european funding opportunies in micro and nanoelectronics overview and perspecves · 2017. 11....

Europeanfundingopportuni/esinmicroandnanoelectronics

Overviewandperspec/ves

EricFribourg-BlancCompe//veElectronicsIndustry

DGCONNECT

IUNET workshop – E. Fribourg-Blanc – 22 September 2017

Compe&&veelectronicsindustry

•  Por4olio–  Strategyonelectronics–  Nanoelectronics,integratedsystems&TOLAE–  ECSELJointUndertaking

•  Role:(re)posi&onEuropeinthemapofcompu&ngandintegrateddevices

•  ProjectmappingacrosstheCommissionsincethebeginningofFP7inmul&pleareas

Horizon2020areas

Horizon2020–electroniccomponents

Excellence in Science

Leadership in Enabling and

Industrial Technologies

(LEIT)

Societal Challenges

European Research Council (ERC) grants

Marie Slodowska-

Curie grants

Future and Emerging Technologies

collaborative projects

Electronic components

ENIAC/ECSEL Joint Undertaking

Somegenerali&es

•  Typesofproject–  RIA–ResearchandInnova&onAc&ons–  IA–Innova&onAc&ons–  CSA–Coordina&onandSupportAc&ons

•  Flagships–  Graphene–  HumanBrainProject–  QuantumTechnologies–infinalprepara&on

•  JointUndertakings–  StartedunderFP7–  Currently7JUs–>ECSELinDGCONNECT

Micro-nanoelectronicsWhathasbeenfundedsofar–keyfigures

•  9yearsoffunding–2007-2015•  ProgrammesFP7andH2020(2years),includingENIACandECSELJoint

Undertakings

•  7areasoffundingcoveringthefullspectrumofelectroniccomponenttechnologies

•  143projects•  About2100par&cipa&ons•  Totalcosts:3.6B€•  EUcontribu&on:880M€

fprojects

FP7 ENIAC H2020 ECSEL

Micro-nanoelectronicsvaluechain–Par&cipa&ons

Largecompanies37%

SMEs19%

RTOs20%

Universities24%

ECSELJOINTUNDERTAKING

ECSEL Joint Undertaking – objectives

•  Contribute to the development of a strong and globally competitive electronics components and systems industry in the Union;

•  Ensure the availability of electronic components and systems for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of technology development, bridging the gap between research and exploitation, strengthening innovation capabilities and creating economic and employment growth in the Union;

•  Align strategies with Member States to attract private investment and contribute to the effectiveness of public support by avoiding an unnecessary duplication and fragmentation of efforts and by facilitating the participation of actors involved in research and innovation;

•  Maintain and grow semiconductor and smart system manufacturing capability in Europe, including leadership in manufacturing equipment and materials processing;

•  Secure and strengthen a commanding position in design and systems engineering including embedded technologies;

•  Provide access of all stakeholders to a world-class infrastructure for the design and manufacture of electronic components and embedded/cyber-physical and smart systems; and

•  Build a dynamic ecosystem involving Small and Medium-Sized Enterprises (SMEs), thereby strengthening existing clusters and nurturing the creation of new clusters in promising new areas.

ECSEL Joint Undertaking

ECSEL Strategic Agenda

Projectsfunded

•  StrongfocusonInnova&onAc&ons•  ResearchandInnova&onAc&onsformaturingtechnologies

Evolu&on->LighthouseIni&a&ves•  Fundingin2016:2projects

–  Industry4.E–  Mobility4.E

•  Structuringac&onsforECSELtoreinforcethestrategicmid-termimpact

•  Currentlyunderdiscussionabouttheprojectswhichcouldbesupportedin2017

ECSEL–interimevalua&on

•  ReportwellreceivedintheCommission

•  ECSELrecognisedasastrategicinstrumenttosupportdigitalvaluechainsinEuropeinacoordinatedway

