about daetec
Post on 24-May-2015
1.229 Views
Preview:
TRANSCRIPT
Company Profile – www.daetec.com 1
Diversified Applications
Engineering Technologies
Company Profile – www.daetec.com
Technology has many barriersMost are Internal
• Ability to change with the markets
• Ability to react
• Ability to find answers
• Ability to assemble resources
• All at low cost
2
Company Profile – www.daetec.com 3
How Does One Cross to a
New Market, Reach a New Customer, or Find Answers?
•Increase investment –
testing & applications
•New product
development
•New tool design
•New process design
•Modification or ancillary
•Bundling
Will it be one or more of these?
Company Profile – www.daetec.com
What’s the right
level of
resources?
•Stay on schedule
•Overcome challenges
•Acquire IP
•Ready for scale-up
•Train staff
•Respond to customers
•Support the Market
4
What is needed to…
Company Profile – www.daetec.com 5
What’s the shortest path to
achieve your objective?
•Stay on-track
•Maintain revenue from
core business
•Avoid hitting road-blocks
•Keep on schedule
•Who will drive this effort?
How do you…
Company Profile – www.daetec.com
DAETEC
We can be your bridge
into new markets
6
Company Profile – www.daetec.com
DAETEC is a Bridge Between One Source to Another
7
•Suppliers
•Wafer Fabs
•Manufacturers
•End-Users
•Assemblers
•Consumers
•New Products
•Solutions
•New Markets
•Ancillaries
•New Processes
Company Profile – www.daetec.com
Partner Facilities to Scale-Up
• R&D in Camarillo, CA
• Partner Fab in Santa Barbara, CA (30,000 sf)
• Access to Toll Mftg at six (6) locations in USA
8
Company Profile – www.daetec.com
History
9
‘95 John Moore founds Moore Enviro-Chemical, Inc.
(MEC)
’95-’00 Moore develops PR strippers, cleaners,
polymers for semiconductors, aerospace, and
automotive.
‘99 Moore develops aqueous soluble polymers and cleaners at MEC for
slicing/dicing – used to found Aquabond technologies, ‘02
sale to private investors.
‘00 General Chemical Corp (GCC) purchases MEC,
Moore becomes Product Development Director of Electronic Chem Division.
‘00-’05 Moore starts specialty products division at
GCC and designs GenSolveTM, GenTakTM, GenCleanTM for top-tier
semiconductor firms.
‘05 Moore founds Daetec, resigns from GCC.
Daetec lab designed and built, equipment
capitalized.
Company Profile – www.daetec.com
Successful Commercialization
10
Product Application Industry
Spin-On Polymer High Temperature Wafer Bonding Semiconductor
Metal Safe PR Stripper Negative Tone and Acrylic Stripper Semiconductor
Dissolving Gel Cured Polysulfide Resin Stripper Aviation
EHS Safe Stripper Negative Tone Isoprene & Bisbenzocyclobutene
Semiconductor
Spin-On Thermoplastic Med Temperature Wafer Bonding Compound Semiconductor
Aqueous Etch Residue Cleaner Copper/Low k residue remover Semiconductor
Aqueous Based Spin-On Polymer Polishing, Slicing, Dicing Electronics/Semiconductor
Aqueous Based Polymer Remover Remover of Aqueous Based Polymer Electronics/Semiconductor
Spray Coat Polymer Wafer Protection/bonding Compound Semiconductor
Spin-On Protection Coating Acid Etch Protection Layer MEMS
Please contact us to see any pertinent publications and patents.
Company Profile – www.daetec.com
Markets Served
11
Microelectronics•Silicon, GaAs & other compound semi,
FPD, data storage, MEMS
•Cleans - PR stripper & rinsing
•Coatings – cured polymers, adhesives
•Rinses – surface active agents, non-foam
•Inhibitors – substrate & metal protection
Company Profile – www.daetec.com
Markets Served
12
Aerospace/Aviation
•Polymer sealants & coatings – high temp,
low CTE, special engineering apps.
