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CORPE
Design for Reliability in Power Electronic Systems
Frede Blaabjerg Villum Investigator
Email: fbl@et.aau.dkCenter of Reliable Power Electronics (CORPE)
Department of Energy TechnologyAalborg University, Denmark
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
1 Towards Reliable Power ElectronicsBeyond Efficiency and Power Density
2IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Power ElectronicsReinvent the way electrical energy processed
Electricity generation…
Electricity consumption…
InterfacesIntegration to electric gridPower transmissionPower distributionPower conversionPower control
Power Electronics enable efficient conversion and flexible control of electrical energy
3IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► 100+ Years of Power Electronics
4
Reliability becomes one of the key application-oriented challengesIEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Performance Factors of Power Electronics
CheaperLighterSmallerCoolermore Reliablemore Versatile…
CostPower densityEfficiencyReliabilityControl Input & output…
5
25% size, 17% weight
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18 6
► Increasing Use of Power ElectronicsExample 1 – Towards Power Electronics Based Energy System
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Increasing Use of Power Electronics
7
Important issuesReliability/security of supply Efficiency, cost, volume, protectionControl active and reactive powerRide-through operation and monitoringPower electronics enabling technology
Example 2 – Electrical Energy Generation from Renewable Sources (1000 GW in 2018 !)
An Example of Full-Scale Power Converter
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Field Experience Examples 1/25 Years of Field Experience of a 3.5 MW PV Plant
Data source: Moore, L. M. and H. N. Post, "Five years of operating experience at a large, utility-scale photovoltaic generating plant," Progress in Photovoltaics: Research and Applications 16(3): 249-259, 2008
Unscheduled maintenance events by subsystem. Unscheduled maintenance costs by subsystem.(ACD: AC Disconnects, DAS: Data Acquisition Systems)
8IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Field Experience Examples 2/2350 onshore wind turbines in varying length of time (35,000 downtime events)
Contribution of subsystems and assemblies to the overall failure rate of wind turbines.
Contribution of subsystems and assemblies to the overall downtime of wind turbines.
Data source: Reliawind, Report on Wind Turbine Reliability Profiles – Field Data Reliability Analysis, 2011.
9IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► The Reliability Challenges in Industry
10
Customer expectations
Replacement if failure Years of warranty
Low risk of failure Request for
maintenance
Peace of mind Predictive
maintenance
Reliability target Affordable returns (%) Low return rates ppm return rates
R&D approach Reliability test Avoid catastrophes
Robustness tests Improve weakest
components
Design for reliability Balance with field load
R&D key tools Product operating tests Testing at the limits
Understanding failure mechanisms, field load, root cause, …
Multi-domain simulation …
Past Present Future
Product + Service (new business)Data + Physics of Failure
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Lifetime Targets in Power Electronics Applications
Applications Typical design target of Lifetime
Aircraft 20-25 years (100,000 hours flight operation)Automotive 15 years (10,000 operating hours, 300, 000 km)Industry motor drives 5-20 years (40,000 hours in at full load)Railway 20-30 years (73,000 – 110,000 hours)Wind turbines 20-25 years (120,000 hours)Photovoltaic plants 30 years (90,000 to 130,000 hours)
11IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Changing Mindset and Reliability Culture
12
Reduce costs by improving reliability upfront
Source: DfR Solutions, Designing reliability in electronics, CORPE Workshop, 2012.
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Changing Mindset and Reliability Culture
13
Example of Galaxy Note 7
96% of about 3 million Note 7 returned globally;Investigation involved 200,000 handsets, 30,000 standalone batteries, and 700 engineers; Estimated 5 billon loss
Source: http://www.consumerreports.org/smartphones/samsung-investigation-new-details-note7-battery-failures/
Bent negative electrodes caused one set of fires; Incorrect welding allowed for problems in a second batch of batteries
A negative example cost of poor reliability -Galaxy Note 7 Incident
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
2 Scientific ChallengesPower Electronics Reliability
14IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Key Reliability Metrics
15
Reliability The probability that an item can perform a required function under given conditions for a given time interval.
