amc contamination strategy 450mm & advanced … airborne molecular contamination (amc) •...

AMC contamination strategy 450mm & advanced nodes M. Davenet

AMC Management

• Airborne Molecular Contamination

• Monitoring

• Curing and Protecting

• Preventing

• Conclusions

© Pfeiffer Vacuum 2014 • M. Davenet • October 2014 • Semicon Workshop

Introduction: Airborne Molecular Contamination (AMC)

• Gaseous compounds present in the air of a clean room, a process equipment or a container can contaminate surfaces or products.

• AMC can create serious damages generating important yield loss and massive performance degradation.

Humidity

O

AMC

Sensitive materials

on wafer surface

Metals, Si

“AlFx”

crystals

TiCxFy

crystals Poly Si

corrosion

Cu

corrosion


Containers’ Contamination

Contaminated wafers Contaminated FOUPs AMC generated during process

Process

Tool


Contaminated FOUP

• Cross contamination

FOUP outgassing

Wafer outgassing

Clean room

External contamination


Monitoring

• Molecules • Particles

• Leaks

• ...

Ex : APA302&ADPC302

Our solutions for next generation devices

Preventing

• Vacuum handling

Mobile LoadLock

Curing & Protecting • Vacuum

decontamination

• Vacuum dry cleaning

Ex : APR 4300, AUD..


From current Pod Analyzer APA 302…

• 2 FOUPs + wafers

• 2 minutes per FOUP

• In situ auto calibration


To Pod Analyzer APA 450

• Airborne Molecular Contamination tracking

• In Line monitoring for 450mm Pods

• Installation & tests at Univ Albany


Pod Analyzer APA 450

• Compatible with 450mm Pods (MAC, Foups…)

• 2 FOUPs + wafers

• 2 minutes per FOUP

• In situ auto calibration

• Full automation

• OHT delivery & PGV compatibility

• SECS/GEM


Analyzer Performances

Analyzer Technology Scale Limit of detection

NH3 IMS* 0 – 200 ppbv < 0.2 ppbv

Total amines IMS* 0 – 200 ppbv < 0.2 ppbv

Total acids IMS* 0 – 200 ppbv < 0.2 ppbv

SO2 UV fluorescence 0 – 500 ppbv < 0.5 ppbv

H2O Hygrometer 0 – 100 % RH 5 %

Total VOC FID 0 – 99 ppmv < 25 ppbv

HF_ID plus CRDS 0 – 1000 ppbv < 0.5 ppbv

* Based on IMS technology, includes 63Ni source ( < 0.005 microcuries)


HF – The Most Critical Contaminant

“AlFx” crystals

TiFx crystals Poly Si corrosion

Cu Corrosion

Cu voids Residue defects

HF

*Source: TQ Nguyen, Thesis

HF levels in FOUP atmosphere:

few ppbv – ppmv *


Contamination mechanisms & FOUP materials

ULK ULK

Etch, strip residues

Porous materials

Plasma, cleaning,

chemical deposition…

• Diffusion in gas phase (FOUP atmosphere)

• Adsorption by polymer (FOUP surface)

• Diffusion in polymer (FOUP wall)

• Wafer outgassing Higher AMC concentration in wafers & FOUP

atmosphere

Low Absorbing FOUPClassical FOUP

« FOUP material influence on HF contamination during queue-time » by adixen & GFoundries, at UCPSS. PLACES2BE Project


• HF concentration outgassed by FOUP materials

[HF] in FOUP_LOW1 = ~ 3 x [HF] in FOUP_STD1

FOUP material influence on HF concentration

« FOUP material influence on HF contamination during queue-time » by adixen & GFoundries, at UCPSS. PLACES2BE Project


Monitoring


• Leaks

• ...

Ex : APA302&ADPC302


Preventing

• Vacuum handling

Mobile LoadLock


decontamination




Yield Enhancement: up to 7 %!

No APR With APR

ETCHWET ETCH APR 24 h WET

ETCHAPR WET


450mm Demo. Tool

• Advanced pumping system to remove AMC from (wafers & FOUP) surfaces

• + Clean N2 passivation of (wafers and FOUP) surfaces

• Compatible with Person Guided Vehicle loading

• Contamination control

• Idle Mode (energy savings)

• APR450 Installation at


Monitoring


• Leaks

• ...

Ex : APA302&ADPC302


Preventing

• Vacuum handling

Mobile LoadLock


decontamination




How to maintain wafer surface integrity between tools?

• Virtual Vacuum Fab concept :


Current Mobile Load Lock for 200 & 300mm

A compact interface (AMLL)

• Specific loadport for vacuum carrier

• Smart Pressure balance system

• Easy to use operation system

A detachable vacuum carrier

• Safe manual wafer transportation

• aluminum <8kg

• Air tightness <5.10-8 mbar.l/s


Example of Issue : surface oxidation

Ge substrate with HF passivation after 48h air exposure

Ge substrate with HF passivation / 4 min air exposure

Ex of Surface oxidation further to standard FOUP storage:

• Ge surface is oxidized after 48 hours of air exposure

No germanium oxidation after 6 day storage in vacuum carrier (no Ge-Ox+Ge-H XPS peak) 6 day storage in vacuum

carrier

B.Pelissier and H.Kambara .semiconductor International, March 2007 B.Pelissier & al Microelectronic Engineering 85 (2008) 151-155


Advanced Vacuum transportation interface for 300/450mm architecture

Partners:

• Development & manufacturing of vacuum

carrier &interface

• Attachment of the system to the 300/450mm

cluster at FhG IISB

• Assessment of the vacuum transportation in

this 300/450mm cluster platform

• Studies of this new Handling concept for

advanced equipment/fab architecture


Conclusion

AMC & particle issues are increasing

AMC metrology development for next

generation nodes & 450mm

Vacuum solutions for fast process development


Thank for your attention! See our Pfeiffer Vacuum Booth 926.

amc contamination strategy 450mm & advanced … airborne molecular contamination (amc) •...

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