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402.2 Test Systems and QC
Anadi Canepa, Yuri Gershtein CD1 Director’s ReviewMarch 20, 2019
OverviewoftechnicalprogresssincetheJune2018IPRreview§ 402.2.4.2TestSystems
§ Hybrids§ Modules§ MaPSA
§ TestingCampaigns§ Summary
Outline
March20,2019A.Canepa402.2.2OuterTrackerElectronicsCD1Director'sReview p2
Test Systems: Hybrids (1)
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§ USCMShasagreedtocontributetothetestingoftheprototypehybridsshippedtoCERNpriortodistributiontotheassemblysites
§ Thetaskincludesthedevelopmentofthetestsystem,thedevelopmentoftheQCSW,thedevelopmentoftheQCprotocol,andthequalificationofdevices§ 8CBC2hybridshavebeenqualified(electricallyandthermally)anddistributedinearlyJanuary2018
§ Utilizedbythevariousmoduleassemblycenterstobuildthefirstfunctional8CBC2modules(outsideCERN)
§ 8CBC3hybridsarebeingqualifiednow§ Tobedistributedsoon
Test Systems: Hybrids (2)
March20,2019A.Canepa402.2.2OuterTrackerElectronicsCD1Director'sReview p4
§ 10Test8CBC3hybridsweredeliveredtoCERNinlate2018§ BasedontheFR4stiffenersinsteadofCFstiffeners
§ ThetestsetupwasupgradefromtheGLIBtotheFC7technologyandtheUIB(universalinterfaceboard)tested
§ Electricalcharacterizationincludes:monitoringofpowerconsumption,I2CcommunicationwithASICs,registerread/writetests,inspectionforshorts,inspectionforopenchannelwithantenna,calibration,measurementofoccupancyaftercalibration,countofread-backerrors
• Currentbatchdoesnotexhibitanyproblem • ExceptforChip6oneachhybrid(issueatvendor,understood)
Test Systems: Modules (1)
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§ USCMSisresponsiblefordesigningthemoduleburn-instationforlongtermtests
§ 10moduleswillbecycledthroughroom-andtheoperating-temperatureandelectricallytested
§ Assumptions:power,max100W;operatingtemperature,-35deg;modulesoncarriers;finalconfigurationofLV/HV/Opticalreadout;systemrunsun-attended
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• ThemonitoringSWrunsontheBeagleBoneBlackboardcommunicatingwithsensorsthroughdedicatedinterfacecard(designedbyUSCMS,shownontheright)
• ThecontrolSWisinterfacedtoOTSDAQ.Itcanalsorunstandalone
Test Systems: Modules (2)
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§ TheprototypeburninsystemwasbuiltbytheJune2018reviewandusedtooptimizethedesigninviewofthefinalversion
§ Thefinalsystemisinplace(available:thermallyinsulatedenclosure,chiller,coolingsystem,modulesupportstructure,beagleboneblackandinterfacecard,controlSW)
§ Thesystemhasbeentestedwithaloadof80W:performancemeetsrequirementwithamplemargin
Test Systems: MPA/SSA Overview
March20,2019A.Canepa402.2.2OuterTrackerElectronicsCD1Director'sReview p7
§ USCMSisresponsibleforthedesignofthetestsystemforMaPSA(includingR&DonMPA/SSAtestsystems)
§ USCMSdesignedtheprobeandinterfacecardstotesttheMPA/MaPSAandtheSSA
§ MPA/MaPSA,productioncomplete;cardsinuse§ SSAprobecardsproductioncomplete;shippedtoothercenters
Test Systems: MPA (1)
March20,2019A.Canepa402.2.2OuterTrackerElectronicsCD1Director'sReview p8
§ ThefirstMPAWaferprobingtookplaceatCERNwithUSCMSpersonnelcarryingoutthetesting§ CategorizationofindividualMPAsonthe12inchwafer
§ Identificationoffaultychips(formultiplefailuremodes)
§ Collectionofinformationabouteachchip
§ Comparisontoperformanceofbump-bondedchips
Test Systems: MPA (2)
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§ Results(from~10waferstested)§ Highefficiencyforgoodchips
Test Systems: MaPSA
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§ AtestsetupisbeingassembledatFermilab§ FunctionalMaPSAsareexpectedtobedeliveredshortly
Characterization of Prototypes
§ SincetheJune2018review(whenresultsfromthe2CBC2,MaPSA-Liteand8CBC2moduleswherepresented),USCMShastestednewprototypes:§ 2CBC3minimodule§ BabyMaPSA§ 2xSSAminimodule
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Characterization of Prototypes (1)
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§ USCMStestedinbeamthefirst2CBC3minimodulebuiltbyCERN
§ Theminimodulewastestedbeforeirradiation,afterirradiationandbefore/aftermechanicalstress
§ FullefficiencyreachedafterthetotalfluenceexpectedfortheHL-LHC2Stracker.