Lifetime (for an individual item) The time span between initial operation and failure
(Percentile) Lifetime (for a population of items)The expected life by which a certain percentage might have failed e.g., B10 lifetime – the time when 10% of the items fail.
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Scientific Challenges
16
Stress or strength
Freq
uenc
y of
occ
uran
ce
Load distribution L Strength distribution S
Time i
n serv
ice
Ideal case without degradation
Ideal case without degradation
Strength degradation
with time
Failure
End-of-life(with certain failure rate criterion)Failure
Extreme load
Nominal load
Understanding of load (mission profile), strength, and strength degradation
Stress-strength analysis to describe the cause of failure
■ Uncertainty in load and strength■ Time-consuming to understand degradation by testing
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Scientific Challenges
17
Understanding of load (mission profile), strength, and strength degradation
50403020100-10
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
Temp (°C)
Freq
uenc
y
62
2793
5780
8588
8000
66766766
5515
3321
520630
Temperature, Phoenix, AZ - 2007
100806040200
14000
12000
10000
8000
6000
4000
2000
0
%RH
Freq
uenc
y
2831022
14781844
2579
4412
7241
11649
12737
4840
Relative humidity, Phoenix, AZ - 2007
Severe users!
Severe environment!IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Scientific Challenges
18
Multi-components/multi-failure sources
System Level Application
Hardware Software Human Error
Power Semiconductos
PassiveComponents
OtherComponents
Transistors Diodes Magnetics Capacitors PCB Gate Drivers Fuses
f1 f2 f7 f3 f4 f5 f6
Wear-out Catastrophic
AssemblyLevel
ComponentLevel
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Scientific Challenges
19
Multi-time scale modeling/multi-stressor modeling
System Level► Wind turbine► Photovoltaics► Motor drives► Pump drives
► Power devices► Capacitors► PCB
• System–level mission profile.• Electrical/mechanical.
Models:• Component–level mission profile.• Losses, temperature, humidity, etc.
Models:
Mission profiles / Environmental Conditions:
System Specifications:• Machine type• Converter topology• Power device• Etc.
Vdc
I
fsw
Multi – time scale modelling
T
V
RH
Component LevelReliability
Multi – stressor modelling
Component Level System - LevelReliability
RBDAnalysis
Component Reliability
System Reliabilityfn(αn,η n,t)
f2(α2,η 2,t)
f1(α1,η 1,t)
Ta
Vibration
User InputLevel 1
User InputLevel 2
Component 1
Component 2
Component n
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► The Research Scope of Power Electronics Reliability
20
Paradigm Shift■ From components to failure mechanisms■ From constant failure rate to failure level with time■ From reliability prediction to robustness validation■ From microelectronics to also power electronics
Sour
ce: H
. Wan
g, M
. Lise
rre,
F. B
laab
jerg
, P. P
. Rim
men
, J. B
. Jac
obse
n, T.
Kvi
sgaa
rd, J
. La
ndki
ldeh
us, "
Tran
sitio
ning
to p
hysic
s-of
-failu
re a
s a re
liabi
lity
driv
er in
pow
er
elec
tron
ics,
" IEE
E Jo
urna
l of E
mer
ging
and
Sel
ecte
d To
pics
in P
ower
Ele
ctro
nics
, vol
. 2,
no.
1, p
p. 9
7-11
4, M
ar. 2
014.
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
3 State-of-the-ArtSelected examples of power electronics reliability research
21IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Example 1 – Understanding of Component-level Degradation Through Multi-physics Simulation, Accelerated Testing, and Condition Monitoring
22IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Multiphysics Simulation
23
Simulation results are consistent with micro-sectioning analysis and four-point probing results of degraded modules
Source: Kristian Bonderup Pedersen, IGBT Module Reliability. Physics-of-Failure based Characterization and Modelling, PhDDissertation, CORPE, Aalborg University, 2015
Example – Degradation of IGBT modules based on physics-of-failure simulations
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Better Understanding in Component Degradation
24
Examples of Power Cycling Testing on IGBT Modules
Diagram of an advanced power cycling testing system
A low-power power cycling testing setup
1700 V/1000 A
600 V/30 A
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Better Understanding in Component Degradation
25
Example of Degradation Testing of DC Film Capacitors under Humidity Conditions
A humidity-dependent lifetime model Optical microscopy investigation of one of the degraded samples
Capacitor degradation testing setup Degradation curve of one group of testing
85°C, 55%RH3,850 hours
Sour
ce: H
. Wan
g, D
. A. N
ielse
n, a
nd F.
