3d sensor processing - ibl g. darbo – infn / genova venezia, 4 june 2009 o ibl per marzio g. darbo...

3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 2009o

IBL per MarzioIBL per Marzio

G. Darbo - INFN / Genova

Agenda page:

3D Sensor Processing - IBL G. Darbo – INFN / Genova Venezia, 4 June 20092

IBL OrganizationIBL OrganizationThe IBL (Insertable B-Layer) is an ATLAS Upgrade project:

• It will deliver a fourth pixel layer, including a new beam-pipe, to the Inner Detector

• When delivered, it will become a part of the Pixel Detector and of the Inner Detector and the organization will be “absorbed” into the Pixel & ID

Module WG

Module WG

IBL MB(Management Board)

IBL MB(Management Board)

StaveWG

StaveWG

I&IWGI&IWG

Off-detWG

Off-detWG

IBL IB(Institute Board)

IBL IB(Institute Board)

Pixel Institutesin IBL

Pixel Institutesin IBL

New Institute

sin IBL

New Institute

sin IBL

ATLASUPO ATLASUPO

ATLAS UPGRADE

IBL

IBL PLIBL TC


Management Board (MB)Management Board (MB)

Module WG(2

coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation

Module WG(2

coordinators)•FE-I4•Sensors•Bump-Bonding•Modules•Test & QC•Irradiation

Stave WG(1 Phys + 1

Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC

Stave WG(1 Phys + 1

Eng.)•Staves•Cooling Design & Stave Thermal Management•HDI•Internal Services•Loaded Stave•Test & QC

IBL Integr.-Install.(2 Eng.)

•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC

IBL Integr.-Install.(2 Eng.)

•Stave Integration•Global Sup.•Beam Pipe (BP)•Ext.services inst.•IBL+BP Installation•Cooling Plant•Test & QC

Off-detector(1 Phys + 1 E.Eng.)

•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test

Off-detector(1 Phys + 1 E.Eng.)

•Power•DCS•ROD•Opto-link•Ext.serv.design/proc.•Test Beam•System Test

IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members

IBL Management BoardMembership:•IBL PL + IBL TC•2 coordinators from each WG•Plus “extra” members

Ad-interim membershipIBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG (2 Physicists): F. Hügging & M. Garcia-Sciveres“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni“IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux“Extra” members:Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling)Offline “liaison” Pixel Off-line coordinator: A. AndreazzaTDR editor (temporary): K. Einsweiler


Ref: N. Hartman:•http://indico.cern.ch/conferenceDisplay.py?confId=43496

Single Stave LayoutsSingle Stave Layouts

Several layouts under study: 14 staves at Rmin=~3.2 cm

Turbine Inverted

Rail Space

Sensor


Ref: N. Hartman:•http://indico.cern.ch/conferenceDisplay.py?confId=43496

BiStave LayoutsBiStave LayoutsBiStave LayoutsBiStave Layouts

Biturbine Castellated

Sensor


Frontend Chip - FE-I4Frontend Chip - FE-I4FE-I4 Status

• Prototype blocks in MPW (MOSIS) submitted 3/2008, measurements, irradiation

• Design review (3/2009): “Design Technical Issues” on full scale design• FE-I4 Collaboration meeting 1/7/2009• Foreseen complete design review after Summer and submission later

this year.

7.6mm

8mm active

2.8mm

FE-I374%

active 16.8mm

20.2mm

~2mm

~200μm

FE-I4~89%

Chartered reticule (24 x 32)

IBM reticule

~19 mm

New FE-I4

Pixel size = 250 x 50 µm2

Pixels = 80 x 336Technology = 0.13µmPower = 0.5 W/cm2

FE-I3


FE-I4 Review & CollaborationFE-I4 Review & Collaboration

FE-I4 – “Design Technical Issue” Review March 2nd , 2009 - Review agenda page:http://indico.cern.ch/conferenceDisplay.py?confId=52403


Modules & Stave ArrangementModules & Stave ArrangementTwo module options:

• Single chip modules abut one against the next

• Small sensor type: like 3D, active edge

• Multi chip modules: chip look the same if using multi-chip modules

• As present sensor size (~2xFE-I4) : like planar n-on-n

• assuming no Z-shingling, no space.