pTthreshold(R=71.5cm)=1.207±0.05GeV/c
2E14,annealed
0E14
2E14
(2+2.4)xE14=4.4E14
Vbias
Characterization of Prototypes (2)
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§ USCMScontributedtothetestingofthefirstPS-likedeviceunderbeamatCERN§ BabyMaPSAdevicesgold-stud-bondedatKIT
§ Theapparatusincluded§ CERNH6testbeamwithAIDAtelescope§ ElectronicsandDAQfromtheUS§ FirmwarefromUS,CERNandDESY
Institut für Experimentelle Teilchenphysik (ETP), KIT5 14.05.2018
CMS Outer Tracker test beam @ CERN
Test beam in H6B from 16.04 till 25.04Team of firmware developer, chip designer and test beam expertsMain goals of this test beam:
Test MPA DAQ functionalityDevelopment and validation of firmware and DAQ
Davide Ceresa, Jarne De Clercq, Thomas Eichhorn, Yuri Gershtein, Mykyta Haranko, Andreas Nürnberg, Maria Rojas, Daniel Schell
AIDA telescope in H6B
BabyMaPSA
Sameinterfaceboardasusedforprobestation
Institut für Experimentelle Teilchenphysik (ETP), KIT15 14.05.2018
Bias rail and punch through
By zooming into bias rail region pixel structures become visibleBias railPunch through bias dotsCurvature of pixel p-stop
Davide Ceresa, Jarne De Clercq, Thomas Eichhorn, Yuri Gershtein, Mykyta Haranko, Andreas Nürnberg, Maria Rojas, Daniel Schell
Institut für Experimentelle Teilchenphysik (ETP), KIT14 14.05.2018
Inpixel efficiency
Efficiency map reduced to a2 x 2 pixel map (modulo plot)
Higher statistics for betterinpixel resolution
Pixel efficiency: >98%Efficiency below bias rail: 7%
Davide Ceresa, Jarne De Clercq, Thomas Eichhorn, Yuri Gershtein, Mykyta Haranko, Andreas Nürnberg, Maria Rojas, Daniel Schell
Projection
Institut für Experimentelle Teilchenphysik (ETP), KIT15 14.05.2018
Bias rail and punch through
By zooming into bias rail region pixel structures become visibleBias railPunch through bias dotsCurvature of pixel p-stop
Davide Ceresa, Jarne De Clercq, Thomas Eichhorn, Yuri Gershtein, Mykyta Haranko, Andreas Nürnberg, Maria Rojas, Daniel Schell
Institut für Experimentelle Teilchenphysik (ETP), KIT10 14.05.2018
Angular scan (MaPSA only)
Rotation along long side of the pixelsCluster width increases with larger angles
Davide Ceresa, Jarne De Clercq, Thomas Eichhorn, Yuri Gershtein, Mykyta Haranko, Andreas Nürnberg, Maria Rojas, Daniel Schell
[Jarne De Clercq]
Mea
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rwid
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1.3
1.4
1.5
1.6
1.7
1.8
1.9
Characterization of Prototypes (3)
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§ PreliminaryresultsfromthebabyMaPSAtestbeamcampaignarebeingreviewed
§ Hitefficiency>98%,withsmallexpectedinefficienciesduetobiasrailandbiaspunch-through
§ Angularscan:longerpaththroughthesensorleadstolargerclusters
D.Schell’sthesisD.Schell’sthesis
