amazing teco

8/14/2019 Amazing Teco

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AugustAugustconfidentialconfidential


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Amazing Microelectronic Corp.Amazing Microelectronic Corp.

TVS ESD ARRAY ICsTVS ESD ARRAY ICs

ProviderProvider


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32007.2007.


Company backgroundCompany background

H/Q : Taipei county , Taiwan (H/Q : Taipei county , Taiwan ( 716716 15F15F--2)2)

Capital : 10 million USDCapital : 10 million USD

Branch :Branch : HsinHsin chuchu , Taiwan, Taiwan44195195 Branch : Kowloon , HK (Branch : Kowloon , HK ( 4242,, 1010))

ISO 9001/2000ISO 9001/2000

ROHSROHS

IECQ QC080000IECQ QC080000 . 2008. 2008

LABLAB

LAB1 :LAB1 : 716716 15F15F--22

LAB2 :LAB2 :44195195


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42007.2007.


ISO 9001 : 2000ISO 9001 : 2000


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52007.2007.


OrranizationOrranization


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72007.2007.


RRD DivisionD Division

(Department(Department--I)I)

(Department(Department--II)II) (())

(Department(Department--III)III) (())

(Department(Department--S)S) (())

1.1.(())

2.2.(())

3.3.(())

4.4.(())

5.5.(())

6.6.(())

1.1.(())

2.2.(())

3.3.(())

4.4.(())

1.1.(())

2.2.(())

3.3.(())

4.4.(())

5.5.4411

1.1.(())

2.2.(())


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82007.2007.


w/w Distributor

TaiwanTaiwan

ChinaChina KoreaKorea

EuropeEurope

TurkeyTurkey USAUSA

SingaporeSingapore

IsraelIsrael

ATM, Chander, Linksync, WeikengATM, Chander, Linksync, Weikeng

ThreeThree--man , Sky sinoman , Sky sino Nam YoungNam Young

EuroSemi, CEEuroSemi, CE

PAKPAK ITGITG

UnimontUnimont

SotaltechSotaltech


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92007.2007.


Amazing Product FamiliesAmazing Product Families

System Level ESDSystem Level ESDProtectorsProtectors

(TVS Arrays)(TVS Arrays)

System LevelSystem Level

EMI Filter ArraysEMI Filter Arrays

With ESDWith ESD

High SpeedHigh SpeedSwitchesSwitches

With ESDWith ESD

High PerformanceHigh PerformanceTransceiversTransceivers

with ESDwith ESD

OnOn--Chip ESDChip ESD

Protection IPProtection IPss AmazingAmazing


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102007.2007.


ESD Consultation ServiceESD Consultation ServiceCustomer : IC design house, system design house

Customized I/O cell Design ServiceCustomized I/O cell Design Service

Customer : IC design house

I/O Cell Library Design ServiceI/O Cell Library Design ServiceCustomer : foundry , IP house , IC design house

ESD Rules Development ServiceESD Rules Development Service

Customer : Foundry, IC design house

Patent AuthorizationPatent AuthorizationCustomer : foundry, IP house , IC design house

ESD Audit, Control Consultation ServiceESD Audit, Control Consultation Service

Customer : Factory.

Deliver ESD Protector for Board Level ESD ProtectionDeliver ESD Protector for Board Level ESD ProtectionCustomer: system manufacture houseCustomer: system manufacture house..

Provided Service Content by Amazing ESD TeamProvided Service Content by Amazing ESD Team


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112007.2007.


Design In and WinDesign In and Win MB/Portable Device MarketMB/Portable Device Market

Key Pad, Audio,

Function Key, LED

AZ2015-04S, AZ2025-04S,

AZ2015-02S, AZ1015-02N,NotebookInventec

USB 2.0AZC099-04SNotebookCompal

USB 2.0, AudioAZ1015-04S, AZ2025-01HPCUSI

Key PadAZ2025-01HMedical PDALiteonKey PadAZ2015-05CCDMA PhoneCam-comp

USB 2.0AZC099-04SSound CardTerrTech/Germany

AntenaAZ2025-01HGPSMitac

USB 2.0, VGA,Audio, Key Pad

AZ1015-04S, AZC099-04S,AZ2025-01H, AZ2015-01H

PC/NotebookAsus

USB 2.0, VGA,Audio

AZ1015-04S, AZC099-04S,AZ2025-02S

PCGigabyte

USB 2.0, VGA, AudioAZ1015-04S, AZC099-04S,AZ2025-02S

PCECS

InterfaceAmazing DeviceProductCustomer


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122007.2007.


Design In and WinDesign In and Win Display MarketDisplay Market

HDMI1.3 , VGAAZ1015-04S, AZC099-04SMonitorTPV (AOC)

USB 2.0, Audio,

HDMI

AZ1015-04S, AZ2025-01L,

AZ1045-04QUDAVLG/Korea

HDMI 1.3AZ1045-04QUKVMATEN

HDMI 1.3AZ1045-04QULCD TVDigimedia

HDMI, Function KeyAZ1045-04SU, AZ2015-01HProjectorMeiloon

USB 2.0, HDMI, ScartAZC014-04S, AZC099-04S,AZ1045-12T, AZ2025-04S

PC/LCD TVVestel/Turkey

HDMI, DVIAZ1045-04Q, AZC099-04SLCD TVChanghung/China

HDMI 1.3, VGA, Audio, S-Video, Scart , USB 2.0,

AZ1045-04QU, AZC099-04S,AZ2025-02S, AZC002-04S

LCD TV/MonitorProview

HDMI 1.3AZ1045-04QULCD TVAmtran

HDMI, DVI, VGA, AudioAZC099-04S, AZC002-04S,

AZ1045-04SU,AZ2015-01LLCD MonitorTatung

HDMI 1.3, VGA, DVI,Key Pad

AZ1045-04SU, AZC099-04S,AZ2015-01H

LCD MonitorLiteon

InterfaceAmazing DeviceProductCustomer


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Our R&D TeamOur R&D Team


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ESD Team MembersESD Team Members

Advisor:Advisor:

Prof. MingProf. Ming--Dou Ker, NCTU EE.Dou Ker, NCTU EE.

He published over 270 Technical Papers in International JournalsHe published over 270 Technical Papers in International Journals andand

Conferences, and granted with 112 US patents and 123 Taiwan pateConferences, and granted with 112 US patents and 123 Taiwan patents.nts.

Team Leader:Team Leader:

Dr. Ryan HsinDr. Ryan Hsin--Chin JiangChin Jiang

He holds ESD related patents of 13 U.S. patents, 15 Taiwan patenHe holds ESD related patents of 13 U.S. patents, 15 Taiwan patents.ts.

Team Members:Team Members:

2 Ph. D., 16 M.S.2 Ph. D., 16 M.S.

This team holds another ESD related patents of 25 U.S. patents aThis team holds another ESD related patents of 25 U.S. patents and 30 ROCnd 30 ROC

(Taiwan) patents, 15 journal papers and over 30 international co(Taiwan) patents, 15 journal papers and over 30 international conferencenferencepapers.papers.


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Brief Biography ofBrief Biography ofDr. Ryan HsinDr. Ryan Hsin--Chin JiangChin Jiang

M.S. and Ph.D. degrees from the Institute of Electronics,M.S. and Ph.D. degrees from the Institute of Electronics, National ChiaoNational Chiao--

Tung UniversityTung University, Hsinchu, Taiwan, R.O.C., in 1992, and 1998, respectively., Hsinchu, Taiwan, R.O.C., in 1992, and 1998, respectively.

He served the Computer and Communication Research Laboratories (He served the Computer and Communication Research Laboratories (CCL)CCL)

and SoC Technology Center (STC),and SoC Technology Center (STC), Industrial Technology ResearchIndustrial Technology Research

Institute (ITRI),Institute (ITRI), Taiwan, from 1999 to 2003.Taiwan, from 1999 to 2003.From 2003 to 2005, he joined in two IC design houses to developFrom 2003 to 2005, he joined in two IC design houses to developAnalogAnalog

and Mixeand Mixe--Signal IC products.Signal IC products.

He has proposed many inventions to improve reliability and qualiHe has proposed many inventions to improve reliability and quality of integrated circuits,ty of integrated circuits,

which have granted withwhich have granted with13 U.S. patents13 U.S. patentsandand15 ROC (Taiwan) patents15 ROC (Taiwan) patents. He also has. He also haspublishedpublished44IEEEIEEEjournal papersjournal papersandand1616InternationalInternationalconference papersconference papers..

His current research topics includeHis current research topics includeESD Protection Design, Analog IC Design, AnalogESD Protection Design, Analog IC Design, Analog

Circuits Behavioral Modeling, Hardware Implementation of NeuralCircuits Behavioral Modeling, Hardware Implementation of NeuralNetwork, SemiconductorNetwork, Semiconductor

Device Physics.Device Physics.

He has been elected asHe has been elected asthetheChairmanChairmanof Taiwan ESD Association in 2005 STILL NOWof Taiwan ESD Association in 2005 STILL NOW..

He has coHe has co--operated with Prof. Mingoperated with Prof. Ming--Dou Ker in the ESD protection design field forDou Ker in the ESD protection design field forover 10over 10

years.years.


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Amazing solves all kinds of ESD problemsAmazing solves all kinds of ESD problems


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182007.2007.AugustAugust

confidentialconfidential

The Major Service Experiences of Amazing ESD TeamThe Major Service Experiences of Amazing ESD Team

Consulting Service of ESD Protection DesignConsulting Service of ESD Protection DesignHas served over 30 companies in Taiwan and USA.Has served over 30 companies in Taiwan and USA.

