recent activities in pixel upgrade g. darbo- infn / genova pixel plenary, 13 dec 2006 o upgrade...

Recent Activities in Pixel UpgradeG. Darbo- INFN / Genova Pixel Plenary, 13 Dec 2006o

Upgrade Activities in

ATLAS

Upgrade Activities in

ATLASG. Darbo - INFN / Genova

So we have now 3 layers, or 112 stave, or 1456 modules, or 23296 FE chips.... fully working!!!!!!!

Ref.: Claudia 15/12/2006

Recent Activities in Pixel UpgradeC. Darbo INFN / Genova Pixel Plenary, 13 Dec 20062

What NextWhat NextComplete the Installation & Commissioning of the Detector

Operate the Detector

Have great Discovery Physics

But also, …

Think how to and start R&D for the Upgrade

When? 2012 B-layer replacement 2016 ATLAS (Tracker) Upgrade for SLHC

What is going on… See next slides

What to do… Start to discuss today.


OutlineOutlineLiverpool Workshop Organization Layout & Simulation Module Integration Engineering Sensor & Electronics Services, Irradiation & Wrap Up

ATLAS Upgrade Organization

R&D 3D Sensors

Since many news comes from, or have been reported at, the Liverpool Meeting I will show some highlights from there.


Latest SLHC Machine Scenarios

Latest SLHC Machine Scenarios

Bunch spacing: 25.0 ns 50.0 ns

Rms bunch length: 7.55 cm 14.4 cm

Long. Profile: Gauss Flat

Luminous region: 2.5 cm 3.5 cm

Peak lumi: 15.5 1034 8.9 1034

Events crossing: 296 340

Lumi. Life time: 2.1 h 5.3 h

Effective lumi : 2.4 1034 2.3 1034

(10 h turn around)

Effective lumi: 3.6 1034 3.1 1034

(5 h turn around)

Note: shorter bunches seems to be an option not achievable because of beam pipe heating

25 ns small ß 50 ns long bunch


Technology Radius(mm) Pitch(m) Eff. Z pitch(mm) Thickness

b Pixel 50 50 0.2 3.5%1 Pixel 120 50 0.2 3.5%2 Pixel 180 50 0.4 3.5%3 Pixel 270 50 0.4 2.6%4 SS2d (uv) 380 80 2. 2.6%5 SS2d (uv) 490 80 2. 2.6%6 SS2d (uv) 600 80 2. 2.6%7 SS1d 750 80 90 2.6%8 SS1d 950 80 90 2.6%

Technology Radius(mm) Pitch(m) Eff. Z pitch(mm) Thickness

b1 Pixel 40 50 0.2 2.6%b2 Pixel 60 50 0.2 2.6%1 Pixel 120 50 0.4 3.5%2 Pixel 200 50 0.4 3.5%3 Pixel 280 50 0.4 3.5%4 SS2d (uv) 380 80 2. 2.6%5 SS2d (uv) 490 80 2. 2.6%6 SS2d (uv) 600 80 2. 2.6%7 SS1d 700 80 90 2.6%8 SS1d 950 80 90 2.6%

LayoutLayoutStrawman layout v.1 now has 4 Pixel Layers with a double B-layer option. Pixel Members in the Layout Advisory have been active in the last 2 months.

Two talks from Pixel at Liverpoo: Sasha - Lessons from b-tagging Performance of ATLAS Pixel Layout Vadim - Vertexing with Inner Detector

Message from Vadim’s talk: Vertexing is important for b-tagging and b-physics “Pixel” layout provides a ~3040% improvements in Z resolution, ~10-20%

improvements in R respect to strawman original layout (ver.0) Thinning of Pixel part of ID allows to increase significantly ID resolutions.

Strawman layouyt ver.1 Proposed Pixel Layout


4+3+2 (Pixel, SS, LS) - Strawman

4+3+2 (Pixel, SS, LS) - Strawman

Ref.: Abe Seiden / Layout Options


Module ConceptsModule ConceptsMaurice showed some concepts for future modules:

Expect larger chips;

Active edges seem like a key development;

No MCC

cables & cooling

robotically placed, fully tested 1-chip modules.Wire bond to stave after placement.

Pre-tested stave structure with integrated bus and integrated, burned-in power adapters

present module

Active edge sensors to abut 1-chip modules w/o acceptance holes

+ Module control chip = 1 single module

Electrically 3 modules. No module control chip.

