design of a ‘single event effect’ mitigation technique for reconfigurable architectures

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Design of a ‘Single Event Effect’ Mitigation Technique for Reconfigurable Architectures. SAJID BALOCH. Prof. Dr. T. Arslan 1,2 Dr.Adrian Stoica 3. Supervisory Team. ACRONYMES. SEU (Single Event Effect) SET (Single Event Transient) SEB (Single Event Burnout) - PowerPoint PPT Presentation

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Baloch 1 MAPLD 2005/1024-L

Design of a ‘Single Event Effect’ Mitigation Technique for

Reconfigurable Architectures

TH

E

UNI VERSI TY

OF

E D I N B U

RG

H

SAJID BALOCH

Prof. Dr. T. Arslan1,2 Dr.Adrian Stoica3Supervisory Team

Baloch 2 MAPLD 2005/1024-L

ACRONYMES

– SEU (Single Event Effect)– SET (Single Event Transient)– SEB (Single Event Burnout)– SEL (Single Event Latch-up)– Cfg (Configuration)– EDAC (Error Detection and Correction)– SoC (System on Chip)– FPGA (Field Programmable Gate Array)– DEU (Double Event Upset)– TEU (Triple Event Upset )– MEU (Multiple Event Upsets)

Baloch 3 MAPLD 2005/1024-L

RECONFIGURABLE ARCHITECTURES

ME

MO

RY

ME

MO

RY

ReconfigurableArray

IP

DSP

IP

Re-Configurable SoC Architecture

a) FPGAs

- SRAM

- Anti Fuse

- EPROM

b) Reconfigurable SoC

- General purpose

- Domain Specific

Baloch 4 MAPLD 2005/1024-L

RADIATION EFFECTS RE-CONFIGURABLE ARCHITECTURES

– PERMANANT FAULTS (due to SEL, SEB etc)

– TEMPORARY FAULTS (due to SEU etc)

Baloch 5 MAPLD 2005/1024-L

SEU MITIGATION TECHNIQUES

a) HARDWARE REDUNDANCY

- Dual Modular Redundancy (DMR)

- Triple Modular Redundancy (TMR)

- EDAC Codes

- Process Technology

b) TIME REDUNDANCY

c) COMBINATION (Hardware & Time)

Baloch 6 MAPLD 2005/1024-L

• TRANSIENT FAULTS (Data Memory etc)

• PERMANANT FAULTS (Cfg. Memory)

Radiation Hardening SEU EFFECTS

Baloch 7 MAPLD 2005/1024-L

SEU EFECTS Synchronous Circuits

D-F

lip F

lop

D-F

lip F

lop

CombinationalLogic Circuits

Data_in Data_out

Clock

Baloch 8 MAPLD 2005/1024-L

SEU EFECTS Configuration Memory

M

M

D-F

lip F

lop

M

M M M MLUT

SEU (BITFLIP)

Baloch 9 MAPLD 2005/1024-L

CLUSTER

CLUSTER

CLUSTER

CLUSTER

CLUSTER

CLUSTER

SEU EFECTS ROUTING OF A SIGNAL

Baloch 10 MAPLD 2005/1024-L

Proposed SEU/SET MitigationTechnique

based on:• Temporal Data Sampling• Weighted Voting

Salient Features of The Proposed Technique:Auto Correction Mechanism for• 100% SEU Recovery• 100% Double Fault Recovery• Voter Faults Recovery

Baloch 11 MAPLD 2005/1024-L

Temporal Sampling

Q

QSET

CLR

S

R

Q

QSET

CLR

S

R

Q

QSET

CLR

S

R

Q

QSET

CLR

S

R

Q

QSET

CLR

S

R

Q

QSET

CLR

S

R

Data

CLk-A

CLk-B

CLk-C

L1 L2

L6L5

L4L3

1

3

5 6

4

2

Primary Section

Secondary Section

Baloch 12 MAPLD 2005/1024-L

TEMPORAL SAMPLING Clock Scheme

• 3 derivates of Main Clock

• Each Clock is Phase shifted

• 25% duty Cycle

CLk-A

CLk-B

CLk-C

CLOCK

Computation Cycle

2 Clock Cycles

Baloch 13 MAPLD 2005/1024-L

Minimized TermX4.X3.X0 + X5.X3.X0 + X5.X4.X0 + X4.X3.X1 + X5.X3.X1 + X5.X4.X1 + X4.X3.X2 + X5.X3.X2 + X5.X4.X2 + X5.X4.X3 +

X3.X2.X1.X0 + X4.X2.X1.X0 + X5.X2.X1.X0

Weighted Voter Circuit

Baloch 14 MAPLD 2005/1024-L

SEU in Secondary Section

Node BeforeSEU

AfterSEU

Voting Weights‘1’ ‘0’

Total Votes ‘1’ ‘0’

1 1 1 2 -

8 1

3 1 1 2 -

5 1 1 2 -

2 1 0 - 1

4 1 1 1 -

6 1 1 1 -

Case Example

Baloch 15 MAPLD 2005/1024-L

Multiple Bit Upset

Node BeforeSEU

AfterSEU

Voting Weights‘1’ ‘0’

Total Votes ‘1’ ‘0’

1 1 1 2 -

5 4

3 1 0 - 2

5 1 0 - 2

2 1 0 1 -

4 1 1 1 -

6 1 1 1 -

Case Example

Baloch 16 MAPLD 2005/1024-L

Hardware Implementation of Proposed Scheme with

Auto-Correction Mechanism

Baloch 17 MAPLD 2005/1024-L

Single Event Transition FaultData / Clock

Baloch 18 MAPLD 2005/1024-L

SEU/SET Simulator•SEU’s can be injected at instance•SEU of any duration can be injected•Multiple upsets can be injected

Baloch 19 MAPLD 2005/1024-L

Performance AnalysisFault Coverage

 Mitigation Scheme %age Fault Tolerance

SET SEU DEU TEU

Proposed Scheme 100% 100% 100% 50%

F. Lima etal Scheme 63% 100% - -

D. Mavis etal Scheme 100% 100% 32% 18%

Baloch 20 MAPLD 2005/1024-L

Performance AnalysisArea Overhead

0

50

100

150

200

250

300

350

400

450

Proposed Technique Mavis etal Technique

Are

a (

u s

qu

are

mete

r)

Results are based on:

0.13µm CMOS technology

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