then do a second pass with a clean wick trying to suck inas much solder as possible. If you put the wick side wise to the pins, itwill do a better job. The second group of ICs would be ball grid array ICs(BGA), the ones with pins like halves of a ball protruding all over theunderside of an IC. Even more bad news. No way you'll de solder thesewith simple tools.

26

. /

One kind of these is the ICs in SOIC packages, the ones which haveleads on two sides. These ICs can be glued or not glued to the PCB. Ifthey aren't glued then it's an easy job. Add excess solder to all the pinson one side of the IC, making them all connected together by a blob ofsolder, heat the solder with soldering iron until all the solder is meltedand fluid (you can move the soldering iron from first to the last pin andback a few times in one smooth move to make sure all the solder ismelted) and then lift that side of the IC off the board (use a smallscrewdriver wedged between IC and the PCB). Remove excess solder bysoldering wick, freeing all the pins on that side of any remaining solder,and then do the same thing to the other side of the IC. Now you canclean the bridges between pins with de soldering wick. The best methodis not to put the wick over the leads and then heat the wick, but to putthe wick on the table (well, not directly because you'll ruin the table),put the iron tip on the wick to heat it up and then touch the front (cut)side of the wick with IC pins. If the IC is glued to the PCB, you'll have tolift the pins one by one with a needle. First use de soldering wick on theleads of the IC to suck up as much solder as you can. Then take a needleand stick it between two pins, heat up a pin with soldering iron andbend it up, away from the pad, with a needle. Do this for the rest of thepins on that side of the IC. On some pins there could be solder left whichwill still form a bridge between the pin and the pad, even though the pinis lifted away from the pad. Use de soldering wick on these again tobreak the bridge. Then, when you're finished, you will be left with all thepins free, and just the glue holding the IC to the board. Break the glue bytaking the IC with tweezers and twist it until the glue gives in, or use asmall flat screwdriver, stick it under the IC and lift the IC up. Take carenot to cut the traces on the PCB.

The ICs in quad flat packages, the ones with leads on all four sidesof the IC are done the same way. First do two opposite sides of the IC byraising pins one by one and then the other two opposite sides you cando by flooding the pins with solder and lifting one side of the IC andthen do the same to the opposite side.

There is another method. Take a thin wire and thread it betweenthe IC casing and the IC leads on one side of the IC, tie one side of thewire to a suitable stronger component on the PCB, take the other side ofthe wire and pull it at a slight angle away from the IC while heating theleads at the same time, so that the wire will go through the meltedsolder between the leads and the pads, raising the leads off the board.This might be much faster, but the risk of lifting the traces off the PCB isquite big and I wouldn't really recommend that method.

4. ( ): :

To make the necessary settings on SMD soldering station to de solder various ICs of different packages by choosingproper clamping tools.

5. / : :

De soldering of various ICs by SMD Soldering station.

6. ( ) : :

List out different de soldering methods for various ICs.7. : :

Make the necessary settings on SMD soldering station to solder various ICs of different packages by choosing properclamping tools

27

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN

:

: 13 :4

: 15 hrs. . . :

: Make the necessary settings on SMD soldering station to solder various ICs of different packages by

choosing proper clamping tools

1.

1:1 : : 1:1:1 Able to soldering of different ICs using SMD Soldering station.

1:2 / :1:2:1 SMD Soldering station.1:2:2 Different clamping tools

1:3 :1:3:1 Solder, clean wipes1:3:2 Flux, PCB


2. / : :

2:1 ( ) ( ): We have studied De Soldering of different ICs using clamping tools bySMD soldering station. Now we will study soldering of different ICs by SMD Soldering station.2:2 : We will study soldering of di erent ICs by SMD Soldering sta onusing diferent clamping tools.

3. / :

. /

1) To solder various ICs of different packages bychoosing proper clamping tools :

Keeping the component in place is the mainproblem when soldering SMD components. Also,preparing the pads is almost as important as thesoldering. To prepare the pads you should tin themwith a fine, thin film of solder. Too much solder onpads when soldering fine pitched ICs will also makeshorts between pins.

With a little practice you will be able to controlhow much solder will be left on pads after using the desoldering wick. The right thickness of solder film can bejudged by the color. You should make it as thin as

Surface mount technology (SMT) is a method forproducing electronic circuits in which thecomponents are mounted or placed directly ontothe surface of printed circuit boards (PCBs). Anelectronic device so made is called a surfacemount device (SMD).

28

possible, but its color should be silvery.

. /

Soldering an IC, you should position thecomponent on the pads so that all pins and pads lineup. Then, holding the component in place, solder twoopposite pins of the IC, to keep the IC in place whileyou are soldering the other pins. Now, there are twoways to solder an IC. You can solder pins one by one,and use a de soldering wick to correct eventual shortsbetween pins. But this is very time consuming, andwith ICs with smaller pitch you'll end up using moretime to fix the solder bridges than to actually solderthe pins. Another method and much faster, is to floodall the pins with solder and then pick up any excesssolder with de soldering wick. Again, this requiressome practice until you will be able to leave justenough solder after sucking it up to keep the pinsoldered, but not too much as to leave bridges. This isbest accomplished by moving the wick with solderingiron tip over the pins quickly, and not resting the wickon the pins and waiting, as that would almost certainlypick up too much of the solder, leaving the joints dry.This is a really quick way to solder ICs, as you cansolder a hundred pin IC in less than a minute!

4. ( ): :

To solder various ICs of different packages by choosing proper clamping tools

5. / : :

Knowledge of different tools required for solder various ICs of different packages

6. ( ) : :

List out steps for solder various ICs of different packages And also tools used for it

7. : :

Checked and repair PCB single, double layer, and important tests for PCB.

29

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

: 14 :5

:12 hrs. . . :

: Checked and repair PCB single, double layer, and important tests for PCB.

1.

1:1 : : 1:1:1 Able to checked and repair PCB single and double layer.

1:2 / :1:2:1 Magnifying glass with lamp.1:2:2 Soldering iron.1:2:3 Knives.1:2:4 Tweezers.1:2:5 ESD safe surfaces.1:2:6 Defective SMD PCB with broken track.

1:3 :1:3:1 Cleaning solvent(IAP)1:3:2 Flux1:3:3 Solder1:3:4 Wipes


2. / : :

2:1 ( ) ( ): We are going to study how to checked and repair PCB single, doublelayer.

2:2 : check and repair PCB single, double layer.

3. / :

. /

1. Identify the broken track on PCB using magnifyingglass.

Use a jeweler’s flat head screw driver and gently scrapboth sides of the break until the bare copper visible.

Melt a blob of solder using soldering iron to tin thebare copper track.

Remove any excess lead on the track. Now you can seethe tinned track.

30

. /

Take a multi strand wire. In that tin only one singlestrand wire.

Cut the required length of tinned wire.

Place the tinned wire on the top of break carefullyusing tweezers.

Keep the soldering iron with the blob of solder for fewsecond to solder it.

Clean the surface using cleaning solvent and get thework checked by your instructor.

4. ( ): :

Checked and repair PCB single, double layer.

5. / : :

Checked and repair PCB single, double layer.

6. ( ) : :

List out how to checked and repair PCB single, double layer.

7. : :

Rework Of PCB.

31

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

: 15 :5

: 8 hrs. . . :

: Rework Of PCB

1.

1:1 : : 1:1:1 Able to Rework Of PCB’s

1:2 / : 1:2:1 Soldering iron1:2:2 Magnifier or magnifying glasses with lamp1:2:3 safety glass1:2:4 Vacuum de soldering Tool1:2:5 Tweezers1:2:6 ESD safe surface1:2:7 ESD wrist strap

1:3 : 1:3:1 Cleaning Solution (IPA)1:3:2 Flux and solder1:3:3 Cleaning cloth1:3:4 Solder wick


2. / : :

2:1 ( ) ( ): We are going to study Rework Of PCB’s For Through Hole & surfaceMount soldered joints

2:2 : Rework Of PCB’s For Through Hole & surface Mount soldered joints

3. / :

. /

1. Removal of through hole solder joint using vacuumde soldering tool:

1. Collect the defective SMD board from theinstructor and indentify the component to beremoved.

2. Inspect the size of the solder joints on thecomponent to be removed using magnifyingglass.

3. If the sizes of the solder joints are minimal,apply additional solder to form an excess solderjoint.

32

. /

4. Apply a small amount of flux to the solderjoints of the component to be removed.

5. Take a vacuum de soldering tool and align thede solder tip with a component lead end andlightly make contact with the solder joint.

6. Keep the decoder tip off the pad by allowing itto slide around on a film of solder.

7. After solder has melted, start a rotating oroscillating motion with de solder tip. Continuethe rotating motion until a change in the feel ofthe rotating motion occurs.

8. When the solder in the solder joint iscompletely molten. Immediately active thevacuum, extracting the solder from the solderjoint.

9. After the solder has been extracted from thesolder joint remove the de solder tip from thecomponent lead.

10. Maintain continuous vacuum for a fewsecond to clear the de solder tip.

11. Use a Flat nose pliers to gently rotate thelead laterally break any remaining solder joints.

12. De solder each of the remaining componentleads individually using a skipping method toreduce thermal buildup at adjacent hole location.

4. ( ): :

Rework Of PCB’s For Through Hole & surface Mount soldered joints

5. / : :

Rework Of PCB’s For Through Hole & surface Mount soldered joints

6. ( ) : :

To list out method of Rework Of PCB’s For Through Hole & surface Mount soldered joints

7. : :

Perform replacement of coating.

