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Background Statement for SEMI Draft Document 4760 info 2 NEW STANDARD: MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 450mm WAFERS – Design A and Design B

Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document. Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Background

For standardization of FOSB, TF pursued the following requirements

i. Interoperability with 450 FOUP, as far as shipping performance requirements allow ii. Shipping performance to protect against accidental package drop during transportation. iii. Storage capability for sufficient period iv. Transportation efficiency

In the TF activities, the following two designs were proposed for prototyping and data gathering for the TF evaluation;

Design A

• Random access (12mm pitch)

• Perimeter support

• Same envelope as FOUP

• Assumptions:

– 2 degree draft angle

– Drop height assumption:

• 200mm palletized shipment

• 510mm individual box shipment

Design B

• Sequential access (reduced pitch ~11.1mm – need confirm)

• Perimeter support

• Pursue same envelope as FOUP*

• Assumptions:

– 3 degree draft angle

– Drop height assumption:

• 200mm palletized shipment

• 510mm individual box shipment

In former document, Doc. 4760, a full set of standards of design A and design B were included in sequential and in different formats. In the ballot review, It was pointed out that the two different formats of Design A and B sections of the blue ballot Doc.4760 were confusing and not easy to compare them, at 450 ISB TF meeting at SEMI NA Fall Meetings. TF agreed there is a need to clean up the ballot in one format with only the design differences illustrated side by side for comparison. ISB TF decided to model rewrite format after 4570B and to include any M31 specific requirements within that format. This document includes the consensus sentences.

This document is prepared by the above requirement and also is reflected by inputs for the former ballot and recalculation for design B for pursuing same dimension as FOUP as far as possible. The same paragraph with Doc.4570B’s definition and dimensions is deleted and is to refer to Doc.4570B for avoiding duplicate of standard.

The figures having design differences are illustrated side by side, or different dimensions are written in xxA and in xxB in the same figure. Design A and Design B dimensions are included in same table. The difference parts are highlighted in color.

The dimensions of Design A and B are summarized in table 1, and the typical differences are in follows;

Item Design A Design B

x1 ≤ 555 ≤ 565.6 Width

x2 ≤ 277.5 ≤ 282.8

y1 ≤481.75 ≤486.75

y2 ≤ 235 ≤ 240 Depth

y4 246.25±0.5 246.25±0.5

Door thickness y58 ≤ 52.25 ≤146.75

Height z1 ≤404 ≤404

Door force f234 ≤227N ≤387N

Latch key torque f230 ≤1.7Nm ≤1.7Nm

COG r20 ≤17 ≤36

Conveyor rail Square rail Side rail

Wafer plane z21 ±0.5 ±0.75

The following items are still open items and will be discussed in future;

TF is still discussing possibility of FOUP vs. FOSB top flange indicator notch.

An appropriate loadport specification for FOSB has not been defined.

Human readable volume area at rear of FOSB has not been discussed.

This standard is to allow prototyping data gathering in 2H’09 to 1H’10, and is to be revised based on the prototyping and gathered data for yellow ballot.

This document is also prepared for receiving inputs from interested parties. Blue ballot period closes on February 25, Friday 2010 (NA time). However, because the first review session will take place on February 11-12, input by February 5 is highly welcome. The inputs to this informational (Blue) ballot is to be discussed in the following international 450 mm shipping box TF (Web/TEL conference); 1st Review: February 11 (NA time) – 12 (JA time) 2nd Review: February 25 (NA time) – 26 (JA time) 3rd Review and final decision on one design: March 17 (NA time) – 18 (JA time)

This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

Page 1 Doc. 4760 info 2 SEMI

Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Phone:408.943.6900 Fax: 408.943.7943

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DRAFTDocument Number: 4760 info 2

Date: 01/27/2010

SEMI Draft Document 4760 info 2 NEW STANDARD: MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 450mm WAFERS - Design A & Design B

1 Purpose

1.1 This standard specifies the front-opening shipping box (FOSB) used to ship 450 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

2 Scope

2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces.

2.2 This standard assumes that the FOSB is used in loading raw silicon wafers to FOSB after inspection in Si suppliers and also used in acceptance and inspection and transfer to another carrier at device makers. The FOSB is not intended to be used in IC manufacturing processes. It is recommended that wafers be transferred from the FOSB to a FOUP using automated methods.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.

3 Limitations

3.1 The detailed methods and mechanisms inside a 450 FOSB door as to how a carrier door may be engaged to and disengaged from the carrier shell are not specified by this document.

4 Referenced Documents and Standards

NOTE 1: Unless otherwise indicated, all documents cited shall be the latest published versions.

4.1 SEMI Standards

SEMI M74 ― Specification for 450 mm Diameter Mechanical Handling Polished Wafers (Design A & Design B, 4570B)

SEMI Draft Document 4624 - Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers

SEMI Draft Document 4570B— Mechanical Specification for FOUP Used to Transport and Store 450 mm Wafers (450 FOUP) And Kinematic Coupling (Design A & Design B)

SEMI Draft Document 4599B — Mechanical Interface Specification for 450 mm Load Port

SEMI XXX— Provisional Standard for 450mm Wafer Shipping System

SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment

SEMI AUX16— List of carrier maker Identification Codes

4.2 ISO Standards1

ISO 4287 ― Geometrical Product Specifications (GPS) - Surface texture: Profile method - Terms, definitions and surface texture parameters ISO/IEC 16022 — International Symbology Specification - Data Matrix

4.3 ISTA Packaging Performance Testing Standards

1 International Organization for Standardization (ISO), ISO Central Secretariat, 1, ch.de la Voie-Creuse, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30; http://www.iso.ch




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ISTA-2A ― Individual packaged products 68kg or less ISTA-3E ― Unitized loads of the same product

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 2D — two dimensional

5.1.2 BP — bilateral plane

5.1.3 CL — center line

5.1.4 EE — end effector

5.1.5 FOSB —front-opening shipping box

5.1.6 FP — facial plane

5.1.7 HP — horizontal plane

5.1.8 KC ― kinematic coupling

5.1.9 KCP — kinematic coupling pin

5.1.10 OHT ― overhead hoist transport

5.1.11 RFID ― radio frequency identification

5.1.12 TIR — total indicator run out

5. 2 Definitions

5.2.1 450 FOSB — used generally as a “term” only within this document to identify the Front Opening Shipping Box.

NOTE 2: unless otherwise specified, the word ‘shipping box’ or ‘carrier’ used herein shall mean 450 FOSB.

5.2.2 2D code — a code identifying elements such as maker, model, version and serial number of a FOSB, by using a data matrix ECC200 symbol according to ISO/IEC 16022.

5.2.3 2D code placement area — an area on the door and another area on top of the shell, where a 2D code can be placed.

5.2.4 bilateral plane (BP) — a vertical plane, defining x=0 of a system with three orthogonal planes (HP, BP, FP), coincident with nominal location of the rear primary KC pin, and midway between the nominal location of the front primary KC pins.

5.2.5 carrier — any cassette, box, or pod that is used to transport and store substrates.