•  Anumberofrecommenda&onsweremadetoimprovethefunc&oning–  Developastrongerstrategyforelectroniccomponentsandsystems–  Engagemoreproac&velytobringthesystemscommunityandactorsinthe

strategy–  Improvetheprocessofmeasuringimpactandsuccessoftheinstrument–  HarmoniseMemberStatepar&cipa&onrulesandreimbursementrates

H2020LASTWORKPROGRAMME

H2020–Lastworkprogramme

LEIT-ICTWP2018-20

•  Unconven&onalNanoelectronics-–  exploringthedevelopmentofpromisingbeyond-CMOSdevices

•  LargeAreaElectronics-–  enhancingmanufacturability,integra&onwithconven&onalelectronic

componentsandtake-upinapplica&ons

•  ElectronicSmartSystems-–  integra&ngsensing,actua&ng,advancedprocessingandwirelesstransmission

–newfunc&onali&es,miniaturisia&onandperformanceimprovement

H2020–Lastcallonnanoelectronics

ICT-08-2019:Unconven/onalnanoelectronicsObjec&ve:accompanyenablingtechnologiesfortheadvancedCMOSandpreparetheroadbeyondCMOSExploratoryResearch

–  Differen&a&ngfactorsfortheIndustry

RIA–ResearchandInnova/on(30M€–100%funding)(Demonstra/onincontrolledenvironmentatalimitedscale)–  Energy-efficientcomputa&ondevicesbeyondthecurrentCMOSparadigm–  Energy-efficientcomputa&oncircuitarchitectures–  3Dandcryogenicelectronics–  Designforadvancednanoelectronicstechnologies

Preparingforproposals

•  Eachcallisunique–  Everywordoftheworkprogrammecountsbutitisusuallyenoughtohookyour

proposal(s)onanumberofthem,notall–  BewareofresubmissionsÄ  Preferablyrestartfromfreshevenifkeepingthesamecoreconcept(s)

•  Excellentproposal–some(non-binding)considera&ons–  Withascoreof13.5(4.5oneachcriteriononaverage)andabove–  Usuallytheminorshortcomingsfromoneevalua&onESRwillnotapplytoanother

call(uniquenessofthecalls)–  Bewareofrankingrules(RIAs)

•  Excellence•  Impact•  SMEbudget•  Genderparity

•  Finetuningofaproposalisessen&altoleavenoroomforshortcomings

Furtherconsidera&ons

•  Providedtheidea/conceptandimpactreasonablyfitwiththecall,thesewillnotbeareasonforlowscore

•  Usualshortcomingswhichcanbeavoided–  Insufficient/nottoorealis&cdescrip&onofimpact–  Languagenotsufficientlyclear–  Insufficientfocusoncoreac&vi&es/developments–  Unbalancedconsor&um–  Insufficientaken&ontorisks,management,dissemina&on

IU.NETINFRAMEWORKPROGRAMMES

IUNETinEUprogrammesonelectroniccomponentsandsystems

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

fprojects

ECSELH2020ARTEMISENIACFP7

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Millions€

fparticipation

•  Coverage–  NanoelectronicsandsmartsystemsprojectsunderFPcalls–  JointUndertakings:ENIAC,ARTEMIS,ECSEL

IUNET-Members

fparticipations

Millions€

•  Coverage–  NanoelectronicsandsmartsystemsprojectsunderFPcalls–  JointUndertakings:ENIAC,ARTEMIS,ECSEL

IUNETinEUprogrammesonnanoelectronics

•  Coverage–  ICdesign,Nanoelectronics,BeyondCMOS&spintronics,RF&mm-wave

devices,Powerelectronics–  BothunderFPandJUcalls

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

fprojects

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Millions€

fpartic

ipation

IUNET-Members

devices,Powerelectronics–  BothunderFPandJUcalls

fparticipations

Millions€

IUNETinEUprogrammesonnanoelectronicsandsmartsystems

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

fprojects

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Millions€

fpartic

ipation

devices,Powerelectronics,Semiconductorequipment&processes–  MNBSinvitro,MEMS,Packaging&heterogeneousintegra&on,Electric

