aadvance comprehensive training manual (rev 1.7 oct 2012)

8/10/2019 AADvance Comprehensive Training Manual (Rev 1.7 Oct 2012)

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System Training Manual

Operation,

System Build,

Configuration,

Programming,

Troubleshooting,

& Maintenance

For the AADvance

Programmable Controller

Revision 1.7

October 2012


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2 AADvance System Training Manual, version 1.7

Copyright Notice and Disclaimers

Notice

In no event will Rockwell Automation be responsible or liable for indirect or consequential

damages resulting from the use or application of this equipment. The examples given in

this manual are included solely for illustrative purposes. Because of the many variables andrequirements associated with any particular installation, Rockwell Automation does not

assume responsibility or reliability for actual use based on the examples and diagrams.

No patent liability is assumed by Rockwell Automation, with respect to use of information,

circuits, equipment, or software described in this manual.Reproduction of this manual in whole or in part, without written permission of Rockwell

Automation is prohibited.

All trademarks are acknowledged.

Disclaimer

It is not intended that the information in this publication covers every possible detail about

the construction, operation, or maintenance of a control system installation. You shouldrefer to your own (or supplied) system safety manual, installation instructions and

operator/maintenance manuals.

Revision and Updating Policy

This document is based on information available at the time of its publication; however, the

document contents are subject to change from time to time. You should contact Rockwell

Automation Technical Support by e-mail [email protected] to check if you

have the latest version of this publication.

Copyright Notice, Rockwell Automation 2012This document contains proprietary information that is protected by copyright. All rights

are reserved.

Documentation Feedback

Your comments will help us to serve your documentation needs better. If you discover any

errors or have any suggestions on how to improve this publication send your comments toour product support group: [email protected]


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Table of Contents 3

Warning

Radio Frequency Interference

Most electronic equipment is influenced by radio frequency interference (RFI). Caution

should be exercised with regard to the use of portable communications equipment around

such equipment. Signs should be posted in the vicinity of the equipment cautioning againstthe use of portable communications equipment.

Maintenance

Maintenance must be performed only by qualified personnel. Otherwise personal injury or

death, or damage to the system may result.

Company BackgroundICS Triplex has been manufacturing and supplying safety critical shutdown and control

systems since 1969.

The Regent Triple Modular Redundant (TMR) system was introduced in 1986. Itincorporated Hardware-Implemented Fault Tolerance (HIFT). The Regent system has been

field-proven in hundreds of installation world-wide.

The Regent + Plus product family was introduced in 1995 and provided additional features

and lower cost to the marketplace.

The Trusted TMR system was introduced in 1997. The Trusted system is compatible with

legacy Regent and Regent + Plus systems allowing a direct migration path for existing

systems.

AADvance was released in 2008. AADvance is a flexible and scalable system designed to

enhance Trusted, not replace it. AADvance components can be configured as simplex, dual

or triplicated. Systems may be small and standalone, or large and distributed.

ApplicabilityThis Training Manual applies to release 1.3.


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Issue Record

Issue Date Comments

1.6 June 2011 Updated for Release 1.2

1.7 July 2012 Integrated with user manuals and updated for release 1.3


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Table of Contents 5

Table of Contents

Chapter 1: Introduction

Course Goals .................................................................................................................... 1-1Who This Course is Intended For .................................................................................... 1-2

Recommended Prerequisites ............................................................................................ 1-2

Course Length .................................................................................................................. 1-2

Chapter 2: System OverviewPurpose ............................................................................................................................. 2-1

Objectives ......................................................................................................................... 2-1AADvance System Overview .......................................................................................... 2-2

Features ......................................................................................................................... 2-2

General System Layout ................................................................................................. 2-3Internal Bus Structure ................................................................................................... 2-5

Flexible Configurations .................................................................................................... 2-6

Non-Redundant, Fail Safe Architecture ........................................................................ 2-7Dual Processor, Non-Redundant I/O ............................................................................ 2-8

Dual Architecture .......................................................................................................... 2-9

TMR Input & Processor, Fault Tolerant Output ......................................................... 2-10

Mixed Architecture ..................................................................................................... 2-11Distributed Architecture .............................................................................................. 2-12

Test Your Knowledge .................................................................................................... 2-13

Chapter 3: System ComponentsPurpose ............................................................................................................................. 3-1

Objectives ......................................................................................................................... 3-1

System Components ......................................................................................................... 3-2Hardware ........................................................................................................................ 3-2

Software .......................................................................................................................... 3-3

Processor Module ............................................................................................................. 3-4

Processor Base Unit ......................................................................................................... 3-8Digital Input Modules .................................................................................................... 3-10

Analog Input Modules ................................................................................................... 3-12

Digital Output Module ................................................................................................... 3-14I/O Module Base Unit .................................................................................................... 3-16

Field I/O Termination Assemblies ................................................................................. 3-18

Digital Input Termination Assemblies ......................................................................... 3-18Analog Input Termination Assemblies ......................................................................... 3-22

Digital Output Termination Assemblies ....................................................................... 3-26Test Your Knowledge .................................................................................................... 3-29


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Chapter 4: System BuildPurpose ............................................................................................................................. 4-1Objectives ......................................................................................................................... 4-1

System Build .................................................................................................................... 4-2

Environmental Limits ...................................................................................................... 4-3

Component Sizes and Weights ........................................................................................ 4-4Free Space ........................................................................................................................ 4-6

Mount a Processor Base Unit ........................................................................................... 4-7

Mount the I/O Base Units ................................................................................................ 4-8Mount Termination Assemblies ..................................................................................... 4-10

Mount I/O Expansion Cables ......................................................................................... 4-12

Module Power ................................................................................................................ 4-14Module Power Supply Requirements.......................................................................... 4-15

Module Power Connections ........................................................................................ 4-16

Grounding ...................................................................................................................... 4-18

Security Dongle .............................................................................................................. 4-19

Processor Fault Alarm Contacts ..................................................................................... 4-20Serial Connections ......................................................................................................... 4-22

Field Power .................................................................................................................... 4-23Wire the Field Connections ............................................................................................ 4-24

Digital Inputs ............................................................................................................... 4-25

Analog Inputs .............................................................................................................. 4-27Digital Outputs ............................................................................................................ 4-30

Cable Management ........................................................................................................ 4-32

Module Polarization ....................................................................................................... 4-34Installing Modules and Blanks ....................................................................................... 4-36

Heat Dissipation ............................................................................................................. 4-38Parts List ........................................................................................................................ 4-40


Chapter 5: Workbench Overview and ProgrammingPurpose ............................................................................................................................. 5-1

Objectives ......................................................................................................................... 5-1Workbench ....................................................................................................................... 5-2

Workbench Overview ...................................................................................................... 5-4

Dictionary ......................................................................................................................... 5-6Data Types .................................................................................................................... 5-8

Import / Export Variables ........................................................................................... 5-19

Equipment Editor ........................................................................................................... 5-23Inserting an I/O Module .............................................................................................. 5-30

Creating Programs .......................................................................................................... 5-36

Saving a Project ............................................................................................................. 5-46



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Chapter 10: Bindings Between ResourcesPurpose ........................................................................................................................... 10-1Objectives ....................................................................................................................... 10-1

Variable Bindings........................................................................................................... 10-2

Plan Your Project ........................................................................................................... 10-3

Prepare Your Project ...................................................................................................... 10-4Linking Resources .......................................................................................................... 10-7

Simulate and Test Your Bindings ................................................................................ 10-10

Test Your Knowledge .................................................................................................. 10-12

Chapter 11: Version Source ControlPurpose ........................................................................................................................... 11-1Objectives ....................................................................................................................... 11-1

Version Source Control .................................................................................................. 11-2

Repository ..................................................................................................................... 11-2

Check In and Check Out ................................................................................................ 11-4

Version Status Icons ....................................................................................................... 11-5Comparing Version ........................................................................................................ 11-6

Retrieving Earlier Versions ............................................................................................ 11-8Test Your Knowledge .................................................................................................... 11-9

Chapter 12: Miscellaneous Workbench FeaturesPurpose ........................................................................................................................... 12-1

Objectives ....................................................................................................................... 12-1Cross Reference Browser ............................................................................................... 12-2

Printing ........................................................................................................................... 12-4Passwords ....................................................................................................................... 12-7

POU Access Control ..................................................................................................... 12-8

Resource Access Control .............................................................................................. 12-9

Configuration (Controller) Access Control ................................................................ 12-10Project Access Control ............................................................................................... 12-11

Export / Import Workbench Elements ......................................................................... 12-12

Export ........................................................................................................................ 12-12Import ........................................................................................................................ 12-13

Archive / Restore Projects ............................................................................................ 12-16

Archive ...................................................................................................................... 12-16Restore ...................................................................................................................... 12-18



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Table of Contents 9

Chapter 13: OPCPurpose ........................................................................................................................... 13-1Objectives ....................................................................................................................... 13-1

OPC Server .................................................................................................................... 13-2

Data Access vs. Alarm & Event ................................................................................... 13-3

Configuring the OPC Server .......................................................................................... 13-4Configuring OPC Clients ............................................................................................... 13-7


Chapter 14: TroubleshootingPurpose ........................................................................................................................... 14-1Objectives ....................................................................................................................... 14-1

Self Test Cycle Times .................................................................................................... 14-2

Latching and Unlatching Faults ..................................................................................... 14-3

Fault Types ..................................................................................................................... 14-4

Viewing Variables Live ................................................................................................ 14-6I/O State and LED Indications ...................................................................................... 14-7

Processor Event Log ...................................................................................................... 14-9Test Your Knowledge .................................................................................................. 14-13

Chapter 15: Replacing ModulesPurpose ........................................................................................................................... 15-1

Objectives ....................................................................................................................... 15-1Removing Modules ........................................................................................................ 15-2

Installing Modules .......................................................................................................... 15-3Test Your Knowledge .................................................................................................... 15-5

Appendix 1: AADvance Discover Util ityPurpose .......................................................................................................................... A1-1

Objectives ...................................................................................................................... A1-1

Processor Base Unit Configuration ............................................................................... A1-2

Appendix 2: GlossaryPurpose .......................................................................................................................... A2-1

Objectives ...................................................................................................................... A2-1

Glossary ........................................................................................................................ A2-2


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Appendix 3: Puzzles and ExercisePurpose .......................................................................................................................... A3-1Objectives ...................................................................................................................... A3-1

Hardware Puzzle ........................................................................................................... A3-2

Software Puzzle ............................................................................................................. A3-3

Programming Exercise .................................................................................................. A3-4

Appendix 4: Safety Manual ConsiderationsPurpose .......................................................................................................................... A4-1

Objectives ...................................................................................................................... A4-1

Please Read the Safety Manual! .................................................................................... A4-2Rules vs. Recommendations ...................................................................................... A4-2

High Demand, SIL 3 and Energize to Action Applications ....................................... A4-3

Utilizing I/O Module Diagnostics .............................................................................. A4-3

Degraded Run Time Restrictions ............................................................................... A4-7

I/O Forcing ................................................................................................................. A4-8Safety Manual Checklists ......................................................................................... A4-10


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Introduction 1-1

Introduction

Course Goals

To teach users of the AADvance system:

How the AADvance system operates as a non-redundantand fault tolerant programmable logic controller.

What modules and components are used in the

AADvance system.

How to put an AADvance system together.

How to use the workbench to create, modify, test,download and update projects and programs to the

system.

How to create user defined functions and functionblocks.

How to pass safety critical data between controllers.

How to communicate with the system using OPC.

How to utilize the version control features.

How to troubleshoot a system and replace modules.

Chapter 1


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1-2 AADvance System Training Manual, version 1.7

Who This Course Is Intended For

Personnel responsible for designing, configuring andprogramming an AADvance system.

Personnel responsible for installation, troubleshooting

and maintenance of an AADvance system.

Personnel designing a control system that needs tocommunicate with an AADvance system.

Recommended Prerequisites

A general knowledge of programmable logic controllers

(PLCs).

A background in industrial electronic control principles

and practices.

A level of competence using Microsoft Windows

operating systems and programs.

Course Length

4 days

The majority of the course is hands-on. Students implement

working solutions using actual hardware and software.


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System Overview 2-1

System Overview

Purpose

To provide an overview of the AADvance system and itscomponents.

Objectives

To understand the different system components andconfigurations.

To understand what module configurations meet whatSafety Integrity Levels (SIL).

To understand the types and names of modules used inthe AADvance system.

To understand the configuration limits of the system.

Chapter 2


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AADvance System Overview

AADvance is an industrial controller that can be configured fornon-redundant and fault tolerant control and safety applications.It is a scalable system consisting of different modules and

interconnecting base units. AADvance can be used for a widevariety of applications such as:

Critical process control

Emergency shutdown

Fire and gas detection/protection

Rotating machinery control

Burner management

Boiler and furnace control

Distributed monitoring and control

The system is designed for both high and low demandapplications.

Features

The main features of AADvance are:

Flexible modular construction using individual modulesto build a system.