NOTE 3: Here are the other definitions in the above:

box - a protective portable container for a cassette and/or substrate(s) [SEMI E1.9, E15, E19.4, E45, E47, E47.1, E57, E62, E63, E92, E101, E103, E119, E146, M31]

cassette - an open structure that holds one or more substrates [SEMI E1.9, E15, E19.4, E47.1, E48, E57, E62, E63, E92, E99, E103, E106, E108, E146]

pod - a box having a standardized mechanical interface [SEMI E19, E47.1]

substrate - the basic unit of material, processed by semiconductor equipment, such as wafers, CDs, flat panels, or masks [SEMI E30.1]

5.2.6 center line (CL) — a horizontal line centered vertically on the carrier door used as the reference for z dimensions of door features.

5.2.7 end effector — wafer transfer device for transferring wafers to or from the carrier.

5.2.8 facial plane (FP) — a vertical plane, defining y=0 of a system with three orthogonal planes (HP, BP, FP), y33=194 ±0 mm in front of the nominal location of the rear primary KC pin.

5.2.9 front (of shipping box) — the part of the shipping box closest to the door.




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5.2.10 front-opening unified pod (FOUP) — a box (that complies with SEMI Doc. 4570B) with a non-removable cassette (so that its interior complies with SEMI Doc. 4570B) and with a front-opening interface (that mates with a FIMS port that complies with SEMI Doc. 4599B).

5.2.11 horizontal plane (HP) — a horizontal plane, defining z=0 of a system with three orthogonal planes (HP, BP, FP), coincident with the nominal location of the uppermost points (tips) of the three kinematic coupling pins.

5.2.12 nominal location — the value a dimension would have if its tolerance were reduced to zero.

5.2.13 nominal wafer seating plane — a horizontal plane that bisects the wafer pickup volume. [SEMI E1.9]

5.2.14 origin — the intersection of the BP and FP.

5.2.15 plane ― a theoretical surface which has infinite width and length, zero thickness and zero curvature.

5.2.16 rear (of FOSB) — the part of the FOSB farthest from its door.

5.2.17 shipping box — a protective portable carrier that is used to ship wafers from the wafer suppliers to their customers.

5.2.18 shipping box capacity — the number of substrates that a shipping box holds.

5.2.19 shipping box sensing pads — surfaces on the bottom of the shipping box for triggering optical or mechanical sensors.

5.2.20 wafer deflection — change in wafer shape (TIR) due to gravity while the wafer is resting on the shipping box wafer supports with the shipping box door open.

5.2.21 wafer extraction volume — the open space for extracting a wafer from the shipping box.

5.2.22 wafer pick-up volume — the space that contains entire bottom of a wafer once the door is removed from the FOSB for wafer transfer.

5.2.23 wafer seating plane — the bottom surface of an ideally rigid flat disk that meets the diameter specification for 450 mm wafers, with negligible droop due to gravity, as it rests on the wafer supports.

5.2.24 wafer set-down volume — the open space for inserting and setting down a wafer in the shipping box.

6 Reference Planes (HP, FP, BP) Specification

6.1 Refer to SEMI 4570 B

7 FOSB Envelope

7.1 The overall dimensions of the 450 FOSB, (x1), (y1), and (z1), are given as reference dimensions because they are derived from other dimensions. See Table 2. Overviews of 450 FOSB are shown in Figure 1.

(x1) ≤ x2+ x2

(y1) ≤ y2 + y4max

(z1) ≤ x8max + z11




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Figure 1A

Overall Views of 450 FOSB




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Figure 1B

Overall Views of 450 FOSB

8 FOSB Features for Automated Handling

8.1 Automation Flange — On top of the 450 FOSB, there is an automation flange for manipulating the carrier. See Figure 2 (top view) and Figures 3, 4 & 5 (sections).

8.1.1 The automation flange shall be centered in front of the FP. Its orientation and location are constrained by x4 and y12. See Figure 6.

8.1.2 The center of the flange is located x63 and y54 relative to its side and front respectively. The flange shall have a centering feature at its center. The centering feature shall have a depth of z2, diameter of d3 at the top surface, and (d2) at the bottom. The side of the centering feature shall have an angle of θ4.

8.1.3 The flange shall extend back from its front side by y3, and shall extend from its right side (as viewed from the front of the carrier) to the opposite side by x3. The neck below the flange shall extend x34 to each side of the BP, and shall extend y37 in front of the FP and y56 behind the FP.




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8.1.4 The flange has a pattern of notches on all sides. Notches on the front and back have a depth of y31 and those on the sides shall have a depth of x56. The notches shall have an angle of θ5. The four corners shall have chamfers with size of x32 and y28. Notches are located at x30, x31, x33, and x63 on the front and back, and at y29 and y54 on the sides. The flange shall have a thickness of z13, and the carrier shall have no obstructions around the flange for a height of z9, except for the door frame as shown by y30 in Figure 4.

Figure 2

Automation Flange – Top View (Same as FOUP)

Figure 3

Automation Flange at BP (Same as FOUP)

Right Front Left Front




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Figure 4A

FOSB Section at BP

Figure 4B

FOSB Section at BP

See Figure 3

See Figure 26 See Figure 15

See Figure 30

See Figure 3

See Figure 26 See Figure 15

See Figure 30




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Figure 5

FOSB Section at FP

8.2 Center of Gravity Volume ― No specific coordinates are defined within this standard for the exact location of the center of gravity of the 450 FOSB. However, the 450 FOSB shall be designed in a way to ensure the center of gravity in x and y direction with the door closed is within a volume defined by that part of a cylinder of a radius r20 defined about a point on the BP at y36, which is in front of the FP. The center of gravity shall be within this volume whether the shipper is empty, partly filled with wafers, or fully occupied. The center of gravity shall not be behind the FP. It may be necessary for a counterweight to be placed at the rear of the 450 FOSB to locate the center of gravity to meet this requirement. See Figure 6.

Left Right

See Figure 25




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Figure 6

Automation Flange Location

8.3 Fork-lift Feature — The 450 HOSB shall have features on the sides for handling by fork-lift, shown in Figure 7. The fork-lift feature includes a notched indentation for a pin to retain the carrier on the fork-lift.

8.3.1 On each side of the carrier, there shall be an opening to the rear extending vertically from z35 to z19, and forward to y45. The horizontal surface at z19 shall extend from y45 to y46. There shall be no obstruction at the top of the opening to the rear of y46. The surface at z19 shall extend from x17 to the surface at x66. There shall be notches at the FP with a height of z20, a depth of x35 and an angle of θ6.

8.4 Front Clamp Features — The 450 FOSB shall have provision for being clamped at the front of the carrier on vertical surfaces located behind the door frame.

8.4.1 There shall be two front clamping features on the top of the carrier. Each is a rectangular hole with a depth of z5, and is bounded by x15 & x16, and by y43 & y44. See Figure 7.

8.4.2 There shall be two front clamping features on the bottom of the carrier. Each is a rectangular hole with a depth of z36 and is bounded by x57 & x58, and by y47 & y48. See Figure 27.

NOTE 4: It is recommended that the front clamp features not be used for pulling the FOSB from the undocked position into the FIMS interface. All of the dimensions of the 450 FOSB (such as the wafer location, etc.) are defined with reference to the kinematic coupling pins, and will be in the proper location only when the 450 FOSB is held in place on the kinematic coupling pins only by gravity.