33

.......................... F: TRG : 08

: 2018(NSQF) :3

: ETN :

: 16 :5

: 16 hrs. . . :

: Perform replacement of coating.

1.

1:1 : : 1:1:1 Able to perform replacement of coating.

1:2 / : 1:2:1 Cleaning brushes 1:2:2 Gloves 1:2:3 Knife with 16 blades 1:2:4 Scraper 1:2: Hot air gun 1:2:6 ESD safe surface 1:2:7 ESD wrist strap 1:3 : 1:3:1 Cleaning solvent 1:3:2 Marker pen 1:3:3 General PCB or SMD 1:3:4 Cleaning wipes 1:3:5 High temperature tape (50 mm * 100 ft kapton tap) 1:4 :

1:4:1 Practical Book of Electronics Mechanic

2. / : :

2:1 ( ) ( ): We are going to study how to perform replacement of coating.

2:2 : Perform replacement of coating.

3. / :

. /

1. Local spot Removal 1. Mark a outline for a coating removalarea by using a sketch or marker pen.2. Apply high temperature tape tooutline the area where coating to beremoved.3. Dip the end of a form swab instripping solution and apply a smallamount of the solution on the coating tobe removed.4. Rub the solution applied surfacecarefully with a brush or wood stick toremove the coating.5. Clean the stripped area using leaningsolvent.

34

. /

2. Coating Removal by peeling method1. Mark as outline for a coating removal area.2. Slit and peel off the coating material with adull knife or heated dull blade3.Repeat the same until all the coating materialremoved4. Clean the stripped area using cleaning solventand cleaning wipes5. Get the work checked by instructor.

4. ( ): :

Perform replacement of coating

5. / : :

Perform replacement of coating

6. ( ) : :

To list out switches both methods of Perform replacement of coating.

7. : :

Repair damage pad.

35

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

:17 :6

: 6hrs. . . :

: Repair Damage Pad.

1.

1:1 : : 1:1:1 Able to Repair damage pad.

1:2 / :1:2:1 Magnifying glass with lamp1:2:2 Soldering iron1:2:3 knife1:2:4 c clamp1:2:5 Tweezers1:2:6 Wipes1:2:7 Repair kit with bonding tip , bonding system1:2:8 ESD safe surface & ESD wrist band1:2:9 small C – clamp or G – clamp1:2:10 Dental pick1:2:11 Circuit frame ( new conductor pad )1:2:12 Cleaning brushes1:2:13 Adhesive bonding

1:3 :1:3:1 Flux1:3:2 cleaning solvent (IAP)1:3:3 Solder1:3:4 Kapton Tape


2. / : :

2:1 ( ) ( ): We are going to study how to Repair damage pad.

2:2 : Repair damage pad.

3. / :

. /

1. Repair damage pad: 1. Pick one SD board with damaged pads.2. Identify the damaged pad.3. Clean the damaged area with cleaningsolvent by using brush and wipe it gently.4. Carefully cut away the damaged padusing knife.

36

. /

5. Clean the damaged area in and aroundthe pad remove any burned laminationfrom the area.6. Carefully removed the solder mask fromconnecting track using a dental pick.7. Clean the damaged area using cleaningsolvent and dry it using wipes.8. Tin the connection track, indicated.9. Selected the new pad of correct sizefrom the circuit frame .10. Cut out with sharp small knife.11. Tin the connecting track on the boardsurface using flux and solder. The length ofthe overlap solder connection should beminimum two times of the conductorwidth.11. Mix Epoxy bond.12. Place the new pad in right position onthe circuit board surface. Bond the newpad to the PCB. Cure it in open air.13. Solder the ReplacementPad/connecting track to the existingconductor.14. Place a piece of kapton Tape over thetop surface of the new pad for extramechanical strength.15. Use C – clamp to hold the replacementpad/connecting track until it is firmlyattached.16. Remove the clamp. Clean withisopropyl alcohol and the get workinspected by your instructor.

4. ( ): :

Knowledge of how to Repair damage pad.

5. / : :

To Repair damage pad.

6. ( ) : :

List out method to Repair damage pad.

7. : :

Identify different types of fuses along with fuse holder.

37

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 18 : 7

: 9 hrs. . . :

: Identify different types of fuses along with fuse holder

1.

1:1 : :

1:1:1 Able to identify different types of fuses1:1:2 Able to identify different types of fuse holders

1:2 / :1:2:1 different fuse and its holders

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied PCB Rework, now we will study different types of fusesalong with fuse holder

2:2 : different fuse and its holders

3. / : 300

.

Types of Fuses and Their HoldersFuses come in several different form factors, each of which requires its ownholder. The most important aspects of a holder are how well it holds the fuseand the quality of the connection to the wiring. A poor connection can actuallydamage the wires.

Cylindrical FusesCylindrical fuses are the traditional glass fuses, and they are very common inolder vehicle installations. The most common cylindrical fuses are the AG or "AllGlass" fuses, particularly the AGC and AGU sizes. AGC fuses can normallyhandle up to 30 or 35 amperes of current maximum, while the larger AGU fusesare capable of dealing with up to 60 amperes of current. These fuses are oftenfound in older American vehicles.

Cylindrical Fuse HoldersThere are two basic types of inline fuse holders for cylindrical fuses, mostly forAGU size fuses. They are the open kind where the fuse is simply snapped intoplace and the sealed type where the entire fuse is enclosed in a normallywatertight casing. While the fully sealed units may appear better, the open clipunits usually provide better results. The problem with the sealed units is thatthey are not only watertight, but they can also be heat tight. The ends of AGUfuses tend to get hot, and sealed holders only magnify the problem, increasingthe likelihood the fuse will fail.

Cylindrical Fuses and itsHolders

38

.

Blade Type FusesMost modern vehicles use blade fuses. These small fuses are made of coloredplastic and have a clearly visible fusible link. These fuses do not normally gethot and can be placed in sealed units without much of an issue. They come in avariety of sizes and have different names depending on the size, but they allwork in a similar fashion. Depending on the size these fuses, can rangeanywhere from about 5 amperes, all the way to 80 amperes on some of theMAXI fuse.

Blade Type Fuse HoldersBlade fuse holders can be either sealed or unsealed. In most cases, thesealed models are preferable as they provide pressure to hold the fusefirmly in place and lower the resistance. Some of the sealed units havetops that simply clip on, while others use screws to ensure a solidconnection. Other fuse holders use simple spring clips to hold the fusein place. These holders do not provide as good a connection, but theywork fairly well in situations where the fuse rating is notably higher thanthe average draw.

ANL FusesThe ANL fuse is commonly used for high power car stereo applications. Thesefuses typically range from 35 amperes all the way to 750 amperes, providingmore than enough current capacity for most high end stereos and significantlymore than most competing fuse types. Unlike the other types mentioned ANLfuses are generally bolted into place rather than relying on friction. Thisprovides a much better connection and helps ensure safe operation at thehigher current draws that ANL fuses generally operate under. One factor toconsider is that unlike smaller fuses, it is not always immediately obvious onvisual inspection when the fuse has blown as there is no window that providesa clear view of the fusible link. Some ANL fuses use LEDs that light up when thefuse blows, providing a clear visible cue that way.

ANL Fuse HoldersMost ANL fuse holders are relatively simple; they are basically a block tobolt the fuse to. There are some more complex types with built interminals, but for the most part they use ring terminals around the boltsto provide a solid connection.

Attaching Wires to Car Audio Fuse HoldersOne thing that all inline fuse holders have in common, regardless of the kind offuse that is used, is that they need to include some way of connecting thepower wire to the fuse holder. With ANL fuse holders, this can be less of anissue, as ring terminals on the wires provide an excellent connection to the fuseby way of the bolts that hold it in place, but other holders may require differentmethods of attachment.

Set ScrewOne of the simplest methods of attachment is with a set screw. The wire isinserted into the terminal and then a screw is tightened down to hold it inplace. In many cases, these use a bushing to hold a smaller wire and then thescrew is tightened down, applying pressure that keeps everything together. Theproblem with this system is that it often adds extra layers of resistance, whichcan lead to additional heat; and heat is the last thing anyone wants whendealing with electrical components.

Blade Type Fuses and itsHolders

ANL Type Fuses and itsHolders

39

4. ( ): :

Identify different types of fuses along with fuse holder

5. / : :

Identify different types of fuses along with fuse holder

6. ( ) : :

To prepare MCQ for this topic.

7. : :

Connection and testing of MCBs.

41

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 19 : 7

: 8hrs . . :

: Connection and testing of MCBs.

1.

1:1 : :1:1:1 Able Connect and test MCBs.1:1:2

1:2 / :1:2:1 MCBs

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied about fuse and their holders, now we will study aboutConnection and testing of MCBs.

2:2 : 1) Connection and testing of MCBs.

3. / : 300

.

1) Connection of MCBs:

1. Isolate the electrical supply from the consumer unit.

2. Remove the front cover, by turning the two fasteners 90 degrees.

3. Fully slacken the lower terminal of the device.

4. Fully open the bottom device clip

5. Locate the device onto the din rail, and busbar. Ensure that the busbar tooth iswithin the device terminal cage.

6. Close the bottom device clip.

7. While holding the device firmly onto the busbar, fully tighten the lower terminalscrew.

8. After fitting all outgoing devices and connecting all outgoing cables, please checkthe tightness of all cable connections. This should include all factory made connections,which may have loosened during installation ortransit.

