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Passive components and circuits - CCP

Lecture 13

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Content

Electronic packaging levels Manufacturing the Printed Circuit Boards PCB

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Packaging Is a domain which combine the engineering with manufacturing technologies needs to transform an electrical diagram in an operational product. This domain combines knowledge's from electronics, mechanics, materials and quality assurance.

Packaging of electronics microsystems include a set of fundamentals technologies: micro and nanoelectronics, photonics, micro-electro-mechanical systems (MEMS), radio frequency (RF) and wireless technologies.

In order to integrate all these functions in a system, the functions must be designed, manufactured and tested for assuring reliability and an adequate thermal regime.

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Level 0 : Interconnection on a silicon die

Level 1 : Chip encapsulation

Level 2 : Manufacturing of multi-chip modules

Level 3 : PCB

Level 4 : Interconnection of electronics and mechanics sub-assemblies

at a system level

Packaging levels

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Packaging levels

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Interconnections inside the silicon chip.

Level 0

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Single Chip Module (SCM)

In-line packages

Small outline packages

Quad packages

Array packages

Level 1

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Multi Chip Modules (MCM)

MCM-D – deposited MCM. The modules are deposited on the base substrate using thin film technology.

MCM-C – ceramic substrate MCMs (thick-film or cofired ceramic technology). A very good variant is LTCC – low temperature cofiread ceramic)

MCM-L – laminated MCM. The substrate is a multi-layer laminated PCB (organic laminate technology)

Level 2

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Printed Wiring Board (PWB)

Paul Esler from Germany invented this technology in 1943.

Actual production 45,250 mil $/ year, with an 11%/year increasing rate

The large producers made 250,000 m2/year, adding the small producers 50,000 m2/ year.

Level 3

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The final integration stage:

printed circuit boards PWB/PCB

Subassemblies: power supplies, micro-motors, etc.

User interfaces: displays, keyboards,etc.

Special components:transformers, fans, heaters, etc.

Cables

Boxes

Level 4

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Is the most important integration level in packaging

Assures the interconnection between components using Copper traces

Assures mechanical support for components

Printed Wiring Board (PWB) or Printed Circuit Board (PCB)

http://www.ett.bme.hu/vlab/start.html - PWB section

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Width of the interconnection traces

Resolution of traces/elements (pitch)

Number of pads for component connections per square cm

Metalized vias dimensions (passing holes)

Number of layers for the traces

PWB/PCB are characterized by:

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PCB technology evolution

Line Width

Year 1985 : 500 m

Years 90-95: 250 m

Years 95-2000 : 150 m

Years 2000-2005 : 100 m

Years 2003-2006 : 75 m

Years 2005-2008 : 50 m

Years 2008-2010 : 30 m

Tehnology

Single layer

Two layers

Multilayers

With micro via and high density

Substrate

Rigid

Flexible

Rigid-flexible

3-D board

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The most restrictive technological operation is the drilling operation

0

2

4

6

8

10

12

14

16

18

20

100 150 200 250 300 340

Hole diameter, microni

Co

stu

l/K

gău

ri,

$

Series1

0

5

10

15

20

25

30

35

40

45

1994 1996 1998 2000 2002

Anul

Co

stu

ri,

$

Costul găuririi

Costul plăcii

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Technological steps for Single Sided Board

1. Cutting of laminated board

2. Screen Printing – using photo technology or serigraphy

3. Etching

4. Roller Tinning - covering with safety tin

5. Drilling

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Technological steps for Double Sided Board1. Cutting of laminated board

2. Drilling

3. Plating through Holes

4. Traces printing (Dry film Imaging) – solid photo-resist technology

5. Tin plating

6. Stripping- elimination of photo-resist

7. Etching

8. Deposition of masks (soldering masks, Silkscreen mask)

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Technological steps for Multilayer BoardA. The internal layers are made

as single sided or double sided boards

B. Each internal layer is treated with adhesive and then are laminated together with external layers completely covered with Cu

C. Is made like a double sided board

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Double sided board -example

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Equipped boards - example

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Equipped boards - example