Ref.: Maurice Garcia-Sciveres / Pixel Module Concepts


HMCFRP = High Module Carbon Reinforced Plastic (0,2÷0,3 mm)

Tubes made of a braided carbon (i.e. ‚stress free)hose (5÷10 W/mK) (0,1÷0,2) mm

Graphite Foam isotropic (180 W/mK)

Stave ConceptsStave ConceptsTwo Pixel Stave concepts (first time) presented: IVW, Milano, Wuppertal (see bottom left), LBNL (see bottom right)We should sit around a table to discuss and make an (unique) R&D proposal

~120-250 W/mK

~40-80 W/mK

Involute Lay-up (Ply Directions)

Fibers travel predominantly thru thickness rather than along laminate trajectory

Ref.: Peter Maeting / New Carbon Fiber… Ref.: Neal Hartman / Involute Laminates…


CoolingCoolingThermal Management Meeting on Wed 6 Dec reported at the Workshop

Evaporative is the only explored. Possible gas candidates: C3F8:

Used in existing system → experience, Low pressure.

C2F6: Similar, but allows to cover low temperatures.

CO2: Low temperatures. High pressure. Low mass flows. Experience in LHCb, AMS, industry.

For environmental reasons we may be obliged to go to CO2 (C3F8 is 10000 times more effective than CO2 on Greenhouse effect)

0

2

4

6

8

10

12

-60 -40 -20 0 20 40

T [°C]

p [bara]

-35

1.1 bara

7.6 bara

C3F8

0

5

10

15

20

25

30

35

-60 -30 0 30

T [°C]

p [bara]

C2F6

-35 15

6.5 bara

27.1 bara

Critical point

0

10

20

30

40

50

60

70

80

-60 -40 -20 0 20 40

T [°C]

p [bara]

Freezing

Critical point

5.5 bara

12.0 bara

57.3 bara

-35

CO2

Ref.: Georg Viehhauser & Greg Halwell / Summary of Thermal Management ….


Electronics IssuesElectronics IssuesKevin reported on the activities at LBL (Abder Mekkaoui) on the design of the input amplifier. 3 designs: “new fixed shaping”, “new ToT” and “optimised old ToT” designs. Submission foreseen Feb ‘07.He also reported some thinking on Control Circuitry, FE and Global (MCC) R/O architectures

Philippe Farthouat reported on 130 nm electronics plans, on the proposal of a Common R/O Architecture (MCC) for Pixel and Strips, GB opto links.

There will be a common workshop ATLAS-CMS devoted to electronics 19-21 March 2007 at CERN Announcement and program before Xmas

Introduction - Machine, ATLAS plans, CMS plans Power systems, opto-links, services Tracker read-out architectures

On-going R&DTriggering with trackers

Calorimeters, muons, trigger/DAQ Identify/plan potential common building blocks


3D Sensors3D SensorsFor latest 3D Sensor results see Cinzia talk at the last ID week (25/9/2006):

http://indico.cern.ch/conferenceDisplay.py?confId=a0626#1

Many new Labs & Production Facility joined the 3D ATLAS R&D Collaboration

STANFORD SINTEF IRSTCNM/

GLASGOW

HAWAIIBONNBRUNEL/MANCHESTERLBNLNEW MEXICOOSLOPRAHAGENOVAFREIBURG

Common organisationFor bump-bondingAssemblyIrradiation

CERN TEST BEAM

Bump-Bonding: IZM, AMS, Stanford

Testing facilities

Processing

Ref.: Cinzia Da Vià / 3D Status & Summary


3D Sensors - Schedule3D Sensors - Schedule3D Sensor Meeting in Liverpool - 6 Dec. ‘06 Very successful, large attendance.

Aggressive R&D Workplan (to target also b-layer replacement) Phase 1: Jan ‘07 - Dec ‘07

ATLAS Pixel compatible 3D sensors from vendors, test beam, irradiation, data analysis, status report and risl evaluation

Phase 2: Jan ‘08 - Oct ‘08Implementation of R&D studies, test structures compatible wit new FE design

Pre-production phase: Dec ‘08 - Set ‘09Design of new masks for pre-production tests, evaluation of modules with new FE chips

Management: Update R&D proposal with new workplan and interest from laboratories/vendors.

Bi-weekly phoneconference meetings + few per year general meetings.