vehicle,Clinical&healthcarepla4orms–  BothunderFPandJUcalls

IUNET-Members

fparticipations

0.00.51.01.52.02.53.03.54.04.55.0

Millions€

devices,Powerelectronics,Semiconductorequipment&processes–  MNBSinvitro,MEMS,Packaging&heterogeneousintegra&on,Electric

vehicle,Clinical&healthcarepla4orms–  BothunderFPandJUcalls

SMESASPARTNERSINPROJECTS

Impactandexploita&on–SMEsaspartners

Nanoelectronics&ICdesign

Micro-Nano-BioSystems

Impactandexploita&on–SMEsaspartners

RF&mm-wavedevices

Powerelectronics

SMEsfromFP7tonow–4areas

•  Perarea–  60to135SMEs

•  Italy–  10par&cipa&ons–  8SMEsoverall

SPECIFICPORTFOLIOMAPPING

MNBS–mapping

•  From2007to2015•  Focusonsystemintegra&on

•  119projects–  CONNECT2/3–  RTD1/4–  JUs8%

•  1365par&cipa&ons

Micro-Nano-BioSystemsprojects–maps

MNBS–EUcontribu&on

FP7 ENIAC&ARTEMIS H2020 ECSEL

Millions€

Portabledevicesandsystems MNBSanalyticaldetectionplatformsPatient-centreddevicesandimaging Chipsmanufacturing

Horizon2020–Alterna&vecompu&ng

Excellence in Science

Leadership in Enabling and

Industrial Technologies

(LEIT)

Societal Challenges

European Research Council (ERC) grants

Marie Slodowska-

Curie grants

Future and Emerging Technologies

collaborative projects

Electronic components

ENIAC/ECSEL Joint Undertaking

Compu&ngbeyondcurrentnanoelectronics

•  10yearsoffunding–2007-2016•  ProgrammesFP7andH2020

•  6dis&nctareasemerge

•  511projects•  About1650par&cipa&ons•  Totalcosts:950M€•  EUcontribu&on:800M€

fprojects

FP7 H2020

Category Coverage

Quantumcompu&ng Technologiestobuildqubitsandtransportinforma&onbetweenthem,includingalgorithmicandarchitecture

MolecularelectronicsSolid-stateinforma&onprocessingfunc&onsbuiltonorganicmoleculesincludingbiomolecules;molecularspintronics

Spintronics Spin-basedelectronicsandrelatedmaterials

2DmaterialsCarbon-basedandtransi&onmetaldichalcogenides,aswellaselectronicandspintronicfunc&onsbasedonthese

Extended&beyondCMOSNonmainstreamsemiconductortransistors,includingIII-Vmaterials,steep-slopedevices,singleelectrontransistors,etc.

Neuromorphiccompu&ng Hardwareimplementa&onofneuralnetworks,analogueanddigital,architecturesandapplica&ons

Areasofthepor4olio

Typesofprojects

Quantumcomputing

Molecularelectronics

Spintronics 2Dmaterials Extended&beyondCMOS

Neuromorphiccomputing

fprojects

Fundamentalresearch Collaborativefundamental Collaborativeapplied

Par&cipants

Quantumcomputing

fparticipan

tsFundamentalresearch Collaborativefundamental Collaborativeapplied

Funding

Quantumcomputing

Millions€

Fundamentalresearch Collaborativefundamental Collaborativeapplied

WhereinEurope?

FundamentalresearchCollabora/vefundamental

Collabora/veapplied

WhereinEurope?

Quantumcompu/ngMolecularelectronics

Spintronics2Dmaterials

Extended&beyondCMOSNeuromorphiccompu/ng

Typesofpar&cipants

Quantumcomputing

IND SME RES HES

Countrycoverage

Millions€

Quantumcomputing Molecularelectronics Spintronics2Dmaterials Extended&beyondCMOS Neuromorphiccomputing

Outlook

•  Neuromorphiccompu&ngisprobablythemostmaturecontendertothecurrentnanoelectronicsasitreliesmostlyon–  theexis&ngCMOStechnology–  +ananaloguesynapsewhichs&llneedstobefullyintegrated

•  Europecannotaffordtobelateontheindustrialisa&onofneuromorphiccompu&ng

•  Coordina&onisneededto–  Makesurethehardwaretechnologyroadblocksaretackledquickly–  Stabiliseandreachaconsensusonanarchitectureefficientenoughforreal

lifechallenges,inpar&cularinIoT–  Andarriveatdesignkitsfortheindustryandfablesscommuni&es

Outlookandques&ons

•  Extended&beyondCMOS–  S&lllimitedinterestinEuropeanindustry–  Whataretheprospects?