42

.

2) Testing of MCBs:The following will provide you a guide to help you check your MCB.

Step 1: Initial ChecksFirst, make sure the MCB hasn't just tripped. If any one of the switches is in the OFF position,just turn it back to the ON position. If this solves the problem, the MCB works fine. If not, youhave to perform some more tests to see what the problem is.

Step 2: Checking for a Short CircuitSwitch the MCB completely to the OFF position, and then move it back to the ON position. If itdoesn't stay on or there is a humming sound when you switch it on, pull the wire out of the MCBand repeat. If this is the case, there is likely a problem with the wiring.

Step 3: Testing the PanelRemove the wire from the MCB. Test the active MCB with the Voltmeter. If there is voltage, theMCB works fine and your problem is with the MCB panel and you will probably have to replaceit. If there is no voltage, the problem probably lies in the MCB itself.

Step 4: Testing the MCB Using the Wiggin's TesterUse the Wiggin's Tester or a lightbult attached between the screw and a ground in the panel. Ifthe tester doesn't run, it means that the MCB is faulty and should be replaced.

Step 5: Testing the MCB by Changing WiringAnother way to test the MCB to see if it is bad is to move its wire to another

4. ( ): :


5. / : :


6. ( ) : :

List out steps of Connection and testing of MCBs.

7. : :

Connection and testing of ELCBS.

43

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 20 : 7

: 8hrs . . :

: Connection and testing of ELCBs.

1.

1:1 : : 1:1:1 Able Connect and test ELCBs.

1:2 / :1:2:1 ELCBs

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ):We have studied about Connection and testing of ELCBs, now we will study aboutConnection and testing of ELCBs.

2:2 : .Connection and testing of ELCBs.

3. / : 300

.

1) Connection ELCBs:8. Isolate the electrical supply from the consumer unit.2 Remove the front cover, by turning the two fasteners 90 degrees.3. Fully slacken the lower terminal of the device.4. Fully open the bottom device clip5. Locate the device onto the din rail, and busbar. Ensure that the busbar tooth is

within the device terminal cage.6. Close the bottom device clip.7. While holding the device firmly onto the busbar, fully tighten the lower terminal

screw.8. After fitting all outgoing devices and connecting all outgoing cables, please check

the tightness of all cable connections. This should include all factory madeconnections, which may have loosened during installation or transit.

44

.

2) Testing of ELCBs:The following will provide you a guide to help you check your ELCBs

Step 1: Initial ChecksFirst, make sure the ELCBs hasn't just tripped. If any one of the switches is in the OFF position,just turn it back to the ON position. If this solves the problem, the ELCB works fine. If not, youhave to perform some more tests to see what the problem is.

Step 2: Checking for a Short CircuitSwitch the ELCB completely to the OFF position, and then move it back to the ON position. If itdoesn't stay on or there is a humming sound when you switch it on, pull the wire out of theELCB and repeat. If this is the case, there is likely a problem with the wiring.

Step 3: Testing the PanelRemove the wire from the ELCB. Test the active ELCB with the Voltmeter. If there is voltage, theELCB works fine and your problem is with the ELCB panel and you will probably have to replaceit. If there is no voltage, the problem probably lies in the ELCB itself.

Step 4: Testing the ELCB Using the Wiggin's TesterUse the Wiggin's Tester or a lightbult attached between the screw and a ground in the panel. Ifthe tester doesn't run, it means that the ELCB is faulty and should be replaced.

Step 5: Testing the ELCB by Changing WiringAnother way to test the ELCB to see if it is bad is to move its wire to another

4. ( ): :

Connection and testing of ELCBs.

5. / : :

Connection and testing of ELCBs.

6. ( ) : :

List out steps of Connection and testing of ELCBs.

7. : :

Measure the coil winding resistance of the given motor

45

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 21 :

: . . :

: Measure the coil winding resistance of the given motor

1.

1:1 : :1:1:1 Able to Measure the coil winding resistance of the given motor

1:2 / :1:2:1 IR Testers (Megger)1:2:2 motor

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ):We have studied about fuses, MCB, ELCB, Now we will study about measuring thecoil winding resistance of the given motor

2:2 : Measure the coil winding resistance of the given motor

3. / : 300

.

1) Measure the coil winding resistance of the given motorThe measurement of insulation resistance is a common routine test performedon all types of electrical wires and cablesSelection of IR Testers (Megger):

Insulation testers with test voltage of 500, 1000, 2500 and 5000 V areavailable.

Meggers is equipped with three connections Line Terminal (L), EarthTerminal (E) and Guard Terminal (G).

Resistance is measured between the Line and Earth terminals, wherecurrent will travel through coil 1. The “Guard” terminal is provided for specialtesting situations where one resistance must be isolated from another. Let’sus check one situation where the insulation resistance is to be tested in a twowire cable.

To measure insulation resistance from a conductor to the outside of thecable, we need to connect the “Line” lead of the megger to one of theconductors and connect the “Earth” lead of the megger to a wire wrappedaround the sheath of the cable.

Safety Requirements forMeggering:

All equipment under testMUST be disconnected andisolated.

Equipment should bedischarged for at least as long asthe test voltage was applied inorder to be absolutely safe forthe person conducting the test.

Never use Megger in anexplosive atmosphere.

Make sure all switches areblocked out and cable endsmarked properly for safety.

Cable ends to be isolatedshall be disconnected from thesupply and protected fromcontact to supply, or ground, or

46

.

In this configuration the Megger should read the resistance between oneconductor and the outside sheath.We want to measure Resistance between Conductor 2To Sheaths but ActuallyMegger measure resistance in parallel with the series combination ofconductor to conductor resistance (Rc1 c2) and the first conductor to the sheath(Rc1 s).

If we don’t care about this fact, we can proceed with the test asconfigured. If we desire to measure only the resistance between the secondconductor and the sheath (Rc2 s), then we need to use the megger’s “Guard”terminal.

Connecting the “Guard” terminal to the first conductor places the twoconductors at almost equal potential. With little or no voltage between them,the insulation resistance is nearly infinite, and thus there will be no currentbetween the two conductors. Consequently, the Megger’s resistance indicationwill be based exclusively on the current through the second conductor’sinsulation, through the cable sheath, and to the wire wrapped around, not thecurrent leaking through the first conductor’s insulation.

The guard terminal (if fitted) acts as a shunt to remove the connectedelement from the measurement. In other words, it allows you to be selective inevaluating certain specific components in a large piece of electrical equipment.For example consider a two core cable with a sheath. As the diagram belowshows there are three resistances to be considered.

If we measure between core B and sheath without a connection to theguard terminal some current will pass from B to A and from A to the sheath.Our measurement would be low. By connecting the guard terminal to A the twocable cores will be at very nearly the same potential and thus the shuntingeffect is eliminated.

accidental contact.Erection ofsafety barriers with warningsigns, and an opencommunication channelbetween testing personnel.

Do not megger whenhumidity is more than 70%.Good Insulation: Meggerreading increases first thenremain constant.

Bad Insulation: Meggerreading increases first and thendecreases. Expected IR valuegets on Temp. 20 to 30 decreecentigrade.

If above temperature reducesby 10 degree centigrade, IRvalues will increased by twotimes.

If above temperatureincreased by 70 degreecentigrade IR values decreasesby 700 times.

4. ( ): :


5. / : :


6. ( ) : :

List out steps for Measure the coil winding resistance of the given motor

47

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 22 : 8

: 7 hrs . . :

: Prepare the setup & control an induction motor using DOL Starter

1.

1:1 : :1:1:1 Able to start an induction motor using DOL Starter

1:2 / :1:2:1 Induction motor1:2:2 DOL Starter

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ):We have studied about measuring the coil winding resistance of the given motor,now we will study to start an induction motor using DOL Starter

2:2 : 1) to start an induction motor using DOL Starter

3. / : 300

.

1) Start an induction motor using Direct on Line Starter (DOL)

Parts of DOL Starters:(1) Contactors & Coil.(2) Over Load Relay (Overload protection)

Wiring of DOL Starter:(1) Main Contact:Contactor is connecting among Supply Voltage, Relay Coil and ThermalOverload Relay.L1 of Contactor Connect (NO) to R Phase through MCCBL2 ofContactor Connect (NO) to Y Phase through MCCBL3 of Contactor Connect (NO)to B Phase through MCCB.NO Contact ( || ):(13 14 or 53 54) is a normally Open NO contact (closes whenthe relay energizes)Contactor Point 53 is connecting to Start Button Point (94)and 54 Point of Contactor is connected to Common wire of Start/Stop Button.NC Contact ( |/| ):(95 96) is a normally closed NC contact.

2) Relay Coil Connection: A1 of Relay Coil is connecting to any oneSupply Phase and A2 is connecting to Thermal over Load Relay’s NCConnection.

48

.

2) Thermal Overload Relay Connection: T1, T2, T3 are connect toThermal Overload Relay. Overload Relay is connecting between MainContactor and Motor. NC Connection (95 96) of Thermal OverloadRelay is connecting to Stop Button and Common Connection ofStart/Stop Button.