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Figure 1

Front Clamp & Forklift Features

8.5 Manual Handling — A fully-loaded 450 FOSB will be too heavy for manual handling during normal production or maintenance activities. It is anticipated that manual handling will only occur when recovering from an abnormal situation. Consequently, there is no provision for manual handles.

8.6 Conveyor Rails — See section 15.

9 Kinematic Coupling Pins

9.1 Refer to SEMI 4570 B

NOTE 5: Figure 8 is the same as that in SEMI 4570B, so that that is removed from this document.

10 Kinematic Coupling Groove

10.1 Refer to SEMI 4570 B NOTE 6: Figure 9 to Figure 11 are the same as those in SEMI 4570B, so that those are removed from this document.

11 Bottom Surface Features

Sensing Pads — As shown in Figure 12, when the FOSB is fully down on the kinematic coupling, the carrier sensing pads must be z23 above HP. It is recommended that the areas surrounding all of the carrier sensing pads be designed in conjunction with the features that mate with kinematic coupling pins so that a mechanical sensor pin cannot interfere with the lead-in function of the kinematic couplings.




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Figure 12

Bottom Features

11.1 Presence Sensor Feature

11.1.1 The presence sensing features on the bottom of the 450 FOSB are designed to provide three flat, opaque areas for sensing. The load port or other systems using KCPs can use the features to determine that a carrier is present, even if misplaced (see the discussion in the Related Information R5). The features consist of three flat, opaque areas centered along the FP of the carrier within the conveyor rails and extending y21 to the front and rear of the FP. The center area extends x22 to each side of the BP, and the outer areas extend from x20 to x9. The vertical location of the presence sense areas is z29 below the HP. See Figures 13 & 14.

11.2 Placement Sensor Features

11.2.1 Placement sensing features are intended to provide defined locations to confirm proper placement of the kinematic coupling grooves onto the kinematic coupling pins. These consist of a set of four elongated and three circular flat areas located. The elongated flat areas are located symmetrically to the front KC pins, with the outer center at approximately the same distance from the origin (at x21 and y22), The distance from the outer to inner centers is approximately the same as the distance between the primary and secondary KC pins. Two of the circular flat areas are located on either side of the rear secondary KC pin, and the third is in front of the rear KC pins, for use with forklifts. The flat areas shall be at a height of z23. Because the KC pins are not symmetrical, this configuration allows fail-safe sensing of the carrier placement. See Figure 13 & 14.

11.3 Info Pads & Mechanical Lockout Features

11.3.1 The info pads and mechanical lockout features of the 450 FOSB are located symmetrically about the BP, with one row of three info pads and one mechanical lockout feature on each side. From the carrier side, there is no difference between the info pads and mechanical lockout features. On the load port side, the optional mechanical lockout pins will be separate from the sensing info pads. As with the placement sensing pads, the info pad features have a radius of r21 mm (flat or hole per customer option). The flat surface shall be at z50 below the HP, (with a more relaxed tolerance than z23). Hole “depth” shall be at z24. For the mechanical lockout feature, the flat must be capable of supporting a fully loaded FOSB.




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11.3.2 The info pads and mechanical lockout features are located y24 mm from the FP, and symmetrically about the BP at distances of x24, x25, x26, and x27 from the BP. The two features nearest the BP are reserved for mechanical lockout; the other six are reserved for info sensors only (no mechanical lockout pins). The lockout pads are numbered (1 & 2) and the Info Pads are lettered (A thru F) to highlight that the info pads and lockout pins are not intended to be interchangeable.

11.3.3 The info pads and lockout features are end user selectable. See Related Information R1-3 in SEMI Doc.4570 B for an example of how they may be specified.

Figure 13

Presence, Placement, Info-Pads and RFID tag placement

Figure 14 (Same as FOUP)

Sensor Pad & Hole Cross-Section




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12 RFID Tag Placement Volume

12.1 The RFID tag placement volume specifies the volume where an RFID tag can be placed. The entire RFID tag, if present, must be placed within the volume defined by x29, y26, y27, z37 and z38 as shown in Figures 13 and 15. NOTE 7: SEMI E144 provides specifications for the required elements of RFID tags.


RFID Tag Placement Volume

13 FOSB Hold-Down Features

Figure 16 shows two features on the bottom of the FOSB that may be used for retaining the FOSB onto the kinematic couplings. This may be needed to prevent the FOSB from being knocked off the kinematic couplings by the action of pushing the FOSB against the front-opening interface.

13.1 The hold-down features are provided by a pair of structures located symmetrically about the BP and slightly closer to the FP than the front kinematic coupling pins. Each feature consists of cylindrical volume centered at x28 and y38 with top and bottom surfaces at HP and z6 with radius r7. Each volume has an opening to the bottom of the carrier bounded by y34, y35 and r7. From the bottom of the opening, a vertical surface of height z7 joins (with a small but unspecified blend radius) a sloping plane of angle θ3 above the horizontal (and parallel to the intersection of FP and HP). This sloping plane meets the surface at z6. See Figures 16 & 17.

13.2 This configuration provides the load port with several options for holding the carrier in place not limited to the following:

A hook shape that presses against the slope and the shelf, or A Tee shape that passes through the rectangular opening and rotates to press down on the shelf and/or the

sloping plane with or without contacting the incline See Figure 18.

13.2.1 Either (each) hold-down feature shall be able to withstand a force in any direction of f001 without permanent damage or deformation.

13.2.2 Door opening and closing shall operate correctly with a force of f002 applied to either (each) hold-down feature. The carrier must withstand this force without impact on its intended function.

NOTE 8: The force generated at the bottom hold down feature is related to the wafer retention forces and the door sealing forces that occur during the door insertion and removal operation. Carrier suppliers should consider the maximum force generated in their FOSB design when designing the carrier’s hold down feature.




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Figure 16

Hold-Down Feature Locations

NOTE 9: Figure 17 and Figure 18 are the same as those in SEMI 4570B, so that those are removed from this document.

14 Carrier Door

14.1 Door features – Door has features such as Door Seal Area, Frame Seal Area, Latch Key Opening, Door Pin Opening, Door Sense Area and Area for Vacuum Pads. See figure 2.

14.2 The areas for vacuum application are the four circles bounded by r28 and located at x49 & z31. The vacuum pad areas, door seal areas, frame seal areas and door sense areas shall be at a distance of y4 from the FP when the door is closed and latched. No feature on the FOSB may project further from the FP than these areas.

14.3 Dimension y39 assures that there is clearance between the door and latch keys when the FOSB is pressed against the FIMS port and both latch keys on the port are inserted to their full length. See Figure 22.

14.4 When the latch keys are turned more than 45° toward the position that unlocks the FOSB door from the FOSB, the latch key holes on the door shall be such that the door is not removable from the latch keys.

14.5 To allow for unobstructed latch key rotation, the thickness of the outer panel of the carrier door in the area defined by r23 shall be y10. Clearance for latch keys shall be provided by y39 at (x44). Clearance for door pins shall be provided by y40 at (x45). The latchkeys and door pins shall be located on the centerline (CL). See Figure 2.

14.6 FOSB door features are symmetrical about the CL. Features other than the openings for Frame Pins and Door Pins are symmetrical about the BP.

14.7 The opening for the door pin on the left side is circular with diameter (d4), and the opening on the right side is a slot. See Figure 23. The purpose of these openings is to assist with FOSB door recovery when the system experiences utility loss.

