Slide 1

Communications G. Darbo INFN / Genova IBL MB#15, 5 October 2009 o Bump Bonding Selex / INFN Roma, October, 30 th 2009 G. Darbo - INFN / Genova Slide 2 Communications G. Darbo INFN / Genova IBL MB#15, 5 October 2009 2 Present ATLAS Pixel Detector ATLAS Pixel Module 1744 Modules x 16 FE-I3 chips 1468 Modules bumped by Alenia (now Selex) Slide 3 Communications G. Darbo INFN / Genova IBL MB#15, 5 October 2009 3 ATLAS Pixel Detector ATLAS Pixel Detector: 3 Barrel Layers + 3 forward and backward disks. 1744 modules with 16 chips (27904 FE-I3 chips) 1.7 m 2 of active area Slide 4 Communications G. Darbo INFN / Genova IBL MB#15, 5 October 2009 4 ATLAS Pixel Pictures Bi-stave with 26 modules Layer2 half shell Slide 5 Communications G. Darbo INFN / Genova IBL MB#15, 5 October 2009 5 ATLAS Upgrade Plans: IBL Add a new layer of Pixel inside the present three layers of the detector: 14 staves with 16 (or 32) double (single) chip modules. Prototype 2010, production 201112 FE-I4 chip: ~2x2 cm, 250x50 m pixel size 7.6mm 8mmactive 2.8mm FE-I3 74% active 16.8mm 20.2mm ~2mm ~200 m FE-I4 ~89% Chartered reticule (24 x 32) IBM reticule ~19 mm New FE-I4 Pixel size = 250 x 50 m 2 Pixels = 80 x 336 Technology = 0.13m Power = 0.5 W/cm 2 FE-I3 Slide 6 Communications G. Darbo INFN / Genova IBL MB#15, 5 October 2009 6 ATLAS sLHC Upgrade For sLHC ATLAS foresee a complete replacement of the inner detector: Replace the Pixel with a 4 or 5 pixel layers: 2 or 3 times the surface Technology Looking at is hybrid pixel detector (FE, sensor, bump-bonding) Large area requires reduce cost Single, double or 2x2 front-end modules Reduce material, make thin FE chip Time scale: Prototyping 20102012 Production: 20132014 (15) Slide 7 Communications G. Darbo INFN / Genova IBL MB#15, 5 October 2009 7 Assemblies Two options: module with two FE-I4 (2x4 cm 2 ) for planar sensors or with single FE-I4 (2x2cm 2 ) for 3D sensors FE-I4 thickness: