div class=ts-pagebuttonPage 1button div class=ts-image amp-img class=ts-thumb alt=Page 1: HIPCA Journal No 16 Figure 3 Comparison of process operating window for HASL with different alloys With tin-lead solder the copper concentration must be maintained below 03% src=https:reader031vdocumentinreader031viewer20220418125e589bc51b51530af81e245dhtml5thumbnails1jpg width=142 height=106 layout=responsive amp-img divdivdiv class=ts-pagebuttonPage 2button div class=ts-image amp-img class=ts-thumb alt=Page 2: HIPCA Journal No 16 Figure 3 Comparison of process operating window for HASL with different alloys With tin-lead solder the copper concentration must be maintained below 03% src=https:reader031vdocumentinreader031viewer20220418125e589bc51b51530af81e245dhtml5thumbnails2jpg width=142 height=106 layout=responsive amp-img divdivdiv class=ts-pagebuttonPage 3button div class=ts-image amp-img class=ts-thumb alt=Page 3: HIPCA Journal No 16 Figure 3 Comparison of process operating window for HASL with different alloys With tin-lead solder the copper concentration must be maintained below 03% src=https:reader031vdocumentinreader031viewer20220418125e589bc51b51530af81e245dhtml5thumbnails3jpg width=142 height=106 layout=responsive amp-img divdivdiv class=ts-pagebuttonPage 4button div class=ts-image amp-img class=ts-thumb alt=Page 4: HIPCA Journal No 16 Figure 3 Comparison of process operating window for HASL with different alloys With tin-lead solder the copper concentration must be maintained below 03% src=https:reader031vdocumentinreader031viewer20220418125e589bc51b51530af81e245dhtml5thumbnails4jpg width=142 height=106 layout=responsive amp-img divdiv