Bla
abje
rg, “
Degr
adat
ion
test
ing
and
failu
re a
naly
sis o
f DC
film
cap
acito
rs u
nder
hig
h hu
mid
ity co
nditi
ons,”
M
icro
elec
tron
ics R
elia
bilit
y, 20
15
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Better Understanding in Component Degradation
26
Condition Monitoring of IGBT Modules and Capacitors
Gate Peak Current based IGBT Junction Temperature Monitoring
25°C
125°C3mV/°C
Peak detector output voltages
Gate voltage
1.0 µs/div
150 mV/div
3.3 V/div
Outcome■ Experimentally verified and
calibrated■ Gate voltage compensation
Condition Monitoring and Remaining Lifetime Prediction of Capacitors
Outcome■ An Artificial Neural Network (ANN) based method is applied for estimation of capacitance
■ Based on existing available information, pure software solution
Sour
ce: N
. Bak
er, A
n El
ectr
ical
Met
hod
for
Junc
tion
Tem
pera
ture
Mea
sure
men
t on
Pow
er
Sem
icon
duct
or S
witc
hes,
PhD
diss
erta
tion,
CO
RPE,
Aal
borg
Uni
vers
ity, 2
016
Sour
ce: H
. Sol
iman
, Con
ditio
n M
onito
ring
of C
apac
itors
for D
C-lin
k Ap
plic
atio
n in
Pow
er E
lect
roni
c Co
nver
ters
, CO
RPE,
Aal
borg
U
nive
rsity
, 201
7
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Example 2 – Impact of Mission Profile Resolution on the Predicted Lifetime of IGBT Modules in an Modular Multi-level Converter (MMC)
27IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Modular Multi-level Converter (MMC)
28
Background
MMC-based HVDC – Basic Scheme (Source: Siemens)
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Modular Multi-level Converter (MMC)
29
Down-scale sub-module
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FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Impact of the Mission Profile Resolution
30
Lifetime prediction
Lifetime distribution
Input
Output
Wind Speed
Power Conversion Model
Loss Model
Thermal Model
Counting
Emulate instantaneous losses
Thermal Model
vw
Pw
PT1, PD1, PT2, PD2
Average losses
Lifetime Model
Monte Carlo
Tj
Modules/IGBT/DiodeElectrical behaviorThermal parameters
m ϕ f0
Temperature swings at fundamental frequency
Junc
tion
tem
pera
ture
Design iterations to select proper IGBT modules
Mission profiles
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18 31
1 hour/data
10 minutes/data
1 second/data
Different studies adopt different resolution of the wind speed, what is the impact on the predicted lifetime?
Source: ABB
► Impact of the Mission Profile Resolution
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18 32
► Impact of the Mission Profile Resolution
(STO1s is stochastic model and 1s wind speed, IEC1s means IEC power curve and 1s wind speed, IEC10minmeans IEC power curve and 10min-average wind speed, IEC1h means IEC power curve and 1h-avergewind speed, STO1sREG means stochastic model and regenerated 1s wind speed based on 10min-averagewind speed. T1, D1, T2, D2 are IGBT1, Diode1, IGBT2, Diode2 respectively. CS, BS, BW mean chip solder,baseplate solder and bond wire respectively).
>7 times difference in degradation prediction for the power modules
Long-term high resolution data (e.g., 1s/data) and dynamicmodels are necessary for degradation performance and reliabilityassessment of electrical components.