I/O Cell Library Design ServiceI/O Cell Library Design Service

Has delivered I/O Cell Libraries for 0.25um 40V, 0.18um, 0.25um,Has delivered I/O Cell Libraries for 0.25um 40V, 0.18um, 0.25um, 0.35um0.35um

Logic and MixedLogic and Mixed--Signal processes.Signal processes.

Foundry ESD Rules Setting ServiceFoundry ESD Rules Setting Service

Has delivered ESD rules for a 0.25um LV/HV process of a foundryHas delivered ESD rules for a 0.25um LV/HV process of a foundry inin

Malaysia and a 0.18um LV/HV process of a foundry in Mainland ChMalaysia and a 0.18um LV/HV process of a foundry in Mainland Chinaina

Measurement System DeliveryMeasurement System Delivery

Has Developed a Transmission Line Pulsing System for ESD PerformHas Developed a Transmission Line Pulsing System for ESD Performanceance

Characterization.Characterization.

ESD AuditESD Audit ESD ControlESD Control ESD Control LectureESD Control Lecture

Has served over 10 companies in Taiwan.Has served over 10 companies in Taiwan.


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HBMHBM

Grounded Surface

!@#$%&*$^#

ESD :ESD :EElectrolectroSStatictaticDDischargeischarge

Discharge event due to tribo-electrically generated charges.

ESD is a High-Current (~Amps) and Short-duration (~ ns) stress event.


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1.1. The ICThe ICs are progressing into nm era, e.g. 90nm, 60nm, 45nms are progressing into nm era, e.g. 90nm, 60nm, 45nmprocesses.processes. Transistors are very weak for sustaining ESD event.Transistors are very weak for sustaining ESD event.

2.2. The system operating voltage is going to low voltage, e.g. 5VThe system operating voltage is going to low voltage, e.g. 5V 3.3V3.3V

2.5V2.5V

1.8V1.8V

1.2V.1.2V.

Signals are easy to be destroyed due toSignals are easy to be destroyed due toESD transient event.ESD transient event.

3.3. The Aspects of Electronic Products are going into Compact andThe Aspects of Electronic Products are going into Compact and

Light.Light. ESD event is easy to enter the core circuit regions of theESD event is easy to enter the core circuit regions of the

system.system.

4.4. The UserThe Users usage behaviors should be more friendlier, e.g. lesss usage behaviors should be more friendlier, e.g. less

limitation.limitation. One popular usage behavior is the hotOne popular usage behavior is the hot--plugging action.plugging action.

ESD event is easy to be generated.ESD event is easy to be generated.

5.5. High Quality demand is current vogue.High Quality demand is current vogue. ESD testing specificationsESD testing specifications

are more stricter!are more stricter!

Why System ESD Issue Is More Important?Why System ESD Issue Is More Important?


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ESD Is So Serious !ESD Is So Serious !

Means of Static GenerationElectrostatic Voltage

10% R.H. 40% R.H. 55% R.H.

Person walking across CarpetPerson walking across Vinyl Floor

Worker at a Bench

Ceramic DIP in Plastic Tube

Ceramic DIP in Vinyl Set-up Trays

IC Packs as Bubble Plastic Coveris removed

IC Packs as Packed in Foam LinedShipping Box

35,000 V 15,000 V 7,500 V12,000 V 5,000 V 3,000 V

6,000 V 500 V 400 V

2,000 V 700 V 400 V

11,500 V 4,000 V 2,000 V

26,000 V 20,000 V 7,000 V

21,000 V 11,000 V 5,500 V

EndEnd--useruserssenvironmentenvironment

FactoryFactoryss

environmentenvironment


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Two Kinds of ESD Testing StandardsTwo Kinds of ESD Testing Standards

Component Level:Component Level: To Simulate the ESD events in aTo Simulate the ESD events in a wellwell--controlledcontrolled

environment, such as factory environment.environment, such as factory environment.

To characterize a componentTo characterize a components (s (e.g. ICe.g. ICss) electrostatic) electrostatic

discharge (ESD) susceptibility fully.discharge (ESD) susceptibility fully. It isIt is not alive testingnot alive testing and it uses damage as testingand it uses damage as testing

criterion.criterion.

System Level:System Level: To Simulate the ESD events in anTo Simulate the ESD events in an unun--controlledcontrolled

environment, such as endenvironment, such as end--userusers environment.s environment.

To characterize a systemTo characterize a systems (s (e.g. Electronic Productse.g. Electronic Products))electrostatic discharge (ESD) susceptibility fully.electrostatic discharge (ESD) susceptibility fully. It isIt is alive testingalive testing and it uses interference, maland it uses interference, mal--function, andfunction, and

damage as testing criteria.damage as testing criteria.


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ESD Events for ICESD Events for ICss

(Component Level)(Component Level)


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ESD Events for ICESD Events for ICs (Component Level)s (Component Level)

Component Level:Component Level:(To Simulate the ESD events in a(To Simulate the ESD events in a wellwell--controlledcontrolled environment,environment,

such as factory environment)such as factory environment)

To characterize a componentTo characterize a components (s (e.g. ICe.g. ICss) electrostatic) electrostaticdischarge (ESD) susceptibility fully, it should be tested to thedischarge (ESD) susceptibility fully, it should be tested to the

following three ESD test standards:following three ESD test standards:

Human Body ModelHuman Body ModelHBM :HBM :Discharge to the ICDischarge to the ICs.s.

(ANSI/ESD STM5.1(ANSI/ESD STM5.1--2001)2001)

Machine ModelMachine ModelMM :MM :Discharge to the ICDischarge to the ICs.s.

(ANSI/ESD STM5.2(ANSI/ESD STM5.2--1999)1999)

Charged Device ModelCharged Device ModelCDM:CDM:Discharge from the ICDischarge from the ICs.s.

(ANSI/ESD STM5.3.1(ANSI/ESD STM5.3.1--1999)1999)


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(1). Human Body Model (HBM)(1). Human Body Model (HBM)

CHBM= 100pF; RHBM= 1.5k

Ipeak = ~ 1.3A (for 2000V HBM)tr = 2 ~ 10 ns

DEVICEUNDERTEST

1.5kBA

100pF

R

V

+

_

Discharge to the ComponentDischarge to the Component


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(2). Machine Model (MM)(2). Machine Model (MM)

CMM= 200pF

RMM= 0

VESDDeviceUnderTestC=200pF

GND

Rg

Ipeak = ~ 3.8A (for 200V MM)Resonance Freq. = ~ 16 MHz

Discharge to the ComponentDischarge to the Component


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(3). Charged Device Model (CDM)(3). Charged Device Model (CDM)

GND

VESDDevice

UnderTest

Cd

Rg

Ld

Rd

Ipeak= 15A (for 1000-V CDM @ 4pF)

tr < 200ps (for CDM @4pF)

Discharge from the ComponentDischarge from the Component


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Comparisons among the ESD PulsesComparisons among the ESD Pulses

Rise Time: Duration : Peak Current:

CDM < MM < HBM HBM > MM > CDM CDM > MM > HBM


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General ESD Specifications for IC ProductsGeneral ESD Specifications for IC Products

HBM MM CDM

+/- 2kV +/- 200V +/- 1kV

+/- 4kV +/- 400V +/- 1.5kV

+/- 10kV +/- 1kV +/- 2kV

Okay

Safe

Super

* An IC during ESD test with all pin combinations has topass above ESD specifications (both positive and negativeESD voltages).

* ESD failure criterion including pin leakage current andall function testing.

Basic Spec. forCommercial ICs

This Spec. CanThis Spec. Cant Guarantee System Level ESD Performance!t Guarantee System Level ESD Performance!


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CMOS Technology RoadmapCMOS Technology Roadmap

FeatureSize (m)

JunctionDepth (m)

OxideThickness (A)

3 2 1.5 1.0 0.8 0.5 0.35 0.25 0.18

0.8 0.5 0.4 0.35 0.3 0.25 0.2 0.18 0.15

500 400 300 200 150 100 70 50 30

ReliabilityConcerns

Hot Carrierdegradation

LDD ESDdegradation

Silicide/Salicide

ESD Processoptimization

HC Processoptimization

ESDdegradation

Still be majorStill be major

concernconcern


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ESD Event for SystemsESD Event for Systems

(System Level)(System Level)


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SystemSystem--Level ESD Testing StandardLevel ESD Testing Standard

IEC 61000IEC 61000--44--22: Electromagnetic Compatibility (EMC): Electromagnetic Compatibility (EMC)Part 4: Testing and measurement techniquesPart 4: Testing and measurement techniques

Session 2: Electrostatic discharge immunity Test.Session 2: Electrostatic discharge immunity Test.


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Air dischargeAir discharge

headhead

Contact dischargeContact discharge

headhead

SystemSystem--Level ESD Gun (IEC/EN 61000Level ESD Gun (IEC/EN 61000--44--2)2)


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Test SetTest Set--upup

Electronics SystemElectronics System--Level ESD Test SetLevel ESD Test Set--upup

System is aliveSystem is alive

to be tested!to be tested!