Operates as a stand alone system or part of a largerdistributed network.

Easily transforms from a non-redundant to a faulttolerant system.

I/O module expansion/additions without systeminterruption.

IEC 61508 certified system; reviewed and approved byTV.

Handles the full range of IEC 61131 programminglanguages.

Supports industry standard protocols such as HART,Ethernet, Modbus RTU, Open Modbus TCP, CIP andOPC.


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System Overview 2-3

General System Layout

The AADvance system consists of:

A processor base unit (that can hold up to three

processor modules) I/O base units (that can hold up to three I/O modules)

I/O termination assemblies (that are inserted into the I/O

base units)

Processor and I/O modules (that are inserted into the

base units)

Figure 2-1: System Components


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A processor base unit can support up to 8 I/O base units (up to

24 I/O modules) on its right side (Bus 1), and up to the same

number on its left side (Bus 2), for a total of 48 modules.

Module positions within the I/O base units are numbered from

01 to 24, the left most position being slot 01. Any individualmodule position within the system is uniquely identified by the

combination of its bus and slot number, for example 1-01.

Expansion cables may be used to connect base units, as shown

in Figure 2-2.

Figure 2-2: Example System Layout

I/O base units do

not plug directly

into the left

connector of theprocessor base unit.

Use an extension

cable.

48 simplex

modules, 24 dual,

or 16 triplicated.

There can be a mixwithin a system.


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System Overview 2-5

Internal Bus Structure

Internal communications between the processor and I/Omodules are supported by command and response buses that arerouted through the processor and I/O base units.

The processor modules send commands to the I/O modules andprocess their returned responses. Each I/O module has adedicated response line back to the processors. An inter-processor link (IPL) provides the communication links betweendual or triple processor modules.

Figure 2-3: Internal Bus Structure


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Flexible Configurations

The AADvance system is flexible and scalable. Configurationsrange from non-redundant fail safe to triplicated fault tolerant.

Individual modules are designed as fail safe. Redundantmodules are implemented for fault tolerance.

Processor Modules

A single processor module meets SIL 2 requirements.Redundant processor modules (two or more) meet SIL 3requirements. High demand applications also require the use ofredundant processor modules.

Input Modules

Individual input modules meet SIL 3 requirements. Redundantmodules are implemented for fault tolerance.

Output Modules

Individual output modules meet SIL 2 requirements in a

normally de-energized application and SIL 3 requirements in anormally energized application. Redundant (dual) modules meetSIL 3 requirements in a normally de-energized application andprovide fault tolerance in a normally energized application.

Output modules incorporate dual redundant circuitry internally.A dual module configuration provides a quad redundant outputcircuit arrangement.

Typical system configurations are covered in the following

pages.

Triplicated output

modules are not

necessary and are

not supported.


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System Overview 2-7

Non-Redundant, Fail Safe Architecture

Non-redundant modules will fail safe on the first detected fault

and the process under control will shut down.

This configuration meets SIL2 requirements (due to the single

processor) and is suitable for low demand mode applications

with either de-energise or energise to trip outputs.

This configuration is also known as 1oo1D.

Figure 2-4: 1oo1D Configuration


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Dual Processors, Non-Redundant I/O

Non-redundant I/O modules will fail safe on the first detected

fault and the process under control will shut down.

The processor modules will degrade to 1oo1D on the first fault

and must be replaced within the MTTR (Mean Time To Repair)

assumed in the PFD (Probability of Failure on Demand)

calculations in order to maintain the SIL 3 rating.

This configuration is suitable for high as well as low demand

mode applications and meets SIL3 requirements (SIL 2 for

energize to trip outputs).

Figure 2-5: 1oo2D Processors, 1oo1D I/O Configuration


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System Overview 2-9

Dual Architecture

Redundant I/O modules provide fault tolerance. Duplicated

output modules also meet SIL3 requirements for energise to trip

outputs.

Input modules will degrade to 1oo1D (fail safe configuration)

on the first detected fail danger fault with no time limit to

repair.

Processor modules will degrade to 1oo1D on a module fault and

must be replaced within the MTTR (Mean Time To Repair)

assumed in the PFD (Probability of Failure on Demand)

calculations in order to maintain the SIL 3 rating.

A failed output module used for a SIL3 energise to trip must be

replaced within the MTTR assumed in the PFD calculations.There is no time limit in normally energized applications.

This configuration is also known as 1oo2D.

Figure 2-6: Dual Configuration

Termination

assemblies can

span across I/O

base units.


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TMR Input and Processor, Fault Tolerant

Output

Redundant I/O modules provide fault tolerance. Duplicated

output modules also meet SIL3 requirements for energise to trip

outputs.

Input modules will degrade to 1oo2D on a first fault. They will

degrade to 1oo1D on a second fault with no time limit to repair.

Processor modules will degrade to 1oo2D on a first fault. They

will degrade to 1oo1D on second module fault and a processor

must be replaced within the (Mean Time To Repair) assumed in

the PFD (Probability of Failure on Demand) calculations in

order to maintain the SIL 3 rating.

Output modules will degrade to 1oo1D on the first fault and

must be replaced within the MTTR assumed in the PFD

calculations (only for energize to trip outputs). There is no time

limit for normally energized applications.

Figure 2-7: TMR (2oo3D) Inputs & Processors, Fault TolerantOutput Configuration


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System Overview 2-11

Mixed Architecture

There can be a mixture of architectures and SILs within one

system. Figure 2-7 shows non-redundant and dual I/O

configurations with dual processors. Triplicated inputs and/or

processors may also be included.

Figure 2-8: Mixed Architecture


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Distributed Architecture

It is possible to locate I/O modules in separate systems and link

the data using a network connection certified for safety

applications. The systems share variables using bindings, as

covered in Chapter 10.

Figure 2-9: Distributed Architecture


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System Overview 2-13

Test Your Knowledge

1.

How many of each I/O module are required to meet SIL3 in a normally energized application?

2.

How many processor modules are required to meet SIL3?

3. What is the minimum number of modules required forfault tolerance?

4. What is the total number of I/O modules that a processorcan support?

5.

Are triplicated output modules supported?

6. How many response buses does a processor have?


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System Components 3-1

System Components

Purpose

To provide an overview of the AADvance system and its

components.

Objectives

To understand the types and names of modules andcomponents used in the AAdvance system.

To understand module and component features.