Characterization of Prototypes (4)
March20,2019A.Canepa402.2.2OuterTrackerElectronicsCD1Director'sReview p15
§ Investigationofa2xSSAmoduleison-going:§ VerificationoftheSSAchipfrontend
§ Testoftheinter-chipcommunication
§ Status:§ Workingwire-bondedversionofthe2xSSAwastested,lateralSSAinter-chipcommunicationwasverified
§ Thebumpbondedversionofthe2xSSAmoduleisexpectedthismonth
§ The2xSSAcanbeconsideredtheprecursortoababymoduleconsistingofababySSAsensorandababyMaPSA
Sensortobeplacedhere
2SSAchipsunderprotectivecover
DATAFROM2xSSAMODULE
(measuredusing2500injections)
Stu
b tra
nsm
issi
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effic
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y (%
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3-bit current register
§ AlanHonmawasselectedastheQA/QCcoordinatorfortheOTwithinCMS(currentlyemployedbyBrownUniversity)
§ QCprotocolsarebeingdevelopedasthefinalversionofthefrontendASICsandservicehybridsbecomeavailable§ UntilnowCMS(andUSCMS)hasfocusedontheremainingvalidationofprototypesusingad-hoctestsystems(e.g.testingof8CBC3moduleswillbedoneusingCIC1mezzaninecardandGBTx)
§ TheCMSDAQischargedwithreleasingthefinalsystemfortestingproductionservicehybrids,frontendhybrids,modules
§ USCMSisanactivecontributortothedevelopmentoftheQCprotocolformodulesthroughourworkonthemiddle-waredevelopment
§ TestinfrastructureforfrontendhybridsisbeingdevelopedbyCERN.USCMSisinvolvedinthetestingthefrontendhybrids.
§ Aachen/CERNareresponsiblefordevelopingtheQA/QCprotocolforservicehybrids.Thefirst2Sfunctionalservicehybrids(v3)willbedistributedtoUSCMSinthelateSpring,alongwiththeQCprotocol.
Overview of QA/QC (1)
March20,2019A.Canepa402.2.2OuterTrackerElectronicsCD1Director'sReview p16
§ USCMSstarteddevelopingtheQCprotocolforMaPSA§ Documentsincludes
• Description• Parts• HandlingandPackaging• Mechanicaltestsandinspection5.Electricaltests• FermilabDocumentation• Con-conformityactions
§ WeexpectUSCMSpersonneltoensureknowledgetransfertothevendorthroughactiveparticipationinsettingupthesystematthecompanyandsitevisitsasdeemednecessary
§ VendorswillbeexpectedtohaveaprobestationcompatiblewiththetestsetupdesignedbyUSCMS.USCMSwillprovidethetestsetup
Moredetailsinbackupslide
Overview of QA/QC (2)
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§ USCMSisnotresponsibleforthetheOTASICS.§ Shownhereforcompletenessisthestatusoftheinternationalcontributions
§ ServiceHybrids§ 2SV3willbedistributedtothemoduleassemblycentersinlateSpring2019(Aachen).
TestboardsforV3areundercommissioning.CERNwilldevelopV4andtheassociatedtestboard.
§ PSPOHV1(andtheassociatedtestsystem)willbedistributedforPSfunctionalmodulescontributioninlate2019.PSPOHV2(andtheassociatedtestsystem)willbedevelopedbyCERN.