Milestones

Other issues: Funding seems critical specially next year

Meeting Agenda & Talks: http://indico.cern.ch/conferenceDisplay.py?confId=9185


CMS Perspective for Tracker Upgrade

CMS Perspective for Tracker Upgrade

Pixel everywhere

Module R/O. Make a MCC like controller

Use in the Trigger

TRIGGER LAYER

Today TBM R/O Scheme Future MCC like scheme

Ref.: Tilman Rohe / CMS Tracker Upgrade


R&D ActivitiesR&D ActivitiesDoc no. Title Principle contact Short name Institutes EDMS Page

ATL-P-MN-0001Template for R&D proposals for ATLAS upgrades

Stefan Tapprogge Template https://edms.cern.ch/document/694044/1.00

ATL-P-MN-0002Radiation Test Programme for the ATLAS Opto-Electronic Readout System for the SLHC for ATLAS upgrades

Cigdem Issever Opto Taiwan, Ljubljana, Ohio, Oklahoma, Oxford, SMU

https://edms.cern.ch/document/694105/1.05

ATL-P-MN-0003Development and Integration of Modular Assemblies with Reduced Services for the ATLAS Silicon Strip Tracking Layers

C. Haber, M. Gilchriese Staves BNL, Hampton, Santa Cruz LBNL, New York, Milano

https://edms.cern.ch/document/713247/1

ATL-P-MN-0004

Proposal to develop ABC-Next, a readout ASIC for the S-ATLAS Silicon Tracker Module Design

Francis Anghinolfi, Wladek Dabrowski

ABC-Next Cambridgs, CERN, Geneva, Glasgow, Krakow, KEK, Liverpool, London, Ljubljana, Santa Cruz, Valencia


ATL-P-MN-0005Radiation background benchmarking at the LHC and simulations for an ATLAS upgrade at the SLHC

Ian Dawson Radiation BG Sheffield, Arizona, Ljubljana https://edms.cern.ch/document/735306/1

ATL-P-MN-0006

Development of non-inverting Silicon strip detectors for the ATLAS ID upgrade

Hartmut Sadrozinski n-on-p sensors KEK, Tsukuba, Liverpool, Glasgow, Lancaster, Sheffield, Cambridge, London, Freiburg, MPI, Ljubljana, Prague, Barcelona, Valencia, Santa Cruz, BNL


ATL-P-MN-0008Evaluation of Silicon-Germanium (SiGe) Bipolar Technologies for Use in an Upgraded ATLAS Detector

Alex Grillo, S. Rescia SiGe chips https://edms.cern.ch/document/757354/1

ATL-P-MN-0009

Development, Testing, and Industrialization of 3D Active-Edge Silicon Radiation Sensors with Extreme Radiation Hardness: Results, Plans

Sherwood Parker 3D sensors https://edms.cern.ch/document/760768/1

ATL-P-MN-0010Research towards the Module and Services Structure Design for the ATLAS Inner Tracker at the Super LHC

Nobu Unno Modules KEK, Geneva, Freiburg, Melbourne


ATL-P-MN-0011

Future ATLAS tracker Thermal Management Research Programme

Georg Viehhauser Thermal Management

BNL, CERN, Genova, Glasgow, KEK, LBNL, Liverpool, Marseille, NIKHEF, Oxford, Prague, QMUL, RAL, Sheffield

https://edms.cern.ch/document/781387/3.0

ATL-P-MN-0012Read-out Electronics for the ATLAS upgraded tracker

Philippe Farthouat, Alexander Grillo

R/O Architectures


ATL-P-MN-0013Research and Development of power distribution schemes for the ATLAS Silicon Tracker Upgrade

Marc Weber Powering BNL, Bonn, CERN, Krakow, LBNL, RAL, Yale


ATL-P-MN-0014R&D of segmented straw tracker detector for the ATLAS Inner Detector Upgrade

Vladimir Peshekhonov TRT JINR, Lebedev, Warsaw https://edms.cern.ch/document/788881/1

ATL-P-MN- H. van der Graaf Gossip


ATLAS Upgrade OrganizationATLAS Upgrade Organization

Executive Bodies

Advisory Role

Reports to

Major Discussions

Discussions

EB

USGN. Hessey

TC

UPOD. Lissauer

Review BodyM. Tyndel

Layout Advisory Committee

Layout GroupR&D

R&DR&D

Working Groups

Ref.: Nigel Hessey / Steering Group Report


MembershipNigel Hessey (Coordinator)

Giovanni Darbo (Inner Detector)

Ian Dawson (radiation and shielding)

Philippe Farthouat (electronics)

Fabiola Gianotti (ex-officio)

Per Grafstrom (machine interface)

Vincent Hedberg (radiation and shielding)

Peter Jenni (ex-officio)

Tatsuo Kawamoto (muons)

Francesco Lanni (LAr calorimeter)

David Lissauer (technical coordination)

Marzio Nessi (ex-officio)

Sandro Palestini (muons)

Ilya Korolkov (TileCal)

Giacomo Polesello (physics)

Steinar Stapnes (ex-officio)

Abe Seiden (Inner Detector)

Stefan Tapprogge (TDAQ)

Jeff Tseng (software coordinator)

Christian Zeitnitz (LAr calorimeter)

