ibl @ october rrb
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IBL @ October RRBG. Darbo & H. Pernegger RRB – October 2010o
IBL @ October RRBIBL @ October RRB
Slides for Marzio’s RRB talk
CERN, October, 11th 2010
G. Darbo & H. Pernegger
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 20102
Material from Raphael/NealThe Insertable B-Layer (IBL) is a fourth layer added to the present Pixel detector between a new beam pipe and the current inner Pixel layer (B-layer).
ISTIBL Support Tube
Alignment wires
PP1 Collar
IBL DetectorIBL Detector
IBL Staves
Sealing service ring
IBL key Specs / Params
•14 staves, <R> = 33.25 mm•CO2 cooling, T < -15ºC @ 0.2 W/cm2
•X/X0 < 1.5 % (B-layer is 2.7 %)•50 µm x 250 µm pixels•1.8º overlap in ϕ, <2% gaps in Z •32/16 single/double FE-I4 modules per stave•Radiation tolerance 5x1015 neq/cm2
IBL key Specs / Params
•14 staves, <R> = 33.25 mm•CO2 cooling, T < -15ºC @ 0.2 W/cm2
•X/X0 < 1.5 % (B-layer is 2.7 %)•50 µm x 250 µm pixels•1.8º overlap in ϕ, <2% gaps in Z •32/16 single/double FE-I4 modules per stave•Radiation tolerance 5x1015 neq/cm2
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 20103
IBL LayoutIBL LayoutBeam-pipe reduction:• Inner R: 29 25 mm
Very tight clearance:• “Hermetic” to straight tracks in Φ (1.8º
overlap)
• No overlap in Z: minimize gap between sensor active area.
Material budget:• IBL Layer (with IST): 1.5 % of X0
• Other Pixel layers: ~2.7 % of X0
Beam-pipe (BP) extracted by cutting the flange on one side and sliding (guiding tube inside).
IBL Support Tube (IST) inserted.
IBL with smaller BP inserted in the IST
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 20104
IBL Technical Design ReportIBL Technical Design ReportATLAS TDR includes:
• Overview and motivation for the project
• Study of the physics performance
• Technical description of the project with baseline and options for critical issues
• Three sensor technologies.
• Beam-pipe, extraction/insertion, installation, ALARA.
• Organization of the project and resources
Editorial team:M. Capeans (technical editor), G. Darbo,
K. Einsweiller, M. Elsing, T. Flick,M. Garcia-Sciveres, C. Gemme,H. Pernegger, O. Rohne and R. Vuillermet.
Approved by the ATLAS Collaboration Board (October 2010 ATLAS Week)
• 43 Institutions and 300 people in IBL
CERN-LHCC-2010-13, ATLAS TDR 19
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 20105
Physics PerformancePhysics Performance
b-tagging performance crucial for:• New Physics (3rd generation !)
• observation of H → bb through boosted WH production
Main conclusions of IBL performance Task Force: • performance at 2x1034 with IBL is equal to or better than
present ATLAS without pile-up
• w/o IBL and 10% B-layer inefficiency: b-tagging ~ 3 times worse at 2x1034 than today
b-tagging with pile-up & inefficiencies
b-tagging with pile-up 2 jets of 500 GeV event with 2 x 1034 pile-up Same event w/o pile-up
IBL
IBL
Physi
cs &
Perf
orm
ance
Task
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IBL @ October RRBG. Darbo & H. Pernegger RRB – October 20106
The New Front-end Chip (FE-I4)
The New Front-end Chip (FE-I4)
18
160
FE-I3(Pixel) FE-I4
(IBL)
80 columns
336 rows
19
mm
20.2 mm60 KGD / Wafer
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 20107
Sensor Technologies for IBLSensor Technologies for IBL
Planar sensors (3 producers)
• slim edge n-in-n & n-in-p
• require the lowest temperature and high bias voltage.
• have very well understood manufacturing sources, mechanical properties, relatively low cost, and high yield.
ATLAS Pixel FE-I3 diamond module
IBL FE-I4 diamond sensors
Thin n-in-p
Planar Sensor
3D Sensor
450 µm
n-in-n slim edge
IBL layout
3D column
11 µm
3D sensors (3 producers)
• Active edge, single/double side
• require the lowest bias voltage, intermediate operating temperature, and achieve the highest acceptance due to active edges.
• their manufacturability with high yield and good uniformity must be demonstrated.
