ibl mou g. darbo – infn / genova 17 april 2010 o ibl mou contribution prepared for marzio’s talk...

IBL MoUG. Darbo – INFN / Genova 17 April 2010o

IBL MoUIBL MoU

Contribution prepared for Marzio’s talk at April RRB

G. Darbo - INFN / Genova

IBL MoUG. Darbo – INFN / Genova 17 April 20102

Material from Raphael/NealThe present 7m long section of the beam-pipe will be cut (flange too big to pass inside the existing pixel) and extracted in situ:

The new beam-pipe with the IBL will be inserted at its place.

ISTIBL Support Tube

Alignment wirers

PP1 Collar

IBL DetectorIBL Detector

IBL Staves

Sealing service ring

Iourii Gusakov

Existing B-layer

IBL (Staves)


Technical Status of the ProjectTechnical Status of the ProjectFE-I4 – New pixel front-end chip for IBL

• 20 x 19 mm2 real-estate, more that 70 M-transistors, largest HEP chip ever.

• 2 year design work for a team of ~15 engineers + several physicists from 5 laboratories.

• Three design reviews: 17/3/2008, 3-4/11/2009, 16/4/2010 - submission to IBM: 17/5/2010

Sensor prototypes for FE-I4 under processing – 3 technologies considered: Planar Sensors, 3D Sensors, Diamonds.

• Expected sensors bump-bonded to FE-I4 for next fall

IBL Layout finalised – 14 staves with 32 FE-I4 chip modules at R=3.2 cm

Stave baseline (following last December review’s recommendations)• Low density carbon foam (ρ = 0.2 g/cm3), thin wall titanium cooling pipe (d=2mm), CO2 cooling.

• Fitting and permanent cooling joints under prototyping.

• FEA analysis on going, thermal figure of merit measurement on samples

Mechanical design of the whole IBL detector• 3D model and FEA for the whole detector on going.

• Installation mock-up under construction in bld.180 at CERN.

• Internal electrical services, flex hybrid in prototype phase.

New ROD/BOC (off-detector readout).Modernized version of the Pixel VME ROD – more compact (x4 more channels/board) increased performance, large reduction of component count with state of the art FPGA technology.


Memorandum of Understanding

Memorandum of Understanding

IBL Memorandum of Understanding (MoU)

• Between The ATLAS COLLABORATION, and Funding Agency/Institution of the ATLAS Collaboration (for the ATLAS construction was between Institutes and CERN)

IBL MoU – Steps toward project shaping:• “IBL Kick-off” meeting (8/7/2009) – Institutes express their interest in the IBL

based on project WBS (Workpackage Breakdown Structure).

• Sharing of Resources (draft) discussed in the (interim) Institute Board (1/3/2010) – Contribution to the Cost presented to the National Contact Physicists in ATLAS (ATLAS NCP meeting – 25/2/2010).

IBL interim MoU• Ad Interim MoU until sensor technology is chosen (Planar Silicon / 3D Silicon /

Diamond) - Decision on sensor technology (early 2011) – Sensor R&D and IBL communities work in tight collaboration to finalise a design matching IBL specification.

• Consolidate interest of Institutes and availability of funds


Institutes and Contributions to IBL (Draft)

Institutes and Contributions to IBL (Draft)

Note: the numbers in the table "are not final, nor are the suggested financial contributions yet firm, but are meant for a common overall discussion.”

Technology options refer to supplementary costs that are sensor technology specific and will be known before the definite MoU takes effect.

So far, France, Italy and US have requested their shares to be moved from M&O to Project part.


BACKUP SLIDESBACKUP SLIDES


FE-I3 FE-I4FE-I3 FE-I4FE-I4 Collaboration:Bonn: D. Arutinov, M. Barbero, T. Hemperek, A. Kruth, M. Karagounis.CPPM: D. Fougeron, M. Menouni. Genova: R. Beccherle, G. Darbo.LBNL: S. Dube, D. Elledge, M. Garcia- Sciveres, D. Gnani, A. Mekkaoui.Nikhef: V. Gromov, R. Kluit, J.D. Schipper

The first version of full FE-I4 chip will be submitted by end of March 2010

~70 million transistors, 0.13 µm CMOS technology6 Cu and 2 Al routing layers.

7.6mm

8mm active

2.8mm

FE-I3 74%

20.2mm

active16.8mm

~2mm

~200μm

FE-I4 ~89%

Ch

art

ere

d r

eti

cu

le (

24 x

32)

IBM

reti

cu

le

~19 mm

FE-I3 FE-I4Pixel size [µm2] 50x400 50x250

Pixel array 18x160 80x336

Chip size [mm2] 7.6x10.8 20.2x19.0

Active fraction 74% 89%

Analog current [µA/pix] 26 10

Digital current [µA/pix] 17 10

Analog Voltage [V] 1.6 1.5

Digital Voltage [V] 2.0 1.2

Pseudo-LVDS out [Mb/s] 40 160


IBL LayoutIBL LayoutBeam-pipe reduction:• Inner R: 29 25 mm

Very tight clearance:• “Hermetic” to straight tracks

in Φ (1.8º overlap)

• No overlap in Z: minimize gap between sensor active area.

Layout parameters:• IBL envelope: 9 mm in R

• 14 staves.

• <R> = 33 mm.

• Z = 60 cm (active length).

• η = 2.5 coverage.


Institutes/Institutions in IBL (Draft)

Institutes/Institutions in IBL (Draft)


Annex 4: Tentative Contribution to IBL

Annex 4: Tentative Contribution to IBL

Note: the numbers in the table "are not final, nor are the suggested financial contributions yet firm, but are meant for a common overall discussion.”

Technology options refer to supplementary costs that are sensor technology specific and will be known before the definite MoU takes effect.

So far, France, Italy and US have requested their shares to be moved from M&O to Project part.


IBL Organisation StructureIBL Organisation Structure

Module WG(2 coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation

Module WG(2 coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation

Stave WG(1 Phys + 1

Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC

Stave WG(1 Phys + 1

Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC

IBL Integr.-Install.(2 Eng.)

•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC

IBL Integr.-Install.(2 Eng.)

•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC

Off-detector(1 Phys + 1 E.Eng.)•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test

Off-detector(1 Phys + 1 E.Eng.)•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test

IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members

IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members

MembershipIBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG (2 Physicists): F. Hügging & M. Garcia-Sciveres“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni“IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux“Extra” members:Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling)Offline “liaison” Pixel Off-line coordinator: A. AndreazzaTDR editor (temporary): K. Einsweiler

Whole project divided into 4 working groups• IBL Management Board has 10 members, plus

“extra” and ex-officio members.

• Frequent meetings (every ~14 days) in this phase of the project.

ibl mou g. darbo – infn / genova 17 april 2010 o ibl mou contribution prepared for marzio’s talk...

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