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SystemSystem--Level ESD WaveformLevel ESD Waveform

Short Discharging Current WaveformShort Discharging Current Waveform

2A

1/ 1/tr

Wide Freq. Band

(10MHz) (320MHz)

(1.8A/MHz)

El i S L l ESD T L l


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372007.2007.AugustAugustconfidentialconfidential

IEC 61000IEC 61000--44--2 Test Levels2 Test Levels

Electronics SystemElectronics System--Level ESD Test LevelsLevel ESD Test Levels

El i SEl t i S t L l ESD T C i iL l ESD T t C it i


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Electronics SystemElectronics System--Level ESD Test CriteriaLevel ESD Test Criteria

FailHardware damageClass D

Pass/

Fail

Abnormal phenomenonoccurs after ESD stress,

manual restart is needed

Class C

Pass

Abnormal phenomenon

occurs during ESD stress, but

will recover automatically

Class B

Pass

No abnormal phenomenon

occurs during ESD stressClass A

ResultCriterionClass

More popularMore popular

Criterion for HighCriterion for HighQuality Products!Quality Products!

Wh h t b t t d d H i th t t L l?Wh h t b t t d d H i th t t L l?


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Where has to be tested and How is the test Level?Where has to be tested and How is the test Level?

Test pointsAll contactable points.Test Level

Shell

contact 8kV

I/O ports Should be also 8kV

Why:Why:

Although the data pins in the I/OAlthough the data pins in the I/O

ports can not be touched by hands,ports can not be touched by hands,

But the 8kV ESD event can stressBut the 8kV ESD event can stressthe data pins viathe data pins via Cable DischargeCable Discharge

method.method.


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Cable Discharging EventCable Discharging Event

(CDE)(CDE)

(New Focused Event)(New Focused Event)

Cable Discharge EventCable Discharge Event


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Cable Discharge EventCable Discharge Event

Tribocharging (surface charges)

Cable frictionizes with floor.Tribocharging (space charges)

Cable carries high voltage signal.

Tribocharging (space charges)Cable is placed in electric field

Induced voltages

If a cable is subjected by the field of a strong pulse (e.g., alightning stroke, ESD close to the cable) a momentary

voltage will be introduced along the cable.

The Types of ESD Protection devicesThe Types of ESD Protection devices


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The Types of ESD Protection devicesThe Types of ESD Protection devices

Transient Voltage Suppressors (TVS)Transient Voltage Suppressors (TVS)VaristorVaristor

Zener diodeZener diode

DiodeDiode

AdvantagesAdvantages

Single channel, 2 terminals, easy to use.Single channel, 2 terminals, easy to use.

Cheap.Cheap.

DisadvantagesDisadvantages

Clamping Voltage is high.Clamping Voltage is high.C load is big, not suitable for high speedC load is big, not suitable for high speed

application.application.

The main function of TVS is to absorb high peak power as a surgeThe main function of TVS is to absorb high peak power as a surge device.device.

It also can be an ESD protector.It also can be an ESD protector.

The Types of ESD Protection devices (contThe Types of ESD Protection devices (contd)d)


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The Types of ESD Protection devices (contThe Types of ESD Protection devices (contd)d)

Integrated ESD protection arrayIntegrated ESD protection array


Multiple channels.Multiple channels.

Small size.Small size.

C load could be low, suitable for highC load could be low, suitable for high

speed applications.speed applications.

DisadvantagesDisadvantagesCost is a little of higher than generalCost is a little of higher than general

Diode (single channel).Diode (single channel).

Board has to be preBoard has to be pre--designed for use.designed for use.

Zener diode arrayZener diode array

Regular Diodes arrayRegular Diodes array

Special designed array (Amazing)Special designed array (Amazing)


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VaristorsVaristors

Varistor MaterialsVaristor Materials


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Varistor MaterialsVaristor Materials

VaristorsVaristors are made fromare made from ceramic materialsceramic materials. The predominant Varistor. The predominant Varistor

type has a main component which istype has a main component which is Zinc Oxide (ZnO).Zinc Oxide (ZnO). To this areTo this are

added small amounts of other oxides such as Bismuth, Cobalt,added small amounts of other oxides such as Bismuth, Cobalt,

Manganese and others.Manganese and others.

Accordingly,Accordingly, VaristorsVaristors are sometime known asare sometime known as Metal Oxide VaristorsMetal Oxide Varistors oror

MOVsMOVs..

A given Varistor specificationA given Varistor specification may be satisfied by a variety of materialmay be satisfied by a variety of material

formulations.formulations.

CeramicCeramic

The Features of VaristorThe Features of Varistor


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The Features of VaristorThe Features of Varistor

PositivePositive Cheap.Cheap.

NegativeNegative Resistance characteristic isResistance characteristic is non linearnon linear.. TheThe voltage dropvoltage drop across the varistor willacross the varistor will increaseincrease

dramaticallydramatically as the current increases.as the current increases.

ItIt agesages as the ZnO particles weakenas the ZnO particles weaken

after conducting current.after conducting current.

Slow in circuit response time, > 35 nsec.Slow in circuit response time, > 35 nsec.

ESD Clamping Voltage is High, hard to help to passESD Clamping Voltage is High, hard to help to passClassClass--A test.A test.

The Most Popular Varistor FormatesThe Most Popular Varistor Formates


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The Most Popular Varistor FormatesThe Most Popular Varistor Formates

TheThe Surface Mount (SM)Surface Mount (SM) type, which are produced intype, which are produced in Multilayer ChipMultilayer Chip

format,format, refer asrefer as MultiLayer Varistor (MLV)MultiLayer Varistor (MLV)..

Industry standard sizes are the same as those for Capacitors andIndustry standard sizes are the same as those for Capacitors and

Resistors, These range are fromResistors, These range are from 06030603 (length 1.5 mm x width 0.75 mm)(length 1.5 mm x width 0.75 mm)

throughthrough 22202220 (5.5 mm x 5.0 mm).(5.5 mm x 5.0 mm).

The Operating voltages are fromThe Operating voltages are from 3.5 to 120 volts dc3.5 to 120 volts dc..


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Zener DiodesZener Diodes

(TVS Diodes)(TVS Diodes)

Terminology (for Zener Diode & TVS Diode)Terminology (for Zener Diode & TVS Diode)


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Terminology (for Zener Diode & TVS Diode)Terminology (for Zener Diode & TVS Diode)

Zener DiodesZener Diodes can be used to be acan be used to be a Transient VoltageTransient Voltage

SuppressorsSuppressors..

Conventionally,Conventionally, Zener DiodesZener Diodes are designed and specifiedare designed and specifiedforfor voltage regulation.voltage regulation.

In order to make it be distinguishableIn order to make it be distinguishable, someone calls the, someone calls the

Zener DiodesZener Diodes designed and characterized for transientdesigned and characterized for transient

voltage suppressionvoltage suppression asas TVS DiodesTVS Diodes..

TVS diodesTVS diodes areare clamping devicesclamping devices that will limitthat will limit a voltagea voltagespikespike byby the low impedance avalanche breakdown ofthe low impedance avalanche breakdown of aa

semiconductor PN junctionsemiconductor PN junction..

The Characteristics of TVS DiodesThe Characteristics of TVS Diodes


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The Characteristics of TVS DiodesThe Characteristics of TVS Diodes

Ideally the TVS diode appearsIdeally the TVS diode appears as an open circuitas an open circuit, although there is a small, although there is a smallamount of leakage current present. Whenamount of leakage current present. When a transient appearsa transient appears on the line theon the line the

TVS Diode becomes activeTVS Diode becomes active,, clamping the pulse to level that will not damageclamping the pulse to level that will not damage

the component it is protectingthe component it is protecting..

The Structure of TVS DiodesThe Structure of TVS Diodes


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The Structure of TVS DiodesThe Structure of TVS Diodes

The depletion region is only a 100nm thick forcing mostThe depletion region is only a 100nm thick forcing mostenergy dissipation into a very thin region at the surface ofenergy dissipation into a very thin region at the surface of

the diode.the diode.

The Formats of TVS DiodesThe Formats of TVS Diodes


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e o ats o S odes

Axial LeadsAxial Leads

Usually for Surge purposeUsually for Surge purpose

Surface MountSurface Mount

Usually for ESD protection purposeUsually for ESD protection purpose

The Features of TVS DiodesThe Features of TVS Diodes


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PositivePositive

Fast in circuit response time, < 5 nsec.Fast in circuit response time, < 5 nsec.

Can conduct their maximum current without any increase in clampCan conduct their maximum current without any increase in clamp

voltagevoltage..

No age issue, as long as their parameters are not exceeds.No age issue, as long as their parameters are not exceeds.

Dominate in low voltage transient suppressor applications, due tDominate in low voltage transient suppressor applications, due too

their low clamping voltage.their low clamping voltage.

NegativeNegative

Expensive than Varistor.Expensive than Varistor.

The handling maximum transient current is less than that of VariThe handling maximum transient current is less than that of Varistor.stor.

The capacitance is high for high speed applications, typically >The capacitance is high for high speed applications, typically > 25pF.25pF.

Discrete Zener diodes always suffer the high dynamic turnDiscrete Zener diodes always suffer the high dynamic turn--onon

resistance which make them have high clamping voltage under highresistance which make them have high clamping voltage under high

ESD level stress.ESD level stress.


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TVS ESD ArrayTVS ESD Array

TVS ESD ArrayTVS ESD Array


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Multiple channels.Multiple channels.Let System size be small.Let System size be small.

C load could be low, suitable for high speed applications.C load could be low, suitable for high speed applications.

y

TVS Diodes Array is anTVS Diodes Array is anintegrated multiintegrated multi--channels ESDchannels ESD

protection deviceprotection device

Application Examples of TVS Diodes ArrayApplication Examples of TVS Diodes Array


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VaristorsVaristors TVS ArraysTVS Arrays

TVS ArraysTVS ArraysDiodesDiodes

Save Board Area!Save Board Area!Save Total System Cost!Save Total System Cost!


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Amazing Microelectronic Corp.

The ESD Design of

N/B , PC , LCD TV, Cellphone

The Comparisons of ESD Protection devicesThe Comparisons of ESD Protection devices


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pp

LowHighHighSystem Cost

HighLowLowIndividualDevice Cost

FareFareGoodHeat Sink

LowMediumHighC_load

NoNoYesAging problem

LowMedium to highHighClamp Voltage

FastSlowSlowResponse Time

TVS ArrayZener DiodeVaristor

The Troubles of Traditional ESD Design Methods for PC/NBThe Troubles of Traditional ESD Design Methods for PC/NB


59/161


Try and ErrorTry and Error Time Consumptive.Time Consumptive.

Through Mechanical DesignThrough Mechanical Design System cost is high.System cost is high.

Developed Solution is hard to be repeatedly used.Developed Solution is hard to be repeatedly used.


60/161


System LevelSystem LevelESD Protection DevicesESD Protection Devices

(TVS Devices)(TVS Devices)

TVS: Transient Voltage SuppressionTVS: Transient Voltage Suppression

The Function of ESD Protection DeviceThe Function of ESD Protection Device


61/161


I/O port of a ProductI/O port of a Product

Prevent the operation of an Electronic Product from thePrevent the operation of an Electronic Product from thedisturbance of ESD event.disturbance of ESD event. -- Bypass the ESD currentBypass the ESD current

andand Clamp the voltage at a low valueClamp the voltage at a low value..

The Operation of TVS Device (The Operation of TVS Device (Clamping voltageClamping voltage))


62/161


Prevent System from Malfunction!Prevent System from Malfunction!

TVSTVSssClamping VoltageClamping Voltageis the most important parameter.is the most important parameter.

System malSystem mal--function thresholdfunction threshold

Different Systems have differentDifferent Systems have different system malsystem mal--function thresholdfunction threshold values.values.

TLP ITLP I--V Curve :V Curve :TVSTVSs ESD Clamping Voltage Measurements ESD Clamping Voltage Measurement


63/161


TLP: Transmission Line Pulsing.TLP: Transmission Line Pulsing.

t

D

UT

+

-V_TLP

I_TLP

A

B

C

D

E

AB

C

D

E

V_TLP

I_TLP

The Clamping Voltage

during Bypassing ESDCurrent (I_TLP).

30ns~100ns30ns~100ns Similar to ESD GunSimilar to ESD Guns waveforms waveform TLP ITLP I--V CurveV Curve


64/161

An Example of TLP IAn Example of TLP I--V CurveV Curve


65/161


Transmission Line Pulsing (TLP) Measurement

Transmission Line Pulsing (TLP) Voltage (V)

0 2 4 6 8 10 12 14

0

2

4

6

8

10

12

14

16

18

20

V_pulse

100ns

Pulse from atransmission line

DUT

TLP_I+

-

TLP_V

I/O to GND

When IWhen ITLPTLP=I=IESDESD= 16A (~ESD= 16A (~ESD5kV), the TVS5kV), the TVSs ESD clampings ESD clamping

voltage Vvoltage VCLCL = 12V.= 12V.

When IWhen ITLPTLP

=I=IESDESD

= 6A (~ESD= 6A (~ESD

2kV), the TVS2kV), the TVSs ESD clampings ESD clamping

voltage Vvoltage VCLCL = 8.75V.= 8.75V.

Clamping Voltage Comparison by TLP MeasurementClamping Voltage Comparison by TLP Measurement


66/161


Stress condition:Stress condition:I/O vs. GNDI/O vs. GND

AZ1015

AZ1015--04

S

04

S

Sx

Sx

Cxxx

Cxxx

S

xxxxxx

S

xxxxxx

Pxxxxxx

Pxxxxxx

TLP:

TransmissionLinePulsing

TLP:

TransmissionLinePulsing

Direct Pin Injection Contact DischargeDirect Pin Injection Contact DischargeProtectionProtection


67/161


------XXVVVVSxSx

VVVVVVVVAZ1015AZ1015--04S04S

------------------XXPxxxxxxPxxxxxx

------------------XXCxxxxCxxxx

8kV8kV

(contact)(contact)2kV2kV

(contact)(contact)1kV1kV

(contact)(contact)600V600V

(contact)(contact)PartsParts

Self Recover ErrorsSelf Recover Errors

( X: error happened, V: pass))( X: error happened, V: pass))

Contact Discharge @ USB ports of PCBContact Discharge @ USB ports of PCB

Put ESD Protect ICPut ESD Protect IC

@ USB Port@ USB Port

(Class(Class--A)A)


68/161


Direct Pin InjectionDirect Pin Injection

Contact Discharge TestContact Discharge Test(Clamping Voltage of the ESD Protector is the Key Parameter)(Clamping Voltage of the ESD Protector is the Key Parameter)

WHAT ISWHAT IS


69/161

Direct Pin Injection Contact Discharge TestDirect Pin Injection Contact Discharge Test

The E ample @ PCThe Example @ PCss USB PortsUSB Ports


70/161


The Example @ PCThe Example @ PCss USB PortsUSB Ports


71/161


72/161


The ESD Protection DesignsThe ESD Protection Designs

for Electronic Productsfor Electronic Products(PC , NB , Display , Cellphone)(PC , NB , Display , Cellphone)

Computer SystemsComputer Systems


73/161


CPU

NorthBridge

SouthBridge

PS2 Print Port DVI VGA HDMI

IEEE

1394

10M/100M/1G LAN

USB 2.0

Audio

SATA

CardReader

LCD Display SystemsLCD Display Systems


74/161

742007.2007.


Portable SystemsPortable Systems


75/161

752007.2007.


LCD

Interface

LED

Ext. MemoryCard

Keypad

Serial Port

USB/OTG

Battery

Volumn Adj/ON/OFF

Speaker

Mic


76/161

762007.2007.


ESD Design For High SpeedESD Design For High Speed

I/O portsI/O ports


77/161

Architecture DiagramsArchitecture Diagrams

AZ1ss/AZCss Family (AZ1ss/AZCss Family (High Speed Data Line Protection FamilyHigh Speed Data Line Protection Family))


78/161

782007.2007.


ApplicationsApplications USB2.0 Power and Data line protectionUSB2.0 Power and Data line protection

Digital Video Interface (DVI)Digital Video Interface (DVI)

IEEE 1394 Firewire PortsIEEE 1394 Firewire Ports

Video Graphics CardsVideo Graphics Cards

Monitors and Flat Panel DisplaysMonitors and Flat Panel Displays

Notebook ComputersNotebook Computers SIM portsSIM ports

10/100/10000 Ethernet10/100/10000 Ethernet

ATM InterfacesATM Interfaces

USB OTGUSB OTG

HighHigh--Definition Multimedia Interface (HDMI)Definition Multimedia Interface (HDMI)


AZ1ss familyAZ1ss family may be used to meet themay be used to meet the

ESD immunityESD immunity requirements ofrequirements of

IEC 61000IEC 61000--44--2 (ESD)2 (ESD) 15kV (air),15kV (air), 8kV8kV

(contact)(contact)IEC 61000IEC 61000--44--4 (EFT) 40A (5/50ns)4 (EFT) 40A (5/50ns)

IEC 61000IEC 61000--44--5 (Lightning) 12A (8/205 (Lightning) 12A (8/20s)s)

I/O

GND

VDD

High

Speed

I/OB

us

C_load

Steering Diode DesignSteering Diode Design

V BUS

D+

VBUS

RT1.1. VDD pin directly short to USBVDD pin directly short to USBs VBUSs VBUS

TVS Array on USB portsTVS Array on USB ports


79/161

792007.2007.


USBController

1 2 3

456

AZ1015-04S

USBPort1

USBPort2

GND

D+

D+

D_

D_

VBUS

GND

GND

RT

RT

RT

CT CT

CT CT

plate, No trace connection.plate, No trace connection.2.2. GND pin directly short to USBGND pin directly short to USBs GNDs GND

plate, No trace connection.plate, No trace connection.

3.3. TVS can NOT be placed at theTVS can NOT be placed at the

boundary of different power Plates.boundary of different power Plates.

4.4. Data trace should be connected toData trace should be connected toTVSTVSs I/O pin first, then connected tos I/O pin first, then connected to

the controller.the controller.

ThatThats ALL!s ALL!

Chip cap.

USBV

D1+

D1-

GND

GND

GND

CommonMode

Choke

Dual PortsUSB Connector

13

4

Amazing's 6-pin TVS

6

USBV

D2+

D2-

GND

GNDCommonMode

Choke

Use power plateis better

GND

Choose Different Amazing TVSChoose Different Amazing TVSs for Different ESD Test Specs.s for Different ESD Test Specs.

I/O 3I/O 4 VDD


80/161

802007.2007.


AZC099AZC099--04S04S



AZ1015AZ1015--04S04S

AZ1045AZ1045--04S04S

6 5 4

1 2 3I/O 1 I/O 2GND

SOT23-6L

Higher ESD spec.Higher ESD spec.

