5. july 2010 christian irmler (hephy vienna), yoshiyuki onuki (tohoku university) 6” origami...

5. July 2010

Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)

6” Origami Module and Front End Electronics

6th Open Meeting of the Belle II Collaboration

2Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010


Components

Testing & Quality Check

Assembly

Module Test

Summary



Components


Assembly

Module Test

Summary



Origami Chip-on-Sensor Concept

• Principal feasibility shown in 2009 by building a prototype module using a 4” DSSD

• Successfully tested in lab and SPS beam

• Can it be scaled up to the size required for the center 6” sensor of the outer most ladder?



Summary 4” Origami

• Flex hybrid produced by CERN PCB workshop– long delivery time– almost made by hand– not suitable for series production

• Several vias broke after soldering of electronics components

• Only moderate bondability

• We found a Japanese company for production of new 6” design



Origami Design for Belle II SVD

• Present design for center module of outermost ladder (6“ HPK sensors)

• Consists of 4 parts:– Origami PCB (~ 450 mm long)– PA0: pitch adapter for n-side, glued onto hybrid– PA1, PA2: pitch adapters to connect p-side strips, wrapped around

the edge of the sensor

• Manufacturer: Taiyo Industrial Co., LTD.



Origami Design for Belle II SVD

• Design finalized in mid of March – needed some iterations with company– e.g. separate PA0 from hybrid to ensure high precision,

tear drop design for vias

• First batch of PA1 and PA2 received end of March (10 pieces each)

• 10 pieces of Origami PCB and PA0 shipped end of April

• Shipment within appointed time• PA0 already glued onto hybrids by

company



6“ Origami PCB and Pitchadapters

• Origami PCB– 3-layer design– 237µm thick (nominal)

• PA0, PA1 and PA2 – 2-layer design – 145µm thick (nominal)

Origami PCB

PA1

PA2

PA0glued onto

hybrid



Components


Assembly

Module Test

Summary



PA1 & PA2

• Top layer (coating) and thus PAs are thicker than expected• PAs are rigid complicates bending• Can the company use a thinner coating?• We brought one (thinner) pitch adapter made by CERN as sample

• Shorts and open measurement no failure found

• Design issue:– Staggering at sensor side is wrong– Does not match staggering of DSSD– Bonding is nevertheless possible – Can be used for prototype module– Layout will be corrected for next batch



Origami PCB - Optical Inspection

• Overall impression is very good• Shape of pads and lines look very precise• Gold plating of bond pads seems to be uniform• PA0 is well aligned to the footprints of the AVP

chips.

• Few minor issues:– On one PCB the top layer of PA0 is slightly

displaced by about 88µm (~1 pitch), but still bondable

– Drill of some vias is not centered, but within tolerance– The second (left hand) bias pad is covered by the

solder stop layer missing opening– Alignment marks on two PCBs are incomplete

(partially removed), e.g. hybrid #10 required for auto adjustment of our bonder..



Origami PCB – Electrical Test

• We measured the connection between the connectors and all APV chips

• ~3300 measurements in total• Very satisfying results:

9 of 10 board are good• On one PCB we found a single open

via near APV #1 (p-side)

• Design issues:– APV signals lines swapped: 0<>1, 2<>3 – doesn‘t matter for prototype

– Bias connection between PA0 and Origami PCB will be covered by neighboring hybrid

– change location of pad

Origami PCBof neighboring sensorcovers and damages

bond wires



Origami PCB – Soldering• Was an annoying issue of 4” Origami

hybrids (soldered by hand @ ~350 °C)• Broken vias after soldering, caused by

local delamintation

• Vapor phase soldering ?– lower temperature– Nanonics connector

• Baking of one hybrid: 48h @ 65°C• Solder cycle w/o applied parts:

5 min. @ 230°C• Optical inspection & electr. Test

– no visible damage– all connections still ok – no broken via



Origami PCB Soldering – Nanonics Connector

• We equipped and soldered one hybrid using vapor phase soldering no damage of PCB

• Nanonics connector is still problematic– connector has two rows of pins– sometimes they are not at the same height– causes bad connection of some pins– resoldering of inner row is difficult

• Further investigation required• Other connector available?