14.8 The openings for the frame pins are circular on the left side with diameter d5, and are slots on the right side.

See Figure 23. (Design A only).




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14.9 The frame seal area is bounded by x11 & x64 on the sides, by z27 & z34 on the top, and by z28 & z43 on the bottom. There are blend radii r30and r36 at the inner and outer corners respectively.

14.10 The door seal area is bounded by a x47 on the sides, and by z33 on the top and bottom. The width of the seal area is given by x48 and z32. There are blend radii of r31 & r32 at the outer and inner edges respectively. See Figure 21 and Related Information R1-2.10.

14.11 Neither the FOSB door opening nor the frame opening is specified. But the door and its position on the load port door shall be controlled so the gap between the load port door and the load port door opening is not obstructed. x47 and z33 are the limits for the door and any variation in its position on the load port door.

Figure 19

450 FOSB Door Features




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Figure 20A

FOSB Door Frame

Figure 20B

FOSB Door Frame




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Figure 21

FOSB Door

Figure 22

Section at Door Centerline - Looking Down on the Right Side

See Figure 22




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Figure 23

Frame Pin and Door Pin Area - Right Side

14.12 Front Clamp Features — See section 8.4. Figure 7 shows the top front clamp features and Figure 27 shows the bottom front clamp features. NOTE 10: It is recommended that the front clamp features not be used for pulling the FOSB from the undocked position into the FIMS interface. Also, all of the dimensions of the 450 FOSB (such as the wafer location, etc.) are defined with reference to the kinematic coupling pins, and will be in the proper location only when the 450 FOSB is held in place on the kinematic coupling pins only by gravity.

14.13 Door Closing Force —The force required to push the carrier door into the carrier shell to its fully seated position is f234. The application of f234 to the door shall push the door fully closed, so that the outer surface of the door is equal to y4 from the FP. With the door in this position, the latches shall operate without exceeding the torque limit f230 for the latch keys.

NOTE 11: FOSB suppliers should design their products to keep this force required to close as small as possible to ensure no damage will occur to wafers upon opening and closing the door.

14.14 Thickness of Door (y9) — y58 See Figure 4

14.15 Latch Torque — The maximum torque required to turn each of the latch mechanisms (with which the latch keys of a load port will engage) on the carrier door is f230.

14.16 Door Latching and Unlatching ― The door of the FOSB must be designed so that the door is completely latched or completely unlatched when the door latch keys are turned to the angular positions described in the relevant SEMI Mechanical Interface Specification for 450 mm load ports for FOSB.

14.17 Latch Pull Force — Load ports may pull in on the latches to hold the FOSB door in place with a force f235 that is defined in the SEMI standard for 450 mm load ports.

14.18 A door should be able to withstand a force when applied to one of the retaining features of up to f002 in any direction without negative impact to the intended function of the FOSB (e.g., shell deformation, wafer positions, door closing capabilities).

15 Conveyor Rails

This section specifies certain aspects of the 450 FOSB that define the conveyor rails, their exclusion areas, and relationships to other features.

15.1 Conveyor Rail Surface Dimensions — The conveying surface extends below the HP, as shown in Figures 25 and 26. The bottom view is given in Figure 24. The conveyor rail surfaces are meant to provide smooth, continuous surfaces symmetric to the origin. The inner boundary of the conveying surfaces is defined by x6. The outer guiding edges of the conveying surfaces are defined by x5 on the left side. The right side is x59 from the left side. A blend radius r11 connects the inner boundaries, and the four outer corners are bounded by radius r10. The conveying surface forms a plane at a distance z12 below the HP.




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15.2 Conveyor Rail Cylindrical Fork-lift Pin Holes – Cylindrical holes are provided in the conveyor rails, defining cylindrical volumes on the FP. The holes (cylinders) are of diameter d1. The left side hole is located x60 inside of the left conveyor guiding surface, and the right side hole is x37 from the left side hole. Both holes are centered on the FP. The depth of the holes is z46. See Figure 25.

15.3 Conveyor Guiding Surface —. The external edges of the conveyor rails will provide a physical conveyor guiding surface consisting of a vertical edge with height of z10 above the conveying surface. No part of the FOSB may occupy the space outside of or below the conveyor guiding surface below its top at z10. Note that r35 applies to the guiding surface while r10 applies to parts of the carrier that are above z10.

15.3.1 The (vertical) conveyor guiding surfaces shall be opaque for the purpose of presence sensing.

Figure 24A

Conveyor Rail Locations




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Figure 24B

Conveyor Rail Locations

Figure 25

Conveyor Rails (Same as FOUP)




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Figure 26A

Conveyor Rails section at BP

Figure 26B

Conveyor Rails section at BP

16 Port Exclusion Areas NOTE 12: Port exclusion areas are not specified for 450 FOSB, so that Figure 27 in the document is different from Figure 27 in SEMI Document 4570B.




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Figure 27

Front Clamps

17 Wafer Support Features (This section is different between Design A & Design B and FOUP)

17.1 Internal Horizontal Dimensions — Figure 7 shows a cross-section of the horizontal boundaries of the FOSB side domains (which contain the parts of the FOSB higher than z25 above the HP and lower than z15 above the top wafer). In this and following figures, the most heavy lines are used for surfaces that have tolerances (not surfaces that have only maximum or minimum dimensions).

17.2 Side and rear wafer support structure volume — Wafer shipping requires perimeter contact only. The number and location of wafer contacts are carrier design specific based on end user requirements, ie silicon manufacturer, and the defined wafer pickup volume. The volume defined by DIM 1 & DIM 2 and by wafer support structure thickness. (EJ to feature out DIMS) See Figures 28, 29 & 30.

17.3 Wafer Retaining — When the FOSB door is closed, the wafers must be retained in the FOSB to prevent movement during subsequent handling

17.4 Wafer Orientation and Numbering — The wafers must be horizontal when the FOSB is placed on the coupling, and the wafers slots are numbered in increasing order from bottom to top (so the bottom wafer is wafer number 1, the next wafer up is wafer number 2, etc.).




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Figure 28

FOSB Section (Between Wafer Supports)

Figure 29

Wafer Support Area




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Figure 30

Wafer Slots

Figure 31

Wafer Pick-Up Volume (Between Wafer Supports)




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Figure 32

Wafer Pick-Up Side View

Figure 33

Wafer Set-Down Volume (Between Wafer Supports)




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Figure 34

Wafer Set-Down Side View


Wafer Extraction Volume (Between Wafer Supports)




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Figure 36

Wafer Extraction Side View

17.5 Wafer insertion and extraction

17.5.1 Wafer Pitch and Capacity — Wafer pitch is defined by z17. The FOSB capacity is 25 wafers

17.5.2 Vertical Dimensions — Figures 4 & 5 show the vertical dimensions of the FOSB. Note that z14 (the height of the bottom nominal wafer seating plane above the HP) and z17 (the distance between adjacent nominal wafer seating planes) are given as absolute distances with no tolerance. This means that the sum of actual height variations in the FOSB from the kinematic coupling to the supporting features holding each wafer must be contained within the tolerance of z21 with no further stack-up at each higher wafer. The method for meeting this requirement is left up to the FOSB supplier. Table 1 defines all dimensions for Figures 4 & 5.