Chapter 3


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System Components

Hardware

The current release of AADvance consists of a 9110 processormodule, 9401 & 9402 24V isolated digital input modules (8 &16 channel), 9431 & 9432 4 20mA isolated analog input

modules (8 & 16 channel), 9451 24V digital output module and

9481 & 9482 isolated analog output modules (3 & 8 channel).Other components required to complete the systems are a 9100

processor base unit, 9300 I/O base units for connecting the I/O

modules to the processor, 9310 bus extension cable and

termination assemblies for connecting the I/O modules to fielddevices.

The hardware is modular. A processor base unit supports up tothree processor modules. I/O base units support up to three I/O

modules. I/O base units mate directly with the processor base

unit and other I/O base units. I/O base units provide the inter-module communications buses and route power from the

processor base unit to the I/O modules. The system becomes

one interconnected mechanical and electrical assembly once

assembled.

Figure 3-1: AADvance System


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1 9110

2 C C

3 9401 24

4 9451 24

5 9852 24 8 C. A

6 9802 16 C.

A

7 9100 B

8 C

9

Table 3-1: AADvance Components

Hardware may be mounted on a DIN rail or flat panel. The

system does not require forced air cooling fans.

Software

AADvance can be a distributed system where each node

(referred to as a configuration) has at least a single processor

module and its associated I/O. Each node is a stand alone

system configured using IEC 61131-3 languages. Data mayeasily be transferred between nodes using bindings. Programs

may be simulated offline for testing. AADvance runs a certified

for safety operating system.


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Processor Module

The 9110 processor module communicates with the network,

handles I/O scanning and solves application logic. Itincorporates the following features:

Rated for applications up to SIL2 (non-redundant) and SIL 3(dual & triple)

IEC 61508 certified

Handles full range of IEC61131-3 languages

Application processor,

communications co-processor

and math co-processor Two Ethernet and two serial

ports (RS485) per processor

MODBUS, CIP and AADvancesafety network protocols

Built in diagnostic testing andindependent watchdog

Removal and replacementwithout system interruption in

dual or triple configurations System self-discovery at start-

up

Figure 3-2: AADvance

Processor Module


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Battery

A replaceable battery is used to retain

the following during a power loss:

1) system diagnostic logs

2) keep the real time clock running

3) variables flagged as retained

Resources and programs are stored inflash memory that does not need a

battery.

The battery is a coin type BR2032 and is secured in a holderunder the front cover of the module. The holder is provided

with a ribbon to facilitate removal of the battery, as shown in

Figure 3-3.

You gain access to the battery by unscrewing the protective

cover on the lower portion of the front panel.

Fault Reset Button

There is a fault reset button on the front of each processor

module. It is used to clear any fault indications and allow

replaced I/O modules to come online. However, if a fault is stillpresent, the diagnostic system will report a fault again so

quickly there will be no visible change in the status indications.

Module Locking Mechanism

Each module (processor and I/O) has a locking mechanism that

secures the module onto its base unit. The locking mechanism is

a screw visible on the front panel of the module. It is engaged

by a clockwise quarter turn of a flat blade screwdriver. Themodule incorporates an interlock which detects when a module

is locked or unlocked.

Figure 3-3:Processor Battery

Pressing the fault

reset button does

not impact scan

time or the

handling of I/O.

The battery will last

for approximately

ten years under

normal conditions(powered) and six

months unpowered.

Modules will only

run when the screw

is in the locked

position.


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LEDs

There are 10 LEDs on the front of the module. The meaning of

each LED is described in Table 3-2.

/ ; ;

/

()

A

()

.

.

A ,

;

.

.

()

A ()

/ .

.

/

A A /,

A

A


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A

()

A

Table 3-2: Processor LED Status


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Processor Base Unit

Figure 3-4: AADvance Processor Base Unit

The 9100 processor base unit accepts up to three processormodules and incorporates the following features:


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Provides redundant connections for the system power

Provides the connection for ground

Provides the connections for the external redundant control

network via two Ethernet connectors per processor

Provides the connections for two serial ports per processor

Provides the connection for a security dongle

Figure 3-5: AADvance Processor Base Unit Detail

11, 12 1 2 A

21, 22 1 2 B

31,33 1 2 C

11, 12 1 2 A

21, 22 1 2 B

31, 32 1 2 C

1, 2 +24 & 0 1 2

A C ( )

C

Table 3-3: Processor Base Unit Connection Information

Module power is

connected to the

processor base unit

and connects

through the I/O

base units to powerall I/O modules.


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Digital Input Modules

The 9401 (8 channel) and 9402 (16 channel) are 24Vdc digital

input modules. They accept galvanically isolated inputs andperform signal conditioning and conversion.

The modules incorporate extensivediagnostics. Individual modules are

non-redundant, fail-safe, and

certified for use in SIL 3

applications.

Redundancy and fault tolerance is

achieved by grouping two or threemodules together with common

field connections.

Modules can be removed and

replaced online without system

interruption when used in

redundant (dual or triple)configurations.

Sequence of events (SOE)resolution is 10 msec.

The modules measure analog

voltage in order to perform linemonitoring and field fault detection

(e.g., open / short circuits).

Switching levels for each input

channel are configurable in the

workbench. The default parametersare:

Off: 0 to 5V dc

On: 15 to 30V dc

There are 11 LEDs on the front of

the module. The meaning of eachLED is described in Table 3-4.

Figure 3-6: AADvanceDigital Input Module


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()

A (.., )

C ( )/

C ( )

A ( )

C

Table 3-4: Digital Input Module LED Status Indications


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Analog Input Modules

The 9431 (8 channel) and 9432 (16 channel) are 24Vdc analog

input modules. They accept galvanically isolated 4 20mAinputs and perform signal conditioning and conversion.

The modules incorporate extensivediagnostics. Individual modules are

non-redundant, fail-safe, and

certified for use in SIL 3

applications.


achieved by grouping two or threemodules together with common

field connections.

Modules can be removed and

replaced online without system


redundant (dual or triple)configurations.

Monitoring levels for each analogchannel are configurable in the

workbench. The default parameters

are:

Fault: 0 to 3.8mA

Normal: 3.8 to 22.0mA

Fault: >22.0mA

The modules support HART

(Highway Addressable Remote

Transducer) communications.

There are 11 LEDs on the front of

the module. The meaning of each

LED is described in Table 3-5.Figure 3-7: AADvanceAnalog Input Module


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()

A (.., )

C

A ( , , )

C

Table 3-5: Analog Input Module LED Status Indications


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Digital Output Module

The 9451 isolated digital output module connects to eight

isolated circuits and incorporates the following features:

Dual series output switchesper channel (1oo2)

Built in overload protectionper channel

1A continuous rating for eachcircuit

Voltage and currentmonitoring (feedback) per

channel

Short circuit and open circuitline fault detection for on andoff channels

Dual redundant field powerwithout the need for external

diodes

Output channel reversecurrent protection

The modules incorporate

extensive diagnostics. Individualmodules are fail-safe and certifiedfor use in SIL 2 normally de-

energized and SIL 3 normally

energized applications.


achieved by grouping twomodules together with common

field connections. Two modules

provide a quad output circuit

arrangement and full faulttolerance.