Upgrade Steering Group (USG)Upgrade Steering Group (USG)Tasks... Executive/Policy body: Sets policy Follows cost overview Monitors resources and task sharing Takes major decisions (or forwards to EB) Acts as interface to ATLAS Systems and

Machine Sets the overall schedule (in consultation with

CMS, machine, ATLAS management) Requests PO

Make detailed schedule Follow progress (Review Office) Estimate resources needed Make recommendations on choices

Membership: To represent the ATLAS Systems and

management + Machine Interface, Electronics, Software, Physics, TC



Project Office (PO) Composition

Project Office (PO) Composition

ATLAS Management (Ex-officio) S. Stapnes, F. Gianotti, P Jenni

ATLAS Management and TC: M. Nessi

Steering Group Chair: N. Hessey

POL: : D. Lissauer

PO Deputy/Reviews : M. Tyndel

Electronics Coordinator: P. Farthouat ( 2-3 Electronics and DAQ)

Radiation and Shielding: V. Hedberg (Acting)

Machine Interface : P. Grafstrom

Cooling : G. Viehhauser

Sensors : N. Unno

Integration/Installation : H. Pernegger (Starting early next year)

Module Integration : P. Allport

Mechanical Structures : (Under discussions, see next slide)

LAr : F. Lanni (Acting)

Trigger : S. Tapprogge

B-Layer Upgrade: G. Darbo

Additional persons invited for special discussions.

Some permanent members still missing. (Tile, Muons, Trigger)

Note (GD): Pixel is poorly representedRef.: David Lissauer / Project Office Review


Project Office (PO) organization

Project Office (PO) organization

The Organization of the ATLAS Upgrade is given in: https://edms.cern.ch/file/690177/1/Upgrade_Org_PO.doc

Upgrade web page:

http://atlas.web.cern.ch/Atlas/GROUPS/UPGRADES/

The project office is part of TCn. The PO reports to TC/TMB and the Upgrade Steering Group. (EB when needed)

The ATLAS management/Upgrade Steering Group will define the concept of R&D resources , deliverables, Upgrade common funds etc. in the overall ATLAS concept.

The ATLAS resource coordinator, TC and ATLAS Spokesperson (s) with the Upgrade PO will develop the MOU for the deliverables of the Upgrade.

PO composed of a small core helps coordinate the effort relying on existing TC staff and functions. (i.e. No duplications)

A large fraction expected to come from the from major (outside) labs and universities.

Ref.: David Lissauer / Project Office Review


Mechanical Structure / Engineering

Mechanical Structure / Engineering

Partial list of potential Engineering effort: (NOT FINAL – NO Firm commitments yet – but expression of interest

expect that additional Eng. groups will be in contact in the coming month)

CERN: Andrea Catinaccio BNL : Mechanical Structure Anatoli Gordeev / Margareta RehakLBNL: Stave Design Bill MillerRAL: Justin Greenhalgh /Andy NicholsGENEVA: Barrel Structure Erik Perin KEK: Barrel/Module integration TakashiNIKEHF: End Cap Patrick WernekeValencia: End Cap Jose Vicente Civera LBNL: b-layer/Pixel E. Anderson, N. HartmanMilano: b-layer/Pixel D. Giugni

Regular Engineering meetings will start only after the EC - ID installation

Ref.: David Lissauer / Project Office Review


ID LayoutID LayoutLayout Advisory Committee has been set up

Tasks: Develop list of performance goals, "Straw

man" layout with list of options, and evolve it to "Baseline layout"

Advise USG and PO on layout matters Membership

Sasha and Norbert added to the initial Pixel membership

Layout Group Anyone working on layout matters Simulation etc.

Developed a document on performance goals, definition of straw man, and options

Straw-man is now 4 pixel layers, 3 SS (Stereo) layers, 2 LS layers

Option: double b-layer

Advisory Committee:Phil AllportAllan ClarkMogens Dam Giovanni DarboJuan Fuster VerduMauricio Garcia-Sciveres Nigel HesseyDavid LissauerMarzio Nessi Pavel NevskiRichard Nisius Ulrich Parzefall Leonardo RossiSteinar Stapnes Jeffrey Tseng Mike Tyndel Yoshinobu UnnoDirk Zerwas Alexander RozanovAbe SeidenNorbert Wermes



ConclusionsConclusionsPixel community is becoming active in Upgrade (better represented in the Committee) and at the Liverpool workshop3D Sensors - Lot of interest a groups joining - real ATLAS R&DNew ideas coming for FE Chips, Modules and Stave designs.Who will drive the Upgrade and Replacement of B-layer: Pixel Collaboration or PO?

2005 Genova 2006 Liverpool 2007 ???

recent activities in pixel upgrade g. darbo- infn / genova pixel plenary, 13 dec 2006 o upgrade...

Documents