3d integration
TRANSCRIPT
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PRESENTED BY VIPIN KUMAR GAUTAM
09-EC-58
3D IC TECHNOLOGY
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INTRODUCTION 3D IC technology assures higher levels of
miniaturization and integration.
It focuses on portraying advances in interconnect technologies and reduction of interconnect delays.
It is a single circuit built by stacking and integrating. Separately-built layers
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WHY A 3D IC?In modern world when the utilization of IC’s is increasing rapidly , a problem is being observed by the IC developers and that problem is space.general ICs those are in form of 2-D having a limited space.So developers are now a days planning on a concept that is called 3D IC.In 3D IC developers use 3rd dimension to manufacture the IC.
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• Interconnect structures increasingly consume more of the power and delay budgets in modern design.
• Reasonable solution: increase the number of “nearest neighbors” seen by each transistor by using 3D IC design
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Design tools for 3D-IC designDemand for EDA tools
As the technology matures, designers will want to exploit this design area No design tool is available till date for commercial
purpose
Current tool-chainsMostly academic
MIT has developed a tool for the academic purpose.
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Energy performanceWire length reduction has an impact on the
cycle time and the energy dissipationEnergy dissipation decreases with the
number of layers used in the designFollowing graph is based on a 3D tool
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Energy performance• Energy dissipation decreases with increase
in the number of layers used in the design.
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Concerns in 3D circuit• Thermal Issues in 3D-circuits• Inductance Effects • Reliability Issues
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Thermal Issues in 3D Circuits• Effects dramatically impact interconnect and
device reliability in 2D circuits
• Due to reduction in chip size of a 3D implementation, 3D circuits exhibit a sharp increase in power density
• Analysis of Thermal problems in 3D is necessary to evaluate thermal robustness of different 3D technology and design options.
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Heat Flow in 2DHeat generated arises
due to switchingIn 2D circuits we have
only one layer of Si to consider.
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Heat Flow in 3D With multi-layer circuits , the upper layers will also generate a significant fraction of the heat. Heat increases linearly with level
increase
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Heat DissipationAll active layers will be insulated from each other
by layers of dielectricsWith much lower thermal conductivity than SiTherefore heat dissipation in 3D circuits can
accelerate many failure mechanisms.
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Inductance EffectsInterconnect Inductance Effects
Shorter wire lengths help reduce the inductance
Presence of second substrate close to global wires might help lower inductance by providing shorter return paths.
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Reliability Issues?Electro thermal and Thermo-mechanical effects
between various active layers can influence electro-migration and chip performance
Die yield issues may arise due to mismatches between die yields of different layers, which affect net yield of 3D chips.
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ADVANTAGES 3D ICs offer many significant benefits,
including:
SPEEDDESIGNHETEREOGENEOUS INTEGRATIONBANDWIDTH
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Challenges Yield – Each extra manufacturing step
adds a risk for defects. In order for 3D ICs to be commercially viable, defects must be avoided or repaired.
Heat – Thermal buildup within the stack must be prevented or dissipated
Design complexity – Taking full advantage of 3D requires elegant multi-level designs. Chip designers will need new CAD tools to address the 3D integration
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WAFER LEVEL 3D INTEGRATION: An emerging architecture for future chips
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APPLICATIONSREAD-ONLY MEMORYDIGITAL CAMERASDIGITAL AUDIO PLAYERSSMART CELLULAR PHONESGAMING DEVICES MEMORY CARDS
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Three Dimensional Read-Only Memory ( 3D - ROM).
3D -ROM is a new non-volatile semiconductor memory with lower cost , higher capacity and comparable bandwidth.
It is compatible with standard CMOS process.
More importantly, 3D-ROM can be readily integrated with RAM/flash ROM.
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3D Integration of Next-Generation Transceiversfor Wireless Communications:
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Conclusion3D IC design is a relief to interconnect driven IC
design.
Still many manufacturing and technological difficulties.
Needs strong applications for automated design.
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THANK YOU