17.5.3 Wafer Set-Down Volume — The open space for the wafer set-down volume consists of a cylindrical section with radius r12 and a main axis parallel to and y14 in front of the nominal wafer centerline. The top of this cylindrical section is z18 above the nominal wafer seating plane and its bottom is z15 above the nominal wafer seating plane.

17.5.4 The implications for wafer positioning of the tolerance on r12 are as follows. The wafers should be placed in the FOSB within a circle of radius corresponding to the smaller bound on r12 to avoid touching the edge of the wafer to the side of the FOSB. Once the wafer has been placed, the FOSB must not allow a wafer to move outside of a circle of radius corresponding to the larger bound on r12. There are two exceptions to this limit on wafer movement. When the wafer is pushed toward the rear of the FOSB, the location of the wafer is defined by the wafer pick-up volume (see ¶ 17.5.8). When the FOSB door is opened, the wafers may slide forward, but it is recommended that they not extend further than y20 from the FP.

17.5.5 Wafer Extraction Volume ― The open space for the wafer extraction volume shall include a cylindrical section with radius r18 which has a vertical axis y14 in front of the origin. The vertical cross section at the FP is extended out to the door opening. The bottom of this cylindrical section is z22 above the nominal wafer seating plane and its height is z49. See Figures 35 & 36.

17.5.5 Wafer Extraction Volume — The open space for the wafer extraction volume includes a cylindrical section

17.5.6 The implications of wafer extraction for the definition of dimension r18 are as follows. The FOSB shall provide an extra 1 mm (0.04 in.) of horizontal clearance once the wafer is picked up from wherever it ends up (within the bounds of r12) after transport in the FOSB. 17.5.7 If a wafer is placed in the wafer set-down volume and the FOSB door is closed and subsequently opened (i.e. a normal transportation between load ports), the wafer seating plane shall be contained in the wafer pick-up volume. NOTE 13: If the wafer is not pushed toward the rear of the FOSB, then the wafer may only be somewhere within the wafer extraction volume.

17.5.8 Wafer Pick-Up Volume ― The wafer pick-up volume shall be defined by a cylindrical section with radius r13 and a vertical axis at the origin. Its top and bottom are the upper and lower tolerance of z21 around the nominal wafer seating plane. See Figures 31 & 32




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18 End Effector and Wafer Mapping Exclusion Volumes

18.1 End Effectors ― End effectors reaching into the carrier shall stay between the wafer support areas defined by x13, except as specified in paragraph 18.1.2. See Figure 37.

18.1.1 The maximum reach into the carrier is limited by r6, y11, and y19. (Design A & Design B, 4570B)

18.1.2 If an end effector width extends beyond x13, it shall not extend beyond y8 when the width is between x13 and x12.

18.2 Wafer Mapping ― A volume shall be reserved for wafer mapping.

18.2.1 It shall extend from z26 above the HP up to z25 above the top nominal wafer seating plane. See Figure4.

18.2.2 It shall extend from y55 to y9 and shall have a width of x12. See Figure 28.

Figure 37

End Effector Exclusion Area

19. 2D code (for Design B)

19.1 2D Code Placement Area — One optional area on the door and another optional area on top of the FOSB shell, where a 2D code can be placed. The 2D code on top of the FOSB shell must be within the lateral boundaries of an area defined by x70, x71, y70 and y71 as defined in Table 1 and shown in Figure 38. The 2D code on the front surface of FOSB door must be within the lateral boundaries defined by x72, x73, z70 and z71 as defined in Table 1 and shown in Figure 39.




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Figure 38B

2D Code Placement Area on Box Shell

Figure 39B

2D Code Placement Area on Door

19.1.2 The 2D codes are not intended to be used for automated reading on fab equipment load ports, since readers would likely conflict with spaces reserved for other purposes.




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19.2 2D Code — A square data matrix with a size of 8 ± 2mm consisting of 18 rows and 18 columns shall be employed on the surface of FOSB with laser marking. Each data matrix includes information designated as “primary upper case alphanumeric” per Data Matrix ECC200 Symbol of ISO/IEC 16022 with a capacity of 25 alphanumerical characters in total. These 25 characters shall contain the following 6 elements:

Character 1–2 FOSB maker; See SEMI AUX16 - List of carrier maker Identification Codes

Character 3 Door-Type; Auto (A)

Character 4 Location; Box Shell (B) or Door (D)

Character 5–8 Model code as defined by each FOSB maker

Character 9 Mold Revision number

Character 10–25 FOSB Serial number

Table 1 450FOSB Dimensions NOTE 14: All linear dimensions are in mm, all angular dimensions are in degrees.

Value Specified Symbol Used

Figure

Design A Design B

Datum Measured From Feature Measured To

θ1 9 45 ±6 degrees Vertical (BP & FP) Angle from vertical of the planar surfaces of kinematic coupling grooves

(θ2) 11 (34.0 degrees) BP Axis of symmetry of front pin-mating grooves

θ3 17 30.0 ±2 degrees HP Incline of hold-down feature

θ4 3, 5 45 ±0.5 degrees Vertical (BP & FP) Edge of automation flange centering feature

θ5 2 45 ±0.5 degrees Perpendicular to Side surface of automation flange

Side surfaces of automation flange notches

θ6 7 45 ±0.5 degrees FP Side of fork-lift retainer feature

d1 24 8.0 ±0.5 x37, FP and y32, BP Diameter of fork-lift pin hole

(d2) 3 (17) Automation flange centering feature at x63, y54

Diameter at bottom of depression

d3 2, 3, 5 51 ±0.5 Automation flange centering feature at x63, y54

Diameter at top of depression

(d4) 21 (10.6) x45, CL Diameter of door pin opening

d5 20 6.5 ±0.5 No need x46, CL Diameter of frame pin opening

d6 23 6.5 ±0.5 No need (x40 & x41), CL Diameter of slot for frame pin

(d7) 23 (10.6) (x43 & x42), CL Diameter of slot for door pin

f001 ¶ 14.2.1 ≥ 175 N Applied at any point, in any direction

Force that the any one hold down feature that the carrier must withstand.

f002 ¶ 14.2.2 ≥ 141 N Force applied to hold down feature

Force that carrier must withstand during door opening and closing without a negative impact on the intended function of the carrier

f230 ¶ 15.17 ≤ 1.7 Nm Latch Key Torque required to operate latches (each latch key)

f234 ¶ 15.19 ≤ 227 N ≤ 387 N Door Force to close carrier door




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Figure

Design A Design B


r1 8 10.0 ±0.025 Centerline of KCP Cylindrical (side) surface of KCP

r2 8 14 ± 0 Centerline of KCP Circle to define center of curvature of KCP contact surface

r3 8 30.0 ±0.05 Circle defined by r2 & z4 Contact surface of KCP

r4 8 15.0 ±0.05 Centerline of KCP & z3 Top surface of KCP (sphere)

r5 8 2.0 ±0.1 Blend radius Surface between KCP contact surface and adjacent surfaces

r6 28, 37 ≥ 245 Origin Rear boundary of EE exclusion area

r7 16 ≥ 30 x26, y29 Space in hold-down feature

r8 11 ≤ 136 Origin Innermost end of Kinematic Coupling Groove for Front KCPs

r9 11 ≥ 218 Origin Outermost end of Kinematic Coupling Groove for rear KCP

r10 6, 24, 28

≤ 314 Origin Outer limit of carrier and conveyor rails

r11 24 ≥10 No need Blend Radius Blend radius of conveyor rail edges

r12 33, 34 227 +1/-0 x=0, y14 Radius of wafer set-down volume

r13 31, 32 ≤ 226 Origin Radius of wafer pick-up volume

r14 27 25 x7, y7 and x7, y57 Radius of exclusion area for ports

r15 10 ≥ 15 N/A Lead in: correctable 450 FOSB misalignment in any horizontal direction