& Higher Criterion& Higher Criterion

Lower PriceLower Price


81/161

812007.2007.


Changing system ESD criteria is effortlessChanging system ESD criteria is effortless

with Amazing's solutionwith Amazing's solution


82/161

822007.2007.


Why Should Choose AmazingWhy Should Choose Amazings TVSs TVSs?s?


83/161

832007.2007.


1.1. Lowest Clamping Voltage of the World.Lowest Clamping Voltage of the World.

2.2. Lowest input Capacitance of the World.Lowest input Capacitance of the World.

3.3. Strong technical support from very experienced team.Strong technical support from very experienced team.

4.4. Provide pin to pin solutions for all I/O of PC, NB, and TV.Provide pin to pin solutions for all I/O of PC, NB, and TV.

5.5. Fast L/T and price advantage.Fast L/T and price advantage.

Amazing TVSAmazing TVSs Help USB ports to pass 2~8KV contact Mode Classs Help USB ports to pass 2~8KV contact Mode Class--A CriterionA Criterion

6 5 4

I/O 3I/O 4 VDD

4.0

Typical Variation of CIN vs. VIN


84/161

842007.2007.


AZ1015AZ1015--04S04S

(SOT23(SOT23--6L)6L)

1 2 3I/O 1 I/O 2GND

Input Voltage (V)

0 1 2 3 4 5

InputCapacitance(pF)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

VDD = 5V, GND = 0V, f = 1MHz, T=25 oC,

Peak pulse Current (A)

4 5 6 7 8 9 10 11 12 13

ClampingVoltage(V)

0123

456789

10111213

1415

Clamping Voltage vs. Peak Pulse Current

WaveformParameters:

tr=8std=20s

I/O pin to GND pin



0 2 4 6 8 10 12 14Transmissi

onLinePulsing(TLP)Curr

ent(A)

0

24

6

8

10

12

14

1618

20

V_pulse

100ns


DUT

TLP_I+

-

TLP_V

I/O to GND

Lowest ValueLowest Value Lowest ValueLowest Value

Can pass 2.0 eyeCan pass 2.0 eye

For ESDFor ESD

For LightningFor Lightning

AZ1015AZ1015--04S04SHelpsHelpsUSB portsUSB portsto passto pass8KV contact Mode8KV contact Mode


85/161

852007.2007.


Port 1Port 1 Port 2Port 2 Port 3Port 3 Port 4Port 4

w/ow/oESD DeviceESD Device

w/w/

AZ1015AZ1015--04S04S

USB 2.0 Eye Diagram Measurement ResultUSB 2.0 Eye Diagram Measurement Result

@ High Speed Operation Mode@ High Speed Operation Mode

Amazing TVS DevicesAmazing TVS Devices


86/161

862007.2007.


ESD Design For VGA portESD Design For VGA port

VDDGND

1

2

3 4

5

6AZ1015-04S

TVS Arrays on VGA portTVS Arrays on VGA port(for 3kV ~ 8kV contact ESD)(for 3kV ~ 8kV contact ESD)

Red

G

VCC6 5 4

VCC RedGreen

VideoFilter

75

RedVCC


87/161

872007.2007.


1

15

5

1

2

3 4

5

6AZ1

015-04S

VDD

GND

RedGreenBlue

DDC DATDDC CLK H-SyncV-Sync

11




AZ1G15AZ1G15--04S04S

AZ1045AZ1045--04S04SHigher ESD spec.Higher ESD spec.

& Higher Criterion.& Higher Criterion.


Green

Blue

VSYNC

HSYNC

DDC_Data

DDC_CLK

DIG_GND

Red_GND

Green_GND

Blue_GND

1 2 3

Blue

GND

6 5

1 2

4

3

VCC

DDC_Data

VSYNC

HSYNC

DDC_CLK

VideoFilter

75

Green

VideoFilter

75

Blue

FBVSYNC

FBHSYNC

FB DDC_Data

FBDDC_CLK

SignalsFromScaler

15-pinVGA connector

* optional0.1uF or 0.01uF

chip capacitor for filteringhigh-frequency ESD noise

VCC

Pick &Pick &

Place!Place!

TVS arraysTVS arrays



88/161

882007.2007.


ESD Design For LAN portESD Design For LAN port

Amazing TVS on LAN port of PC/NBAmazing TVS on LAN port of PC/NB

L P iL P i


89/161

892007.2007.





AZ1G15AZ1G15--04S04S

AZ1045AZ1045--04S04S






90/161

902007.2007.


ESD Design For DVI portESD Design For DVI port

TVS Arrays on DVI portTVS Arrays on DVI port(for 3kV ~ 8kV contact ESD)(for 3kV ~ 8kV contact ESD)

TMDS_D2-

VCC

VCC

VCC

TMDS D2+

6 5 4

TMDS_D2-TMDS_D2+

1 2

43

TMDS-D2-

common modechoke

TMDS-D2+

1 2TMDS-D1-

common mode

choke

CKT24

CKT24


91/161

912007.2007.


DDC_CLK

DDC_Data

Detect

GND

FB

Detect

FBDDC_Data

FB

DDC_CLKSignalsFromScaler

DVI_Dconnector

* optional0.1uF or 0.01uF

chip capacitor for filteringhigh-frequency ESD noise

TMDS_D2+

TMDS_D1-

TMDS_D1+

TMDS_D0-

TMDS_D0+

TMDS_CK-

TMDS_CK+

VCC

TMDS_CK-

TMDS_D0-

VCC

6 5

1 2

4

3

VCC

Detect

DDC_CLKDDC_Data

VCC

6 5

1 2

4

3

1 2 3

TMDS_CK+

TMDS_D0+

TMDS_D1-TMDS_D1+43

TMDS D1

TMDS-D1+

1 2

43

TMDS-D0-

common modechoke

TMDS-D1+

1 2

43

TMDS-CK-

common modechoke

TMDS-CK+

TMDSDATA2-

TMDSDATA2+

TMDSDATA1-

TMDSDATA1+

TMDSDATA0-

TMDSDATA0+

TMDSDATACLK+

TMDSDATACLK-

DDCDATA

DDCCLK

HotPlugDetect

+5VPower

CKT1

AZC099-04S

AZC099-04S

AZC099-04S

0.1uF

0.1uF 0.1uF

TMDSDATA2-

TMDSDATA2+

TMDSDATA1-

TMDSDATA1+

TMDSDATA0-

TMDSDATA0+

TMDSDATACLK+

TMDSDATACLK-

DDCDATA

DDCCLK

HotPlugDetect

+5VPower

CKT1

AZC099-04S

AZC099-04S

AZC099-04S

0.1uF

0.1uF 0.1uF

TVS arraysTVS arraysAZC099AZC099--04S04S



AZ1G15AZ1G15--04S04SAZ1045AZ1045--04S04S




Pick &Pick &

Place!Place!



92/161

922007.2007.


ESD Design For HDMI portESD Design For HDMI port

HDMI Block DiagramHDMI Block Diagram


93/161

932007.2007.


Audio, video and auxiliary data is transmitted across the threeAudio, video and auxiliary data is transmitted across the threeTMDS data channels.TMDS data channels.

A TMDS clock is transmitted on the TMDS clock channel and is useA TMDS clock is transmitted on the TMDS clock channel and is used by the receiver as ad by the receiver as a

frequency reference for data recovery on the three TMDS data chafrequency reference for data recovery on the three TMDS data channels.nnels.

The DDC is used by the Source to read the SinkThe DDC is used by the Source to read the Sinks Enhanced Extended Displays Enhanced Extended Display

Identification Data (EIdentification Data (E--EDID) in order to discover the SinkEDID) in order to discover the Sinks configuration and/ors configuration and/or

capabilities.capabilities.

TMDS_D2+

TMDS_GND

TMDS_D2+

TMDS_D2-3 2 1

Via hole to GND

GND

TVS Arrays on HDMI port (1)TVS Arrays on HDMI port (1)


94/161

942007.2007.


HOTPLUG_DET

+5V OUT

GND

DDC_DAT

TMDS_D2-

TMDS_D1+

TMDS_GND

TMDS_D1-

TMDS_D0+

TMDS_GND

TMDS_D0-

CE_REMOTE

N/C

DDC_CLK

TMDS_CK+

TMDS_GND

TMDS_CK-

TMDS_D1+

TMDS_D1-

TMDS_D0+

TMDS_D0-

TMDS_CK+

TMDS_CK-

HOTPLUG_DET

DDC_DAT

CE_REMOTE

DDC_CLK

HDMIConnector

AZC099-04S

3 2

4 5 6

1

Via hole to GND

Via hole to GND

GND

+5VVia hole to +5V

C=100nF

(optional)

AZ1045-04SU

3 2

4 5 6

1

Via hole to GND

Via hole to GND

GND

+5VVia hole to +5V

C=100nF(optional)

AZ1045-04SU

4 5 6

Via hole to GND

+5VVia hole to +5V

C=100nF

(optional)

NC

NC

10

9

Line-1

Line-2

1

2

AZ1045AZ1045--04Q04Q

(MSOP(MSOP--10L)10L)

TVS Arrays on HDMI port (2)TVS Arrays on HDMI port (2)


95/161

952007.2007.


GND

NC

NC

8

7

6

VDD

Line-3

Line-4

3

4

5

Flow through layout style.Flow through layout style.