Working of DOL Starter: The main heart of DOL starter is Relay Coil.Pushing Start Button: When We Push the start Button Relay Coil will getsecond phase from Supply Phase Main contactor (5) Auxiliary Contact (53)Start button Stop button 96 95 To Relay Coil (A2).Now Coil energizes andMagnetic field produce by Magnet and Plunger of Contactor move. MainContactor closes and Motor gets supply at the same time Auxiliary contactbecome (53 54) from NO to NC.Release Start Button: Relay coil gets supply even though we release Startbutton. When We release Start Push Button Relay Coil gets Supply phase fromMain contactor (5) Auxiliary contactor (53) – Auxiliary contactor (54) StopButton 96 95 Relay coil (shown Red / Blue Lines in Diagram).In Overload Condition of Motor will be stopped by intermission of Controlcircuit at Stop Button:When we push Stop Button Control circuit of Starter willbe break at stop button and Supply of Relay coil is broken, Plunger moves andclose contact of Main Contactor becomes Open, Supply of Motor isdisconnected.Point 96 95.Pushing

4. ( ): :

to start an induction motor using DOL Starter

5. / : :

to start an induction motor using DOL Starter

6. ( ) : :

Construct a direction control circuit to change direction of an induction motor

49

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 23 : 8

: 6hrs . . :

: Construct a direction control circuit to change direction of an induction motor

1.

1:1 : :1:1:1 Able to change direction of an induction motor

1:2 / :1:2:1 induction motor

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ):We have studied about induction motor, Now we will study to change directionof an induction motor

2:2 : 1) to change direction of an induction motor

3. / : 300

.

1) To Change Direction of an Induction Motor:

The method of changing the direction of rotation of aninduction motor depends on whether it is a three phase or single phasemachine.

In the case of three phases, reversal is carried out by swappingconnection of any two phase conductors.

In a single phase split phase motor, it is achieved by changingthe connection between the primary winding and the start circuit.

Single phase split phase motors that are designed for specificapplications may have the connection between the primary winding andthe start circuit connected internally so that the rotation cannot bechanged.

Also, single phase shaded pole motors have a fixed rotation, andthe direction cannot be changed.

50

4. ( ): :


5. / : :


6. ( ) : :

Write the method to change direction of an induction motor

7. : :Connect an overload relay and test for its proper functioning.

51

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 24 : 8

: 6hrs . . :

: Connect an overload relay and test for its proper functioning

1.

1:1 : :1:1:1 Able to Connect an overload relay and test for its proper functioning

1:2 / :1:2:1 overload relay1:2:2 Megger

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ):We have studied about induction motor, now we will study about Connection ofan overload relay and test for its proper functioning

2:2 : 1) Connection of an overload relay and test for its proper functioning

3. / : 300

.

1) Connect an overload relay and test for its proper functioning:When it comes to motor overload relays, the primary function of these systemsis to prevent continued motor operation during overload conditions.Maintaining this equipment requires that proper analysis be given whennuisance trips occur to understand the root cause of the tripping beforechanging the overload relay rating. When a motor is tripped, rating the relaywithout knowing the cause could ultimately result in insulation deteriorationand reduction in the life of the motor itself.

Essentially, three motor overload relays are used today: thermal with meltingalloy, thermal with bimetallic strip and electromagnetic. Maintenance programsfor these types of relays should consist of the following:

Cleaning – periodic cleaning will ensure that the relay continues to operatereliably. Dirt and dust from surrounding machinery can cause parts to stopmoving in the relay and prevent proper heat dissipation, particularly in thermalrelays.Tightening – when electrical connections become loose, additional heat maycause nuisance operation, and this condition will especially affect thermalrelays.

52

.

Inspecting – heater size is of particular importance for optimal performance inthermal overload relays. While oversized heaters are often installed to preventunexplained tripping, the required heat needed may seem to require a largerheater when, in fact, the original heater is oxidized and providing a smallcurrent than the original design intended. For magnetic relays, setting shouldbe adjusted for minimum current and time delay.Testing – after the initial cleaning, tightening of connections and inspection,the motor overload should be tested using simulated overload so that the triptime can be measured. Results should then be analyzed based on themanufacturer specifications and relay time curve so make sure that theoverload relay is operating correctly.

Testing of motor overload relays may be accomplished using Megger testequipment such as the Megger MS2 High Current Test Set. While it can be usedfor verification of all types of processes including thermal, magnetic and solidstate overload relays, this Megger meter is self contained and offers the abilityto perform testing for circuit breakers, ground/fault trip devices and overcurrent relays. Its compact and lightweight design also allows for easy use inthe field or plant.

4. ( ): :

Connect an overload relay and test for its proper functioning

5. / : :

Connect an overload relay and test for its proper functioning

6. ( ) : :

Write out all steps of testing overload relay

7. : :

Identification of various types of cables.

53

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 25 : 9

: 15 hrs. . . :

: Identification of various types of cables.

1.

1:1 : :1:1:1 Able to identify various types of cables.

1:2 / :1:2:1 various types of cables.

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ):We have studied about electrical control circuit, now we will study aboutIdentification of various types of cables.

2:2 : 1) Identification of various types of cables.

3. / : 300

.

1) Identification of various types of cables:S.NO. Name of cable Application

TABLE 1

Pick any cable and identify it.Record your observation in the table 1.Repeat the above step for remaining

components.Get the work checked by your

instructor.

54

4. ( ): :

To identify various types of cables.

5. / : :

To identify various types of cables.

6. ( ) : :

List out various types of cables.

7. : :Identify suitable connectors, solder/crimp/terminate.

55

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 26 : 9

: 10 hrs . . :

: Identify suitable connectors, solder/crimp/terminate.

1.

1:1 : :1:1:1 Able to identify suitable connectors, solder/crimp/terminate.

1:2 / :1:2:1 Different connectors, solder/crimp/terminate

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied about Identification of various types of cables; now we willstudy about identify suitable connectors, solder/crimp/terminate.

2:2 : 1) identify suitable connectors, solder/crimp/terminate.

3. / : 300

.

1) Identify suitable connectors, solder/crimp/terminate:Connectors, solder/crimp/terminate that allows a physical interface betweendevices. Functions such as: connecting hardware with a PC cable, provideaudio/video to a system with an A/V cable, deliver digital or analogconnectivity, or power to a device with a power cable, among others.AudioAudio connectors such as 3.5mm, RCA, TOSLINK® and XLR can be used for yourhome theater, an MP3 player, or even an audio mixing board.

CentronicsCentronics connectors such as the Centronics 36 can be used on many parallelmulti function devices to print, scan, copy and fax

DB StyleDB (or D sub) connectors such as DB9, HD15 and DB25 can be used for manytypes of devices including monitors, keyboards and mice.

Digital VideoDigital Video connectors like HDMI and Display Port deliver the highest quality

Audio

Centronics

DB Style

Digital Video

56

.

video and audio signals for your entertainment on your TV or laptop

DIN

DIN connectors such as S Video and PS/2 can be used for keyboards, MIDIinstruments, and other specialized equipment

Fiber & Networking

Fiber optic connectors such as ST, SC and LC transmit networking data viapulses of light versus electrical signals to attain the greatest speed.

FireWire

Fire wire connectors were developed as an interface by Apple® for use withdigital video and portable storage devices.

Internal

Internal connectors such as SATA, 4 Pin Power and SAS typically are foundinside a computer transferring data or supplying power.

Modular

Modular connectors like RJ12 and RJ45 are used for transferring data intelephone systems, data networks, and low speed serial connections.

Power

Power connectors like NEMA 5 15 P and IEC 320 C13 allow electronic devices toconnect to available power outlets.

SCSI

SCSI connectors such as the Internal 68 pin SCSI and Micro DB68 can be usedinternally or externally to connect a variety of peripheral devices.

Specialty

Specialty connectors such as the RJ21 and IEEE 488 (or HP IB) are proprietary innature and have limited functionality beyond the intended application.

USB

USB (Universal Serial Bus) connectors have been through several iterationsfrom USB 1.1 to USB 3.0 — they can be used carry data and supply power.

Video

Video connectors such as BNC, Coaxial and VGA can deliver video signals toyour computer, projector or television.

Not Sure?

If you aren't sure which connector you need, try ConnectXpress!ConnectXpress walks you through step by step to guide you to the cableyou need.

DIN

Fiber & Networking

FireWire

Internal

Modular

Power

SCSI

Specialty

USB

Video

Not Sure?

57

4. ( ): :

To Identify suitable connectors, solder/crimp/terminate.

5. / : :

To Identify suitable connectors, solder/crimp/terminate.

6. ( ) : :

List out suitable connectors, solder/crimp/terminate.

7. : :

Test the cable sets and continuity.

59

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 27 : 9

: 10 hrs . . :

: Test the cable sets and continuity.

1.

1:1 : :1:1:1 Able to test for continuity

1:2 / :1:2:1 Multimeter & its probe

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied about Identification of various types connectors, now we willstudy about test for continuity2:2 : 1) Test the cable sets and continuity.

3. / : 300

.

1) Test the cable sets and continuity:

Step 1 — Testing Continuity

Set the multimeter to continuity test mode.The setting is symbolized by a "volume indicator". If the meter is set tothe correct mode, you should hear the meter beep when the leads aretouched together.Verify that the positive lead is plugged to the voltmeter/ ohmmeteroutlet.

Step 2

Test for a potential open circuit by using one multimeter lead to touchone of the prongs on the AC side of cable. Use the other lead to touchone end of the console side of the cable.If there is an adequate electrical connection, the multimeter will beep.If it does not beep the first time, try using the lead to touch the otherprong.Repeat the above directions in step 2 for the other outlet and prongof the cable.If the multimeter fails to beep on any of the occasions outlined above,your cable is open. In other words, you will need to replace the powercable.

