hardware-in-the-loop testbed

Hardware-in-the-Loop Testbed

Team 186

Project Collaborators• Team Members:

o Aaron Eaddy – EEo Ken Gobin – EE/COMPEo Douglas Pence – ENGR PHYS/EE

• Team Advisor/Sponsor:o Sung Yeul Park – Assistant Professor

Outline• Background• Components:

o Microcontrollero Interface circuito Sensor circuits

• Design Updates• Circuitry• Timeline• Budget

Background• Hardware-in-the-Loop:

o A simulation technique that is used in the development and testing of complex real-time embedded system designs.

o Benefits:• Function tests are able to be done at an early stage of development.• Laboratory tests are cheaper, more flexible and highly controllable.• No potential major risk of physically damaging test failures.• Tests are easy to reproduce and provide highly consistent results.

• Improve battery operation and monitoring• State of Health• State of Charge• Remaining useful life• Voltage, current, and temperature

Components

Design UpdatesInitial Design:• TI ezDSP® F28335

o 6 data/address lines, 59 GPIO, ADCo MATLAB® Simulink, Code Composer Studio®

Updated Design – Rev 1:• dSPACE® RTI-1104

o ADC ports, PWM CP-18 connector, embedded microcontrollero MATLAB® Simulink software for digital signal processing and ease-of-use displayo Removed CCS as an “extra” middle software process. Less complicated and more robust.

Updated Design – Rev 2:o Changed from ‘8’-channel design to hybrid ‘4+2’-channel designo Changed from 1 to 2 PCB design – isolate analog from digital and provide safety barriero Simplified GPIO requirements with PWM MUX selecto Added scaling, filtering and digital isolator

dSPACE® Microcontroller

dSPACE® RTI-1104 dSPACE® ControlDesk

dSPACE® Limitations• Maximum 8 ADC channels• Maximum of 10-Volt ADC processing signal limit• Maximum of 5-Volt system hardware limit

• Main reason for switching from ‘8’-channel design to ‘4+2’-channel design was related to these limitations, specifically the 8 ADC channel hardware limitation.

Sensors and Circuits• Voltage Sensor• Current Sensor

o Internal Impedance of each Cell.

• Temperature Sensoro Ambiento Battery Surface

• Amplificationo Integration with ADC

• Scaling for Multiple Cells• Requirements

o 30Vo 4 Cells

• Integration

Voltage Sensing Circuit

Current Sensor

Current Sensing Circuit

Temperature Sensing Circuit

Interface Circuit

Printed Circuit Board Design

TimelineResearch Item

Jan Feb MarApr

3 4 1 2 3 4 1 2 3 4

Design

Schematics + Part List x x x

PCB Layout x x x x x x x x

Parts Order x x x

PCB Order x x

Board Assembly x x

Board Testing

Hardware x x

DSP x x

Power Test x x

Budget• Total Budget $1,000• Current Expenditure Estimate:

o Temperature Sensors and Initial Parts - $156o PCB Order - $198o Additional Parts and Expandable Testing Components - $492

• Budget Surplus Estimate $154

Questions

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