7/29/2019 ALPHA OM-350 Lead-Free Solder Paste

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Have you ever experienced any ofthese operational issues in yourassembly process?

Cold solder joints with

BGA components?

Variations in printvolume over arange of printspeeds?

Paste unable towithstand highsoak reflowprofiles?

Paste dripping when usedin paste-in-through-holeapplications?

What choices are

you making between

throughput and defects?

DepositVolumemil3

500

400

300

200

100

25mm/sec 100mm/sec0

Max Vol.

Avg Vol.

Min Vol.

OM-350 Type 4 Competitive Paste

Soak 150-190C; 100 sec. air reflow

Pass Fail

OM-350 Competitor

a

lp

h

a

ALPHA OM-350Lead-Free Solder Paste

http://krayden.com/

7/29/2019 ALPHA OM-350 Lead-Free Solder Paste

2/2

What choices are

you making between

throughput and defects?

Worldwide Headquarters 600 Route 440 Jersey City, NJ 07304 USA +1-800-367-5460 www.alphametals.comuropean Headquarters Forsyth Road Sheerwater Woking GU215RZ United Kingdom +44-1483-758-400sia-Pacific Headquarters 1/F, Block A 21 Tung Yuen Street Yau Tong Bay Kowloon, Hong Kong +852-3190-3100

M9042006 Cookson Electronics

Passive componentTombstones?

Mid-chip solder balls?0.2mm shift

OM-350Traditional

x axis y axis

0.3mm shift

x axis y axisTombstonedefect(%)

0102030405060708090

100

Competitor

1005

0.0mm 0.1mm

OM-350

0.0mm 0.1mmComponentswithMCSB(%)

0

5

10

15

20

25 1608 2012

0402 0603 0805

High Soak

ALPHA

OM-350 lead-free solder paste delivers highthroughput, while minimizing defects. In todays competitiveelectronic assembly marketplace, its good to know thatALPHAs technical expertise is there to help you make thebest decision for your SMT application. Contact your localALPHA representative for more information.

Vertical Wetting Wetting force stability coefficient > 0.95

Resistance to Defects Resists tombstones and mid-chip solderballs with 0.2 and 0.3mm print/placement shifts

Post Reflow Tackiness Passes JIS Z 3197 Talc Test

REFLOW

Flux Residue Cosmetics No Observed Flux Burn on OSP Copper Finish

YIELD Solder Spread Full coverage of OSP coated pads after exposure to 2 previous reflow cyclesReduced BGA Pillows after multiple reflow cycles

Random Solderballs Passes IPC TM650 extended test from 4 hours to 24 hours

Resistance to Voids Exceeds requirements of IPC 7095 Class III for low voiding

Slump Resistance Exceeds requirements of IPC J-STD-005 and JIS Z 3284 for hot and cold slump

IPC SIR Pass (7 days 85C / 85% RH)

Bellcore SIR Pass (96 hours @ 35C / 85% RH)

ELECTRICAL BellcoreElectromigration Pass (500 hours @ 65C / 85% RH)

RELIABILITY JIS Electromigration Pass (1000 hours @ 85C / 85% RH)

HP Electromigration Pass

PROCESS ALPHA OM-350STEP ATTRIBUTES

PERFORMANCE CAPABILITY

Fine Feature Print Excellent print definition and consistent volumetric performance to 0.3mm (12 mil)

Definition circles and 0.4mm (16 mil) pitch rectangular QFP padsPRINTING

Stencil Life Excellent Print Volume Repeatability after 4 hours at 33% RH and 66% RH

Print Consistency Repeatable volume deposition and low volume variability (Cp > 2.0) on 12 mil circles

25mm/second to 100mm./second (1 inch/second to 4 inches/second down to

PRINT CYCLEFine Print Speed Range

0.3mm (12 mil) circles across 0.10mm to 0.15mm (4 mil to 6 mil) thick stencils

TIME Wet Bridging Up to 5 prints per wipe at 0.4mm (16 mil) pitch with 0.125 mm (5 mil) thick stencilResistance >20 prints/wipe at 0.5mm (20 mil) pitch with 0.125mm (5 mil) thick stencil

Performance Summary

ALPHA OM-350Lead-Free Solder Paste

http://krayden.com/