Before you test for an electricconnection you must do a fewthings:Make sure your multimeter

is working. You can test thisby brushing the two tipstogether and verifying thatyou hear a beep. The manualyou received with yourmultimeter may have moreinformation on testing yourmultimeter.Make sure the device or

system you are testing ispowered off. If there isalready voltage in the circuityou will not get accuratereadings.

60

.

Step 3

Once you have verified that the cable provides an adequate electricalconnection, you will have to test that the cable is not shorted.Test for a potential short circuit by touching each prong on the ACside of the cable.If the multimeter beeps, your cable is bad and must be replacedimmediately.If your cable is shorted, do not attempt to replug the cord into the ACoutlet.If your cable has passed all of the steps above, then you havesuccessfully tested that your cable is in working order.

4. ( ): :


5. / : :


6. ( ) : :

List out steps for Test the cable sets and continuity.

7. : :

Identify and select various connector and cable inside the CPU cabinet of PC.

61

.......................... F: TRG : 08

: 2017(NSQF) :3

:ETN :

: 28 :10

: 10hrs . . :

: Identify and select various connector and cable inside the CPU cabinet of PC.

1.

1:1 : : 1:1:1 Able to Identify various connector and cable inside the CPU cabinet of PC.

1:2 / :

1:3 :1:3:1 different types of cables and connectors used inside CPU Cabinet of PC.


2. / : :

2:1 ( ) ( ): We are going to study Identify various connector and cable inside the CPUcabinet of PC.

2:2 : Identify various connector and cable inside the CPU cabinet of PC.

3. / :

. /

1. Different types of cables inside CPU cabinet of PC.

VGA Cable:

Connect one end to: computer monitor, televisionDVI Cable:

VGA CableConnect other end to: VGA port on computer

62

Connect one end to: computer monitor

HDMI Cable:

PS/2 Cable:

Connect one end to: PS/2 keyboard, PS/2 mouse

Ethernet Cable:

Connect one end to: router, network switch

3.5mm Audio Cable:

Connect one end to: computer speakers, 3.5mmheadphones, 3.5mmmicrophone

DVI CableConnect other end to: DVI port on computer

HDMI CableConnect other end to: HDMI port on computer

PS/2 Cable

Connect other end to: PS/2 ports on computer

Purple PS/2 port: keyboard

Green PS/2 port: mouse

Ethernet CableConnect other end to: Ethernet port oncomputer

3.5mm Audio Cableconnect other end to: audio ports on computer

Green audio port: computer speakers orheadphones

63

2.

USB Cable:

Connect one end to: USB device

Different types of connectors inside CPU cabinet of PC:

20/24 ATX:

The 20/24 ATX pin allows you turn on the motherboard.Early models had a 20 pin configuration, whereas thecurrent standard is now 24.

ATX P4:

The ATX P4 was introduced by Intel for Pentium 4. It plugsinto the motherboard and exclusively powers the processor.

MOLEX:

Still very present in every PC, it is sometimes used directly onthe motherboard (MSI) and is used to connect the hard diskand other drives. Some graphics cards may require thisconnector, too.

Pink audio port:microphone

Blue audio port: MP3 player, CD player, DVDplayer, turntable, electric guitar etc (line in portto play and record sounds from the abovedevices)

USB Cable: Connect other end to: USB ports oncomputer

How to tell USB 2.0 and 3.0 ports apart: USB 2.0ports have black tips while USB 3.0 ports comewith blue tips

64

SATA CONNECTOR:

Modern power supply systems must have at least 4 of theseto power up drives at the SATA standard

PCI Express:

Modern graphics cards need more power, so they need topower themselves directly from the power block. This is therole of this connector.

4. ( ): :

Knowledge of different connector and cable inside the CPU cabinet of PC.

5. / : :

Identify various connector and cable inside the CPU cabinet of PC.

6. ( ) : :

To list out various connector and cable inside the CPU cabinet of PC.

7. : :

Identify cable and connector to connect a computer with a network switch.

65

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

: 29 :10

:5hrs . . :

: Identify cable and connector to connect a computer with a network switch.

1.

1:1 : : 1:1:1 Able to Identify cable and connector to connect a computer with a

network switch

1:2 / :

1:3 :1:3:1 Different cables and connectors.


2. / : :

2:1 ( ) ( ): We are going to study which cable and connector to connect a computerwith a network switch.

2:2 : Different types of cables and connectors used to connect a computerwith a network switch.

3. / :

. /

There are various types of cables used in networks as follows:Unshielded Twisted Pair (UTP) Cable:

1. Straight Through Cable

66

2. Cross Over Cable :

3. Roll Over Cable :

Shielded Twisted Pair (STP) Cable:

Coaxial Cable:

67

Fiber Optic Cable:

There are various types of connectors used in networks as follows:

USB (Universal Serial Bus):

RJ 11 (Registered Jack):

RJ 45 (Registered Jack):

F Type:

68

ST (Straight Tip):

SC connector:

Fiber LC (Local Connector):

MT RJ (Mechanical Transfer Registered Jack):

4. ( ): :

Knowledge of different cables and connectors to connect a computer with a network switch.

5. / : :

Identify different cables and connectors to connect a computer with a network switch.

6. ( ) : :

To list out different cables and connectors to connect a computer with a network switch.

7. : :

Modulation and Demodulation of various signals using AM & FM on the trainer kit.

69

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:30 :11

: 10 hrs . . :

: Modulation and Demodulation of various signals using AM & FM on the trainer kit.

1.

1:1 : :1:1:1 Able to Modulation and Demodulation of various signals using AM & FM on the trainer kit.

1:2 / :1:2:1 1. Amplitude Modulation and Demodulation Trainer

2. Frequency Modulation and Demodulation Trainer3. Function Generator

1:2:2 Oscilloscope1:3 :

1:3:1 Connecting Wires1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Electronic Cable & Connectors, now we will study Modulationand Demodulation of various signals using AM & FM on the trainer kit.

2:2 : Modulation and Demodulation of various signals using AM & FM on thetrainer kit.

3. / : 300

.

1) Amplitude Modulation & Demodulation

1. Switch on the trainer and check the O/P of carrier generator onOscilloscope.

2. Connect 1KHz with 2 Volts A.F signal at AFI/P to the modulator circuit.

3. Connect the carrier signal at carrier I/P of modulator circuit.4. Observe the modulator output signal at AM O/P Spring by making

Necessary changes in A.F. signal.5. Vary the modulating frequency and amplitude and observe the effects

On The modulated waveform.6. The depth of modulation can be varied using the variable knob

(Potentiometer) provided at A.F. input.7. Find the value of R from fm=1/(2*Pi*R*C) , C=0.1 F8. Connect the circuit diagram as shown in Fig.2.9. Feed the AM wave to the demodulator circuit and observe the output10. Note down frequency and amplitude of the demodulated output

Waveform.11. Draw the demodulated wave form., m=1

70

.

2) Frequency Modulation & Demodulation1. Switch on the FM experimental board.2. Connect Oscilloscope to the FM O/P and observe that carrier frequencyat that point without any A.F. input.3. Connect around 7KHz sine wave (A.F. signal) to the input of the frequencymodulator (At AF input).4. Now observe the frequency modulation output on the 1st channel ofon CRO and adjust the amplitude of the AF signal to get clear frequencymodulated wave form.5. Vary the modulating frequency (A.F Signal) and amplitude and observe theeffects on the modulated waveform.6. Connect the FM o/p to the FM i/p of De modulator.7. Vary the potentiometer provided in the demodulator section.8. Observe the output at demodulation o/p on second channel of CRO.9. Draw the demodulated wave form.

4. ( ): :


5. / : :


6. ( ) : :


7. : :

Construct and test IC based AM Receiver, FM transmitter, FM receiver.

71

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:31 : 11

: 10hr . . :

: Construct and test IC based AM Receiver, FM transmitter, FM receiver.

1.

1:1 : :1:1:1 Able to Construct and test IC based AM Receiver, FM transmitter, FM receiver.1:1:2 Able to

1:2 / :1:2:1 IC MK4844, IC UPC165,1:2:2 32 ohm Head phone, Antenna,

1:3 :1:3:1 Battery, Mic M11:3:2 Different value Resistors, Inductors, and Capacitors.

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Modulation and Demodulation of various signals using AM &FM on the trainer kit. , now we will study Construct and test IC based AM Receiver, FM transmitter, FM receiver.2:2 : Construct and test IC based AM Receiver, FM transmitter, FM receiver.

3. / : 300

.

AM receiver circuit using MK484 IC :

Assemble the circuit on a Vero board.Use a 1.5V cell for powering the circuit.Never give more than 2V to the circuit. It will destroy the IC.The MK484 can be operated over a range of 150 KHz to 3 MHzFor L1 make 90 turns of 36SWG enameled copper wire on a 1cm diameter card boardformer. Experiment with the number of turns for getting optimum performance. A littletrial and error is needed.

72

.

FM transmitter using UPC1651

The circuit can be assembled on a Vero board.Inductor L1 can be made by making 5 turns of 26SWG enameled copper wire on a 4mmdiameter plastic former.A ¾ meter insulated copper wire can be used as the antenna.Do not give more than 6V to the IC.Mic M1 can be a condenser microphone.