W-bond pads


Requirements - FluenceRequirements - FluenceRequirements discussed in previous meetings

• New simulation of n fluences as input for the IBL design (see box)

• Other requirements are:• IBL design Peak Luminosity = 3x1034,

• Integrated Luminosity seen by IBL = 550 fb-1

€

Φ(r) =493

r2+

25

r

⎛

⎝ ⎜

⎞

⎠ ⎟×1014

• Fit made for 2 < r < 20 cm for L=1000fb-1

• Gives for IBL @ 3.7 cm (550 fb-1):

Φ1MeV=2.4x1015 (1.2 MGy)

• Safety factors not included in the computation (pp event generator: 30%, damage factor for 1 MeV fluences: 50%)Ref. Ian Dawson - AUW


Sensors - Time lineSensors - Time lineIBL project started now:

• TDR March 2010 – sensor option not decided before

FE-I4.v1 prototyping• FE-I4.v1 submitted (earliest) 15/10/2009 – Wafer back 31/4/2010

• FE-I4.v1 prototype modules and testing – second half 2010

Sensor decision on FE-I3 and FE-I4.v1 prototypes• End of 2010

Sensor production and testing• 8 months production assumed. Testing could last 4 months after end

production.

• Production starts beginning 2011.


How Many 3D Sensor WafersHow Many 3D Sensor WafersFor IBL we need:

• 14 staves (+6 spares)

• 32 FE-I4 (3D sensors)

• Total need = 640 single FE-I4 tiles = 54 Wafer

• If we consider yields:

• Sensor (0.5)

• Bump Bonding

• Module

• ~ 150÷200 wafer for whole IBL

4” Wafer – Fits 12 FE-I4


Beam-pipe - LayoutBeam-pipe - LayoutBeam-pipe radius can be reduced by at least 4mm

• On-site survey has shown that cavern floor is stable (~1mm respect 9.8mm foreseen)

• See LEB (LHC Experimental Beam-pipes) WG – 5/3/2009:http://indico.cern.ch/conferenceDisplay.py?confId=53606

Smaller beam-pipe Layout options• Better physics performance obtained with “reverse turbine” layout -

sensor facing beam-pipe – cooling redundancy (two cooling pipes) for beam-pipe bake-out

1 mm


Material BudgetMaterial BudgetPhysics performance low material budget

• Strategy for reducing X0: carbon foam, carbon fiber (CF) cooling pipe, CO2 cooling,…

Omega 0.00165Carbon foam 0.00179Epoxy 0.00030Sensor 0.00434R/O chips 0.00382Flex 0.00144Cooling pipe (Al) 0.00266Cooling fluid (C3F8) 0.00133

General total 0.01730

Total structure 0.00640Structure+cool. Fluid0.00773

Omega 0.00165Carbon foam 0.00179Epoxy 0.00030Sensor 0.00434R/O chips 0.00382Flex 0.00144Cooling pipe (CF) 0.00083Cooling fluid 0.00133

General total 0.01550

Total structure 0.00457Structure + cool. Fluid0.00590

X0 - Ti cooling pipe option

X0 - CF cooling pipe option


Inner Tracker R&DInner Tracker R&DStatus – November 2008

Approved by Executive Board

EoI, Proposal presented to USG

Pixel

Strips

Inner Detector


Calorimeter, Muon & Other R&D

Calorimeter, Muon & Other R&D

Status – November 2008

Approved by Executive Board

EoI, Proposal presented to USG

Calorimeter

Muon

Trigger, Elec,

…

3d sensor processing - ibl g. darbo – infn / genova venezia, 4 june 2009 o ibl per marzio g. darbo...

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