Modules can be removed andreplaced online without system


redundant (dual) configurations.

Figure 3-8: AADvance

Digital Output Module

Triplicated output

modules are not

necessary and are

not supported.


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There are 11 LEDs on the front of the module. The meaning of

each LED is described in Table 3-6.

()

A (.., )

C /

C /

A

C

Table 3-6: Digital Output Module LED Status Indications


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I/O Module Base Unit

Figure 3-9: AADvance I/O Module Base Unit

The 9300 I/O module base unit connects the processor to I/Omodules. You can install up to three modules on a base unit.

The base unit will also allow you to fit the same number of

termination assemblies in different combinations. For, example,you can fit three simplex termination assemblies; or one dual

and one simplex together, or one triple termination assembly.The combination will depend entirely on your required

configuration.

Termination

assemblies can

span across base

units.


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The I/O base unit incorporates the following features:

Provides connection for one, two or three input/outputmodules depending on the redundancy requirements

Provides connections with termination assemblies that

connect to the field input/outputs

Routes power to the I/O modules from the processor baseunit

Routes common processor commands to the I/O modules

Routes responses between the I/O modules and processors


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Field I/O Termination Assemblies

Field wiring is connected to termination assemblies (TAs).

Digital Input Termination Assemblies

A 9801 digital input termination assembly is a non-redundnatunit that provides connections for 16 non-isolated digital input

channels and mates with a single 9401 or 9402 24Vdc digital

input module.

Figure 3-10: AADvance DI Non-Redundant Termination Assembly


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Figure 3-11 & 12: AADvance DI Non-Redundant

Termination Assembly and Fuses

Fuse (shown in the figures above) will blow when an extreme

over voltage is applied. Fuses can be replaced without removing

a module using needle-nose pliers.

The assembly incorporates the following features:

16 input channels for a simplex configuration

Industry standard field device connections at the terminalblocks

Fail safe design with individually fused channels and overvoltage protection


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The 9802 termination assembly is the dual version and mates

with two 9401 or 9402 modules, as shown in Figure 3-13.

Figure 3-13: AADvance DI Dual Termination Assembly


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The 9803 termination assembly is the triplicated version and

mates with three 9401 or 9402 modules, as shown inFigure 3-14.

Figure 3-14: AADvance DI Triplicated Termination Assembly


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Analog Input Termination Assemblies

A 9831 termination assembly is a non-redundant assembly that

provides connections for 16 non-isolated analog input channelsand mates with a single 9431 or 9432 analog input module.

Figure 3-15: AADvance AI Non-Redundant Termination Assembly

Each channel has a 50mA fuse to prevent component damage inover-current situations. Fuses can be replaced without removing

a module using needle-nose pliers


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Figure 3-16: AADvance AI Simplex Termination Assembly

The assembly incorporates the following features:

16 input channels for a simplex configuration

Industry standard field device connections at the terminalblocks

Fail safe design with individually fused channels


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The 9832 termination assembly is the dual version and mates

with two 9431 or 9432 modules.

Figure 3-17: AADvance AI Dual Termination Assembly


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The 9833 termination assembly is the triplicated version and

mates with three 9431 or 9432 modules.

Figure 3-18: AADvance AI Triplicated Termination Assembly


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Digital Output Termination Assemblies

Figure 3-19: AADvance DO Non-Redundant Termination Assembly


provides termination for 8 digital outputs and mates with asingle 9451 24Vdc digital output module.

The termination assembly routes the module output channelsvia the mating connector to the field connection terminal

blocks.

The 24Vdc field voltages VFIELD 1 and VFIELD 2, used bythe output module for the output field voltages, are connected at

the terminal blocks and routed via two replaceable 10A fuses F1

and F2. These fuses, shown in Figures 3-19 through 21, giveprotection for the output module against field faults.


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Figure 3-20 & 21: AADvance DO Termination Assemblyand Field Power Fuses


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Figure 3-22: AADvance DO Dual Termination Assembly

A 9852 termination assembly is a dual assembly that provides

termination for 8 digital outputs and mates with two 945124Vdc digital output modules.


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Analog Output Termination Assemblies

Figure 3-19: AADvance AO Non-Redundant Termination Assembly


provides termination for 8 analog outputs and mates with asingle 9481 or 9482 analog output module.

The termination assembly routes the module output channels

via the mating connector to the field connection terminal

blocks.

Although it has a fuse cover, there are no fuses. The visible

components are capacitors for EMC suppression.


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Figure 3-22: AADvance DO Dual Termination Assembly

A 9882 termination assembly is a dual assembly that provides

termination for 8 analog outputs and mates with two 9481 or9482 analog output modules.


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System Build 4-1

System Build

Purpose

To summarize how to assemble an AADvance system.

Objectives

To understand the environmental limits of the system.

To understand module power requirements, heatdissipation and weight.

To be able to install base plates, termination assemblies,cables and modules.

To be able to wire field devices to the system.

Chapter 4


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System Build

Note: This chapter is a condensed version of the AADvanceSystem Build Manual, which system integrators are

highly encouraged to read.

AADvance is a modular system. Base units snap together usingmating connectors and retaining clips.

The base units provide the interconnections for module power,processor and I/O data. Once connected, the base units form a

single mechanical assembly.

The insertion and removal of modules will not disturb the

electrical connections with field devices.

AADvance modules are suitable for wall mounting or forinstallation within an enclosure. The system is designed to meet

its electromagnetic compatibility criteria without further

protection from an enclosure.

AADvance can be panel or DIN rail mounted (using TS35

35mm x 7.5mm standard symmetric rails).

Use the following steps to assemble a system.

1)

Mount a processor base unit

2)

Mount the I/O base units

3)

Mount termination assemblies

4)

Mount I/O expansion cables (optional)

5)

Wire the field connections

6) Connect power and ground

7) Mount the processor and I/O modules

8) Ensure adequate power and heat dissipation


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System Build 4-3

Environmental Limits

The design of each installation must ensure that the operatingenvironment is within the tolerances of the equipment.