4. ( ): :


5. / : :


6. ( ) : :


7. : :

IC based AM transmitter transmitted power .

73

.......................... F: TRG : 08

: 2018(NSQF) :3

: ETN :

:32 :11

:08hrs . . :

: IC based AM transmitter Transmitted Power .

1.

1:1 : :

1:1:1 IC based AM transmitter .

1:1:2 AM transmitter .

1:1:3

1:1:4

1:2 / :simi nimi (trade theory)

1:2:1 IC based AM transmitter Trainner

1:3 :

1:3:1 , ,

1:4 :trade theory(simi,nimi)1:4:1 Practical Book of Electronics Mechanic

2. / : :

2:1 ( ) ( ): , IC based

AM transmitter .

2:2 : , AM transmitter

.

3. / :

. /

1. 2 C/S 2 kilo c/s

2 C/S 2 kilo c/s

. 1

335 . 11 .

2. FM trasnmitter .

1.

.

2.

.

3.

.

4. .

5. .

74

3. .

4.

Audio .

5. 1 186 0

3 .

6.

1. 2. .

7. :

(

)

. . . , ,

.

8. RF

, . . 6 3c/s

6 3 c/s .

.

= =( 3×1 8)/F

=(

)/( )

5.

6.

4. ( ): : :

AM .

5. / : :

AM .

6. ( ) : :

FM transmitter .

7. : :

Dismantle the given FM Receiver set and identify different stages.

75

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:33 :12

: 10hrs . . :

: Dismantle the given FM Receiver set and identify different stages

1.

1:1 : :1:1:1 Able to Dismantle the given FM Receiver set and identify different stages1:1:2 Able to

1:2 / :

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Construct and test IC based AM Receiver, FM transmitter,FM receiver. , now we will study Dismantle the given FM Receiver set and identify different stages

2:2 : Dismantle the given FM Receiver set and identify different stages

3. / : 300

.

Block Diagram of FM Receiver:

76

.

Each Function Block1. Antenna: work to catch signals from the antenna2. RF Amplifier: fatherly function strengthens the signal captured by the antenna beforeforwarded to block Mixer (mixer).3. OSC (Local Oscillator): function of vibration frequency is higher than the frequency of theRF output signal. Where the results will be forwarded to the mixer block.4. Mixer (mixer): Contribute to mix the two frequencies are derived from the RF amplifier andthe Local Oscillator. Results from the mixer is processed Intermediate Frequency (IF) with alarge 10.7 MHz5. IF amplifier: used to strengthen the intermediate frequency (IF) before forwarded to thelimiter block.6. Limiter (delimiter): fatherly damping function which is modulated amplitude waves (thesignal sent by the transmitter) in order to form a pure FM signal7. FM Detector: used to detect frequency changesh. De emphasis: function to suppress excessive amount of audio frequency (high) sent by thetransmitter.8. AFC (Automatic Frequency Control / Automatic Frequency Control) function fatherly localoscillator frequency adjust automatically to remain stable.9. Stereo Decoder: Stereo signal processing used fatherly, so the results are forwarded to thetwo pieces of AF amplifier (FM Stereo).10. Audio Amplifier: used to rectify the vibration / AF signal and enhance the audio signallevel and then forwarded to an AF amplifier speakers.

11. Speakers (speakers) are used to change the vibration frequency electrical signals or AF became audible sound vibration by the human ear.

4. ( ): :

Dismantle the given FM Receiver set and identify different stages

5. / : :


6. ( ) : :


7. : :

Modulate two signals using AM kit, draw the waveform and calculate percentage of modulation

77

.......................... F: TRG : 08

: 2018(NSQF) :3

: ETN :

: 34 :12

:10hrs . . :

: Modulate two signals using AM kit, draw the waveform and calculate percentage of modulation

1.

1:1 : : 1:1:1 Able to Modulate two signals using AM kit

1:2 / :1:2:1 Amplitude Modulation trainer kit1:2:2 C.R.O (20MHz)1:2:3. Function generator (1MHz).

1:3 :1:3:1 Connecting chords & probes.


2. / : :

2:1 ( ) ( ): We are going to study modulation of two signals using AM kit, draw thewaveform of it and calculate percentage of modulation

2:2 : Modulation of two signals using AM kit.

3. / :

. /

1. Switch on the trainer kit and check the O/P of the carrier generator onoscilloscope.2. Connect around 1KHz with 2Volts .A.F signal at A.F I/P to themodulator circuit.3. Connect the carrier signal at carrier I/P of the modulator circuit.4. Observe the modulator output signal at AM O/p Spring by makingnecessary changes in A.F signal 5. Vary the modulating frequency andamplitude and observe the effects on the modulated waveform.6. The depth of modulation can be varied using the variable knobprovided at A.F input.7. The percentage modulation can be calculated using the formula.

78

. /

8. Connect the output of the modulator to the input of the demodulatorcircuit and observe the output.EXPECTED WAVEFORMS:

4. ( ): :

Knowledge of modulation of two signals using AM kit.

5. / : :

Modulation of two signals using AM kit.

6. ( ) : :

To list out method of modulation of two signals using AM kit.

7. : :

Modulate and Demodulate a signal using PAM, PPM, PWM Techniques.

79

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:35 :12

: 15hrs . . :

: Modulate and Demodulate a signal using PAM, PPM, PWM Techniques.

1.

1:1 : :1:1:1 Able to Modulate and Demodulate a signal using PAM, PPM, PWM Techniques.1:1:2 Able to

1:2 / :1:2:1 Pulse modulator trainer,1:2:2 CRO, power supply

1:3 :1:3:1 probes,1:3:2 connecting wires

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Dismantle the given FM Receiver set and identify differentstages, now we will study Modulate and Demodulate a signal using PAM, PPM, and PWM Techniques.2:2 : Modulate and Demodulate a signal using PAM, PPM, and PWMTechniques.

3. / : 300

.

1) Pulse Amplitude Modulation:

PROCEDURE:1. Make the connection according to the block diagram.2. Connect pulse generator to the unipolar to bipolar converter Pulse generator Audiofrequencygenerator Unipolar to Bipolar Converter PAMModula tor3. Connect the audio frequency of 2 KHz, 2V to modulator.4. Connect the modulator output to CRO.5. Observe output on CRO.

80

.

Pulse width modulation:BLOCK DIAGRAM:

PROCEDURE:1. Make the connection according to the block diagram.2. Connect the audio frequency of 2 KHz, 2V to modulator.3. Connect the modulator output to CRO.4. Switch ON the power supply.5. Observe output on CRO.Pulse position modulation:BLOCK DIAGRAM:

PROCEDURE:1. Make the connection according to the block diagram.2. Connect the audio frequency of 2 KHz, 2V to modulator.4. Connect the PWM output to the PPM modulator.4. Connect the PPM modulator output to CRO.5. Switch ON the power supply.6. Observe output on CROPRECAUTIONS:1. Do not use open ended wires for connecting to 230 V power supply & Before connectingthe power supply plug into socket, ensure power supply should be Switched off.

2. Ensure all connections should be tight before switching on the power supply.3. Take the reading carefully4. Power supply should be switched off after completion of experiment

4. ( ): :


5. / : :


6. ( ) : :


7. : :

Identify ICs & their functions on Microcontroller kit.

81

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:36 : 13

: 5hrs . . :

: Identify ICs & their functions on Microcontroller kit.

1.

1:1 : :1:1:1 Able to Identify ICs & their functions on Microcontroller trainer kit.

1:2 / :1:2:1 Trainer kit with manual.

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Communication electronics, now we will study Identify ICs& their functions on Microcontroller kit.

2:2 : Identify ICs & their functions on Microcontroller kit.

3. / : 300

.

1. Identify ICs & their functions on Microcontroller kit:

IC IC NUMBER NO OF PINS Purpose of IC

IC 1

IC 2

IC 3

IC 4

IC 5

TABLE 1

1. Read the Microcontroller trainerkit operating instruction.

2. Read the layout diagram of givenMicrocontroller trainer kit.

3. Read and understand thefunction of various IC’s used inthe kit.

4. Record the brief functioning offew important IC’s used in theMicrocontroller trainer kit in thetabular form as shown in table 1.

82

4. ( ): :


5. / : :


6. ( ) : :


7. : :

Identify the address range of RAM & ROM.

83

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:37 :13

: 5hrs . . :

: Identify the address range of RAM & ROM.

1.

1:1 : :1:1:1 Able to Identify the address range of RAM.1:1:2 Able to Identify the address range of ROM.

1:2 / :1:2:1 Trainer kit with manual.

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Identify ICs & their functions on Microcontroller kit., nowwe will study Identify the address range of RAM & ROM.

2:2 : Identify the address range of RAM & ROM.

3. / : 300

.

Identify the address range of RAM & ROM:

MEMORY TYPE STARTINGADDRESS

END ADDRESS MEMORYCAPACITY

RAM

ROM

TABLE 1

1. By referring theMicrocontroller trainerkit read the RAMaddress which is used toload user program.

2. By referring theMicrocontroller trainerkit read the ROMaddress which is used toload user program.

3. Record the address ofRAM and ROM used inthe Microcontrollertrainer kit in the tabularform as shown in TABLE1.

84

4. ( ): :


5. / : :


6. ( ) : :


7. : :

Measure the crystal frequency, connect it to the controller.

85

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

: 38 : 13

: 5hrs . . :

: Measure the crystal frequency, connect it to the controller.

1.