TMDS_D0+

TMDS_D0-

TMDS_CK-

TMDS_CK+

C=100nF (optional)

TMDS_D2+

TMDS_D2-

TMDS_D1-

1

2

3

4

5

10

9

8

7

6

HOTPLUG_DET

+5V IN

GND

DDC_DAT

TMDS_D2+

TMDS_GND

TMDS_D2-

TMDS_D1+

TMDS_GND

TMDS_D1-

TMDS_D0+

TMDS_GND

TMDS_D0-

CE_REMOTE

N/C

DDC_CLK

TMDS_CK+

TMDS_GND

TMDS_CK-

HDMIConnector

1

2

3

4

5

10

9

8

7

6

GND +5V

TMDS_D1+

C=100nF (optional)

GND +5V

HOTPLUG_DET

DDC_DAT

CE_REMOTE

DDC_CLK

AZC099-04S

3 2

4 5 6

1

Via hole to GND

Via hole to GND

GND

VCC Via hole to VCC

C=100nF(optional)

(( ))

1 385V VDD

5V_supply

NC

1

2

38

37

AZ1045-12T5V_VDD

NC

NC

*Note 1

CESD0.1uF

(TSSOP(TSSOP--38L)38L)TVS Arrays on HDMI port (3)TVS Arrays on HDMI port (3)


96/161

962007.2007.


TMDS_D2+

TMDS_D2-

TMDS_D1+

TMDS_D1-

TMDS_D0+

TMDS_D0-

TMDS_CK+

TMDS_CK-

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

GND

GND

GND

GND

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

AZ1045-12T

17

18

19

22

21

20

GND

5V_VDD

CEC

SCL

SDA

HP-Detect

TMDS_D2+

TMDS_D2-

TMDS_D1+

TMDS_D1-

TMDS_D0+

TMDS_D0-

TMDS_CK+

TMDS_CK-

GND

GND

GND

GND

CEC

SCL

SDA

HP-Detect

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

+5V OUT

GND

NC

HDMITranceiver

TMDS_D2+

TMDS_D2-

TMDS_D1+

TMDS_D1-

TMDS_D0+

TMDS_D0-

TMDS_CK+

TMDS_CK-

CEC

SCL

SDA

HP-Detect

VCC

WP

SCL

SDA

A0

A1

A2

GND

EEPROM

NC

NC

NC

HDMIConnector

TMDS_D2+TMDS_D2-

TMDS_D1+TMDS_D1-

TMDS_D0+

TMDS_D0-

TMDS_CK+TMDS_CK-

3

4

5

6

7

8

9

10

11

12

13

14

15

16

36

35

34

33

32

31

30

29

28

27

26

25

24

23

17

18

19

22

21

20

NC

CEC

SCL

SDA

HP-Detect

TMDS_D2+

TMDS_D2-

TMDS_D1+

TMDS_D1-

TMDS_D0+

TMDS_D0-

TMDS_CK+

NC

TMDS_CK-

CEC

SCL

SDA

HP-Detect

+5V OUT

GND

GND

GND

GND

GND

+5V OUT

CP0.1uF

RP1kohmRSCLRSDA

EEPROM

SDA

EEPROM

SCL

Note-1

*Note-2

*Note-3

*Note-1 : The NC pins are those pins without any connectionin the chip, thus, on PCB, they can be connected toanywhere.*Note-2 : Differential TMDS pairs need be designed as normal100 ohm HDMI microstrip. Single Ended TMDS traces underthe AZ1045-12T and between AZ1045-12T and Connectormaybe need to be tuned to match chip/connector parasitics.

*Note-3: Pin 16 is short to Pin 23 in the chip, Pin 17 is shortto Pin 22 in the chip,Pin 18 is short to Pin 21 in the chip,andPin 19 is short to Pin 20 in the chip,

HDMIConnector

Single Chip & Flow through layout style.Single Chip & Flow through layout style.

TMDS_D2+

TMDS_GND

TMDS_D2+

TMDS_D2-

3 2 1

Via hole to GND

GND

Amazing TVS on HDMI port of PC/NB/ LCD TVAmazing TVS on HDMI port of PC/NB/ LCD TV



97/161

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HOTPLUG_DET

+5V OUT

GND

DDC_DAT

TMDS_D2-

TMDS_D1+

TMDS_GND

TMDS_D1-

TMDS_D0+

TMDS_GND

TMDS_D0-

CE_REMOTE

N/C

DDC_CLK

TMDS_CK+

TMDS_GND

TMDS_CK-

TMDS_D1+

TMDS_D1-

TMDS_D0+

TMDS_D0-

TMDS_CK+

TMDS_CK-

HOTPLUG_DET

DDC_DAT

CE_REMOTE

DDC_CLK

HDMIConnector

AZC099-04S

3 2

4 5 6

1

Via hole to GND

Via hole to GND

GND

+5VVia hole to +5V

C=100nF

(optional)

AZ1045-04SU

3 2

4 5 6

1

Via hole to GND

Via hole to GND

GND

+5VVia hole to +5V

C=100nF(optional)

AZ1045-04SU

4 5 6

Via hole to GND

+5VVia hole to +5V

C=100nF

(optional)

AZC099AZC099--04S(ver 1.2)04S(ver 1.2)

AZC002AZC002--04S(ver 1.2)04S(ver 1.2)

AZC015AZC015--04S(ver 1.2)04S(ver 1.2)

AZ1G15AZ1G15--04S(ver 1.2)04S(ver 1.2)

AZ1045AZ1045--04S(ver 1.3)04S(ver 1.3)




Amazin

g TVS DevicesAmazing TVS Devices


98/161

982007.2007.


AZ1045AZ1045--04S, AZ104504S, AZ1045--04Q04Q(For HDMI Application)(For HDMI Application)

Can pass 12kv on NB by direct injectionCan pass 12kv on NB by direct injection

AZ1045AZ1045--04S04SHelpsHelpsHDMI portHDMI porttotopass 8KV contact Modepass 8KV contact Mode

6 5 4

I/O 3I/O 4 GND


99/161

992007.2007.


AZ1045AZ1045--04S04S

(SOT23(SOT23--6L)6L)

Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Capacitance(

pF)

0.00.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

I/OI/O--toto--GNDGND

Lowest ValueLowest Value

AZ1045AZ1045--04S04S

6 5 4

1 2 3I/O 1 I/O 2VDD

0.55pF0.55pF

TMDS R eciverTMDS transimtter

TMDS Data 2+

Host DisplayHDMI

Connec tor

TMDS Dat a 2-

TMDS Dat a 2+

TMDS Da ta 2-

Application of AZ1045Application of AZ1045--04S04S


100/161

10

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2007.2007.


TMDS Data 1+

TM DS Data 1-

TMDS Data 0+

TMDS Data 0-

TMDS C lock+

TMDS Clock-

TMDS Data 1+

TMDS Data 1-

TMDS Data 0+

TMDS Data 0-

TMDS Clock+

TMDS Clock-

1

3 4

6

1

3 4

6

1

34

6

1

34

6

AZ1045-

04S

AZ1045-

04S

AZ1045-

04S

AZ1045-

04S

CEC

S CL

+5V Power

SDA

Hot Plug Detect

DD C/CEC GND

CEC

SCL

+5V Power

SDA

Hot P lug Detect

DDC/CEC GN D

1

3 4

6 1

34

6AZ1045-

04S

AZ1045-

04S

AZ1045-

04S

AZ1045-

04S

AZ1045-

04S

AZ1045-

04S

AZ1045-

04S

AZ1045-

04S


1416

18

V l

AZ1045AZ1045--04S vs CM2021 performance comparision04S vs CM2021 performance comparision

PowerPower--RailRail

AZ1045AZ1045--04S04S


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10

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2007.2007.




0 2 4 6 8 10 12 14

0

2

4

6

8

10

12

14

16

18

V_pulse

100ns


DUT

TLP_I+

-

TLP_V

I/O to GND


0 1 2 3 4 5 6 7 8 9 10

0

2

4

6

8

10

12

V_pulse

100ns


DUT

TLP_I+

-

TLP_V

VDD to GND

Voltage (V)

0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5

Current(A)

0.0

0.5

1.01.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

6.5

7.0

7.5

pin1 (5V_supply) vs. pin3 (GND)

pin4 (TMDS_D2+) vs. pin3 (GND)

pin37 (ESD_BYP) vs. pin3 (GND)


CM2021CM2021

0 50 5 0 S0 S

AZ1045AZ1045--04S04S



AZ1045AZ1045--0404QQHelpsHelpseasy PCB layouteasy PCB layout

8 NC 10 Line-11


102/161

10

2

2007.2007.


6 7 9 10

3

NC

GND

NC

NC

9

8

7

6

Line-2

VDD

Line-3

Line-4

2

3

4

5

MSOP-10L

7

8

9

10

NC

GND

NC

NC 6

NC

4

3

2

1

Line-2

VDD

Line-3

Line-4

Line-1

5

Line-1

Line-2

Line-3

Line-4

Line-1

Line-2

Line-3

Line-4

GND VDD

Flow through layout style.Flow through layout style.


103/161

0 8

0.9

1.0

I/OI/O--toto--GNDGND 0.100.11

0.12

I/OI/O--toto--I/OI/O

C_Load of AZ1045C_Load of AZ1045--04Q : The lowest C_in in the world04Q : The lowest C_in in the world

@ VDD = 5V@ VDD = 5V


104/161

10

4

2007.2007.


Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Capacitance(pF)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8 I/OI/OtotoGNDGND

Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

C

apacitance(pF)

0.00

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.09

Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Capacitance(pF)

0.0

0.1

0.20.3

0.4

0.5

0.6

0.7

0.8

0.91.0


Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

C

apacitance(pF)

0.00

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.09

0.10

0.110.12


@ VDD = Floated@ VDD = Floated

0.55pF0.55pF

0.7pF0.7pF

PowerPower--RailRail I/OI/O--toto--GNDGND

TLP CharacteristicsTLP Characteristics

Clamping voltage of AZ1045Clamping voltage of AZ1045--04Q : The lowest in the world04Q : The lowest in the world


105/161

10

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2007.2007.


PowerPowerRailRail I/OI/OtotoGNDGND



1 2 3 4 5 6 7 8 9 10 11 12 13 14TransmissionLine

Pulsing(TLP)Current(A)

0

2

4

6

8

10

12

14

16

18

V_pulse

100ns


DUT

TLP_I+

-

TLP_V

I/O to GND



0 1 2 3 4 5 6 7 8 9 10T

ransmissionLine

Pulsing(TLP)Cu

rrent(A)

0

2

4

6

8

10

12

14

16

18

V_pulse

100ns


DUT

TLP_I+

-

TLP_V

VDD to GND

Amazing TVS ARRAY could help you cost down

1)1) Provide ESD protection for all I/OProvide ESD protection for all I/O


106/161

10

6

2007.2007.

AugustAugust


1)1) Provide ESD protection for all I/OProvide ESD protection for all I/O

2)2) To reduce the component counts (multiTo reduce the component counts (multi

channels instead of numbers of diode)channels instead of numbers of diode)3)3) Offer pin to pin compatible with different I/O forOffer pin to pin compatible with different I/O for

one time designone time design

4)4) Simply to control stock based on 2) &3)Simply to control stock based on 2) &3)5)5) Simply to purchase based on 2) & 3)Simply to purchase based on 2) & 3)

6)6) Cost down for SMTCost down for SMT

Application Examples of TVS Diodes ArrayApplication Examples of TVS Diodes Array


107/161

10

7

2007.2007.

AugustAugust


VaristorsVaristors TVS ArraysTVS Arrays

TVS ArraysTVS ArraysDiodesDiodes

Save Board Area!Save Board Area!

Save Total System Cost!Save Total System Cost!

Monitor board : Before , lots of zener diodes


108/161

10

8

2007.2007.

AugustAugust


Monitor board : After , replaced by TVS arrayAZC099AZC099--04S04SAZC099

AZC099--04S04S


109/161

10

9

2007.2007.

AugustAugust


AZ1045AZ1045--0404

Authentec SensorAuthentec Sensor


110/161

11

0

2007.2007.

AugustAugust


FingerPrintFingerPrint

AZ1015AZ1015--02N02N

Authentec SensorAuthentec Sensor

AES1610AES1610


111/161

11

1

2007.2007.

AugustAugust


AZ2015AZ2015--01H @01H @

PanelPanels VDDs VDD--

toto--GND.GND.

AZ2015AZ2015--01H @01H @

PanelPanels Resets Reset

pin.pin.

AZ2015AZ2015--01H @01H @

PanelPanels V_com pin.s V_com pin.

2 AZ20252 AZ2025--01H @01H @

Speaker linesSpeaker lines



112/161

11

2

2007.2007.

AugustAugust


AZ2AZ2ss Familyss Family

(for(forPowerPowerandandControl LinesControl LinesProtection)Protection)

The Architecture ofThe Architecture ofAZ201AZ201 FamilyFamily


AZ2ss Family (AZ2ss Family (Power and Control Lines Protection FamilyPower and Control Lines Protection Family))

The Architecture ofThe Architecture ofAZ202AZ202FamilyFamily


Equal toEqual toE l tE l t


113/161

11

3

2007.2007.

AugustAugust


ApplicationsApplications

Computer Interfaces ProtectionComputer Interfaces Protection

Microprocessors ProtectionMicroprocessors Protection

Serial and Parallel Ports ProtectionSerial and Parallel Ports Protection

Control Signal Lines ProtectionControl Signal Lines Protection

Power lines on PCB ProtectionPower lines on PCB Protection Latchup ProtectionLatchup Protection

ApplicationsApplications

Computer Interfaces ProtectionComputer Interfaces Protection

Microprocessors ProtectionMicroprocessors Protection

Serial and Parallel Ports ProtectionSerial and Parallel Ports Protection

Control Signal Lines ProtectionControl Signal Lines Protection

Power lines on PCB ProtectionPower lines on PCB Protection Latchup ProtectionLatchup Protection

AZ2ss familyAZ2ss family may be used to meet themay be used to meet the ESD immunityESD immunity requirements ofrequirements of

IEC 61000IEC 61000--44--2 (ESD)2 (ESD) 15kV (air),15kV (air), 8kV (contact) ; IEC 610008kV (contact) ; IEC 61000--44--4 (EFT) 40A (5/50ns) ;4 (EFT) 40A (5/50ns) ;

IEC 61000IEC 61000--44--5 (Lightning) 12A (8/205 (Lightning) 12A (8/20s)s) ..

Equal toEqual toEqual toEqual to


114/161

Excellent Clamping PerformanceExcellent Clamping Performance

@ 8/20us Current@ 8/20us Current

The Lower Clamping VoltageThe Lower Clamping Voltage

helps systems to pass Higherhelps systems to pass Higher

Choosing Low Clamping Voltage TVS ArraysChoosing Low Clamping Voltage TVS Arrays


115/161

11

5

2007.2007.

AugustAugust

confidentialconfidentialVoltage (V)

0 1 2 3 4 5 6 7 8 9 10 1 1 1 2 1 3 1 4

Current(A)

0

1

2

3

4

56

7

8

9

10

11

12

13

14

15

16

17

AZ2015-02S I /O vs. GN D

AZ2015-0 2S I/O vs. I/O

TLP pulse width : 100ns

Pulse rise/fall time: 1ns/1ns

Lowest ValueLowest Value is the best choice.is the best choice.

@ TLP Current@ TLP Current

Lowest ValueLowest Value is the best choice.is the best choice.

ESD level with ClassESD level with Class--A criteria.A criteria.

AZ2015AZ2015--02S02S

AZ2015AZ2015--02S02S

AUR

AUL

Shield

@ Bidirectional node@ Bidirectional node

Input Output

V V

Bidirectional Clamping TVS ArraysBidirectional Clamping TVS Arrays


116/161

11

6

2007.2007.

AugustAugust


2

1

2

1

AUR

AUL

Shield

3

1 2

gnd

VBR

-VBR

gnd

VBR

-VBR

gnd

VCL

-VCL

gndNormalOperation

TransientVoltage

ProtectedDevices

3

1 2

Audio PortAudio Port

Conne

ctor

KeyboardTerminalPrinter

.

.

. ICtobe

protected

VDD

data-1

data-2

Control-1

GNDConnecto

r

ICtobepro

tected

I/O 1

I/O 2

I/O 3

I/O 4

GND

TVS Arrays on Low Speed I/O Ports / Internal BusesTVS Arrays on Low Speed I/O Ports / Internal Buses


117/161

11

7

2007.2007.

AugustAugust


3

1 2

AZ2015-02S

3

1 2

AZ2015-02S

GND

1 2 3

5 4

Connector

ICtobepro

tected

I/O 1

I/O 2

I/O 3

I/O 4

GND

1 2 3

6 45

I/O 5 Chip-A

Chip-B

Chip-C

Low SpeedData Line

Low SpeedData Line

Control Line

Control Line

VDD

VCC

GND

AZ2015-02S

AZ2015-02SAZ2015-02S

Low Speed I/O portLow Speed I/O port Low Speed I/O portLow Speed I/O portLow Speed I/O portLow Speed I/O port

Low Speed I/O portLow Speed I/O portLow SpeedLow Speed

Internal BusesInternal Buses

Low SpeedLow Speed

Internal BusesInternal Buses


118/161

TVS Arrays on Critical Internal BusesTVS Arrays on Critical Internal Buses

LCM Module for Mobile Products (pass 12kV Air ESD)LCM Module for Mobile Products (pass 12kV Air ESD)


119/161

11

9

2007.2007.

AugustAugust


TVSTVS

TVSTVS

TVSTVS


120/161

It's time to change the ESD concept of system design


121/161

12

1

2007.2007.

AugustAugust


1.1. Higher ESD tolerance level will lower down RMA.(provenHigher ESD tolerance level will lower down RMA.(provenfacts)facts)

2.2. Higher ESD tolerance level won't get higher system cost.Higher ESD tolerance level won't get higher system cost.

3.3.

Choosing AMC's ESD solution will simplify the systemChoosing AMC's ESD solution will simplify the systemdesign/layout and component source/purchasing.design/layout and component source/purchasing.

4.4. Pass ESD compliance test at the first time, no more tryPass ESD compliance test at the first time, no more tryand error !and error !


122/161

12

2

2007.2007.

AugustAugust


Road MapRoad Map

Amazing TVS Array Product RoadmapAmazing TVS Array Product Roadmap

For


123/161

12

3

2007.2007.

AugustAugust


For < 12V, 24VFor < 12V, 24Vsystemssystems

50A Surge50A Surge

ProtectorsProtectors20A Surge20A Surge

ProtectorsProtectors

For


124/161

Amazing High Speed Switch with ESD Product RoadmapAmazing High Speed Switch with ESD Product Roadmap

20072007

AZHW341

Q4Q4Q3Q3Q2Q2Q1Q1Q4Q420082008


125/161

12

5

2007.2007.