Power modules
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FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Example 3 – Two-Terminal Active Capacitors
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FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Concept of a Two-terminal Active Capacitor
Active Capacitor§ Two-terminals only§ Impedance characteristics equivalent to
passive capacitorsA B
Active switches
Passive elements
Sampling and conditioningMicro-controller
Gate driversABi
ABv
Self-power Supply
Feature No signal connection to main circuit No auxiliary power supply Only two-terminal ”A” and ”B” connected to external main circuit
Retain the same level of convenience as a conventional passive capacitor Application independent Lowest apparent power processed by the auxiliary circuit Long life-time a goal
Source: H. Wang, H. Wang and F. Blaabjerg, ¨A two-terminal active capacitor device¨IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Proof-of-Concept of a Two-terminal Active Capacitor
An implementation of the two-terminal active capacitor concept
Internal auxiliary power from MOSFET
Source: Haoran Wang and Huai Wang, “A two-terminal active capacitor,” IEEE Transactions on Power Electronics, 2017
-50
0
50
100
Mag
nitu
de (d
B)
10-1 100 101 102 103 104-180
-135
-90
Phas
e (d
eg)
Frequency (Hz)
110 µF passive capacitor (3.4 J)
1100 µF passive capacitor (34.4 J)
Active capacitor1100 µF@100Hz (5.8 J)
High pass filter with cut off frequency of 10 Hz
Impedance characteristics of active capacitor
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Key waveforms of the system with 110uF active capacitor
Key waveforms of the system with 1100uF passive capacitor
: [100V/ div]DC linkV −
: [100V/ div]ACv: [10A/ div]ACi
: [20ms/ div]t
Ripple ratio 4.1 %
: [100V/ div]DC linkV −
: [100V/ div]ACv: [10A/ div]ACi
: [20ms/ div]t
Ripple ratio 4.8 %
Single-phase system with active capacitor
ACv
gLActive
Capacitor
A
Resistive load
ACi+ -
DC linkV −
+
-B
Experimental Results of Active Capacitor
Top side
Bottom sideC1 Self-power supply
Micro-controller
GaN based full-bridge
Low voltage DC-link capacitor in full-bridge
High frequency filter inductor
High frequency filter capacitor
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Example 4 – Design for Reliability and Robustness (DfR2) Tool Platform
37IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► DfR2 Tool Platform Developed at CORPE, Aalborg University
38
DfR2 Tool
Circuit Simulation Software
FEM/CFD Simulation Software
Reliability Software
Environmental / Operational
Mission Profiles
System-Level Mission Profile
Modeling
System Circuit Simulation
Component Mission Profile
Modeling
Component-Level Reliability
Modeling
System-Level Reliability Modeling
Level 1 Level 2 Level 3 Level 4
Electro-Mechanical System
Power Electronics System
Application dependent Independent Independent Component dependent
Electro-Thermal Ta
RHTa_sys
RHsys
Vsys
Isys
Ta_comp
RHcomp
Vcomp
Icomp
Vcomp f1
f2
f3
f4
Design for Reliability and Robustness (DfR2) HelpSave Load
ExportBack Reset
Wind Power System
Environmental / Operating mission profiles
I.
Mission Profiles Component Reliability System Reliability
Component: Transistor – T1g
Level: IV
Display
Component: Transistor – T1g
Display
Sub-system: Power Module
DisplaySystem-level mission profile modeling
Power electronics circuit modeling
Component-level mission profile modeling
Component-level reliability modeling
System-level reliability modeling
Step I.
Step II.
Step III.
Step IV.
Step V.
Step VI.
Display: Voltage
Display: Temperature
Display: Static lifetime
Lifetime information(e.g. cycles to failure, confidence level, etc.)
Lifetime information(e.g. cycles to failure, confidence level, etc.)
Display: Unreliability curve
Interfaces to other softwareMain GUI panel
Modeling Framework
Design for Reliability and Robustness (DfR2)
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► DfR2 Tool Platform Developed at CORPE, Aalborg University
39
Design for Reliability and Robustness (DfR2)
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
► Summary
40IEEE PEAC 2018 No Reprint Without Authorization
CORPE
Design for Reliabiity in Power Electronics Systems
Frede Blaabjerg
eMail: fbl@et.aau.dkwww.corpe.et.aau.dk
Presentation at PEAC’2018 – Shenzhen, November 5, 2018
Thanks to Prof. Huai Wang, Aalborg University
IEEE PEAC 2018 No Reprint Without Authorization
References
42
1. M. Liserre, R. Cardenas, M. Molinas, J. Rodriguez, ”Overview of Multi-MW wind turbines and wind parks”, IEEE Trans. on IndustrialElectronics, Vol. 58, No. 4, pp. 1081-1095, April 2011.