§ PSROH(andtheassociatedtestsystem)willbedevelopedbyCERN.§ ConcentratorChipCIC
§ 16boardsequippedwithCIC1deliveredfortestingJanuary30th.Testsareongoing.§ CIC2:chaintestongoingtoensurecompatibilitywithFEASICsandBEsystem.
§ 2SmodulefrontendchipCBC3.1§ 13CBC3.1wafershadbeentested.CBC3.1chipsareperformingwell.
§ PSmodulefrontendchipMPA,SSA§ TheSSAandMPAASICsprovedtoworktogetherandtoproducecorrectstubson8
MPAand8SSA(SRAMfailureisbeinginvestigated)
Status of the OT ASICs
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Summary
Significantprogresshasbeenmadeinthedevelopmentofthetestsystemsinthepastyear§ 402.2.4.2TestSystems
§ Hybrids§ USCMSisacquiringknowledgeabouttestingoftheFEHandcontributedtotheQCoftheprototypesdelivered(tobedelivered)totheassemblycenters
§ Modules§ USCMSfinalizedthedevelopmentofthemoduleburninsystemanddemonstratedthatitsperformancemeetsthespecifications
§ MaPSA§ USCMSdesignedandproducedthetestsystemsfortheMPA[MaPSA]/SSAandusedittocarryouttheMPAwafertestingatCERNandtestbeamsatCERN
§ TestingCampaigns§ USCMShassuccessfullytestedprototypesofgrowingcomplexity(2CBC3minimodulebeforeandafterirradiationinbeam,babyMaPSAinthelabandinbeam,2xSSAminimoduleinthelab)
§ QA/QCprotocolsarebeingdevelopedasadvancedprototypesbecomeavailable
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Additional Material
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Availability of components
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§ Thecurrentplanistoassemble52SmodulesperproductionlineintheUS
§ Thisplanentails§ 208CBC3frontendhybrids(expectedinMay-June2019)
§ OptionstoreadoutoutallCBCsoruseaCIC1mezzanine§ 10SEH3.1servicehybrids(expectedinMay2019)
§ WithGBTinsteadoflpGBT
Test Systems: MPA/MaPSA
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§ TheProbeCardlowerstocontactwire-bondingpadsontheMPA
§ AprobestationisprogrammedwiththewafermaptofacilitatemovingfromMPAtoMPA
QC for MaPSAs (1)
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§ Mechanical/visualtests(afterassemblyandunderfillapplication):§ CheckthebowoftheMaPSA§ Checkwirebonds(freeofcontaminations)§ Checksensorbackside(noscratches)§ CheckthatthereisnoexcessunderfillmaterialthatwouldinterferewithspacesofthePS
module
§ x-rayorultrasonicimagingtoverifypresenceandlocationofbumpsandpenetrationandcontinuityoftheunderfill.
§ electricaltests(afterassemblyandunderfillapplication):§ Poweronsequence§ Powerconsumption§ BiasDAC§ SensorcurrentonasampleMPA§ BiasDACcalibration§ Write/Readtoregisters§ MemoryandStripInputchecks§ Individualpixeltests-noisemeasurementisdiagnosticofbumpconnectivity(Trimmingand
pulseinjection,s-curves)
QC for MaPSAs (2)
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§ FromexperiencesatCERN/Rutgers,thetestsareexpectedtotake~4minutesperchip.
§ Westillneedtodefinepass/failand/orgradingcriteria.§ Wewillprovidevendorswithmostelementsoftheteststand:
§ probecard/interfaceboard,FC7withallsmallattachmentboards,powersupplies,necessarycables,thesoftware(eventuallyevenalinuxhostcomputer).
§ Wewillbewillingtohelpsetupthesystematthevendorsites.§ Weexpectthevendorstohaveaprobingstationthatisableto(automatically)movetheMaPSA,