achieving higher speeds for cmos image sensor testing · as cmos image sensors continue to grow at...
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Achieving higher speeds for CMOS Image Sensor Testing
FormFactor Inc. Larry LevyMinoru Mikami
Hitachi Chemical Co.,Ltd.
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Abstract
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As CMOS Image Sensors continue to grow at ~10% CAGR, a part of that market is driven by the need for speed.At SWTW in 2014 FormFactor and Advantest first presented the challenges of the test infrastructure keeping pace with the device speeds.Since that time new requirements relating to the incorporation on lens modules in the probe card, have increased the difficulty of meeting this challenge.Last year we produced several card designs requiring 2.5Gbps for the differential pair and clock speeds as called out by MIPI D‐PHY V1.2. However, new M‐PHY opportunities require 3Gbps speeds for several differential pairs.In cooperation with Hitachi Chemical Co.,Ltd, using new PCB materials and design rules, we were able to achieve loss characteristics of the probe card that was comparable to traditional high speed CIS probe card performance without a lens module. An Eye pattern simulation that used actual S‐parameter data indicated we finally have enough signal quality to meet 3Gbps.However, as we look toward the future our next target of 5Gbps may require some structural changes.
Levy, Mikami
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Agenda• Need for speed the sequel• How do we meet the testing needs?
– Tester + Probe card (system solution)
• The bar has been raised– Probe card design just became more difficult
• New PCB material required• S‐Parameter and Eye Pattern Measurement• Summary and Next Steps
3Levy, Mikami
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Need For Speed
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Image sensor applicationsMajor Driver
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Cell Phones
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Peshkova/Shutterstock.com
Levy, Mikami
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Cell Phones
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More Data Drives Need for Higher Speed
• More Megapixels in cameras• Display resolution increasing for video and still
– At least 21 models greater than 1080P resolution– At least 20 models with 4K video speeds
• Need to take multiple pictures to get one good high resolution picture– Apple video/picture feature
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High Pixel Count Cell Phones
4K video capture5.2” Quad HD AMOLED Display with
564ppi
Microsoft Lumia 950 / 950 XL20 MP camera
LG G516 MP camera
5.3" IPS Quantum QHD Display with 554 ppi
Samsung Galaxy S712 MP camera
5.5”/5.1” Quad HD super AMOLED display
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Apple 6S 12 MP
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List of Cell Phones with 1440P Resolution
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Wikipedia
• Apple 6S is 1080P• Sony has an offering at
2160P
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There Are Over 20 Cell Phones that Shoot 4K Video
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source: Phone Arena 2014
Levy, Mikami
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How Do We Meet the Testing Needs?
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Presented in 2014 SW.
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Presented in 2014 SW.
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Phase2 PC
Phase2 PH
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The Bar Has Been Raised
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CIS Probe Card with Lens Module
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PCBPOGO
Performance Board
Probe Head
Light Source
Lens Module
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Larger Diameter
Lens
Low LossTechnologyRequire
Larger Hole(PCB, Probe Head)
Longer Trace Length
Large Loss
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PCB & Probe Head Signal Trace
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Trace Length : Short Long
2014No Lens Module
2016Lens Module
PCB Signal Trace
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LargeHole
SmallHole
Probe HeadSignal Trace
LargeHole
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Larger Lens Drives Complexity • Springs now overhang opening
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Lens Module
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PCB and Probe Head
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Optimized FormFactor Design rules• Tight trace length adjustment• Tight impedance control• Optimal signal trace spacing
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New PCB material required
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Target
Probe Card : High// CIS with Lens ModuleSignal Speed : MIPI D‐PHY 3Gbps
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Clock
Data lane 1
Data lane 2
1 Cycle
2 bit data
MIPI D‐PHY outline
Levy, Mikami
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Multi Wire Board (MWB)
Crossover wiring within one layer Two to three times as much wiring capacity as that of etching method boards Uniform copper wire diameter Provides stable electrical characteristics even if long wiring on big size board
PCB Material Dielectric Constant (DK) and Dissipation Factor (Df)
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Crossover Wiring
PCB Material Dk @ 1GHz Df @ 1GHz
STD (Polyimide) I‐671 4.2 – 4.3 0.013 – 0.015
High Performance HE‐679G(S) 3.7 – 3.9 0.006 – 0.008
Provided by Hitachi Chemical Co.,Ltd.
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PCB Material CharacteristicsLoss at 1.5GHz: ‐1.7dB HE‐679G(S), ‐2.0dB I671
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HE679GSI671
-7
-6
-5
-4
-3
-2
-1
00 1 2 3 4 5
Sig
nal L
oss
(dB
)
Frequency (GHz)
*With TRL(Thru‐Reflect‐Line) CalibrationProvided by Hitachi Chemical Co.,Ltd.
