1icc proprietary mems device wafer level packaging technical presentation customer device wafer
DESCRIPTION
3ICC Proprietary TECHNICAL PROPOSAL FOR MEMS DEVICE WLP Chip 1TRANSCRIPT
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ICC Proprietary 1
MEMS DEVICE WAFER LEVEL PACKAGINGTECHNICAL PRESENTATION
Customer Device Wafer
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ICC Proprietary 2
Process Modification Required as follows:- Reduction of Bond pads to half of existing bond pads size.
- Since bond pad size has been reduced, the distance between 2 chip isolation lines will be more now and additional scribing / dicing area can be provided for our SWP
Process Flow Changes:New smaller Bond Pads Passivation Bond Pad Opening Testing Ship Wafers to ICC
TECHNICAL PROPOSAL FOR ULTRASOUND MEMS DEVICE WLP
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ICC Proprietary 3
TECHNICAL PROPOSAL FOR MEMS DEVICE WLP
Chip 1
Chip 1
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ICC Proprietary 4
TECHNICAL PROPOSAL FOR MEMS DEVICE WLP
Chip 1
Chip 1
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ICC Proprietary 5
Chip 1
Chip 2
Chip 3
Chip 4
Schematic plan showing a possible EXISTING chip configuration
Active Area
Scribe / Dicing Area
Bond Pads
Isolation line
Bond pad size= 100 micron Sq.
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ICC Proprietary 6
Chip 2a
Proposed NEW chip configuration
Bond pad size= half original pad
Active Area
Scribe / Dicing Area
New Bond PadsChip 2a
Chip 2a
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ICC Proprietary 7
Proposed NEW chip configuration
Chip 2a
Bond pad size= 50 micron Sq.With 20 micron SqOpening at center.
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ICC Proprietary 8
Proposed NEW chip configuration
Chip 2a
Chip 2a
Via fabrication At the scribe zoneVia Size 20um Sq. X 50 um
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ICC Proprietary 9
Proposed NEW chip configuration
Chip 2a
Chip 2a
Via passivation PECVD process
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ICC Proprietary 10
Proposed NEW chip configuration
Chip 2a
Chip 2a
Interconnection At the scribe zone
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ICC Proprietary 11
Proposed NEW chip configuration
Chip 2a
Chip 2a
Top Passivation layer
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ICC Proprietary 12
Proposed NEW chip configuration
Chip 2a
Chip 2a
Glass wafer Bonding
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ICC Proprietary 13
Proposed NEW chip configuration
Backside of the Wafer after Back grinding and polishing
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ICC Proprietary 14
Proposed NEW chip configuration
1st Passivation on backside
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ICC Proprietary 15
Proposed NEW chip configuration
Back side pad opening
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ICC Proprietary 16
Proposed NEW chip configuration
Routing to new Bump pads
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ICC Proprietary 17
Proposed NEW chip configuration
2nd PassivationFilm on bump pads
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ICC Proprietary 18
Proposed NEW chip configuration
UBM pads
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ICC Proprietary 19
Proposed NEW chip configuration
Solder Bumping
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ICC Proprietary 20
Proposed NEW chip configuration
Dicing Process
ICC Proprietary