amkor technology advanced package solutionstheconfab.com/wp-content/uploads/robert_lanzone... ·...
TRANSCRIPT
Amkor TechnologyAdvanced Package SolutionsAmkor TechnologyAdvanced Package Solutions
Enabling aMicroelectronic
World®
Robert Lanzone – SVP Engineering Solutions
Confab 2013 Las Vegas
• R&D Focus
• Core Technologies
• Focus on Package Integration
R&D TopicsR&D Topics
Amkor Confidential Information Jul-132
• Focus on Package Integration
R&D Focus : R&D Focus : Profitable Growth From New Profitable Growth From New Package TechnologiesPackage Technologies
In the Right MarketsIn the Right Markets
Amkor Confidential Information Jul-133
End Market Summary
Amkor Confidential Information Jul-134
Communications
52%
Consumer
19%
Computing
10%
Networking
11%
Other
8%
Smartphone
Tablet
Wireless LAN
Gaming
Television
Set Top Box
PC / Laptop
Hard Disk Drive
Peripherals
Server
Router
Switch
Automotive
Industrial
4
Note: Percentages represent share of LTM 1Q13 Net Sales
$112
$80
$100
$120
$140
t R
eve
nu
es (
$ in
bill
ion
s)
Mobile Communications Driving Semi Growth
Growth - $43BCAGR - 10%
Growth - $6BCAGR - 2%
Growth - $15B
Semiconductor IndustryGrowth
2012 - $292B2017F - $380BGrowth - $88B
CAGR - 5%
Amkor Confidential Information Jul-135
$69
$36
$68
$47
$25
$47 $42
$74
$62
$32
$58
$0
$20
$40
$60
Mobile Phones & Tablets
Consumer Computing Networking Automotive Other*
Se
mic
on
du
cto
r M
ark
et R
5
Source: Prismark Partners. February 2013* Other includes Medical, Industrial, Military and Aerospace
2012
2017F
Growth - $6BCAGR - 3%
Growth - $15BCAGR - 6%
Growth - $7BCAGR - 5%
Growth - $11BCAGR - 4%
R&D Focus : Customer & Market SegmentR&D Focus : Customer & Market Segment
Amkor Confidential Information Jul-136
R&D Focus : Critical Customer AlignmentR&D Focus : Critical Customer Alignment
Amkor Confidential Information Jul-137
• R&D Focus
• Core Technologies
• Focus on Package Integration
R&D TopicsR&D Topics
Amkor Confidential Information Jul-138
• Focus on Package Integration
Amkor’s Core Technology & Advanced Amkor’s Core Technology & Advanced Integration SchemesIntegration Schemes
Thermal &Thermal &
Cu PillarCu Pillar
TSVTSV
Amkor Confidential Information Jul-139
WLFOWLFO
Thermal &Thermal &Adv. MaterialsAdv. Materials
HighHigh--End FCEnd FC
Amkor’s Core Technology & Adv. Integration Amkor’s Core Technology & Adv. Integration SchemesSchemes
Thermal &Thermal &
Cu PillarCu PillarCu PillarCu Pillar
TSVTSV
Amkor Confidential Information Jul-1310
WLFOWLFO
Thermal &Thermal &Adv. MaterialsAdv. Materials
HighHigh--End FCEnd FC
Interconnection : Fine Pitch Cu PillarInterconnection : Fine Pitch Cu Pillar
•• Copper Copper Pillar PlatformPillar Platform
� Foundation for most of future advanced packaging platforms
� Potential cost reduction on substrate
� Better electrical performance
� Larger die in a given body size
•• Next Node ActivityNext Node Activity
Amkor Confidential Information Jul-1311
•• Next Node ActivityNext Node Activity
� Reducing pitch / increasing density
� 28/20nm in Qualification
� Extending to all flip chip products
Executive Summary
Driven by Demand for Handheld, HighPerformance, Low Power Devices
Provides Significant Improvement Over Solder Bump
Amkor Confidential Information Jul-131212
Launched in 2010, >200 Million Units Sold
Industry-Leading Platform Being Adopted byMultiple Customers
Enabling Technology for 2.5D and 3D Packagingwith Through Silicon Vias
� Digital Baseband
� Applications Processor
� Networking ASICs
� Digital TV ASICs
Why the Need for Fine Pitch Copper Pillar?