1:1 : :1:1:1 Able to identify the crystal oscillator in the given microcontroller kit.1:1:2 Able to measure the crystal frequency of the given microcontroller kit.

1:2 / :1:2:1 Trainer kit with manual1:2:2 DMM1:2:3 Digital Frequency meter1:2:4 Oscilloscope

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Identify the address range of RAM & ROM, now we willstudy Write data into RAM &measure the crystal frequency, connect it to the controller.

2:2 : Measure the crystal frequency, connect it to the controller.

3. / : 300

.

Measure the crystal frequency, connect it to the controller:

Clock Frequency Value measured inthe Frequencymeter/Oscilloscope

Value as per theformula given in themanual.

TABLE 1

1. Identify the crystal oscillator inthe given microcontroller kit.

2.Using the manual note downthe value of crystal oscillator.

3.Measure the clock frequencywith using Digital frequencymeter and oscilloscope.

4.Verify the reading with thecalculation given in the manual.

5. Tabulate the reading as shownin TABLE 1.

86

4. ( ): :

Write data into RAM & measure the crystal frequency, connect it to the controller.

5. / : :


6. ( ) : :


7. : :

Identify the port pins of the controller.

87

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:39 : 13

: 7hrs . . :

: Identify the port pins of the controller.

1.

1:1 : :1:1:1 Able to Identify the port pins of the controller.1:1:2 Able to

1:2 / :

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Write data into RAM & measure the crystal frequency,connect it to the controller. , now we will study Identify the port pins of the controller.

2:2 :

3. / : 300

.

Identify the port pins of the controller:8051 microcontrollers have 4 I/O ports each of 8

bit, which can be configured as input or output.

Pin configuration, i.e. the pin can be configured

as 1 for input and 0 for output as per the logic

state.

Port 0 The P0 (zero) port is characterized by two

functions When the external memory is used

then the lower address byte (addresses A0A7) is

applied on it, else all bits of this port are

configured as input/output.

Port 1

P1 is a true I/O port as it doesn’t have any

alternative functions as in P0, but this port can be

configured as

88

.

Reading and Writing

Writing to a port pin is very simple, as shown below:SETB P3.5 ; set pin 5 of port 3MOV P1, #4AH ; sending data 4AH to port 1 the binarypattern on the port will be 0100 1010MOV P2, A ; send whatever data is in the accumulator toport 2

Reading a port pin is also very simple, once the pin hasbeen initialized for input:SETB P1.0 ; initialize pin 0 of port 1 as an input pinMOV P2, #FFH ; set all pins of port 2 as inputsMOV C, P1.0 ; move value on pin 0 of port 1 to the carry

MOV R3, P2 ; move data on port 2 into R3

general I/O only. It has a built in pull up resistor

and is completely compatible with TTL circuits.

Port 2

P2 is similar to P0 when the external memory is

used. Pins of this port occupy addresses intended

for the external memory chip. This port can be

used for higher address byte with addresses A8

A15. When no memory is added then this port can

be used as a general input/output port similar to

Port 1.

Port 3

In this port, functions are similar to other ports

except that the logic 1 must be applied to

appropriate bit of the P3 register.

4. ( ): :


5. / : :


6. ( ) : :


7. : :

Use 8051 microcontroller, connect LED to the port, blink the LED with a switch.

89

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

:40 :14

:10hrs . . :

: Use 8051 microcontroller, connect LED to the port, blink the LED with a switch.

1.

1:1 : : 1:1:1 Able to connect LED to 8051 microcontroller and blink the LED with a

Switch.1:2 / :

1:2:1 5V Power Supply

1:3 1:3:1 AT89C51 (8051 Microcontroller1:3:2 8 LEDs1:3:3 8 Resistors – 3301:3:4 Crystal oscillator – 11.0592MHz1:3:5 2 Capacitors – 33pF1:3:6 2 Resistors – 10K1:3:7 1 Capacitor – 10 F1:3:8 1 Push Button1:3:9 8051 Programmer


2. / : :

2:1 ( ) ( ): We are going to study, how to connect LED to 8051 microcontroller andblink the LED with a Switch.

2:2 :

3. / :

. /

The circuit diagram for interfacing push button switch to 8051 is shown in fig.

AT89S51 is the microcontroller used here.

In this circuit, LEDs are connected to the port P3.The controller is connected with external crystal oscillator to pin 18 and 19pins.Crystal pins are connected to the ground through capacitors of 33pf.

90

. /

How to Operate?

Initially, burn the code into the microcontroller.Now, connect the LEDs to the Port3 of the microcontroller.Switch on the circuit.You can observe LEDs glowing.Now, switch off the circuit.

4. ( ): :

Able to connect LED to 8051 microcontroller and blink the LED with a Switch.

5. / : :

To connect LED to 8051 microcontroller and blink the LED with a switch.

6. ( ) : :

To list out method to connect LED to 8051 microcontroller and blink the LED with a Switch.

7. : :

Perform interface of 18*2 LCD with 8051 microcontroller

91

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

:41 :14

:15hrs . . :

: Perform interface of 18*2 LCD with 8051 microcontroller

1.

1:1 : : 1:1:1 Able to Perform interface of 18*2 LCD with 8051 microcontroller

1:2 / :1:2:1 5V Power Supply1:2:2 Crystal oscillator – 11.0592MHz

1:3 :1:3:1 AT89C51 (8051 Microcontroller) 1:3:2 16X2 LCD Display1:3:3 2 X 33pF Capacitors 1:3:4 2 X 10 K Resistors1:3:5 1 K X 8 Resistor Pack 1:3:6 10 K Potentiometer1:3:7 330 Resistor 1:3:8 Push Button1:3:9 10 F/16V Capacitor 1:3:10 8051 Programmer1:3:11 Connecting Wires

1:4 :1:4:1 Practical Book of Electronics Mechanic1:4:2

2. / : :

2:1 ( ) ( ): We are going to study interface of 18*2 LCD with 8051 microcontroller

2:2 : Interface of 18*2 LCD with 8051 microcontroller

3. / :

. /

Assemble the circuit as shown in fig. :

92

Programming LCD to 8051

Coming to the programming you should follow these steps:

STEP1: Initialization of LCD.STEP2: Sending commands to LCD.STEP3:Writing the data to LCD.

Initializing LCD

To initialize LCD to the 8051 the following instruction and commands are tobe embed in to the functions

0x38 is used for 8 bit data initialization.0xoC for making LCD display on and cursor off.0X01 for clearing the display of the LCD.0x80 for positioning the cursor at first line .

Sending Commands to the LCD

E=1; enable pin should be highRS=0; Register select should be low for sending commandsPlacing the data on the data registersR/W=0; Read/Write pin should be low for writing the data.

Writing the Data to the LCD

E=1; enable pin should be highRS=1; Register select should be high for writing dataPlacing the data on the data registersR/W=0; Read/Write pin should be low for writing the data.

4. ( ): :


5. / : :


6. ( ) : :

To list out method to Perform interface of 18*2 LCD with 8051 microcontroller

7. : :

Identify sensors used in process industries such as RTDs, Temperature Ics ,Thermocouples ,proximity switches, loadcells ,strain gauge ,LVDT.

93

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:42 :15

: 15hrs . . :

: Identify sensors used in process industries such as RTDs, Temperature Ics , Thermocouples , proximity switches,load cells , strain gauge , LVDT.

1.

1:1 : :1:1:1 Able to Identify sensors used in process industries such as RTDs, Temperature Ics ,Thermocouples ,proximity

switches, load cells ,strain gauge ,LVDT.1:1:2 Able to

1:2 / :1:2:1 RTDs, Temperature Ics ,Thermocouples ,1:2:2 proximity switches, load cells, strain gauge, LVDT.

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Microcontroller(8051) , now we will study Identifysensors used in process industries such as RTDs, Temperature Ics ,Thermocouples ,proximity switches, ,strain gauge,LVDT.

2:2 : Identify sensors used in process industries such as RTDs, TemperatureIcs, Thermocouples, proximity switches, load cells, strain gauge, LVDT.

3. / : 300

.

1)

2)

Identification of RTD:

Identification of Thermocouples:

94

.

3)

4)

5)

6)

Identification of Proximity Switches:

Identification of load cells:

Identification of strain gauge:

Identification of LVDT:

95

4. ( ): :

Identify sensors used in process industries such as RTDs, Temperature Ics , Thermocouples ,proximity switches, loadcells, strain gauge ,LVDT.

5. / : :

Identify sensors used in process industries such as RTDs, Temperature Ics, Thermocouples, proximity switches, loadcells, strain gauge, LVDT.

6. ( ) : :

Identify sensors used in process industries such as RTDs, Temperature Ics, Thermocouples, proximity switches, loadcells, strain gauge, LVDT.

7. : :

( ) RTD .

97

.......................... F: TRG : 08

: 2017 (NSQF) : 3

: ETN :

: 43 : 3

: 8 hrs. . . :

: ( ) RTD .

1.

1:1 :

1:1:1 : (thermocouple) RTD

1:1:2 (thermocouple) RTD .

1.1.3 .

1:2 / : ( )

1:2:1 (thermocouple) instrument,RTD,PIDC ,

1:3 :

1:3:1 , ,

1:4 : ( )

1:4:1 Practical book of Electronics Mechanic.

2. / : :

2:1 ( ) ( ): (thermocouple)

2:2 :

, (thermocouple) .