Diamond sensors (2 producers)
• polycrystalline CVD (pCVD)
• require the least cooling and have similar bias voltage requirements to planar sensors.
• their manufacturability with high yield, moderate cost, and good uniformity must all be demonstrated.
Selection in summer 2011
Three candidate sensor technologies address the IBL requirements with different trade-offs:• Prototyping with FE-I4 – qualification with irradiation (5x1015 neq/cm2) and test beam – production yield
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 20108
SPARE SLIDESSPARE SLIDES
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 20109
History of IBL Project - Time Line
History of IBL Project - Time Line
1998: Pixel TDR • B-layer designed to be substituted every 3 years of nominal LHC (300 fb-1): due
to then available radiation hard sensor and electronic technologies.
2002: B-layer replacement • became part of ATLAS planning and was put into the M&O budget to RRB.
2008: B-layer taskforce• B-layer replacement cannot be done – Engineering changes to fulfil delayed on-
detector electronics (FE-I3, MCC) made it impossible even in a long shut down.
• Best (only viable) solution: “make a new smaller radius B-layer insertion using technology being developed for HL-LHC prototypes”. This became the IBL.
2009: ATLAS started IBL project:• February: endorsed IBL PL and TC
• April: IBL organization in place (Endorsed by the ATLAS EB)
2010: TDR and interim-MoU• TDR is under approval in ATLAS
• Interim-MoU is collecting last signatures.
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 201010
Interim-MoU - InstitutionsInterim-MoU - InstitutionsThere are 43 institutions in the IBL project
• Large interest for the sensor (22 Institutions)
• Full effort and funding requirements are covered
300 people have expressed their interest to contribute to the project
• many have already started to work.
• In most cases institutes contribute with money where also there is contribution with manpower.
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 201011
Management Board (MB)Management Board (MB)
Module WG(2 cordinators)
•FE-I4•Sensors•Bump-Bonding•Modules•Procurement & QC•Irradiation & Test Beam
Module WG(2 cordinators)
•FE-I4•Sensors•Bump-Bonding•Modules•Procurement & QC•Irradiation & Test Beam
Stave WG(1 Phys + 1
Eng.)
•Staves•Cooling Design & Stave TM•HDI (Flex Hybrid)•Internal services•Loaded stave•Procurement & QC
Stave WG(1 Phys + 1
Eng.)
•Staves•Cooling Design & Stave TM•HDI (Flex Hybrid)•Internal services•Loaded stave•Procurement & QC
Integration & Installation WG
(2 Eng.)•Stave Integration•Global Supports•BP procurement•Ext. services inst.•BP extraction•IBL+BP Installation•Cooling Plant
Integration & Installation WG
(2 Eng.)•Stave Integration•Global Supports•BP procurement•Ext. services inst.•BP extraction•IBL+BP Installation•Cooling Plant
Off-detector(1 Phys + 1 E.Eng.)
•BOC/ROD•Power chain & PP2•DCS & interlocks•Opto-link•Ext. serv .design/proc.•Procurement & QC•System Test
Off-detector(1 Phys + 1 E.Eng.)
•BOC/ROD•Power chain & PP2•DCS & interlocks•Opto-link•Ext. serv .design/proc.•Procurement & QC•System Test
IBL Management Board (MB)Membership:•IBL PL + IBL TC•2 cordinators from each WG•Plus “extra” members
IBL Management Board (MB)Membership:•IBL PL + IBL TC•2 cordinators from each WG•Plus “extra” members
MB ad-interim membership
IBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG (2 Physicists): F. Hügging & M. Garcia-Sciveres“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni“IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): F. Cadoux + R. Vuillermet“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux“Extra” members:IBL/Pixel “liaison”: Off-line SW: A. Andreazza, DAQ: P. Morettini, DCS: S. KerstenEx officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), IB Chair (C. Gößling)
IBL @ October RRBG. Darbo & H. Pernegger RRB – October 201012
FE-I4 TableFE-I4 Table
FE-I3 FE-I4Pixel size [µm2] 50x400 50x250
Pixel array 18x160 80x336
Chip size [mm2] 7.6x10.8 20.2x19.0
No. of transistors [millions] 3.5 87
Active fraction 74% 89%
Analog/digital current [µA/pix] 26 / 17 10 / 10
Digital current [µA/pix] 17 10
Analog/digital voltage [V] 1.6 / 2.0 1.5 / 1.2
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