(r16) 11 (145) Origin Location of rear secondary KCP

r18 35, 36 ≥ r12 + 1 Origin Radius of wafer extraction volume

r20 6 ≤ 17 ≤ 36 BP, y36 Outer surface of cylinder contains the center of gravity of the carrier

r21 13 ≥ 10 Center of Info, placement and Lock-Out pads

Extent of pad area

(r22) 11 (206.5) Origin Location of front primary KCPs

r23 21, 23 ≥ 14 latch key Clearance

r24 11 > 231 Origin Outermost end of Kinematic Coupling Groove for Front KCPs

(r25) 11 (225) Origin Radius of 450 mm diameter wafer

(r26) 11 (160) Origin Location of front secondary KCPs

(r27) 11 (194) Origin Location of rear primary KCP

r28 21 ≥ 30 x38,z31 Area reserved for vacuum pads

r29 21 ≥ 20 x44, CL & x45, CL Boundary of door sense area

r30 20 ≤23 Blend radius Corners of frame seal area

r31 21 ≥21 Blend radius Outer edge of door seal area

r32 21 ≥ 19 Blend radius Inner edge of door seal area

r33 11 ≤121 Origin Innermost end of Kinematic Coupling Groove for Rear KCPs

r35 24 313 ±1 No need Origin Front and rear corners of conveyor guiding surface

r36 20 ≤35 Blend radius Corners of frame seal area

r37 29 ≥200 No need Origin Inner boundary of wafer support




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Figure

Design A Design B


r38 28 ≥200 Origin Inner wall of FOSB

r40 ¶ 20.1 N/A 1mm max Not applicable All concave features (radius)

R41 ¶ 20.1 N/A 2mm max Not applicable All required concave features (radius)

Ra1 ¶ 9.1 ≤ 0.30 µm n/a Kinematic Coupling Pin surface finish roughness per ISO 4287

(x1) 1, 5, 11, 20, 28

(≤555) (≤565.6) n/a Overall width of carrier

x2 6, 7, 20, 28

≤ 277.5 ≤ 282.8 BP Outer edge of carrier

x3 2 300 ±0.5 Right side of automation flange

Left side of automation flange

x4 5, 6 150 ±1 BP Right edge of automation flange on carrier

x5 5, 24, 25

234 ±1 BP Outer edge of left side conveyor rail surface

x6 24, 25 ≤220 BP Inner edge of side conveyor rail surface

x7 27 185 BP Center of port exclusion area

x9 13 ≤220 BP Outer edge of presence sense area

x10 13 193 ±1 BP Outer center of placement sense pad

x11 20, 28 ≤ 259 ≤ 268.8 BP Inner edge of frame seal area

x12 28, 37 ≥ 243.5 BP Inner edge of EE exclusion area

x13 29, 37 ≥ 135 BP Inner extent of wafer support surface

x14 29, 37 ≤ 50 BP Extent of rear wafer support structure

x15 7 ≥ 250 BP Outer side of top front clamping feature

x16 7 ≤ 210 BP Inner side of top front clamping feature

x17 7 ≤ 260 BP Inner side of fork-lift feature

x18 11 171.20 ±0.05 BP Location of front primary KCP

x19 11 132.65 ±0.05 BP Location of front secondary KCP

x20 13 ≤160 BP Inner edge of side presence sense area

x21 13 141 ±1 BP Outer center of placement sense pad

x22 13 ≥30 BP Edge of central presence sense pad

x23 13 55 ±1 BP Center of rear placement sense pad

x24 13 55 ±1 BP Center of lock-out pad (1 left / 2 right)

x25 13 85 ±1 BP Center of info pad (C left / D right)

x26 13 115 ±1 BP Center of info pad ( B left / E right)

x27 13 145 ±1 BP Center of info pad (A left / F right)

x28 16 50 ±0.5 BP Center of hold-down feature

x29 13, 25±1 BP Side of RFID placement volume


Automation flange notch






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Figure

Design A Design B


x32 2 12 ±1 Edge of flange Automation flange chamfer



x34 5 ≤ 132 BP Side of automation flange neck

x35 7 14 ±0.5 Outer edge of carrier Depth of notch for fork-lift

x37 24 450 ±1 Left fork-lift pin hole Right fork-lift pin hole

x38 21, 23 ≥ 10 Centered at x44, CL Width of latch key clearance

x40 23 ≥1.0 No need Centered at x41 Length of slot for frame pin

x41 23 272 ±0.5 No need BP Center of slot for right frame pin r24

x42 23 ≥3.0 Centered at x43 Length of slot for door pin

(x43) 23 (220) BP Center of slot for right door pin r22

(x44) 21, 23 (142) BP Latch key opening

(x45) 21 (220) BP Left door pin opening

x46 20 272 ±0.5 No need BP Left frame pin opening

x47 21 256±1 ≤265.8±1 BP Outer edge of door seal area

x48 21 ≥2 Outer edge of door seal area

Inner edge of door seal area

x49 21 200 BP Area reserved for vacuum pads

x50 5, 28 ≥ 229 BP Inner wall of carrier

x52 7 ≥ 250 x15 BP Outer side of top front clamping feature

x53 7 ≤ 210 x16 BP Inner side of top front clamping feature

x54 7 ≤ 260 x17 BP Inner side of fork-lift feature

x55 7 14 ± 0.5 No need Outer edge of carrier Depth of notch for forklift

x56 2 14 ± 0.5 Edge of automation flange depth of notches

x57 27 ≥257 BP Outer side of bottom front clamp

x58 27 ≤ 217 BP Inner side of bottom front clamp

x59 24 469 +0,-2 Left side of conveyor guiding surface

Opposite side of conveyor guiding surface

x60 24 9 ±0.2 Left side of conveyor guiding surface

Left fork-lift hole

x61 13 154 ±1 BP Inner center of placement sense pad

x62 13 102 ±1 BP Inner center of placement sense pad


Front automation flange notch and center of d3

x64 20 ≥275.5 ≥280.8 BP Outer side of frame seal area

x66 7 276 ±1 BP Outer surface of fork-lift feature

x70 38 N/A 110 BP edge of 2D-code indication area on body

x71 38 N/A 60 BP edge of 2D-code indication area on body

x72 39 N/A 175 BP edge of 2D-code indication area on door




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Figure

Design A Design B


x73 39 N/A 225 BP edge of 2D-code indication area on door

(y1) 1, 11, 28, 31

(≤481.75) (≤486.75) n/a Overall depth of carrier

y2 4, 6, 24, 28

≤ 235 ≤ 240 FP Rear of carrier

y3 2 300 ±0.5 Front side of automation flange

Rear side of automation flange

y4 4, 6, 26, 28, 35

246.25 ±0.5 FP Front surface of carrier at door and frame seal areas, and reserved areas for vacuum application and door sensing at Door sense area and 246.75mm maximum elsewhere on door or box shell