Origami PCB Soldering – Resistor

• Resistor in front of APV– located between two bond pads– no space for solder stop between resistor and pads

• solder tin covers bond pad no more bondable• Solution for prototype:

– we glued small pads beneath the damaged one• Future design:

– modified routing of lines between solder and bond pads– glued PA0 acts as solder stop layer

Edge of PA0



Origami PCB – Thermal Cycling

• Test long term thermal stress resistivity• 84 cycles between -10 and +30 °C• Same conditions as used for CMS

thermal tests• Duration: ~ 2 weeks• Thereafter we repeated optical inspection

and electrical test• No damage detected

Thermal Cycling

-15

-10

-5

0

5

10

15

20

25

30

35

9.6. 10.6. 11.6. 12.6. 13.6. 14.6. 15.6. 16.6. 17.6. 18.6. 19.6. 20.6. 21.6. 22.6. 23.6. 24.6.Date/Time

Te

mp

era

tu

re

[°C

] Temp Sensor 1

Temp Sensor 2



Origami PCB – Impedance of Analog Data Line• Determined diff. impedance of analog output of p-side APV #1 • Measured reflexions of rectangular input signal and

adjusted Rterm until reflection disappeared• Measurement: Zdiff = 102.6 • Simulation: Zdiff = 102.7

• Path length: ~ 45 cm, Propagation delay (measured) = 5.46 ns • Propagation speed: c = 164 800 km/s 6.07 ns/m • Hybrid cable: Zdiff = 125 still no reflexions visible

Rterm << Rz Rterm = 102.6Ω = Rz Rterm = 125Ω



Origami PCB – Ohmic Resistance of Line

• Measurement: Rline = 22 (single line)• Simulation: Rline = 9.4 half the measured value

• Comparison line geometry

nominal [µm] measured [µm] line width 100 74.3+-2.0 line distance 121 144.3+-1.5 dist.to next pair 380 410

slightly over etched, but does not explain huge difference of R

nominal [µm] measured [µm] thickness 9 5

• Measurements were done with the tactile sensor of our CMM• 5µm copper thickness is compatible with measured resistance• Apparently, there is less copper than planned, but this is not a real problem.• Anyhow, we originally requested 5µm less material budget



Origami PCB – Wire Bonding

• Fully automated bonding machine

• Bond process control • Easy to find working

parameters• Very uniform deformation• Excellent bondability

Excellent and uniform gold coating

Origami

Sensor

deformation vs. time



Components


Assembly

Module Test

Summary

5. July 2010 21

Assembly procedure of 6” Origami• We must newly develop the assembly jigs so that the size of component is entirely

different with that of 4” DSSD Origami prototype modules.• The procedures should be as simple as possible to minimize the developing and

actual assembly time (~7 weeks. limited by my stay at HEPHY), but should be extendable whole ladder for near future production.

• The procedures are developed to require basic three jigs and these supplements.

• The Jigs are used to hand the current procedure to the next procedure with keeping their alignment ( assured by pin&hole ). The assembly precision

　　 is limited by the difference of pin and hole’s diameter. If we use 　　 precise pin and linear bush( circulating boles inside wall of hole to 　　 reduce friction ), it easily achieve several m precision level. • As a results, we could assemble very smoothly on schedule using developed

procedures without any problems.

