automatic, non-contact die monitoring system

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MICRON. MICRON. Automatic, Non-Contact Die Monitoring System. The Low Cost Solution For:. Misfeeds Slug detection Material Changes Stroke Deviation Mis-alignment between punch and die Broken punch or die assemblies. Micron base unit with 2 additional channels. - PowerPoint PPT Presentation

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Helm Instrument Co., Inc

Automatic, Non-Contact Die Monitoring System

Micron base unit with 2 additional channels

MICRONMICRON

The Low Cost Solution For:

• Misfeeds• Slug detection• Material Changes• Stroke Deviation• Mis-alignment between punch and die• Broken punch or die assemblies

Helm Instrument Co., Inc

Micron is the most advanced monitoring system available

to the stamping industry

With precise accuracy to .00004 inches (1/1000 mm)

Helm Instrument Co., Inc

Micron Detects Separation Gap to Within .00004 Inches

L o w er D ie

A b n o rm alN o rm al

U p p er D ie

U p p er D ie S h o e

L o w er D ie S ho e

S en so rTarg et

S en so r S lu g

S trip p er

M ateria l

Helm Instrument Co., Inc

Easy to use, limits are set automatically

Helm Instrument Co., Inc

Each stack includes one channel of monitoring with high and low limits

Helm Instrument Co., Inc

HMIC-R Sensor and target

Helm Instrument Co., Inc

Power requirements:Power consumption:Output contacts:Response time:Operating speed:Repeatability:Operating temperature:Alarm adjustment:Sensor type:Maximum sensing distance:Enclosure size:

115VAC ±10%30 watts1 NO-NC, 250VAC 5A ratingLess than 10 MsecUp to 2500 SPMTo .00004 inches-10°C to 50°C± 99 MicronsProximity 500 KHZ.1 inch (2.5mm)Base 8.25”w x 9.50”d x 3.25”hStack 8.25”w x 9.50”d x 4.75”h

Specifications:

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