2. REN21 - Renewables 2014 Global Status Report, June, 2014. (Available: http://www.ren21.net)3. Z. Chen, J.M. Guerrero, F. Blaabjerg, "A Review of the State of the Art of Power Electronics for Wind Turbines," IEEE Trans. on Power
Electronics, vol.24, No.8, pp.1859-1875, Aug 2009.4. F. Blaabjerg, Z. Chen, S.B. Kjaer, “Power Electronics as Efficient Interface in Dispersed Power Generation Systems”, IEEE Trans. on
Power Electronics, Vol. 19, no. 4, pp. 1184-1194, 2004.5. A.D. Hansen, F. Iov, F. Blaabjerg, L.H. Hansen, “Review of contemporary wind turbine concepts and their market penetration,” Journal of
Wind Engineering, Vol. 28, No. 3, pp. 247-263, 2004.6. M.P. Kazmierkowski, R. Krishnan, F. Blaabjerg, Control in Power Electronics-Selected problems, Academic Press, 2002. ISBN 0-12-
402772-5.7. F. Blaabjerg, M. Liserre, K. Ma, “Power Electronics Converters for Wind Turbine Systems,” IEEE Trans. on Industry Application, vol. 48,
no. 2, pp. 708-719, 2012.8. F. Blaabjerg, K. Ma, “Future on power electronics for wind turbine systems,” IEEE Journal of Emerging and Selected Topics in Power
Electronics, vol. 1, no. 3, pp. 139-152, 2013.9. H. Wang, M. Liserre, F. Blaabjerg, P. P. Rimmen, J. B. Jacobsen, T. Kvisgaard, J. Landkildehus, "Transitioning to physics-of-failure as a
reliability driver in power electronics," IEEE Journal of Emerging and Selected Topics in Power Electronics, Vol. 2, No. 1, pp.97-114, 2014.10. H. Wang, M. Liserre, and F. Blaabjerg, “Toward reliable power electronics - challenges, design tools and opportunities,” IEEE Industrial
Electronics Magazine, vol.7, no. 2, pp. 17-26, Jun. 2013.11. S. B. Kjaer, J. K. Pedersen, and F. Blaabjerg, “A review of single-phase grid connected inverters for photovoltaic modules,” IEEE Trans.
on Ind. Appl., vol. 41, no. 5, pp. 1292-1306, Sep. 2005.12. K. Ma, F. Blaabjerg, and M. Liserre, “Thermal analysis of multilevel grid side converters for 10 MW wind turbines under low voltage ride
through”, IEEE Trans. Ind. Appl., vol. 49, no. 2, pp. 909-921, Mar./Apr. 2013.13. K. Ma, M. Liserre, and F. Blaabjerg, “Reactive power influence on the thermal cycling of multi-MW wind power inverter”, IEEE Trans. on
Ind. Appl., vol. 49, no. 2, pp. 922-930, Mar./Apr. 2013.14. C. Busca, R. Teodorescu, F. Blaabjerg, S. Munk-Nielsen, L. Helle, T. Abeyasekera, and P. Rodriguez, “An overview of the reliability
prediction related aspects of high power IGBTs in wind power applications,” Journal of Microelectronics Reliability, vol. 51, no. 9-11, pp.1903-1907, 2011.
15. E. Koutroulis and F. Blaabjerg, “Design optimization of transformerless grid-connected PV inverters including reliability,” IEEE Trans. onPower Electronics, vol. 28, no. 1, pp. 325-335, Jan. 2013.
16. K. B. Pedersen and K. Pedersen, “Bond wire lift-off in IGBT modules due to thermo-mechanical induced stress,” in Proc. of PEDG’ 2012,pp. 519 - 526, 2012.
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References
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FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Books available
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Books available
IEEE PEAC 2018 No Reprint Without Authorization
FREDE BLAABJERG, CENTER OF RELIABLE POWER ELECTRONICS, AALBORG UNIVERSITY SL IDE19-NOV-18
Books available
IEEE PEAC 2018 No Reprint Without Authorization
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