Consideration must be given to proper control of:

Temperature

Humidity

Vibration and shock

EMI / RFI

Temperature

Operating temperature: -20 to 70C (-4 to 158F)

Note: Processors limited to 60C (140F)

Storage & transport temperature: -40 to 70C (-40 to 158F)

Humidity

The system is designed to operate in the range of 10 to 95%

relative humidity, non-condensing. It is important to avoidchanges of humidity and temperature that could produce

condensation. Condensation on any type of electrical equipment

can result in equipment failures or improper operation.

Vibration and shock

The modules are designed to withstand a 15g peak shock andvibration to 0.5g sinusoidal sweep between 10Hz to 150Hz.

Care must be taken to isolate the system from any sources of

extreme mechanical shock or vibration.

EMI / RFI

The modules have been designed to meet the requirements of

EN500081/82 and EN55011/55022.


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Component Size and Weights

(

233 126 18

(9 5 )

166 42 118

(6 1 4 )

Table 4-1: AADvance Component Sizes

The total depth of a base unit and module is 136 mm (5-in).

Figure 4-1: Component Dimensions (in mm)


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System Build 4-5

Ensure that the mounting assembly can support the weight of

the AADvance components using the Table 4-2.

(

460 (16)

/ 133 (5) 430 (15)

(8 ) 280 (10)

(16 ) 340 (12)

(8 ) 280 (10)

(16 ) 340 (12)

340 (12)

(8 ) 290 (10.5)

133 (5)

260 (10)

360 (13)

40 (1)

/ 50 (2)

(2 ) 670 (24)

Table 4-2: AADvance Component Weights


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Free Space

The system requires a free space at least 140mm deep (fromfront to back) between the rear panel of an enclosure and the

inside of an enclosure door.

Allow sufficient free space around the base units. Every

application needs space on at least three sides, as follows:

Space above, to manipulate and install field wiring

Space below, to enable modules to fit and to be able tograsp a module during removal

Space to the right, to maneuver an I/O base unit duringassembly or in the event of installing a new base unit.

If an expansion cable is to connect to the left-most base unit, thecontroller also needs space to the left, to fit the expansion cable

adaptor.

Figure 4-2 shows the minimum recommended clearances for

DIN rail mounting.

Figure 4-2: Required Free Space (in mm)


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System Build 4-7

Mount a Processor Base Unit

A processor base unit will support up to three processormodules.

Figure 4-3: Installing a Processor Base Unit

1) Place the processor base unit onto the DIN rail.

2) Secure the base unit by pushing the bottom retaininglever as far to the left as it will go until it latches in the

locked position.

Note: Base plates may also be mounted flush on a panel wallusing screws without a DIN rail.


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Mount the I/O Module Base Units

You can install up to three I/O modules on an I/O base unit.

Figure 4-4: Installing an I/O Base Unit

1)

Mount a 9300 I/O base unit onto the DIN rail and slide it

towards the 9100 processor base unit.

2)

Ensure the joining connectors are fully mated.

3) Secure the base unit by pushing the bottom retaining

lever as far to the left as it will go until it latches in thelocked position.

4)

Insert the plastic retaining clips into the top and the

bottom slots.

Note: Base plates mounted flush on a panel wall will need to

be connected before mounting.


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System Build 4-9

This page is intentionally blank.


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Mount Termination Assemblies

Termination assemblies connect to I/O base units. You can fitthree simplex assemblies, or one dual and one simplex, or a

single triplicated termination assembly. The combination used

will depend on your systems specific configurationrequirements.

1) Insert the termination assembly (TA) retaining clip (at

the rear of the TA) into the slot on the plastic base unit,as shown in Figure 4-5. Press down and slide the

assembly upwards as far as it will go.

2) Ensure the retaining tab clips over the circuit board to

secure the TA in position, as shown in Figure 4-6.

Figure 4-5: Installing a Termination Assembly

Termination

assemblies can

span across base

units.


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System Build 4-11

Figure 4-6: Installing a Termination Assembly


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System Build 4-13

Figure 4-8: I/O Expansion Cable Adapters

Standard expansion cable assemblies are two meters long.(Custom lengths can be supplied.) The maximum possible

length of an entire bus (the combination of I/O base units and

expansion cables) is 8 meters.

Terminators are notrequired at the end

of the bus (last base

unit).


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Module Power

Power supplies should be installed in a position where the 24Vdc supply wiring can be kept reasonably short. Figure 4-9

shows an arrangement with one power supply unit for a non-

redundant, fail safe controller.

Figure 4-9: Power Supply Mounting

It is recommended that the negative side of the field supply begrounded. This will avoid possible fail danger conditions that

can be caused by some earth fault monitors used with floating

power supplies.

The power supply protection of the system is within the

modules, not the base units. To protect the base units, the powerdistribution arrangement must provide a circuit breaker on the

input side of each power source. The system can withstand a

reverse polarity connection without permanent damage.


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System Build 4-15

Module Power Supply Requirements

AADvance requires 24Vdc power with a tolerance between

18Vdc and 32Vdc. The system has been designed to operatewith most commercially available industrial uninterruptable

power supplies (UPS). To select a suitable power supply,calculate the overall system load that must be powered (usingTable 4-3), include any additional devices and add a

contingency allowance between 25% and 50%.

9110 8

9401 3.3

9402 4.0

9431 3.3

9432 4.0 9451 3.0

9482 3.6

Table 4-3: AADvance Module Power Requirements

Field devicesrequire an

additional source of

power.

High Availability

I/O (1715) use the

same hardware but

ratings are different

these arecalculated as worst

case using different

methods.


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Module Power Connections

AADvance modules are designed to operate from twoindependent 24Vdc sources with a common return. Power is

connected to the two plugs PWR-1 and PWR-2 on the processor

base plate, as shown in Figures 4-10 and 4-11. The centerterminals are normally left unconnected.

Figure 4-10: Processor Base Unit Power Connection

Figure 4-11: Module Power Connection

Power is distributedto the I/O modules

through the base

units.

The terminal blocks

can be removed for

easy access.


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System Build 4-17

The processor base unit links the +24V dc connections to thecenter terminal of each connector, as shown in Figure 4-12.

This link may be used to connect the +24V dc supply to other

processor base units.

Figure 4-12: Processor Base Unit Power Connection Detail

,

2.5 2(12 )

,

2.5 2(12 )

7 (9/32 )

Table 4-4: Module Power Wiring Sizes


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Grounding

AADvance systems may have up to three separate groundsystems:

An AC safety ground(sometimes called the dirtyground) to protect people in the event of a fault. Theground stud on the processor base unit, shown in Figure

4-13, should be connected to the AC safety ground,

along with all exposed metalwork such as DIN rails.

An instrument ground(sometimes called the cleanground or 0 Vdc ground) to provide a good stable 0Vreference for the system. Every signal return should be

referenced to the instrument ground, which will be

isolated from the AC safety ground.

