1 tehniline ülevaade uusimast füüsikast cern’is endel lippmaa 20. detsember 2006, ttÜ

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Tehniline ülevaade uusimast füüsikast CERN’is

Endel Lippmaa

20. Detsember 2006, TTÜ

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The Large Hadron Collider (LHC) will accelerate two counter-rotating beams of protons to energies of 7 TeV, about a million times larger than the energies of radioactive decay. The goal will be to have protons from

one beam collide with protons from the other, hence the name "Collider”.

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BEAM ZONES

LHC TUNNELS/ EXPERI MENTS Point 7

Point 8

Point 6

Point 5

Point 4

Point 3.3

Point 2

Point 1

SPS

TI8

TI2

PX16

PX14

PX15

PM15

USA1

UX15

US15 UL14

PM18

UJ18 UJ16

UJ14 UL16

RB14 RB16 RR13

UJ23 UJ24

UA23 RA23

PX24

UL24

US25

UW25

PM25 UL26

UX25

UJ26 PGC2 UA27

RA27

UJ27

R32

UJ32 TZ32

PM32

R33

R28

R22

PZ33 UJ33

UP33

R34 R36

R42 UJ43 UJ44 UA43 RA43 UL4

4 US45

UX45

PM45

PX46

PZ45

UL46 RB44 RB46 UJ46

UA47

RA47 UJ47 R48 TX4

6 UW45

UJ53 UL54

PM54

UXC55 USC5

5 UJ56 PM56

PX56

UL56

UJ57 RZ54

TD62 R62

UJ63 UA63 RA63

UJ64 UL64

UL66 UJ66 RB66

PM65

PX64 P

Z65

UW65

US65

UX65

TX64

UA67

RA67

UJ67 UJ68

TD68

R68

UJ76 TZ76

PM76

R76

R77

UJ83 UA83

RA83 UJ84

PX84

PZ85

PM85

UL84

UL86

UW85 U

S85 UX8

5 TX84

UJ86 RB84

RB86 UA8

7 RA87

UJ87 UJ88 R88

Point 3.2 SERVI CE ZONES

LHC SERVI CE GALLERI ES/ CAVERNS/ SHAFTS

NON-I NTERLOCKED AREAS

US32

Large Hadron Collider Tunnel

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This is the underground tunnel of the Large Hadron Collider (LHC) accelerator ring, where the proton beams are steered in a circle by

magnets. The LHC is the accelerator facility (in France and Switzerland).

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Cross section LHC tunnel

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Leading Proton Detection 147m 180m 220m0m 308m 338m 420 430m

IP

Q1-3

D1

D2 Q4 Q5 Q6 Q7 B8 Q8 B9 Q9 B10 B11Q10

Jerry & Risto

= 0.02

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ACCESS to DS5

• Travel for ~ 400 m in the LSS and DS– LSS1/5 very radioactive regions (~ KGy/y)– DS : ~ 1 KGy/y foreseen close to the missing magnet and Q11 – Both the passage trough this zone and the work to be done at the cryostat have to be

carefully planned with Radiation Protection Group . – At least a few hours are needed before access is granted after a beam dump:

• Flush fresh air in the tunnel• RP technician has to inspect the zone

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Schematics of the ATLAS Detector

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EVENT

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PARTICLES

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Värskemad uudised – CMS installeerimineNEW

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ATLAS BARREL DETECTOR

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Leading Proton Detection 147m 180m 220m0m 308m 338m 420 430m

IP

Q1-3

D1

D2 Q4 Q5 Q6 Q7 B8 Q8 B9 Q9 B10 B11Q10

Jerry & Risto

= 0.02

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Configuration of the Experiment

CMS

What is the CMSTOTEM detector configuration?

Roman PotStation at147 / 220m

Aim at detecting colour singlet exchange processes with the leading protonsscattered at small angles with respect to the beam.

Roman PotStation at147/220mCASTOR?T1T1T2 T2

Services routing:

From Castor to Racks

Patch Panels

T2 Services routing:


Patch Panels

T2Services routing:


Patch Panels

T2 Services routing:


Patch Panels

T2

CASTOR?

CMSTOTEM Meeting Risto Orava CERN 23.9.2005

ZDCZDC

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The Roman Pot unit

• Three measurement pots : two verticals, one horizontal

• Integrated beam position monitor

•Interconnection bellow between horizontal and vertical pots

•Vacuum compensation system interconnected to the machine vacuum

• Individual stepper motors to drive the pots

• Adjustable jacks to align the RP unit in the tunnel

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Roman Potpre-series delivered and mounted

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3D Detectors and Active edges3D Detectors and Active edges

3D TECHNOLOGYE-field line contained byedge (p) electrode

EDGE SENSITIVITY <10 m

Side view

Top view

Pictures of processed structuresBrunel, Hawaii, Stanford 2003

EDGE SENSITIVITY <10 mCOLLECTION PATHS ~50 m

SPATIAL RESOLUTION 10-15 m

DEPLETION VOLTAGES < 10 V DEPLETION VOLTAGES ~105 V at 1015n/cm2

SPEED AT RT 3.5 ns

AREA COVERAGE 3X3 cm2

SIGNAL AMPLITUDE 24 000 e before Irradiation

SIGNAL AMPLITUDE 15 000 e- at 1015n/cm2

50 m pitch

S. Parker, C. Kenney1995

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3D DETECTORSMAKING OF THE HOLES

Deep, reactive–ion etchings to produce HIGH ASPECT RATIO of over 18:1, near vertical holes. The fabrication of 3D structures depends on the capability of etching narrow holes with high precision in the silicon bulk.

Deep reactive ion etching has been developed for Micro-Electro-Mechanical Systems (MEMS).

Photo of the plasma (violet colour) from the porthole of the STS (Surface Technology Systems) while etching a silicon wafer

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KEY STAGES THAT MAKE THIS TECHNOLOGY POSSIBLE

1. WAFER BONDING

(mechanical stability). After

complete processing this support

wafer will be removed.

2. PHOTOLITHOGRAPHY

3. MAKING THE HOLES

4. FILLING THE HOLES

5. DOPING THE HOLES AND ANNEALING

6. METAL DEPOSITION

3D process consists of > 100 steps

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READOUT ELECTRONICS – VFAT128

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Detector Control Systems

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CERN PHYSICS GRID

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Näited rakendustest

The Medipix2 ASIC is a high spatial, high contrast resolving CMOS pixel read-out chip working in single photon counting mode. It can be combined with different semiconductor sensors which convert the X-rays directly into detectable electric signals. This represents a new solution for various X-ray and gamma-ray imaging applications

1 tehniline ülevaade uusimast füüsikast cern’is endel lippmaa 20. detsember 2006, ttÜ

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