High performance PCB material
STD
Comparison of Sdd21 (Signal Loss), in 250mm length of differential pair path
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S‐Parameter and Eye Pattern Measurement
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Probe Card Specifications
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• PCB type : Multi Wire Board• PCB material : High performance PCB material HE‐679G(S) • Array configuration: 4x8, 1 Skip Column and 1 Skip Row• Probe Head : Standard FormFactor Ceramic PH100
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Measurement Apparatus
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Network Analyzer:Agilent E5071C
Differential Probe:Yokowo FCP‐VPDFfor Probe Head Spring
Differential Probe:Agilent N1021Bfor PCB POGO
USB Camera
Levy, Mikami
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Measurement & Simulation Method1. Calibrated Network Analyzer2. Measured Differential probe loss
• Agilent N1021B • Yokowo FCP‐VPDF
3. Measured S‐Parameter• 5 site (1 pair / site)• Stimulation Amplitude 360mV (P‐P)• Rise Time 100psec
4. Calculated Probe Card loss5. Simulated Eye pattern from measured S‐Parameter
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Site Map
Levy, Mikami
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Calibration Method for Cable loss
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• Calibrator : Agilent N4433A• Calibration point: End of the cableCancelled Network Analyzer cable loss
Calibration point (0dB)
Electronic calibration unit: Agilent N4433A
To Probe Head side Differential probe
To POGO side Differential probe
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Probe Card Measurement Point
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PCBProbe HeadProbe Head
Tester Side
Wafer SidePOGO PADCapture PAD
POGO side Differential Probe
Probe Head side Differential Probe
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Probe Head Measurement point
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PN
Capture PAD
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Differential Probe Loss
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Loss at 1.5GHz: ‐1.4dB
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Probe Card Loss
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Loss at 1.5GHz: ‐3.1dB (U31) ~ ‐4.0dB (U15)
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Calculated Probe Card Loss
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Loss at 1.5GHz: ‐1.7dB (U31) ~ ‐2.6dB (U15)
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Eye Pattern Simulation Setting• Input Signal setting:
– Type: PRBS (Pseudo random bit sequence)– Length: 127bit– High Voltage: 360mV (P‐P)– Low Voltage: 0V– Data Rate: 1.0Gbps ~ 3.5Gbps – Rise Time: 15% of Half cycle time (20‐80%)
• Eye parameter calculation setting:– Rise Time: 20‐80%
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1.0Gbps
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U31 U15
‐1.8dB @0.5GHz ‐2.1dB @0. 5GHz
Loss(Sdd21): Best Worst
Probe Card Loss (Including Differential Probe Loss)
Jitter Height
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1.5Gbps
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U31 U15
‐2.3dB @0.75GHz ‐2.3dB @0.75GHz
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Loss(Sdd21): Best Worst
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2.0Gbps
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U31 U15
‐2.6dB @1.0GHz ‐2.8dB @1.0GHz
Loss(Sdd21): Best Worst
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2.5Gbps
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U31 U15
‐2.8dB @1.25GHz ‐3.2dB @1.25GHz
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Loss(Sdd21): Best Worst
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3.0Gbps
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U31 U15
‐3.1dB @1.5GHz ‐3.5dB @1.5GHz
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Loss(Sdd21): Best Worst
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3.5Gbps
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U31 U15
‐3.4dB @1.75GHz ‐3.8dB @1.75GHz
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Loss(Sdd21): Best Worst
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Eye Height
42Levy, Mikami
Height at 3.0Gbps: 190mv ~ 201mV (Input Signal 360mV)
Height
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Jitter (P‐P)
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Jitter(P-P)
Jitter: Less than 25psec
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Summary and Next Steps
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Summary3Gbps Achieved
– Probe card loss (Sdd21)• Probe card loss was less than ‐2.6dB @1.5GHz
– Eye Pattern• Eye Height was more than 190mV @ 3Gbps• Jitter was shorter than 25psec regardless of the signal speed
45Levy, Mikami
3Gbps achieved with optimized FormFactor Design rules and high performance PCB material HE‐679G(S)
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Next Step• High// 5Gbps Probe Card Concept
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PCB
POGO
Performance Board
Probe Head
Light Source
High Speed SignalConnector
Reduce loss and reflectionReduce Light Source space
Adopt low loss technology
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Acknowledgements• Team Member
– Hitachi Chemical Co.,Ltd.• Seiichi Kurihara• Noriaki Watanabe• Hiroyuki Mukouyama
– FormFactor Japan• Nobuhiro Kawamata• Hiromitsu Sasanami• Yoichi Funatoko
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