jig1 jig2 jig3

5. July 2010 22

Procedure1: Placing DSSD on the Jig1

Attachable stopper to align the DSSD

1. Placing the DSSD on the jig1

2. Fixing DSSD with vacuum chucking

Jig1Poral stone to vacuum-chuck

DSSD

3. Removing stopper and pin

Commonly used holes to hand Origami components to the other jigs

5. July 2010 23

1. Placing PAs on the sensor

Procedure2: Placing Pitch adaptors on the DSSD

2. Aligning PAs

5. July 2010 24

2. Fixing PAs to the PA-jigs with vacuum-chucking

1. Placing PA-jig on the PA

3. Picking up PAs

Procedure3: Placing PA-jigs and picking up the PAs

PA-jig

Jig1Vacuum chucking holes

PA-jig

PinsChucked PA

5. July 2010 25

2. Dispensing glue on the backside of PAs

3. Placing PA-jigs on the Jig1 again to glue

1. Placing PAs on the PA-jigs upside down

Procedure4: Picking up PA-jigs, gluing, wire-bonding

4. After cured, removing PA-jigs

5. Wire-bonding p-side of DSSD and PAsAraldite 2011(Epoxy adhesive)

5. July 2010 26

1. Placing the Support ribs in the groove of Jig2

2. Dispensing glue top of the ribs

Procedure5: Placing ribs on the jig2 and dispensing glueJig2 Support ribs

Jig2Grooves for ribs

Poral stone

5. July 2010 27

2. Flipping upside down

1. Placing the jig2(Ribs) on the jig1(DSSD) to glue

Procedure6: Placing the jig2 on the jig1

3. Fixing DSSD to the jig2 with vacuum chucking

4. After curing the glue(~24h), removing jig2

Pin

Hole Jig2

Jig1

Jig1

Jig2

5. July 2010 28

1. Placing the Rohacell on the Jig1 with as same as procedure1

3. Dispensing glue on the Rohacell


Jig1 Rohacell

2. Fixing the Rohacell with vacuum-chucking

Attachable stopper for Rohacell

5. July 2010 29

2. After cured(~24h), removing Jig1

1. Placing Jig1(Rohacell) on Jig2(DSSD) to glue them


Jig1

Jig2

Rohacell

Jig1

Jig2

Jig2

5. July 2010 30

zzz…

Procedure9:Placing the PCB on the Rohacell to align

Tired man

2. Aligning the bonding pads of the PCB to the bonding pad for N-side of DSSD

1. Placing the Origami PCB on the Rohacell(Jig2) to align

Jig2

Attachable support for the Origami PCB

Origami PCB

Microscope

5. July 2010 31

Procedure10:Picking up the PCB, gluing and wire-bonding

2. Dispensing glue on the backside of the PCB

1. Placing the Jig3 on the PCB(jig2). And then, picking up PCB to the Jig3 with vacuum-chucking

1 2

3 4

3. Placing the jig3 again to glue the PCB and Rohacell on the Jig2

4. After cured(~24h), removing Jig3

5. Wire-bonding APV to n-side DSSD

Jig3 PCB support

Jig2 Jig3

Jig3Jig2

5. July 2010 32

Procedure11:Wrapping PAs, gluing and wire-bonding

2. Dispensing PAs and gluing to the PCB

1. Wrapping the PAs with special jigs

3. After cured, wire-bonding the PAs to the APV.

=> Assembly completed

We think the developed procedures are based for the full ladder production to extend to the lateral direction.

Jig2

Special jig



Assembly – Required Equipment

Origami assembly toolbox



Assembly – Finished Module

Although the schedule was very tight, we succeeded to finish the first module before the B2GM



Components


Assembly

Module Test

Summary



Origami Module – Sensor Characteristics

• Sensor #8: B2HPK_10938-9239_8• Dark current: 3µA @ 80V• Rpoly:

– p-side: 16.3 M – n-side: 2.9 M– confirmed by measurement

I [µA]

-1,0

-0,5

0,0

0,5

1,0

1,5

2,0

2,5

3,0

3,5

0 20 40 60 80 100 120 140 160

IV CurveSpecifications of Polysilicon Resistors18 March 2010 by HPK

Process parametersPoly resistor Measurment results (Mega Ohm)

Serial No. Pside Nside MAX MIN AVE1 P1 N1 P1 17.6 15.1 16.32 P1 N1 P2 46.3 35.6 41.13 P1 N1 P3 7.1 6.4 6.84 P1 N2 5 P1 N2 N1 20.5 15.3 17.46 P1 N2 N2 7.2 6.2 6.57 P1 N2 N3 3.3 2.7 2.98 P1 N39 P1 N3

10 P1 N311 P1 N312 P2 N213 P2 N214 P2 N215 P2 N216 P1 N217 P1 N218 P1 N219 P3 N2



Stripscan Sensor #8 (n-side)

• I_strip = -3.31 nA• R_poly =2.76 Mohm• C_ac=186.83 pF• No pinhole• HPK: AC AL short at

strips 275/276 - could be verified by C_ac measurement!

376. July 2010



Origami – Source Test

• Made a source test using 90Sr source

• Module works well all APVs ok

• No I2C problems

• Currently we can read out 8 of 10 APVs(limited by existing readout system)

• Due to leak of time:– Only one single run performed

– No cooling pipe applied

– Results are very, very preliminary!