AugustAugust


AZHW351AZHW351(3 to 1 HDMI 1.3 Switch)(3 to 1 HDMI 1.3 Switch)

AZHW241/251AZHW241/251

(2 to 1 HDMI 1.1/1.3 Switch)(2 to 1 HDMI 1.1/1.3 Switch)AZHW651AZHW651

(3 to 1 Display Port Switch)(3 to 1 Display Port Switch)AZHW451AZHW451

(2 to 1 Display Port switch)(2 to 1 Display Port switch)

AZHW341AZHW341

(3 to 1 HDMI 1.1(3 to 1 HDMI 1.1

Switch)Switch)HighHighSpeedSpeed

SwitchSwitch

with ESDwith ESD

ProductProduct

FamiliesFamilies

Amazing Transceivers with ESD Product RoadmapAmazing Transceivers with ESD Product Roadmap

20072007

AZRS2322AZRS2322

(Dual Ports RS232(Dual Ports RS232

Q4Q4Q3Q3Q2Q2Q1Q1Q4Q4

20082008


126/161

12

6

2007.2007.

AugustAugust


AZRS232XAZRS232X

(X Ports RS232 Transceiver)(X Ports RS232 Transceiver)

AZRS422XAZRS422X

(X Ports RS422 Transceiver)(X Ports RS422 Transceiver)AZRS485XAZRS485X

(X Ports RS485 Transceiver)(X Ports RS485 Transceiver)

AZRS4852AZRS4852

(Dual Ports RS485(Dual Ports RS485Transceiver)Transceiver)

AZRS4222AZRS4222(Dual Ports RS422(Dual Ports RS422

Transceiver)Transceiver)

(Dual Ports RS232(Dual Ports RS232

Transceiver)Transceiver)

HighHigh

PerformancePerformance

TransceiverTransceiver

with ESDwith ESDProductProduct

FamiliesFamilies


127/161

12

7

2007.2007.

AugustAugust


Comparison ReportComparison Report


128/161

12

8

2007.2007.

AugustAugust


ComparisonsComparisons

ST _Semtech_CMDST _Semtech_CMD

6 5 4

Amazing TVS arrays for USB, VGA, LAN, DVI, and other HighAmazing TVS arrays for USB, VGA, LAN, DVI, and other High--Speed I/O portsSpeed I/O ports


129/161

12

9

2007.2007.

AugustAugust


I/O pin to GND pin TLP Curve

TLP Voltage (V)1 2 3 4 5 6 7 8 9 10 11 12 13 14

TLPCurrent(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC015-04S

AZC002-04S

AZC099-04S

VDD pin to GND pin TLP Curve

TLP Voltage (V)1 2 3 4 5 6 7 8 9 10

TLPCurrent(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC015-04S

AZC002-04S

AZC099-04S

1 2 3

Amazing TVS arraysAmazing TVS arrays Comparing withComparing with that of CAMDthat of CAMD

6 5 4

AmazingAmazing CAMDCAMD

>21V >15V


130/161

13

0

2007.2007.

AugustAugust



TLP Voltage (V)4 6 8 10 12 14 16 18 20 22

TLPCurre

nt(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC015-04S

CM1293

CM1213


TLP Voltage (V)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

TLPCurre

nt(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC099-04S

CM1293

1 2 3

Amazing TVS arraysAmazing TVS arrays Comparing withComparing with that of NXPthat of NXP

6 5 4

AmazingAmazing NXPNXP


131/161

131

2007.2007.

AugustAugust



TLP Voltage (V)5 10 15 20 25 30 35 40 45 50

TLPCurrent

(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC099-04S

IP4220

IP4223

Damages Happened!


TLP Voltage (V)5 10 15 20 25 30 35 40 45 50 55 60

TLPCurrent

(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC015-04S

IP4220

IP4223

Damages Happened!

1 2 3

Amazing TVS arraysAmazing TVS arrays Comparing withComparing with that of Semtechthat of Semtech

6 5 4

AmazingAmazing SemtechSemtech


132/161

132

2007.2007.

AugustAugust



TLP Voltage (V)5 10 15 20 25 30 35

TLPCurrent(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC099-04S

Rclamp0504S

SRV05-4


TLP Voltage (V)5 10 15 20 25

TLPCurrent(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04SAZC099-04S

Rclamp0504S

SRV05-4

1 2 3

Amazing TVS arraysAmazing TVS arrays Comparing withComparing with that of STMthat of STM

6 5 4

AmazingAmazing STMSTM


133/161

133

2007.2007.

AugustAugust



TLP Voltage (V)5 10 15 20

TLPCurre

nt(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC099-04S

ST_USBLC6-2SC6


TLP Voltage (V)5 10 15 20 25 30

TLPCurrent(A)

0

2

4

6

8

10

12

14

16

18

AZ1015-04S

AZC099-04S

ST_USBLC6-2SC6

ST_DVIULC6-4SC6

1 2 3


134/161

Amazing HDMI TVS arraysAmazing HDMI TVS arrays Comparing withComparing with that of CAMDthat of CAMD6 5

1 2

4

3

NC

NC

10

9

Line-1

Line-2

1

2


135/161

135

2007.2007.

AugustAugust



TLP Voltage (V)5 10 15 20 25 30 35 40 45 50 55

TLPCurren

t(A)

0

2

4

6

8

10

12

14

16

18

AZ1045-04S

AZ1045-04Q

CM2021

Ron ~ 0.15

Ron ~ 2.5


TLP Voltage (V)5 10 15 20 25 30 35 40 45

TLPCurrent(A)

0

2

4

6

8

10

12

14

16

18

AZ1045-04S

AZ1045-04Q

CM2021

Ron ~ 2.7

Damages Happened!

Ron ~ 0.3

GND

NC

NC

8

7

6

VDD

Line-3

Line-4

3

4

5

Amazing HDMI TVS arraysAmazing HDMI TVS arrays Comparing withComparing with that of Semtechthat of Semtech6 5

1 2

4

3

NC

NC

10

9

Line-1

Line-2

1

2


136/161

136

2007.2007.

AugustAugust



TLP Voltage (V)5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

TLPCurren

t(A)

0

2

4

6

8

10

12

14

16

18

AZ1045-04S

AZ1045-04Q

RClamp0514M

Ron ~ 0.15

Ron ~ 0.4


TLP Voltage (V)5 10 15 20 25 30 35

TLPCurrent(A)

0

2

4

6

8

10

12

14

16

18

AZ1045-04S

AZ1045-04Q

RClamp0514M

RClamp0524P

Ron ~ 0.3

Ron ~ 0.8

Ron ~ 0.8

GND

NC

NC

8

7

6

VDD

Line-3

Line-4

3

4

5


137/161

I/O-to-VSS TLP Waveforms

ent)(A)

1314151617

18

ESD Level~ TLP_I x 330

ESD Clamping Voltage Comparison (I/OESD Clamping Voltage Comparison (I/O--toto--VSS)VSS)


138/161

138

2007.2007.

AugustAugust


Clamping Voltage (V)

1 3 5 7 9 11 13 15 17 19 21 23 25

TLPCurrent(=ESDC

urre

012345

6789

1011

1213

Semtech RClamp0514M

AZ1045-04Q


139/161

AZ1045AZ1045--04Q04Q

C_load Comparison (I/OC_load Comparison (I/O--toto--VSS, I/OVSS, I/O--toto--I/O)I/O)


140/161

140

2007.2007.

AugustAugust


Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Capacitance(pF)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.70.8

0.9

1.0


Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Capacitance(pF)

0.00

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.09

0.10

0.11

0.12


@ VDD = 5V@ VDD = 5V0.55pF0.55pF

RClamp0514MRClamp0514M


141/161

TLP I-V Curves of IP4223

13

14

15

16

17

Vdd-to-Vss

I/O-to-VssIt2


142/161

142

2007.2007.

AugustAugust


Voltage (V)

0 5 10 15 20 25 30 35 40 45 50

Current(A)

0

1

2

3

4

5

6

7

8

9

10

11

12

13

IP4220 will damage when the current is over 14A.

This is about 4.5KV ESD attack, will become permanent failure


143/161

143

2007.2007.

AugustAugust


This is about 4.5KV ESD attack, will become permanent failure

and have no ESD protection any more.

TLP I-V Curves of IP4220

14

15

16

17

Vdd-to-Vss

I/O-to-Vss

It2


144/161

144

2007.2007.

AugustAugust


Voltage (V)

0 5 10 15 20 25 30 35 40 45 50 55

Current(A)

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

TLP I-V Curves of cm1293

14

15

16

17

Vdd-to-Vss

I/O-to-Vss


145/161

145

2007.2007.

AugustAugust


Voltage (V)

0 2 4 6 8 10 12 14 16 18 20 22

Current(A)

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

TLP I-V Curves of SRV05-4

14

15

16

17

Vdd-to-Vss

I/O-to-Vss


146/161

146

2007.2007.

AugustAugust


Voltage (V)

0 2 4 6 8 10 12 14 16 18 20 22 24

Current(A)

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

TLP I-V Curves of Rclamp0504S

14

15

16

17

Vdd-to-Vss

I/O-to-Vss


147/161

147

2007.2007.

AugustAugust


Voltage (V)

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

Current(A)

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

Comparison ofComparison of

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