� Function Integration in All Three Dimensions
� Silicon Node “Shrinks” But Die Size Remains Unchanged or Grows
Technology Trends & Challenges Devices
Amkor Confidential Information Jul-1313
� Power Management� Increased I/O Density
� Finer BGA Pitch
� More Demanding Warpage and Coplanarity Criteria
13
Developed and Commercialized by Amkor and TI
2004 2006 2008 2010 2012
� Early Wafer Level Copper Pillar Bumping Development
� TI Fine Pitch Development
� Thermo Compression Assembly Development
� Shape, Height, Pitch, Alloy, Reliability, Electromigration,…
� > 200 Million Units Sold to Date
� Multiple Customers in Production or Qualification
Amkor Confidential Information Jul-131414
2004 2006 2008 2010 2012
� New Copper Chemistry Developed
� Product Launch in Conjunction with Texas Instruments
Sputtered Seed Layer (TiWCu)
Resist Coat
Plate Cu/Solder (SnAg)
Strip Resist
Expose and Develop
AnimationCreation of Cu Pillar
Amkor Confidential Information Jul-131515
Seed Layer Etch
Strip Resist
Silicon Active Area
Reflow Solder
NCP writingheating
1. Bond Head Down Die
Thermo-Compression Bonding (TCNCP)Animation
Amkor Confidential Information Jul-1316
1. Bond Head Down
2. Bond force then head temperature is going up to solder melting point : 220 �
3. Bond Head up :
Bonding completed
NCP
PCB
Cu pillarDIE
HEAD
Bump pad Solder NCP
Cu pillar
Die
PCB
Amkor’s Core Technology & Adv. Integration Amkor’s Core Technology & Adv. Integration SchemesSchemes
Thermal &Thermal &
Cu PillarCu Pillar
TSVTSVTSVTSV
Amkor Confidential Information Jul-1317
WLFOWLFO
Thermal &Thermal &Adv. MaterialsAdv. Materials
HighHigh--End FCEnd FC
Integration : Through Silicon Via (TSV)Integration : Through Silicon Via (TSV)
•• Current StatusCurrent Status
� World’s first mass production of TSV backside finishing
� World’s first production of fully integrated TSV package platform
� “Logic dies on Si interposer” product is being produced
� ~10 customers are engaged in active TSV development
� Target devices
� Logics on Si interposer
Amkor Confidential Information Jul-1318
� Logics on Si interposer
� Logics + memories on Si interposer
� Memory / Memory stack
� Memory / Logic combination
Focus : Provide Most Cost Effective / Reliable Option
Chip on Chip“CoC-oS”
Chip on Wafer“CoW-oS”
Chip on Substrate“Co-CoS”
TSV Assembly Requires FlexibilityTSV Assembly Requires Flexibility
Amkor Confidential Information Jul-1319
2.5D TSV & Interposer Supply Chain2.5D TSV & Interposer Supply Chain
• High End Products : Networking, Servers
� Silicon interposers ; < 2um L/S, < 15nsec latency, > 25k µbumps per die
� Amkor is engaged with Foundries to deliver silicon interposers today
• Mid Range Products : Gaming, Graphics, HDTV, Adv. Tablets
� Silicon or Glass interposers ; < 3um L/S, < 25nsec latency, ~10k µbumps/die
� Glass may provide cost reduction path in future
Amkor Confidential Information Jul-1320
� Glass may provide cost reduction path in future
� Not actively pursuing glass interposers yet as infrastructure still immature
• Lower Cost Products : Lower End Tablets, Smart Phones
� Silicon, Glass or Laminate interposer ; < 8um L/S, low resistance, ~2k µbumps
� Must provide cost reduction path to enable this sector
� Working with laminate supply chain to enable
������������ABC��DEFF�FE������
������������ABC��D��������FE������
�������������
ABC�D BEF���
���������������
ABC�D BEF���
����������
A������BF���
���C������������
���C�� �����������
��E���D������������C�
Vo
lum
�����
��E��
!EFB�
TSV Production InterceptsTSV Production Intercepts
Amkor Confidential Information Jul-1321
�C�"C� ��!C�DC�E��D#$%�
BE�B BE�� BE�� BE��BE��
���DB��C��
�C���&'(
A������BF���
������ ����
ABCF���
!"����
ABCF���
���DB��C��
�C���)�*&''
��E���D������������C�
���C����C�����������
�+�,T
mes
E����
��� B�CE
���
Amkor’s Core Technology & Adv. Integration Amkor’s Core Technology & Adv. Integration SchemesSchemes
Thermal &Thermal &
Cu PillarCu Pillar
TSVTSV
Amkor Confidential Information Jul-1322
WLFOWLFOWLFOWLFO
Thermal &Thermal &Adv. MaterialsAdv. Materials
HighHigh--End FCEnd FC