y5 24, 26 234 ±1 No need FP Outer edge of front & rear conveyor rail surface

y6 24, 26 ≤220 No need FP Inner edge of front & rear conveyor rail surface

y7 27 174 FP Center of rear port exclusion areas

y8 28, 29, 37

≤ 180 FP Inner extent of EE exclusion area between x12 and x13

y9 4, 28, 37

≥ 211.25 FP Inner surface of door

y10 22 3.00 ±0.25 Front surface of door (y4) Space for unobstructed rotation of latch keys

y11 28, 29, 37

≥ 200 FP Extent of rear wafer support structure

y12 4, 6 162 ±1 FP Front edge of automation flange

y13 24 469 +0,-2 No need Front conveyor guiding surface

Rear conveyor guiding surface

y14 33 >0, ≤3.0 >1, ≤3.0 FP Center of r12

y15 11 194 ±0.05 FP Location of rear primary KCP

y16 11 115.5 ±0.05 FP Location of Front Primary KCP

y17 11 89.5 ±0.05

89.47 ±0.05

FP Location of front secondary KCP

y18 11 145 ±0.05 FP Location of rear secondary KCP

y19 4, 28, 29, 31, 33, 34, 35, 36, 37

≥ 228 FP Inner extent of EE exclusion area near rear wafer support structure

y21 13 ≥ 30 FP Edges of side presence sense area

y22 13 151 ±1 FP Outer center of placement sense pad

y23 13 74 ±1 FP Outer center of placement sense pad

y24 13 120 ±1 FP Row of info and lock out pads

y25 13 194 ±1 FP Center of rear placement sense pads




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Figure

Design A Design B


y26 4, 13, 15

≥ 225 FP Front of RFID placement volume

y27 4, 13, 15

≤ 230 FP Rear of RFID placement volume

y28 2 12 ±1 Edge of automation flange Automation flange chamfer

y29 2 90 ±0.5 Front side of automation flange


y30 4, 6 ≥ 195.75 FP Back of door flange

y31 2 14 ±0.5 Side of automation flange Depth of notches

y33 ¶5.2.8 194 ±0 FP Nominal location of rear primary KCP

y34 16, 17 90 ± 0.5 FP Front edge of hold-down opening

y35 16, 17 60 ± 0.5 FP Rear edge of hold-down opening

y36 6 12 ± 1 FP Center of cylinder containing the center of gravity

y37 3 ≤ 144 FP Front side of automation flange neck

y38 16, 17 75 ± 0.5 FP Center of hold-down feature

y39 22 ≥ 12 Front surface of door Clearance for latch keys

y40 22 ≥ 12 Front surface of door Clearance for door pin

y41 22 ≥ 12 No need Front surface of door Clearance for frame pin

y43 7 3.5 ± 0.5 Front surface of FOSB frame

Front side of front clamping feature

y44 7 ≤ 222.75 FP Rear side of front clamping feature

y45 7 ≥180 ≥150 FP Front side of fork-lift feature

y46 7 ≥ 120 FP Rear limit of surface for fork-lift

y47 27 3.5 ± 0.5 Front surface of FOSB Frame

Front side of bottom front clamp

y48 27 ≤230 FP Rear side of bottom front clamp

y50 13 95 ±1 FP Placement sense pad for fork-lift

y52 13 125 ±1 FP Inner center of placement sense pad

y53 13 48 ±1 FP Inner center of placement sense pad

y54 2 150 ±0.5 Front of automation flange Automation flange notch

y55 4 ≤196.25 FP Rear of wafer mapping exclusion volume

y56 3 ≤120 FP Rear side of automation flange neck

y57 27 174 FP Center of rear port exclusion areas

y58 4 ≤52.25 ≤146.75 Front Surface of FOSB Frame

Thickness of Door

y60 4 N/A ≥100 FP Rear of wafer retaining

y61 24 N/A >205 FP Outer edge of front conveyor rail surface

y62 24 N/A >205 FP Outer edge of rear conveyor rail surface

y70 38 N/A 170 FP Edge of 2D-code indication area on body

y71 38 N/A 120 FP Edge of 2D-code indication area on body




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Figure

Design A Design B


(z1) 1, 4, 5 (≤404) n/a Over all height of carrier

z2 5 ≥ 17 Top of automation flange Bottom of centering depression

z3 8 15 ±0 HP Point on KCP centerline to define KCP top surface (r1)

z4 8 24.543 ±0 HP Center of radius r3

z5 7 ≥12 Top of door frame Bottom of upper front clamp feature

z6 17 11 ±0.5 HP Lower horizontal surface inside hold-down feature

z7 17 6 ±0.2 Lower horizontal surface inside hold-down feature

Lower edge of hold-own incline

z8 1, 4, 5 382 ±1 HP Top of carrier

z9 3, 4, 5 ≥ 21 Bottom surface of automation flange

Clearance for use of automation flange

z10 25, 26 ≥ 8 Conveyor running surface (z12)

Top edge of conveyor guiding surface

z11 4, 5, 9, 10, 14, 17, 25, 26

≤21 HP FOSB bottom surface areas not otherwise specified

z12 25, 26 20 ±1.0 HP Conveyor surface

z13 3, 5 7.5 ±0.5 Top surface of automation flange

Bottom surface of automation flange

z14 4 36 ±0 43.1 ±0 HP Bottom nominal wafer seating plane

z15 4 ≥ 12 ≥ 11.1 Height of first wafer slot top

Clearance below top of first wafer slot

z16 30 ≥ 8 ≥ 7.1 Top surface of each nominal wafer seating plane

Bottom surface of next higher wafer support

z17 30 12 ±0 11.1 Each nominal wafer seating plane

Adjacent nominal wafer seating planes (wafer pitch)

