Cleanroom committee neeting Jan 2014 Vijayaraghavan

pecvd- of-fice hrs

pecvd-

non of-fice hrs

Drie- of-fice hrs

Drie-

non of-fice hrs

rie fl- of-fice hrs

rie fl-

non of-fice hrs

rie cl- of-fice hrs

rie cl-

non of-fice hrs

sputter 1- of-fice hrs

sputter 1-

non of-fice hrs

sputter 2- of-fice hrs

sputter 2 -

non of-fice hrs

E-beam

evptr-of-fice hrs

E-beam

evptr-

non-of-fice hrs

CPD - of-fice hrs

CPD -

non of-fice hrs

RF-Anelva

Sputter-ing- of-fice hrs

Equip 1- non of-fice hrs

Thermal Evapo-ra-tor- of-fice hrs

Thermal Evapo-ra-tor- non of-fice hrs

Used

76 6 NaN 27 3 NaN 37 1 NaN 32 2 NaN 176 152 NaN 52 20 NaN 104 0 NaN 18 1 NaN 144 0 NaN 132 4

Not Used

102 354 NaN 153 357 NaN 143 359 NaN 148 358 NaN 4 184 NaN 128 316 NaN 68 360 NaN 85 281 NaN 36 360 NaN 48 356

Down-time

2 0 NaN 0 0 NaN 0 0 NaN 0 0 NaN 0 24 NaN 0 24 NaN 8 0 NaN 77 78 NaN 0 0 NaN 0 0

Un-available

0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180

To-tal

180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540

50

150

250

350

450

550

Equipment Utilization Chart- January 2014

Tota

l hrs

28-01-2014

Cleanroom committee neeting Jan 2014 Vijayaraghavan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Oct

Nov

Dec

Jan

Used

78

14

0 76

NaN

39

34

39

27

NaN

60

47

47

37

NaN

48

17

23

32

NaN

176

180

136

176

NaN

16

32

20

52

NaN

126

96

76

104

NaN

95

87

32

18

NaN

144

116

84

120

NaN

132

96

80

104

Not Used

102

82

0 102

NaN

123

144

69

153

NaN

120

132

67

143

NaN

132

162

83

148

NaN

4 0 0 4 NaN

140

140

116

128

NaN

18

84

64

68

NaN

60

93

78

85

NaN

36

64

96

60

NaN

48

84

100

76

Downtime

0 84

180

2 NaN

18

2 72

0 NaN

0 1 66

0 NaN

0 1 74

0 NaN

0 0 44

0 NaN

24

8 44

0 NaN

0 0 0 8 NaN

25

0 0 77

NaN

0 0 0 0 NaN

0 0 0 0

Unavailable

0 0 0 0 NaN

0 0 0 0 NaN

0 0 0 0 NaN

0 0 0 0 NaN

0 0 0 0 NaN

0 0 0 0 NaN

36

0 40

0 NaN

0 0 70

0 NaN

0 0 0 0 NaN

0 0 0 0

Total

180

180

180

180

NaN

180

180

180

180

NaN

180

180

180

180

NaN

180

180

180

180

NaN

180

180

180

180

NaN

180

180

180

180

NaN

180

180

180

180

NaN

180

180

180

180

NaN

180

180

180

180

NaN

180

180

180

180

10

30

50

70

90

110

130

150

170

190

Equipment Utilization Chart- ComparisonT

ota

l h

rs

RIE-Fl RIE-ClE-beam

EvaporatorSputter Coater1

Sputter Coater2 CPD Thermal

Evap.

PECVD DRIE Anelva Sputter

28-01-2014

Cleanroom committee neeting Jan 2014 Vijayaraghavan

Dry Etch– Tool status Update Jan 2014 • RIE

– SiGe etch• process trials using CF4 ,C4F8 and Cl

• CF4 gives vertical profile, high etch rate• Selectivity checks to be done

– Quartz etch• Process trials with varying power using Ar,CHF3

• Etch rate increases with increase in power • Work in progress for better profile

SiGe etch

Quartz etch

28-01-2014

Cleanroom committee neeting Jan 2014 Vijayaraghavan

• PECVD – SiGe deposition – repeatability checks (for deposition rates and

characterization)– Ge deposition – process trials to achieve low deposition rate– Annealing – as deposited samples amorphous, annealing for poly

nature– vacuum leak in load lock - (bellow puncture in VAT valve),

procurement still in progress.• Process is done in manual mode due to load lock issue

• DRIE – AFM Tips work in progress

28-01-2014