3. / :

. /

1) 1. (thermocouple)

2. temparature

,

(thermocouple) .

(thermocouple) ?

RTD . PID

? .

.

98

. /

3. (thermocouple)

series .

4. 23 volt AC

.

5. ,

.

6.PID controlar .

7.

.

8.

(thermocouple) .

.

.

10. .

4. ( ): 03 : 05

1. ,

2. .

3. .

5. / : : 5

6. ( ) : :

1. prectical PID .

7. : :

Measure temperature of a lit fire using a thermocouple, RTD and record the readings referring to data chart.

99

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:44 : 15

: 15rs . . :

: Measure temperature of a lit fire using a thermocouple, RTD and record the readings referring to data chart.

1.

1:1 : :1:1:1 Able to Measure temperature of a lit fire using a thermocouple, RTD and record the readings referring to data

Chart.

1:2 / :1:2:1 a thermocouple, RTD1:2:2 Temperature transducers, Digital temperature indicator, Thermometer, Electric sterilizer.

1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Identify sensors used in process industries such as RTDs,Temperature Ics, Thermocouples, proximity switches, load cells, strain gauge, LVDT. , now we will study Measuretemperature of a lit fire using a thermocouple, RTD and record the readings referring to data chart.

2:2 : Measure temperature of a lit fire using a thermocouple, RTD and recordthe readings referring to data chart.

3. / : 300

.

Procedure:1. Select the Thermocouple/RTD selector switch.

2. Connect the Thermocouple/RTD to sensor socket provided at front panel.

3. Set the min pot to read the ambient temperature in display.

4. Insert Thermocouple/RTD the hot bath.

5. 3 digit LED display shows the temperature obtaining at the hot bath directlyin degrees Celsius.

6. If necessary adjust the max pot for the maximum level oftemperature calibration.

7. Recorder red and green terminals for the anal output.

8. Fuse holder provider to protect the circuit from the over load (500 mA)

100

.

4. ( ): :


5. / : :


6. ( ) : :


7. : :

Measure the DC voltage of a LDTV. Detect different objectives using capacitive, inductive and photoelectric proximitysensor.

101

.......................... F: TRG : 08

: 2017(NSQF) : 3

: ETN :

:45 : 16

: 15hrs . . :

: Measure the DC voltage of a LDTV. Detect different objectives using capacitive, inductive and photoelectric proximitysensor.

1.

1:1 : :1:1:1 Able to Measure the DC voltage of a LDTV. Detect different objectives using capacitive, inductive and

Photoelectric proximity sensor.1:2 / :

1:2:1 LVDT, Digital displacement indicator, Calibration jig (with micrometer)1:3 :

1:4 :

2. / : : 30

2:1 ( ) ( ): We have studied Measure temperature of a lit fire using a thermocouple, RTDand record the readings referring to data chart. , now we will study Measure the DC voltage of a LDTV. Detect differentobjectives using capacitive, inductive and photoelectric proximity sensor.2:2 : Measure the DC voltage of a LDTV. Detect different objectives usingcapacitive, inductive and photoelectric proximity sensor.

3. / : 300

.

`1)

2)

Measure the DC voltage of a LDTVProcedure:1. Plug power chord to AC mains 230 V, 50Hz and switch on the instrument.2. Place the READ/CAL switch at READ position.3. Balance the amplifier with thehelp of zero knob so that display should read Zero (00.00) without connectingthe LVDT to instrument.4. Replace the READ/CAL switch at CAL position.5. Adjust the calibration point by rotating CAL knob so display should read10.00 i.e., maximum calibration range.6. Again keep the READ/CAL switch atREAD position and connect theLVDT cable to instrument.7. Make mechanical zero by rotating the micrometer.Display will read (00.00) this is null balancing.8. Give displacement with micrometer and observe the digital readings.9. Plot the graph of micrometer reading v/s digital reading.Different objectives using capacitive, inductive and photoelectric proximitysensor:1. Inductive SensorsInductive proximity sensors detect ferrous targets. They operate under theprinciple of inductance. Inductance is the phenomenon where a fluctuatingcurrent induces an emf in a target object. The components in the inductivesensors are ferrite core with coils, oscillator, Schmitt trigger and amplifier.Output of the inductive sensor is read by control unit and converted into usableinformation. Normal speed ranges from 10 to 20 Hz in AC or 500 Hz to 5 kHz inDC for the inductive sensor.

102

.

2. Capacitive Sensors:Capacitive sensors are similar to inductive sensors. The main difference is thatcapacitive sensors produce an electrostatic field instead of an electromagneticfield.

Applications for capacitive proximity sensors are:Level control of granular substances,Level control of non conductive liquids.Sensing substances through a protective layer.

3. Ultrasonic Proximity SensorsUltrasonic Proximity Sensors consists of a transducer which helps to send andreceive the sound signals. When the target comes to the beam, sound getsreflected back to the switch. Duration of the pulse reflected is evaluated by thetransducer. When the target enters the range, output of the switch changesand when the target leaves the range, output returns to the original state.

4. Photoelectric SensorsPhotoelectric Sensors are proximity sensors that can detect targets within arange of 10 meters. They are commonly used to detect metallic and nonmetallic targets.

4. ( ): :


5. / : :


6. ( ) : :


7. : :

, . (Detect different objectives using capacitive,inductive and photoelectric proximity sensor).

103

.......................... F: TRG : 08

: 2018(NSQF) : 3

: ETN :

: 46 : 16

: 08 hrs . . :

: , . (Detect different objectives usingcapacitive, inductive and photoelectric proximity sensor).

1.

1:1 : : , 1:1:1

1:2 / : simi nimi

1:2:1 , , , ,

1:3 : , , , ,

,

1:4 : / :

1:4:1 simi

1:4:2 nimi trade theory

2. / : : 30

2:1 ( ) ( ): prectical ,

.

2:2 : ,

.

104

3. / : 300

.

(1)

(2)

(3)

(4)

(5)

1.

. =C A/D E0 ER A/D

.

.

.

LED .

, +VE = , –

PNP ,NPN .

C=

A= ,

B=

.

?

,

?

4. ( ): : :

, , .

5. / : :

, .

6. ( ) : :

, .

7. : :

Construct and test the Laptop Protector.

105

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

: 47 :17-18

:50 hrs . . :

: Construct and test the Laptop Protector.

1.

1:1 : : 1:1:1 Able to Construct and test the Laptop Protector.

1:2 / :

1:3 :1:3:1 Resistors 100ohm , 1K Ohm , 10K ohm, 1.5M ohm1:3:2 Tilt Switch1:3:3 Switch1:3:4 Diode1:3:5Transistor1:3:612V battery1:3:7 Piezo buzzer


2. / : :

2:1 ( ) ( ): We are going to study Construct and test the Laptop Protector.

2:2 : How to Construct and test the Laptop Protector.

3. / :

. /

1. PROCEDURE1. List the component and quantity required.2. Check and confirm good condition of given component.3. Assemble the circuit on general purpose PCB.4. Get the assembled circuit checked by your instructor5. Connect the power supply and observe the working of Laptop Protector.6. Get the work of the circuit checked by your instructor.

106

. /

4. ( ): :


5. / : :


6. ( ) : :

List out how Laptop Protector works.

7. : :

Construct and test the Dancing LEDs circuit.

107

.......................... F: TRG : 08

: 2017(NSQF) :3

: ETN :

: 48 :

: . . :

: Construct and test the Dancing LEDs circuit.

1.

1:1 : : 1:1:1 Able to Construct and test the Dancing LEDs circuit.

1:2 / :1:2:1 Trainees tool kit1:2:2 DC power supply 9V/500mAh battery

1:3 :1:3:1 General purpose PCB for IC circuit1:3:2 IC 555 with IC base1:3:3 IC CD 4017 with IC base1:3:4 Resistors 10Kohm 1/4W

330Kohm 1/4W1:3:5 Preset 100K( variable resistor)1:3:6 Capacitor 100 micro F/15v1:3:7 10 nF ( 0.001 micro F)1:3: LEDs 8 8 No.1:3:9 Switch1:3:10 Connecting wires1:3:11 Solder, Flux


2. / : :

2:1 ( ) ( ): We are going to study Construct and test the Dancing LEDs circuit.

2:2 : How to Construct and test the Dancing LEDs circuit.

3. / :

. /

1 PROCEDURE1. List the component and quantity required.2. Check and confirm good condition of given component.3. Assemble the circuit on general purpose PCB.4. Get the assembled circuit checked by your instructor5. Connect the power supply and observe the working of the dancing LED circuit.6. Get the work of the circuit checked by your instructor.7. Observe that the LEDs will glow one after other and on time to be varied, varythe 100k potentiometer. The LED’s may be fixed in the photos.

108

. /

2

WORKING PRINCIPLE

IC 4017 is a IC of CMOS family and has got wide range of applications. ItInternally consists of 10 stage decade/divider.In this 555 IC astable multivibrator which gives continuous pluse at pin 3 and it isapplied to clock input pin 14 of CD 4017 which is used decade counter, its outputbecome logic high and low sequentially which seems to be dancing LED.

4. ( ): :

Construct and test the Dancing LEDs circuit

5. / : :

Construct and test the Dancing LEDs circuit

6. ( ) : :

List out how the Dancing LEDs circuit works.

7. : :

talimrojgar.gujarat.gov.intalimrojgar.gujarat.gov.in/2014/pdf/26dec2019043227pm.pdf1...

Documents