z18 4 ≥ 8 ≥ 7.1 Top surface of top wafer slot

Any point above top nominal wafer seating plane

z19 7 163 ±1 HP Top of fork-lift feature

z20 7 ≥10 Top of fork-lift feature Bottom of fork-lift retainer feature

z20 4.20,26 Not shown

3 ±0.25 N/A HP Bottom of shipper door opening

z21 30, 32 0 ±0.5 0 ±0.75 Each nominal wafer seating plane

Each actual wafer seating plane

z22 34, 36 6.8 4.85 z49 above each nominal wafer seating plane

Top of wafer extraction and wafer set-down volumes

z23 14 20 ±0.5 HP Surface of placement sense pads

z24 14 ≤ 15 HP Top of space within lockout & info pads when not active

z25 4 ≥17.0 ≥31.5 Top of wafer 25 nominal support

Top of wafer mapping exclusion volume

z26 4 ≥17.0 HP Bottom of wafer mapping exclusion volume




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Figure

Design A Design B


z27 20 ≥193 CL Top of frame seal area

z28 20 ≥193 CL Bottom of frame seal area

z29 14 20, +1, -5 HP Presence sense area

z30 20, 21 178 HP CL – Horizontal Center Line of the door

z31 21 129 CL Center of area reserved for vacuum pads

z32 21 ≥2 Outer edge of door seal area

Inner edge of door seal area

z33 21 178±1 CL Outer edge of door seal area

z34 20 ≤181 CL Inner edges of frame seal area

z35 7 ≤74 HP Bottom of fork-lift feature

z35 20 (190) N/A CL Bottom of carrier door flange

z36 7 ≥4 Bottom of door frame Top of lower front clamp feature

z37 15 ≥ 5 HP Bottom of RFID placement volume

z38 15 ≤10 HP Top of RFID placement volume

z39 7 163±1 N/A HP Top of forklift feature

z40 7 ≥ 10 N/A Top of forklift feature Top of forklift retainer feature

(z42) 20 (12) HP Bottom of door flange

z43 4, 7, 20 376 ±1 HP Top of door flange

(z44) 4, 20 (≤362) n/a Height of door opening

(z45) 20 (388) n/a Height of door flange

z46 25 ≥ 9 Conveyor running surface Depth of opening for fork-lift pin

z48 17 ≥ 11 Lower horizontal surface inside hold-down feature

Upper horizontal surface inside hold-down feature

z49 34, 36 0.7

1.5

Each nominal wafer seating plane

Bottom of wafer extraction volume. (To center the extraction volume between slots)

z50 14 20 ±1 HP Height of info and lockout pads when active

z51 7 ≤74 N/A HP Bottom of forklift feature

z70 39 N/A 230 HP Edge of 2D-code indication area on door

z71 39 N/A 270 HP Edge of 2D-code indication area on door

Unless otherwise noted, all dimensions are in mm. Reference dimensions are in parentheses.

Measured values for dimensions without specified tolerance should be rounded up or down to the last significant figure of the dimension in accordance with good engineering practice. Measured values for dimensions with specified tolerances should be rounded up or down to the last significant figure of the tolerance in accordance with good engineering practice.




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Table 2 Derivation of Reference Dimensions

Value Symbol Used Design A Design B

Formula

(x1) (≤ 555) (≤ 565.6) x2 + x2 ((≤ 277.5 + ≤ 277.5) or (≤ 282.8 + ≤ 282.8)) (y1) (≤ 481.75) (≤ 486.75) y2 + y4 ((≤ 235 or ≤ 240)+ 246.25 +0.5) (z1) (≤ 404) z8 + z11 (382 +1 + 21) (z42) (≤12) z12 – z10 (20+1 – ≥9) (z44) (≤ 362) z34 + z34 (181 + 181) (z45) (≤ 388) z42 + z43 (12 + 376)




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APPENDIX 1 FIXTURES for MEASURING the HORIZONTAL PLANE

Refer to Appendix 1 in SEMI Doc.4570B

APPENDIX 2

MEASUREMENT of WAFER SEATING PLANES

Refer to Appendix 2 in SEMI Doc.4570B

APPENDIX 3

METHOD FOR MEASURING CARRIER CENTER OF GRAVITY Refer to Appendix 3 in SEMI Doc.4570B




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RELATED INFORMATION 1 APPLICATION NOTES

NOTICE: This related information is not an official part of SEMI (doc#) and was derived from the work of the International Physical Interfaces & Carriers Committee. This related information was approved for publication on (date of approval) by the International Physical Interfaces & Carriers Committee.

R1-1 Referenced Standards and Documents

Refer to R1-1 in SEMI Doc.4570B.

R1-2 Drop Height Assumptions for 450 FOSB

The fragility of 450mm wafers is estimated to be 4X worse than that of 300mm wafers. Individual carton shipping of a 450mm FOSB is a concern due to the higher potential for wafer breakage. For this reason, an assumption that palletization will be the primary transportation mode for FOSB design purposes in order to keep the FOSB size similar or same as the size of the 450mm FOUP for equipment/automation interoperability. The 450mm International Shipping Box TF agreed to use the International Safe Transit Association (ISTA) procedures and criteria for drop height assumptions for palletized shipment and for handling of individual cartons. The ISTA-3E procedure covers palletized shipment and ISTA-2A applies to individual cartons. The drop height for individual cartons is based on the estimated packaged weight. Pallet: -Rotational edge drop testing with 90-100mm raised pivot edge and 200 mm drop height Individual Carton: -Drop height requirement 510 mm

R1-3 Carrier Options Checklist

Table R1-1 can be used for communicating the compliance of FOSBs to this standard and the options chosen: Table R1-1

Section Optional Feature Choice

17.1 Rear wafer support yes or

no




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Section Optional Feature Choice

11.3 info pad A height up (pad missing) or

down (pad present)

11.3 info pad B height up (pad missing) or

down (pad present)

11.3 info pad C height up (pad missing) or

down (pad present)

11.3 info pad D height up (pad missing) or

down (pad present)

11.3 info pad E height up (pad missing) or

down (pad present)

11.3 info pad F height up (pad missing) or

down (pad present)

11.3 Lockout Pad 2 up (pad missing) or

down (pad present)

11.3 Lockout Pad 2 up (pad missing) or

down (pad present)

19.1 2D code Yes or

No




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RELATED INFORMATION 2 CONSIDERATIONS for DETERMINING DIMENSIONS


R2-1 Referenced Standards and Documents


R2-2 Discussion

Refer to R2-1 in SEMI Do c.4570B.

R2-3 Height of wafer extraction and set-down volumes


R2-4 Kinematic Coupling System


R2-5 Forces on the Carrier Door

R2-2.1 The values in the following table are based on estimates provided by several parties. The highest values submitted were placed in the table. Table R2-1 Carrier Door Forces

Design. A Design. B Door Seal Gasket Forces

Door Seal Height (mm) 358 358 Door Seal Width (mm) 514 533.6 Door Seal Perimeter (mm) 1744 1783.2 Door Seal Force/Length (N/mm) 0.06 0.05 Door Seal Total Force (N) 105 90

Wafer Retention Forces Shock Load Wafer Retention Capability Without Cross Slotting and Assurance That Wafers Will Be In Pick-Up Volume After Transport From Point A to Point B

(G)

1 3.56

Wafer Retention Force 25 Wafers (N) 122 297

Door Closing Force (N) 227 387

R2-2.2 The Wafer Retention force and Door Seal Gasket force must be applied in order to close the carrier door. So the door closing force is 105 N plus 122 N or ~227 N for design. A, 90 N plus 297 N or ~387 N for design. B.




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RELATED INFORMATION 3 CARRIER HOLD-DOWN FEATURE


R3-1 Hold-down feature


R3-2 AMHS Hold-Down Interactions.

Refer to R4-2 in SEMI Doc.4570B,

R3-3 Manual Handling of 450 FOSB

R3-3.1 ISMI has informed the IPIC committee that manual handling of 450 FOSBs will be infrequent so that handles as were included in 300 mm FOSBs are not needed and not desirable for reasons of conserving space.

・450 FOSBs may have provision for attaching temporary removable handles.

・Features on the 450 FOSB for attaching temporary handles may not increase the overall size of the carrier

・When the temporary handles are installed, automated handling of the carrier must be blocked.

・Use of temporary handles may not increase required clearances.




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RELATED INFORMATION 4 CARRIER PRESENCE AND PLACEMENT AREAS

Refer to Related information 5 in SEMI Doc.4570B.