•  Neuromorphic–  Industrialisa&onhasbegunandfirstdevelopmentsdevelopfast–  Growingnumberoffundedprojectsbuts&llcompara&velylimitedinputfrom

HumanBrainFlagship,especiallyonhardwareandconcretemodelsforrealworldapplica&ons

–  WhereisindustryinEuropebeqnginthisarea?

•  Quantumcompu&ng–  Needfocus(especiallyonintegrated/solid-stateapproach)–  AclearerroadmaptoensuretheFlagshipwilldeliveroutputforLEIT

Outlookandques&ons

•  2Dmaterials–  S&llratherfundamentalfield–  Anumberofexperimentson2Dmaterialsforelectronicsbutalotof

technologicalhurdles

•  Spintronics–  Novisibilityonapplica&onsbeyondMRAM–  Whatarethehurdles?Materials?Foundryservices?Designtools?

•  Molecularelectronics–  Whataretheissues?Whyaretheyblocking?–  DNA-basedcompu&ngisalmostabsentfromEU-fundedprojects

TOWARDSFP9

TOWARDSFP9:KeyfindingsfromtheH2020INTERIMEVALUATION

EFFICIENCY

•  ONTRACKTOBEMOREEFFICIENTTHANFP7–  Administra&veexpenditurebelowthe5%legaltarget–  Time-to-grant110daysfasterthanFP7

•  NETWORKSAWIDERANGEOFSTAKEHOLDERS–  Par&cipantsfromover130countries–  52%ofpar&cipantsarenewcomers;moreofthemcomefromEU-13(31.2%)

thanEU-15(19.7%)

•  LARGE-SCALEOVERSUBSCRIPTION–  Successrateonly11.6%(vs.18.4%inFP7)–  ~EUR1.7billionspenttowriteunsuccessfulproposals

TOWARDSFP9:KeyfindingsfromtheH2020INTERIMEVALUATION

EFFECTIVENESS-ECONOMICIMPACT•  PRODUCINGINNOVATIONS&COMPETITIVENESS

–  Moreprivatesectorpar/cipa/ons(33.2%)thanFP7–  Fundedprojects~40%morelikelytobegrantedpatents;patentsareofhigher

commercialvaluethanotherpeers–  70%ofSMEsaimatnew-to-marketinnova/ons

•  GENERATINGJOBS,GROWTH&INVESTMENTS–  EveryeuroinvestedunderHorizon2020bringsanes&matedGDPincreaseof

6to8.5euros(EUR400toEUR600billionby2030)

•  SUPPORTING&NETWORKINGBUSINESS&SMEs–  5,700organisa&onsfundedunderAccesstoRiskFinance–  EUR13billionprivatefundsleveraged

TowardsFP9–Indica&ve&metable

2017Jan Publicstakeholderconsulta&onfortheinterimevalua&on(withsomeforwardlookingques&ons)closedon15January

May Publica&onoftheStaffWorkingDocumentontheInterimEvalua&on(evalua&onresultsbasedonlegalbaserequirements&5mandatoryevalua&oncriteria)

June •  AssessmentofHorizon2020implementa&oninviewofitsinterimevalua&onandtheFrameworkProgramme9proposalbytheEuropeanParliament(EP);

•  ERACOpinionontheinterimevalua&onofH2020andinviewoftheprepara&onsofthenextFP

July •  Publica&onofHighLevelGroupreportandstakeholderconferenceonHorizon2020InterimEvalua&on(3July)•  InformalCompe&&venessCouncil,Tallinn

