3d time-of-flight module in meizu 17 pro - system plus consulting · 2020. 11. 18. · ©2020 by...

©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

3D Time-of-Flight Module in Meizu 17 Pro

The first 3D ToF camera from Samsung with Lumentum’s VCSEL

SP20571 - IMAGING report by Taha AYARI Laboratory analysis by Youssef EL GMILI

November 2020 - Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/


Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 11

Market Analysis 15

Physical Analysis 19

o Summary of the Physical Analysis

o 3D Sensing System Assembly

✓ Module Views

✓ Module Opening

✓ System Cross-Section

o NIR Camera Module

✓ Module Views & Dimensions

✓ Module Cross-Section

o NIR CMOS Image Sensor

✓ Die Overview & Dimensions

✓ Die Process

✓ Die Cross-Section

✓ Die Process Characteristics

o Flood Illuminator

✓ Module Views & Dimensions

✓ Module Cross-Section

o NIR VCSEL Die

✓ Die Views & Dimensions

✓ Die Process

✓ Die Cross-Section

✓ Die Process Characteristics

o VCSEL Driver Die

✓ Views & Dimensions

✓ Delayering & Main Blocs

✓ Die Process

Manufacturing Process 79

o Global Overview

o NIR Sensor Die Front-End Process & Fabrication Unit

o NIR VCSEL Process Flow & Fabrication Unit

o VCSEL Driver Die Front-End Process & Fabrication Unit

Cost Analysis 92

o Summary of the Cost Analysis

o Yields Explanation & Hypotheses

o NIR Camera Module

✓ Pixel Array, BSI & Optical Front-End Cost

✓ NIR ToF Image Sensor Wafer & Die Cost

o Flood Illuminator Module

✓ NIR VCSEL Front-End Cost

✓ NIR VCSEL Probe Test, Thinning & Dicing

✓ NIR VCSEL Die Wafer Cost

✓ Component Cost

o VCSEL Driver

✓ Front-End Cost

✓ Probe Test, Thinning & Dicing

✓ Die Cost

o ToF Module

✓ Complete Module Cost

✓ Complete Module Price

Technical and Cost Comparison 121

o Meizu 17 Pro vs. Galaxy Note10+ vs iPad Pro

Feedbacks 126

SystemPlus Consulting Services 128



Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossaryo Meizu’s ToF module

Company Profile

Market Analysis

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Meizu 17 pro- Overview

Dimensionso Height: 160 mmo Width: 77.2 mmo Thickness: 8.5 mm

Weighto 219 g

Meizu 17 Pro - Overview



Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossaryo Meizu’s ToF module

Company Profile

Market Analysis

Physical Analysis


Cost Analysis


Feedbacks

Related Reports

About System Plus

Meizu 17 Pro - Overview

UltraWide camera moduleRGB main camera module

Meizu 17 Pro - Rear optical block ©2020 by System Plus Consulting

ToF module

Telephoto camera module



Overview / Introduction

Company Profile

Market Analysis

Physical Analysiso Summary of the Physical

Analysiso ToF Module Disassemblyo NIR Camera Moduleo NIR CIS Dieo Flood illuminatoro NIR VCSEL Dieo VCSEL Driver Die