•Cleaners – dissolve & remove oils,
silicones, polysulfides, epoxies, others.
Company Profile – www.daetec.com
Markets Served
13
Industrial•Automotive
•Construction, roofing, coating
•Metal working, machining
•EHS compliant coatings & cleans
Company Profile – www.daetec.com
Just a few of our past partners…
14
Company Profile – www.daetec.com
What We Do…• Product Development
• Material Modification
• New Application Development
• Process Design
• Tool Design Demo
• Ancillaries
• Yield Enhancement
• EHS Compliance Review
15
Company Profile – www.daetec.com
Technical Capabilities
Properties—physical and chemical Cleaning and residue characterization Coating applications and processing Polymer compounding—thermoplastics Curing—thermal & radiation Properties—mechanical and adhesion Corrosion potential & evaluation Thin film analysis & electrical characterization
Process modeling—screening testing New process demonstration Etch rates Electrical properties for I-V curves SEM & CD analysis ESCA/XPS FIB SIMS
These and other tests allows us to immediately focus on those areas with the most potential to improve the customers processes and applications.
16
Company Profile – www.daetec.com
Program Planning with Market Targets
Flat Panel Mftg
Successful commercialization depends upon market experience
installed into your development schedule
Company Profile – www.daetec.com
Intellectual Property
18
•IP Assigned to
Customer
•Greater Value to
Investment
•Greater Flexibility
on Business Model
Company Profile – www.daetec.com
Creativity to New Heights!
• Creative ideas are the core of our business and we continually push those limits to new levels;• Your objective represents an important part of our growth. This interdependency fuels our program;• Creating new answers often provides new business options, leading to greater market capture.
19
Company Profile – www.daetec.com
Results in Record Time
20
Compatibility Applications
DAETEC prefers screening tests over large DOEs.
Screening tests = many options + statistics
Options = less challenges + faster results
Fast results = less cost
Company Profile – www.daetec.com
Cost EffectiveWe Stretch Our Resources to Reduce Costs
• Screening tests are inherently less costly
• Require a creative approach
• Multi-tasked experiments using abbreviated number of specimens
21
Company Profile – www.daetec.com
Applications
22
Coatings Technologies
Coating Optimization
Understanding PR Polymers
Coatings Electrical Testing
Substrate Thinning
Inhibitors for Corrosion Control
CLEANING
Materials and Processing
Wafer Bumping
Panels (Solar/FPD)
PLATING
Electrolytic/less
Etchants and Surface Finishing
Process Optimization
Company Profile – www.daetec.com
Coatings Technologies
• Spin-Coating
• Spray Coating
• Slit/Brush/Roll
• Films
• Molding
• Photo initiated
• Thermal/Electrical Conductive
• Temporary/Permanent
23
Cured
CoatingCleans (2 steps)
1 X Puddle + 1 X Spin
Water
Rinse
Company Profile – www.daetec.com
Coating Optimization
Conformal
Planarize
State-of-the-art characterization techniques
Company Profile – www.daetec.com
Understanding PR Polymers
DNQ Ketene AcidNon-polar Polar Polar
Company Profile – www.daetec.com
Coatings Electrical Testing
•Hg Probe – Sensitive for Thin Films
•Rapid Measurement
•IV curves, Dielectric Const., Loss
Tangent
•Hg dot contact is non-destructive
•Used for Epi-layers and films
<50Angstroms
•Ideal for Oxide Layers, Inhibitors,
and Used for Residue Detection