Q4 •  H2020WorkProgramme2018-2020integra&ngmainfindingsfromtheInterimEvalua&on•  Publica&onofCommissionCommunica&on:

•  Overallconclusionsontheevalua&onresults;•  Stateofimplementa&onoftheFP7ex-postHLEGrecommenda&ons;•  ResponsetoHighLevelGrouprecommenda&ons;•  MessagesonArt.185andArt.187ini&a&ves

2018Mid NextMFFCommissionproposal

CommissionproposaltabledforthenextFrameworkProgramme&accompanyingImpactAssessment

2019EuropeanParliamentelec&ons,appointmentofthenewCommission

2021Launchofthe9thFrameworkProgramme

PREPARINGFORTHEFUTUREOFELECTRONICCOMPONENTSANDSYSTEMS

Strategyonelectronics–Preparingforthefuture

•  Workshopon27April2017•  26par&cipantsfromindustryandresearchcommunity•  Objec&ves

1.  facilita&ngtheupdateoftheEuropeanStrategyfortheElectronicsindustryandofECSEL,

2.  wideningtheinvolvementandcommitmentinstrategicpartnershipswithactorsalongthevaluechainwiththeoverarchinggoalofarrivingatasafesupplyofsecureandenergyefficientelectroniccomponentsandsystemsinEurope.

•  Mainmessages

–  Theinterna&onalcontexthaschangedveryfastinthepastfewyears–  ThereisaneedtorenewadialoguewiththeindustryinaformsimilartotheELG–  Toaddresssovereigntyissues,themechanismofcer&fica&oncouldbeused–  TheinvestmentsmadebytheRTOsisnecessarytokeeptheinnova&onecosystem

sustainable–  Essen&altechnologies:Europeneedstoensurethestrategicdevelopmentsof

technologiesandthisgoesbeyondthesupportthroughexis&nginstrumentsbutshouldalsobeaddressedunderECSEL

–  DigitalInnova&onHubsareac&onstocon&nueforsuppor&ngaccesstodigitaltechnologiesforSMEs

EuropeanForumforElectronicComponentsandSystems

•  Co-organisedeventtobringhighadded-valueandraiseittoencompasstherelevantvaluechains

•  Dates:5-7December2017•  Loca&on:Brussels

•  TheCommissionwilltakethisopportunitytoproposeaneventwithCommissionerGabriel(invita&onbased)to–  Ensureawarenessonthestrategicvalueofthesector–  Discussthepossiblefollow-upontheIPCEI–  Launchthenextstepsofthestrategyonelectronics

Follow-upofECSELunderFP9–generalelements

•  ECSELwellposi&onedintheLamyreport–  Open,transparent–  Focused(non-redundantinstrument)

•  Generalobjec&vesforthefollow-upECSEL–  Keepitstripar&testructurewithanobjec&vetoimproveitthrough

•  Harmonisa&onofthefundingratesandoftheeligibilitycriteria;•  Improvedtransparencyinfundingandunifiedrepor&ngmechanisms;•  Mul&annualfinancialcommitmentsbythePar&cipa&ngStates;•  Opera&onalisingAr&cle17.1(entrus&ngtheJUdirectlywiththepaymentofthe

na&onalcontribu&ons)–  Bekerfocusonthestrategicambi&onsoftheJUtobecomeacentral

instrumentsuppor&ngtheEuropeanpoliciesonelectronics,HPC,cybersecurity,AI,etc.

•  Consulta&onswithMemberStatesandIndustryAssocia&onsinvolvedinECSELwillstartquickly

DGCONNECT(Communica/onsNetworks,ContentandTechnology):

hbp://ec.europa.eu/dgs/connect/index_en.htm

Horizon2020ontheweb:hbp://ec.europa.eu/research/horizon2020/index_en.cfm

ThankYou

eric.fribourg-blanc1@ec.europa.eu

european funding opportunies in micro and nanoelectronics overview and perspecves · 2017. 11....

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