Cost Analysis


Feedbacks

Related Reports

About System Plus

Summary of the Physical Analysis




Company Profile

Market Analysis




Cost Analysis


Feedbacks

Related Reports

About System Plus

ToF Module Disassembly

Module opening – Optical View ©2020 by System Plus Consulting

NIR cameraFlood illuminator

Metal enclosure

Module tilted view – Optical View ©2020 by System Plus Consulting




Company Profile

Market Analysis




Cost Analysis


Feedbacks

Related Reports

About System Plus

ToF Module Cross-section




Company Profile

Market Analysis




Cost Analysis


Feedbacks

Related Reports

About System Plus

Image Sensor Die – Cross-Section – Lenses




Company Profile

Market Analysis




Cost Analysis


Feedbacks

Related Reports

About System Plus

VCSEL Die Cross-section




Company Profile

Market Analysis




Cost Analysis


Feedbacks

Related Reports

About System Plus

VCSEL Driver Die - Logic Circuit




Company Profile

Market Analysis

Physical Analysis

Manufacturing Process Flowo Global Overviewo NIR Sensor Die Front-End

Process & Fabrication Unito NIR VCSEL Process Flow &

Fabrication Unito VCSEL Driver Die Front-End

Process & Fabrication Unit

Cost Analysis


Feedbacks

Related Reports

About System Plus

Pixel Array & DSP Circuit Process Flow




Company Profile

Market Analysis

Physical Analysis

Manufacturing Process Flowo Global Overviewo NIR Sensor Die Front-End

Process & Fabrication Unito NIR VCSEL Process Flow &

Fabrication Unito VCSEL Driver Die Front-End

Process & Fabrication Unit

Cost Analysis


Feedbacks

Related Reports

About System Plus

NIR VCSEL Wafer Process Flow 1/2




Company Profile

Market Analysis

Physical Analysis


Cost Analysiso Summary of the Cost Analysiso Yields Explanation &

Hypotheseso NIR Camera Module Costo Flood Illuminator Module Costo VCSEL Driver IC o ToF Module


Feedbacks

Related Reports

About System Plus

Complete Module Cost




Company Profile & Supply Chain

Market Analysis

Physical Analysis


Cost Analysis

Technical & Cost Comparisono Meizu 17 Pro vs. Galaxy

Note10+ vs iPad Pro

Feedbacks

Related Reports

About System Plus

Meizu vs. Samsung vs. Apple – NIR ToF Image Sensor





Market Analysis

Physical Analysis


Cost Analysis

Technical & Cost Comparisono Meizu 17 Pro vs. Galaxy

Note10+ vs iPad Pro

Feedbacks

Related Reports

About System Plus

Meizu vs. Samsung vs. Apple – NIR VCSEL

Pictures at scale





Market Analysis

Physical Analysis


Cost Analysis

Feedbacks

Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

IMAGING• 3D Imaging & Sensing 2020• Status of CMOS Image Sensor Industry 2020• CMOS Camera Module Industry for Consumer & Automotive

2020• CMOS Image Sensor Quarterly Market Monitor

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IMAGING• Samsung Galaxy Note 10+ 3D Time of Flight Depth

Sensing Camera Module• iPad Pro LiDAR Module• Sony’s 3D Time-of-Flight Sensing Solution in the Huawei

P30 pro• Sony’s 3D Time-of-Flight Depth Sensing Camera Module• Huawei’s 3D Depth Sensing System, 3D Camera, Flood

Illuminator and DOT projector in the Mate 20 Pro• STMicroelectronics’ Near Infrared Camera Sensor in the

Apple iPhone X• Apple iPhone X – Infrared Dot Projector

http://www.systemplus.fr/https://www.i-micronews.com/products/status-of-cmos-image-sensor-industry-2020/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-sensing-solution-in-the-huawei-p30-pro/https://www.i-micronews.com/products/3d-imaging-sensing-2020/https://www.i-micronews.com/products/status-of-cmos-image-sensor-industry-2020/https://www.i-micronews.com/products/cmos-camera-module-industry-for-consumer-automotive-2020/?utm_source=Yole&utm_medium=relatedreports_Report&utm_campaign=r_Status_of_CIS_2020_Nov2020https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/https://www.systemplus.fr/reverse-costing-reports/samsung-galaxy-note-10-3d-time-of-flight-depth-sensing-camera-module/https://www.systemplus.fr/reverse-costing-reports/apple-ipad-pro-11s-lidar-module/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-sensing-solution-in-the-huawei-p30-pro/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-depth-sensing-camera-module/https://www.systemplus.fr/reverse-costing-reports/the-huawei-mate-20-pros-3d-depth-sensing-system/https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-near-infrared-camera-sensor-in-the-apple-iphone-x/https://www.systemplus.fr/reverse-costing-reports/apple-iphone-x-infrared-dot-projector/https://www.systemplus.fr/reverse-costing-reports/samsung-galaxy-note-10-3d-time-of-flight-depth-sensing-camera-module/https://www.i-micronews.com/products/3d-imaging-sensing-2020/


COMPANYS E RVI CES




Market Analysis

Physical Analysis


Cost Analysis

Feedbacks

Related Reports

About System Pluso Company Serviceso Contacts

Business Model - Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings





Market Analysis

Physical Analysis


Cost Analysis

Feedbacks

Related Reports

About System Pluso Company Serviceso Contacts

Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

www.systemplus.fr

NANTESHeadquarters

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

KOREAYOLE

CORNELIUSYOLE Inc.

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 809CN: [email protected]

America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]
http://www.systemplus.fr/mailto:[email protected]:[email protected]:[email protected]

3d time-of-flight module in meizu 17 pro - system plus consulting · 2020. 11. 18. · ©2020 by...

Documents