• WLFO is now established as a viable alternative to conventional laminate-based and wafer-based packages
• The elimination of a conventional laminate substrate and utilization of wafer-level packaging’s advanced design and feature size capabilities provide many benefits for WLFO, including:
– Increased I/O density
– Reduced form factor
Advanced Platform : Wafer Level Fan Out (WLFO)Advanced Platform : Wafer Level Fan Out (WLFO)
Amkor Confidential Information Jul-1323
– Reduced form factor (including z-height)
– Improved electrical and mechanical performance
– Multi-chip capability
– Outstanding performance
capability
– Scalability within a heterogeneous assembly platform
– Opportunity for advanced 3D structures
Wafer Level Fan-Out Revenue Forecast
Amkor Confidential Information Jul-1324
• WLFO reached the $100M market valuation in 2011
• Predicted by Yole to reach $250M market valuation in the 2015/16 timeframe once demand moves from IDMs to fabless wireless IC players and the OSAT supply chain expands
Amkor Embedded Die Strategy
• All future technology roadmaps indicate a need for higher levels of integration, thinness and cost effective solutions
– Embedded die will be a key enabling package technology that addresses these roadmap requirements
• Amkor already supports embedded die in substrate
– Passive integration in high volumes already
Amkor Confidential Information Jul-1325
– Passive integration in high volumes already
– Active integration just starting
• Amkor has made strategic decision to focus newest efforts in this space on a ‘Panel Level Fan-Out’ platform to address cost, integration and scalability
• Embedded die resources now focused on Panel platform development
Evolution of WLFO Evolution of WLFO
• Key enabling technologies for extensions into 3D
– Thru Mold Via (TMV®)
– Fine pitch copper pillar
– CoC possum™
TMV®3D PoP
3D Die on Pkg
Amkor Confidential Information Jul-1326
Die
Die
Die
Die
Die
3D F2F 3D Stacking
Standard WLFO Structure
3D Die on Pkg
Amkor’s Core Technology & Adv. Integration Amkor’s Core Technology & Adv. Integration SchemesSchemes
Thermal &Thermal &
Cu PillarCu Pillar
TSVTSV
Amkor Confidential Information Jul-1327
WLFOWLFO
Thermal &Thermal &Adv. MaterialsAdv. Materials
HighHigh--End FCEnd FCHighHigh--End FCEnd FC
Flip Chip & Advanced Packaging Leader
LTM 1Q13 Flip Chip & Advanced Packaging Revenue
� Migration to Flip Chip, 3D and Advanced Packaging Continues to Accelerate
� Driven by Strong Demand for Smartphones, Tablets, Consumer Electronics, Network Infrastructure
� Enhances Device Performance, Reduces Power Consumption and Form Factors
($ in millions)
$800 $870
$1,230
Amkor Confidential Information Jul-132828
Power Consumption and Form Factors
� Higher Gross Margin and Returns Versus Wirebond
Non-Amkor Sources: Company Press Releases
$530
STATS SPIL ASE Amkor
• Production Status
� Increasing body size (>55mm BD)
� Increasing die size (>26mm)
� 45/40nm in HVM, 32/28nm in AVM
� Full lead free qualified at 65, 45/40, and 32/28nm
� Cu Pillar for below 150um bump pitch
� Molded FCBGA in AVM
Adv. Packages : High Performance Flip ChipAdv. Packages : High Performance Flip Chip
Amkor Confidential Information Jul-1329
� Molded FCBGA in AVM
� Coreless substrate under development for 32/28nm
• Production Status
� Increasing body size (~45mm BD)
� Increasing die size (~26mm)
� 40/28nm in LVM
� Eutectic & Lead-free qualified at 40/28nm
� Eutectic & Lead-free & Cu pillar for min 150um bump pitch
� Thin core under development (<0.4mm) substrate for 32/28nm
Adv. Packages : Molded U/F FCBGA (Adv. Packages : Molded U/F FCBGA (FCmBGAFCmBGA))
Amkor Confidential Information Jul-1330
� Thin core under development (<0.4mm) substrate for 32/28nm
Advanced FC Packages : Chip on ChipAdvanced FC Packages : Chip on Chip
• Next Generation of FC – CoCCoCPOSSUMPOSSUM
–– MEMs, Automotive, NetworkingMEMs, Automotive, Networking
Amkor Confidential Information Jul-1331
LOGIC (780um thickness)
ASIC (60um thickness)
40um bump pitch CoC Technology
Heat Spreader
200um bump pitch
LOGIC
Substrate
Advanced FC Packages : Chip on Chip, cont.Advanced FC Packages : Chip on Chip, cont.