Some field wiring will need shielded (screened) cable.There may be a shield groundin addition to the ACsafety and instrument grounds to provide a common

point to terminate cable shields.

Figure 4-13: AADvance Processor Base Unit SafetyGround Connection Detail

Systems may also be supplied with an IS (intrinsic safety)

ground as required.

Copper bus bars are normally used for grounding.


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System Build 4-19

Security Dongle

The system uses a dongle to control security. The dongle mustbe connected in order to download programs, make online

changes, or perform locking (forcing). The dongle is supplied

with the processor base unit.

Figure 4-14: Security Dongle

Processor Fault Alarm Contacts

The terminal block marked 'FLT' is no longer used and does not

work from release 1.1.


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Serial Connections

Each processor has two serial RS485 connections. The systemsupports both 2 wire (half duplex) and 4 wire (full duplex)

configurations, with multi-drop supported in both

configurations.

The pin-outs for the six serial connections on the processor base

unit are shown in Figure 4-17 and Table 4-6.

Figure 4-17: Serial Connections

Table 4-6: Serial Connections

( (

()

/

()

()

/

()

0

()

()

The terminal blocks

can be removed for

easy access.

'Receive' and

'transmit') are with

respect to the

processor base unit.


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System Build 4-21

Field Power

Field devices require an external source of power. This may bethe power source used for the controller or a separate power

source, depending on the application.

Each input circuit should be fused. Each output module group(e.g., a module pair) should also have the field power fused. For

a typical system, it is recommended that you provide a single

breaker on the output of the field power source, followed by oneor more fused terminals.


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Wire the Field Connections

Field wiring is connected direct to the terminal blocks of atermination assembly (TA).

,

1.5 2(16 )

,

1.5 2(16 )

6 ( )

Table 4-7: Field Connection Wiring Sizes

Non-redundant termination assemblies have commoned power.


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System Build 4-23

Digital Inputs

Figure 4-18: Simplex Digital Input Field Connections

Figure 4-19: Dual and Triplicated Digital Input Field Connections


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Figure 4-20: Standard Digital Input Field Loop Circuit

Figure 4-21: Line Monitored Digital Input Field Loop Circuit

Note: Please refer to the System Build manual for more detailson normally de-energized inputs, recommended resistor

values and input voltage threshold settings, etc.


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System Build 4-25

Analog Inputs

Figure 4-22: Simplex Analog Input Field Connections

Figure 4-23: Dual and Triplicated Analog Input Field Connections


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System Build 4-27

Figure 4-26: Four Wire Analog Input Loop Circuit


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Digital Outputs

Figure 4-27: Simplex & Dual Digital Output FieldTerminations


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System Build 4-29

Figure 4-28: Digital Output Field Loop Circuit

For inductive loads, connect a diode at the actuator to protectthe controller against back EMF.


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Cable Management

The field, power and other system wiring will be connected toterminals along the top of the base units. It is recommended a

length of trunking be located above each set of base units for

cable management.

Figure 4-29: Cable Management


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System Build 4-31



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Module Polarization

Module polarization prevents the wrong module from beinginserted into the wrong base unit. Modules are supplied with

plugs already fitted, as shown in Figure 4-30.

The legend for the polarization pins is shown in the lower left ofthe processor base unit and on each I/O termination assembly,

as shown in Figure 4-31. The positions are numbered 1 through6. The three pins are lettered A, B and C with A being on thetop. Each pin, shown in Figure 4-32, is fitted in the base unit so

that the index recess is next to the relevant numbered position

shown in Table 4-8, as shown in Figures 4-32 and 33.

9110 1 1 1

9401 2 1 1

9402 2 1 1

9431 2 1 39432 2 1 3

9451 3 1 1

9481 3 1 2

9482 3 1 2

Table 4-8: Module Polarizing Pin Allocation

Figure 4-30: ModulePolarization

Figure 4-31: ModulePolarizing Pin Base

Unit Positions

Terminationassemblies are

supplied with the

pins already

inserted.


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System Build 4-33

Figure 4-32: Polarizing Pin

Figure 4-33 shows the pins inserted for a 9401 digital input

module and TAs.

T9801/2/3 TA T9401 TA

Figure 4-33: Inserted Polarizing Pins


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Installing Modules and Blanks

Installing Modules

Modules are installed by carefully pressing them onto the base

unit, as shown in Figure 4-34, using the following procedure.

1.

Inspect the connectors on the back of the module for

bent or damaged pins.

2. Make sure the slot on the head of the module clamp

screw is vertical.

3.

Place the new module on to the dowel pins on the base

unit.

4. Push the module home until the connectors are fully

mated.5. Turn the locking screw located on the front of the

module turn clockwise using a broad flat bladed

screwdriver.

Figure 4-34: Installing a Module


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Heat Dissipation

AADvance is designed to operate without forced air cooling.

Ensure that adequate ventilation is provided. Ambient

temperature within an enclosure should not exceed 60C

(140F), unless the enclosure does not contain the processors, inwhich case the limit is 70C (158F).

The system dissipates all the power it uses as heat. Module

power is connected to the processor base plate. Field power is

connected to I/O termination assemblies and some of that powerwill also be dissipated as heat. Use Table 4-9 to estimate the

maximum heat generated by the modules.

8

(8 ) 3.3

(16 ) 4.0

0.11

(8 ) 3.3

(16 ) 4.0

(25) 0.06

3.0

(1) 0.5

(8 ) 3.6

Table 4-9: AADvance Module Heat Dissipation

Base plates and

modules must be

mounted vertically

to allow proper air

circulation through

the modules.


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System Build 4-37



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Parts ListNote:Parts may be added to this list in future releases. Please

consult Rockwell Automation for an updated list of availableparts.

Software Development Environment

9082 IEC61131 Workbench suite with single user, single

controller license9083 IEC61131 Workbench suite with single user,

unlimited controller license

9084 IEC61131 Workbench suite with five user, unlimited

controller license9085 Five additional user license (for use with item 9084)

9030 OPC portal server

Processor Equipment9100 Processor base unit9110 Processor module

9193 Blanking cover (short), for unused position on

processor base unit

Expansion Cable Assemblies

Expansion cable assembly, comprising expansion cable and two

adaptors (handed):9310-02 2 meter expansion cable (approximately 6 feet)

9310-xx Custom length expansion cable

I/O Equipment

9300 I/O base unit9401 Digital input module, 24V dc, 8 channel

9402 Digital input module, 24V dc, 16 channel

9431 Analog input module, 8 channel

9432 Analog input module, 16 channel9451 Digital output module, 24V dc, 8 channel

9481 Analog output module, 3 channel

9482 Analog output module, 8 channel9191 Blanking cover (tall), for unused position on I/O base

unit

The 9193 blanking cover may be used for positions on an I/Obase unit with a termination assembly fitted.