Hg-Probe I-V Plots of Triazoles on Cu
0.0
10.0
20.0
30.0
40.0
50.0
60.0
0 0.1 0.2 0.3 0.4 0.5 0.6
Voltage (volts)
Current (
uA
mps)
Triazoles, 0.5% Aqueous SolnsRT 30sec Exposure
BTA
TTA
Triazole Mix
Company Profile – www.daetec.com
Substrate Thinning
•Substrates to <20um
•Protection for Backside Processing
•Simple Application & Removal
•Permanent Systems
•High Temps >400C & Low CTE
•Wide Range of Process Options
•Coating Over Bumps
•Applicable to MEMS
•Aqueous Cleans Available
•Cleans for Single Wafer & BatchMany Polymer Options
Company Profile – www.daetec.com
Inhibitors for Corrosion Control
28
FeatureCorrosion
InhibitorAdded
Pourbaix Diagrams & Tafel Plots to Correct Corrosion
Company Profile – www.daetec.com
Cleaning – Materials & Processing
• Polymers & Residue
• Cured Systems: Silicone, Urethane, Acrylic, Epoxy, Rubber, Sulfides
• Insulators: Polyimide, BCB, PBO, Silicates
• Hydrocarbons: Oils, Greases
• Aqueous Cleans
29
Etch Residue, Before Clean Via
Polyimide, Before Polyimide Removal
Company Profile – www.daetec.com
Cleaning – Wafer Bumping
30
Before Strip After Strip
Flux Reflow to 220C
PR Strip/Cleans
Alkali + Solvent
Minor Issues in Cleans
Solder Plating
Exposure & Develop
Wet PR App.
Plated Solder
Wet PR
Company Profile – www.daetec.com
Cleaning – Panels (Solar/FPD)
31
Company Profile – www.daetec.com
Plating – Electrolytic/less
• Cu + Alloy Processes
• Co Electroless Capping
• Ni Hypophos
• NiFe/NiFeCo Heads
• Sn and Alloys
• Au Processes
• Exchange Processes
• Initiating/Striking
32
Company Profile – www.daetec.com
Etchants & Surface Finishing• Au Etch (aqueous &
solvent)
• Buffered Oxide Etch (BOE)
• Chrome Etch
• Si Etch (acid & base)
• Mixed Acid Etch (MAE)
• Phos Acid Etch PAE)
• Surfactanated Etchants
33
Irregular Etch
Company Profile – www.daetec.com
Process ImprovementIsolating Factors in the Process Step
34
Company Profile – www.daetec.com
•Process Flow
•Residue Removal
•Cleans Improvement
•Yield Improvement
•Monitoring & Controls
•Product Development
35
Survey Process Materials, Stability, Life
Simple, On-Site
Monitor &
Controls
Eliminate
Process
Excursions
Process ImprovementFactors Affecting Performance
Company Profile – www.daetec.com 36
Plasma
1. Substrate Cleaning
2. ResistCoating
3. Exposure
6. ResistStripping
5. Etching 4. Develop
Process ImprovementStudying Interactions Between Process Steps
Company Profile – www.daetec.com 37
Fab Equipment OptimizationHow Materials Work in a Specific Tool
Company Profile – www.daetec.com
EHS Compliant Development
• Solvent Replacement
with Aqueous Agents
• Green Coatings
• Green Cleaners
• Reduced Energy Use
• Eliminate Toxic or
Regulated Items
• Eliminate Haz Waste
• Green Cost Reduction
38
Company Profile – www.daetec.com
Draft Plan to Contract
39
1-Contact
Daetec
&
Customer
2-Objective
* Solution Need
* New Product
* Complementary
Product
* Bundle Option
* New Technology
3-Plan
* Deliverables
* Timing
* IP
* Costs
Adjust
4-Contract
* Written
Document
* Work Plan –
Same as (3)
5-Action
* Progress Reports
* Deliverables
* Payment for
Services
* Completion –
most in 6mos
6-Completion
* Customer Meets
Objective
* Customer has IP
Company Profile – www.daetec.com
To implement a new and innovative plan, contact us!
John Moore Technical Directorjmoore@daetec.com
Daetec, LLCDiversified Applications Engineering Technologies
www.daetec.com
1227 Flynn Rd., Unit 310 Camarillo, CA 93012-8551
Phone: 805-484-5546 Fax: 805-484-5556
40
top related