• 2014 targeted production
Amkor Confidential Information Jul-1332
ASIC (60um thickness)
Cu pillar with LF solder + microbumpCu pillar with LF solder + microbump
Amkor’s Core Technology & Adv. Integration Amkor’s Core Technology & Adv. Integration SchemesSchemes
Cu PillarCu Pillar
TSVTSV
Thermal &Thermal &Thermal &Thermal &
Amkor Confidential Information Jul-1333
WLFOWLFO
HighHigh--End FCEnd FCMUFMUF
Thermal &Thermal &Adv MaterialsAdv Materials
Thermal &Thermal &Adv MaterialsAdv Materials
-�����.�CFFE�-�����.�CFFE�
#���$F%#���$F%
F&��'$((�F&��'$((�
Silicon
)$��*�$F$F%)$��*�$F$F%
Adaptive
Learning
Adaptive
Learning
Advanced Packaging & Technology IntegrationAdvanced Packaging & Technology Integration
Amkor Confidential Information Jul-1334
��+��+DD,����+(-�,����+(-�
����
�,�.,%���,�.,%��
!,��,%�!,��,%�
ThermalThermal
���������
A���BC���Learning
Required
Learning
Required
WBWB
U/F
DA��EFA������
Amkor’s Advanced MaterialsAmkor’s Advanced Materials
Amkor Confidential Information Jul-1335
Thermal
MUFDA��EFA������������
8W/mK3W/mK 5W/mK• Epoxy Mold Compound
• Die Attach Paste
Amkor’s Advanced MaterialsAmkor’s Advanced Materials
• Thermal Performance
Amkor Confidential Information Jul-1336
• Die Attach Paste • L/F (Ag paste)• L/F (Sintered paste)• BGA
• Die Attach Film (BGA)
• TIM (Flip Chip)
• Underfill Material (FC) 1~2W/mK0.5W/mK 1W/mK
10W/mK4W/mK 6W/mK
5W/mK1W/mK 2W/mK
10W/mK4W/mK 10W/mK
60W/mK60W/mK
20W/mK8W/mK 20W/mK
* Thermal conductivity is bulk value of the material, not actual package thermal performance.
Amkor’s Advanced MaterialsAmkor’s Advanced Materials
Pb free / Cu pillar
22nm28/32nm
DieDie
• Bump Alloy
• Si Node
C
Exposed Die
A
D
BE
Target package type : FCmBGA
EU
28/32nm
• Molded Underfill (MUF)
Amkor Confidential Information Jul-1337
22nm28/32nm
<120um130um
<35um50um
450um500um
57.5mm50mm
>22mm20x22mm
• Si Node
• Bump Pitch (C)
• Bump Gap (D)
PackagePackage
• Die Size (A)
• Mold edge to substrate (B)
• PKG size (D) 50mm
28/32nm
150um
60um
19x16mm
600um
45mm
40um
400um
55mm
Amkor’s Advanced MaterialsAmkor’s Advanced Materials
• Next Generation Underfill Development Strategy
– Capillary Based (continuous):
� High modulus and superior adhesion ; good flowability & low warpage
– Film Based :
� Pre-coated non-conductive film underfill material on wafer
Amkor Confidential Information Jul-1338
Thin Die Support
Low k & bump protection
DBRC Control
UF on-die control
Easier Process flow than normal
UF
TSV Application (die to die)
support
NCF
NCF process
Wafer dicing TC bonding Post cure (optional)Pre-applied
• R&D Focus
• Core Technologies
• Focus on Package Integration
R&D TopicsR&D Topics
Amkor Confidential Information Jul-1339
• Focus on Package Integration
���AB��������������C��D���
Wafer LevelWafer Level
Die
Board LevelBoard Level
Amkor Advanced Package IntegrationAmkor Advanced Package Integration
LOGIC LOGIC
ASIC ASIC
LOGIC
ASIC
CoCCoCpossum™possum™CoC
possum™
Amkor Confidential Information Jul-1340
�������������������������
EFB��AFF�AB���F��B������FAB�F���B������EFA�����FD�
Die LevelDie Level
Package MigratioPackage Migration to 3D & n to 3D & SiPSiP--MCM IntegrationMCM Integration
Amkor Confidential Information Jul-1341
���AB��������������C��D���
Production Transition Developing
Amkor Advanced Package Integration RoadmapAmkor Advanced Package Integration Roadmap
Amkor Confidential Information Jul-1342
�������������������������A
EFB��AFF�AB���F��B������FAB�F���B������EFA�����FD�
Die
Die
Industry Advanced Package Integration RoadmapIndustry Advanced Package Integration Roadmap
Amkor Confidential Information Jul-1343
Commissioned report September 2011 courtesy of Amkor Technology and Yole Développement
Develop
�����C��D���
Production Transition
Amkor Aligned Adv. Package Integration RoadmapAmkor Aligned Adv. Package Integration Roadmap
Amkor RoadmapAmkor Roadmap
Amkor Confidential Information Jul-1344
�������������������������AB��������C
EFB��AFF�AB���F��B������FAB�F���B������EFA�����FD�
Die
Die
�
�
�
C
�
�
C
�
Industry RoadmapIndustry Roadmap
��������AEnabling a
Microelectronic World®
��������A