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System Build 4-39

Termination Assemblies

9801 Digital input TA, 16 channel, simplex, non-isolated

9802 Digital input TA, 16 channel, dual9803 Digital input TA, 16 channel, TMR

9831 Analog input TA, 16 channel, simplex, non-isolated

9832 Analog input TA, 16 channel, dual9833 Analog input TA, 16 channel, TMR9851 Digital output TA, 24V dc, 8 channel, simplex, non-

isolated

9852 Digital output TA, 24V dc, 8 channel, dual, non-isolated

9881 Analog output TA, 8 channel, simplex

9882 Analog output TA, 8 channel, dual

Consumable Spares

9901 Input fuse, 50mA (pack of 20)

9902 Output fuse, 10A (pack of 20)

9903 Coding peg / Polarizing Pins (pack of 20)9904 Backplane clip (pack of 20)

9905 Battery, lithium, 3V 255mAh, coin pattern BR2032 or

equivalent, for 9110 processor module (pack of 10)

9906 Replacement security dongle


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Test Your Knowledge

1.

What temperature range are the processors designed to

operate within?

2.

What are the two ways to mount base plates?

3. Where is I/O module field power connected?

4. How much power would a system with the followingmodules require? Assume all input modules are 16

channel.

dual processors

two sets of triplicated analog input modules

five simplex analog input modules

four simplex digital input modules

two sets of dual digital output modules

three simplex digital output modules

5.

How much would the system described in question 4

weigh?

6.

How many I/O module base units would be required for

the system described in question 4?


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Workbench Overview and Programming 5-1

Workbench Overview and

Programming

Purpose

To review the steps required to develop programs.

Objectives

To be able to create projects.

To be able to add variable names to the dictionary.

To be able to build an I/O configuration and assignvariable names.

To be able to configure the hardware: serial portsettings, input module thresholds, watchdog timers, etc.

To be able to create, edit and compile programs.

Chapter 5


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Workbench

The AADvance workbench is used to build control and safetyprograms. These programs can be distributed across several

hardware platforms referred to as configurations.

Configurations communicate with each other throughnetworks. Configurations run resourceswhich are groups ofprograms (up to 250) that are compiled and downloaded.

The workbench is IEC 61131-3 compliant, offering all fivelanguages (ladder, function block, structured text, instruction

list and sequential function chart). Programs can be simulated

and tested on the PC before downloading to actual hardware.

Starting the Workbench

Start the workbench: StartAll ProgramsAADvance

AADvance Workbench. The workbench will run in demo mode

for 30 days without a license. Full functionality requires alicense (e.g., USB dongle).

This manual

describes software

functionality

included in release

1.31 (Build

1.20.508).

Please refer to the

Configuration

Guide for more

information on the

licensing options

and the operation

of the License

Manager.


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Start a New Project

To start a new project, select File | New Project/Library, or use

the New button. The following dialog box will appear.

Figure 5-1: New Project Dialog Box

The name is used as the project folder name. Project file namesare always PRJLIBRARY.MDB.

The Workbench allows multiple people to work on a project atthe same time. This requires locating certain files in a location

that others can access (if you wish to utilize this capability). The

Destination Folderis the location on your PC where various

local files are stored. The Repository Pathis the location folderwhere other centralized version information is stored. The

default location for both folders is on the C drive of the PC that

has the software loaded, but the Repository folder can belocated on a central server.

The topics of the

repository, version

control and check-

in/out are covered

in Chapter 11.


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Workbench Overview

The link architecture view graphically displays the resources ofa project and any links between them. This is the default view

of the workbench providing a main entry point to all editors.

Figure 5-2: Link Architecture View

A configurationrepresents a hardware target (controller).

AADvance configurations run a single resource. A resourceconsists of the dictionary of tag names, I/O configuration and

POUs (Program Organization Units).

If you do not see the

Project Tree on the

left, click Window |

Show Project Tree.


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Dictionary

The typical first step is to define variable (tag) names in thedictionary. These names can then be connected to processor

variables, I/O modules, I/O channels and then used in programs.

However, it is not mandatory to define variables first. You cancreate programs first and enter variable names in the program

editor. When doing so, the workbench will request basic

information on the variable (i.e., type, scope, direction,attribute). While variables created this way will later appear in

the dictionary, you may need to define them in more detail in

the dictionary before compiling and running your program(s)(e.g., MODBUS address, SOE, initial value, retain, etc).

Open the dictionary using the Project | Variables menu selection

or the dictionary button. Expand the tree on the left to see thewindow displayed in Figure 5-4.

Figure 5-4: Workbench Dictionary View


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The various components are sorted in a tree-like hierarchy. The

tree name is displayed on the window title bar. The fourdictionary tree views, as shown in Figure 5-5, are: variables,

parameters, types and defined words.

Figure 5-5: Dictionary Views

In the All Variables workspace on the right, you can toggle

between Grid Mode and Row Mode by right clicking in theworkspace and making the appropriate selection in the pop-up

menu, as shown in Figure 5-6.

Figure 5-6: Switching Between Grid and Row Mode


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Data Types

Variables are unique identifiers of data which can be used in theprograms of a project. There are many different variables types,

such as:

BOOL: Boolean (true / false)

SINT: Signed short integer (8 bit) from -128 to +127.

USINT: Unsigned short integer (8 bit) from 0 to 255.

BYTE: Byte (8 bit) from 0 to 255.

INT: Signed single integer (16 bit) from -32,768 to32,767.

UINT: Unsigned single integer (16 bit) from 0 to

65,535. WORD: Word (16 bit) from 0 to 65,535.

DINT: Signed double integer (32 bit) from-2,147,483,648 to +2,147,483,647.

UDINT: Unsigned double integer (32 bit) from 0 to4,294,967,295.

DWORD: Double Word (32 bit) from 0 to4,294,967,295.

LINT: Signed long integer (64 bit) from

-9,223,372,036,854,775,808 to9,223,372,036,854,775,807.

ULINT: Unsigned Long Integer (64 bit) from 0 to18,446,744,073,709,551,615.

LWORD: Long Word (64 bit) from 0 to18,446,744,073,709,551,615.

REAL: Real (floating, single precision) (32 bit), 1 signbit + 23 mantissa bits + 8

aadvance comprehensive training manual (rev 1.7 oct 2012)

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