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A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen , Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION TECHNOLOGY RESEARCH GROUP ELECTROMAGNETICS

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Page 1: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND

INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS

Martijn Huynen, Daniël De Zutter, Dries Vande Ginste

DEPARTMENT OF INFORMATION TECHNOLOGY

RESEARCH GROUP ELECTROMAGNETICS

Page 2: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

OUTLINE

• Motivation

• Proposed technique

• Examples

• Conclusions

2

Page 3: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

OUTLINE

• Motivation

• Proposed technique

• Examples

• Conclusions

3

Page 4: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

MOTIVATION

Smaller & faster electronics

New solutions such as 3-D ICs

4

Increasing complexity,

functionality,

power constraints, …

signal integrity,

Page 5: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

MOTIVATION

Many challenges

Rigorous modeling increasingly essential !

5

Heat distribution Signal integrity (crosstalk, dispersion, distortion, …)

Page 6: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROBLEM STATEMENT

- Finite conductivity, skin effect, proximity effect

difficult to model broadband

- Solved in 2-D [1, 2] using a Dirichlet-to-Neumann operator

- Open question in 3-D

- Recently proposed for 3-D cylinders and cuboids [3, 4]

6

[1] D. De Zutter and L. Knockaert, IEEE MTT, vol. 53, pp. 2526-2538 (2005)

[2] T. Demeester and D. De Zutter, IEEE MTT, vol. 56, pp. 1649-1660 (2008)

[3] M. Huynen, M. Gossye, D. De Zutter and D. Vande Ginste, IEEE AWPL, vol. 16, pp. 1052-1055 (2017)

[4] M. Huynen, D. De Zutter and D. Vande Ginste, accepted for IEEE MWCL

Page 7: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

OUTLINE

• Motivation

• Proposed technique

• Examples

• Conclusions

7

Page 8: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

8

Original situation

Field equivalence principle

Equivalent situation

Page 9: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

9

Electric field integral equation

Test and basis functions

Page 10: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

10

Discretization

Page 11: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

11

Discretization

Page 12: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

12

Discretization

Page 13: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

13

Discretization

Via partial integration:

Average potential

on each rectangle

Page 14: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

14

Circuit interpretation

Still 2 sets of unknowns:

-

-

Page 15: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

15

3-D Dirichlet-to-Neumann operator [3, 4]

[3] M. Huynen, M. Gossye, D. De Zutter and D. Vande Ginste, IEEE AWPL, vol. 16, pp. 1052-1055 (2017)

[4] M. Huynen, D. De Zutter and D. Vande Ginste, accepted at IEEE MWCL

Differential surface admittance operator

Page 16: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

16

Normalization of

Magnetic eigenfunctions ofWavenumber of

Page 17: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

17

Discretization

Page 18: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

PROPOSED TECHNIQUE

18

Circuit interpretation

Only 1 set of unknowns left:

-

Page 19: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

OUTLINE

• Motivation

• Proposed technique

• Examples

• Conclusions

19

Page 20: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: PARALLEL CONDUCTORS

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Normalized resistance = total resistance (3-D) / length

Pouillet DC resistance

Proximity effect fan out

Page 21: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: PARALLEL CONDUCTORS

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Normalized inductance

[1] D. De Zutter and L. Knockaert, IEEE MTT, vol. 53, pp. 2526-2538 (2005)

Increasing length 2-D results

Page 22: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: RIGHT-ANGLED CORNER

22

right-angled corner cuboid

Page 23: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: RIGHT-ANGLED CORNER

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right-angled corner

Page 24: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: RIGHT-ANGLED CORNER

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Proximity effect crossover

Resistance

Finite difference method (FDM) DC value

Page 25: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: RECTANGULAR LOOP

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Page 26: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: RECTANGULAR LOOP

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[5] U. R. Patel, S. V. Hum and P. Triverio, IEEE 21st Workshop on SPI, pp. 1-4 (May 2017)

Resistance

Confirmation of rigorous modeling

of 3-D effects

Page 27: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: RECTANGULAR LOOP

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[5] U. R. Patel, S. V. Hum and P. Triverio, IEEE 21st Workshop on SPI, pp. 1-4 (May 2017)

Inductance

Faulty meshing unphysical kink

Page 28: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: RECTANGULAR LOOP

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Resistance

Smaller loop stronger proximity effect

Page 29: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

EXAMPLE: RECTANGULAR LOOP

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Inductance

Page 30: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

OUTLINE

• Motivation

• Proposed technique

• Examples

• Conclusions

30

Page 31: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

CONCLUSIONS

Novel 3-D interconnect modeling tool Based on BIE (without volume meshing)

Fully 3-D differential surface admittance operator

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Validation and applications Application to PCB and IC interconnect structures

Accurate modeling of corners

Broadband extraction of R- and L-parameters

Thoroughly compared to industry standards

⇒ Rigorous approach for skin effect, proximity effect, etc. in 3-D

interconnects

Page 32: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

FURTHER READING

2-D:D. De Zutter and L. Knockaert, “Skin effect modeling based on a differential surface admittance operator”, IEEE MTT, vol. 53, pp. 2526-

2538 (2005)

T. Demeester and D. De Zutter, “Quasi-TM Transmission Line Parameters of Coupled Lossy Lines Based on the Dirichlet to Neumann

Boundary Operator”, IEEE MTT, vol. 56, pp. 1649-1660 (2008)

3-D:M. Huynen, M. Gossye, D. De Zutter and D. Vande Ginste, “A 3-D Differential Surface Admittance Operator for Lossy Dipole Antenna

Analysis”, IEEE AWPL, vol. 16, pp. 1052-1055 (2017)

M. Huynen, D. De Zutter and D. Vande Ginste, “Boundary integral equation study of the influence of finite conductivity on antenna

radiation using a 3-D differential surface admittance operator”, ACES Symposium - Italy (March 2017)

M. Huynen, D. De Zutter and D. Vande Ginste, “Rigorous full-wave resistance and inductance computation of 3-D interconnects”,

accepted at IEEE MWCL

32

Page 33: A FULLY 3-D BIE EVALUATION OF THE RESISTANCE AND ...€¦ · INDUCTANCE OF ON-BOARD AND ON-CHIP INTERCONNECTS Martijn Huynen, Daniël De Zutter, Dries Vande Ginste DEPARTMENT OF INFORMATION

Martijn HuynenPhD student

ELECTROMAGNETICS GROUP

E [email protected]

T +32 9 331 48 81

www.ugent.be

www.imec.be

Universiteit Gent

@ugent

Ghent University