Source Test – Very Preliminary Results

strip []0 100 200 300 400 500

sig

ma

[e]

0

1000

2000

3000

4000

5000

6000

7000

8000

Origami6_mod1_p (Orgami 6") - Noise noC1Entries 512Mean 248RMS 143.8

Origami6_mod1_p (Orgami 6") - Noise

strip []0 100 200 300 400 500

sig

ma

[e]

0

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

2400Origami6_mod1_n (Orgami 6") - Noise noC3

Entries 512Mean 262.7RMS 147.6

Origami6_mod1_n (Orgami 6") - Noise

sigm a [e]0 1000 2000 3000 4000 5000 6000 7000 8000

en

trie

s []

0

10

20

30

40

50

Origam i6_mod1_p (Orgami 6") - Noise ndC1Ent ries 512Mean 3353RMS 621.3

/ ndf χ 29.85 / 26Constant 2.6± 41.3 Mean 20.8± 3330 Sigma 18.8± 439.4

Noise = 3330.4

Origam i6_mod1_p (Orgami 6") - Noise

sigm a [e]0 500 1000 1500 2000

en

trie

s []

0

20

40

60

80

100

120

140

160

180

Origam i6_mod1_n (Orgami 6") - Noise ndC3Ent ries 512Mean 975.8RMS 144.8

/ ndf χ 27.83 / 7Constant 11.5± 189.7 Mean 4.6± 962.7 Sigma 3.83± 96.74

Noise = 962.7

Origam i6_mod1_n (Orgami 6") - Noise

Average cluster noise:

p-side: 3330 e-

n-side: 963 e-

• Some noisy strips on both sides• Noise on p-side seems to high • Need to investigate• Requires measurements with cooling!



Source Test – Very Preliminary Results II

• Low SNR on p-side should be > 10 with cooling• n-side benefits from short pitch adapter (PA0) and short strips

signal [e]0 10000 20000 30000 40000 50000 60000 70000 80000 90000

en

trie

s []

0

200

400

600

800

1000

1200

1400

Origami6_mod1_p (Orgami 6" ) - Signal siC1Ent ries 34659Mean 3.506e+04RMS 1.566e+04

/ ndf χ 620.1 / 96Width 26.0± 4518 MP 53± 2.441e+04 Area 195277± 3.565e+07 GSigma 14.5± 500

Peak = 24436.5FWHM = 74.5%

Origami6_mod1_p (Orgami 6" ) - Signal

SNR []0 10 20 30 40 50 60

en

trie

s []

0

1000

2000

3000

4000

5000

6000

7000

8000

Origam i6_mod1_p (Orgami 6") - S NR snr1Entries 34657Mean 8 .845RMS 2 .774

clw = 1 2 3+

Peak = 6.74FWHM = 34.2%

Origam i6_mod1_p (Orgami 6") - S NR

signal [e]0 10000 20000 30000 40000 50000 60000 70000 80000 90000

en

trie

s []

0

1000

2000

3000

4000

5000

Origami6_mod1_n (Orgami 6" ) - Signal siC3Ent ries 95601Mean 3.048e+04RMS 1.266e+04

/ ndf χ 488.4 / 81Width 19.1± 2652 MP 26± 2.28e+04 Area 321418± 9.804e+07 GSigma 35.3± 2718

Peak = 23801.7FWHM = 55.3%

Origami6_mod1_n (Orgami 6" ) - Signal

SNR []0 10 20 30 40 50 60

en

trie

s []

0

1000

2000

3000

4000

5000

Origam i6_mod1_n (Orgami 6") - S NR snr3Entries 95600Mean 23.63RMS 9 .399

clw = 1 2 3+

Peak = 17.08FWHM = 53.8%

Origam i6_mod1_n (Orgami 6") - S NR



Components


Assembly

Wire Bonding

Module Test

Summary



Summary

• Origami Components:– New 6” Origami PCB and PAs manufactured by Taiyo Industrial Co., LTD.– Delivered all parts in time – Excellent quality– Only some minor issues– PA1 and PA2 should be slightly thinner to ease bending – Some design issues will be solved with next batch

• Assembly Procedure– Design and production of jigs within few weeks, thanks to effort of Onuki-san– Proposed assembly procedure verified by building prototype module– In principle scalable for ladder production – Only minor modifications required, e.g. using linear bush to enhance precision

• Module Performance– All APVs work well– High noise level on p-side but currently no cooling applied– More tests and analysis required– Beam test and irradiation scheduled for October 2010



Thank you for your attention



Backupslides

5. july 2010 christian irmler (hephy vienna), yoshiyuki onuki (tohoku university) 6” origami...

Documents

th open meeting

christian irmler hephy

collaboration slide

origami design

design slide

origami module

hybrid slide

open measurement