intel corporation's intel corporation s high density data center an
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Intel Corporation’sIntel Corporation sHigh Density Data Center
An Operational ReviewPaul Vaccaro / Intel – Data Center Architect
David Seger / IDC Architects – Principal Mechanical Technologist
Legal NoticesThis presentation is for informational purposes only. INTEL MAKE NO WARRANTIES, EXPRESS OR IMPLIED, IN THIS SUMMARY.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries. Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2013, Intel Corporation. All rights reserved.
JFS1 High Density Data Center
HPC for Silicon DesignGl b l D i C i E iGlobal Design Computing Environment
User System
CCC Systems
User System
CCC Systems
Batch cycles from Hub
Interactive
Interactive & Batch Compute Cycles
from Hub
Latency/Bandwidth
Medium Site Datacenter
Interactive Compute Servers
Large Memory Compute Servers
Storage & BackupI f t t
Interactive Compute Servers Large Memory
Compute Servers (Interactive)
Interactive
User SystemCCC Systems
Batch Compute Servers
Infrastructure Servers
Storage & Backup
& BackupInfrastructure Servers
Batch cycles from Hub
Interactive
Latency/Bandwidth Small Site
ClosetLarge Site Datacenter (Hub) Infrastructure
Servers
Storage (Backup)
Closet
HPC for Silicon DesignIntel Design Computing Capacity
Silicon Design Compute and Storage Demand vs. Utilization
Growth of Design 2006 2012
EDA-MIPS 75,392 533,554
i C S 62 13 38 92Compute Servers (K)
EDA MPS (10K)
Storage (PB)
Linux Compute Servers 62,137 38,927
Number of Cores 132,282 451,990
Compute BatchUtilization ~58% ~86%Utilization
This is growth specific to Intel silicon design engineering environment and does not include
overall corporate IT demand.
Data Center Compute Dashboard
Site and Facility Configuration
Generators
Office
Module CG
ener
ators
Module D
Module E
Module A
Module B
Office
Circulation Spine
Chilled Water Storage TanksAB
Low Temp Chiller Plant
High-Temp Chiller Plant
Chilled Water Plant
Waterside Economizer
CoolingTower
HeatExchanger
Chiller Condenser
CondenserWater Pump Chiller
Chiller Evaporator
ChilledWater Pump
FromData Center
ToData Center
Water Pump
Chilled Water Plant Economization
1 600 000
1,800,000
2,000,000
1,000,000
1,200,000
1,400,000
1,600,000
‐Hou
rs
400,000
600,000
800,000
, ,
Ton‐
‐
200,000
7977757371696765636159575553514947454341393735333129272523
Outside Air Wetbulb (Deg F)
Mechanical Cooling Economizer Cooling(6,415,500 Ton-Hours) (14,608,500 Ton-Hours)
Data Center Modules
Recirculation Air Handlers
Cooling Coils & Filtration
Electrical Distribution
Air Pathway to IT space
Hot Aisle Isolation
Hot AisleCold Aisle
Non-Isolated Low Power IT
Airflow Model – White Space>100 Temperature (deg F)
91.25
82.5
Network Racks
73.75
<65
Airflow Model – Utility Level>600 Speed (ft/min)
450
300
150
<0
Temperature & Pressure Control Zones
Cascading Energy Efficiency
Hot aisle containment
Increased supply air temperature
Hi h hill d High temperature chilled water system
Variable speed infrastructure fans
Infrastructure fan output tracks IT airflow demand
Water side economizer
Variable speed chilled water pumps
Variable speed cooling tower fans
Adiabatic humidification
Energy Efficiency - PUE*Operational PUE Range*
1.35 without economizer
1 21 With 100% Free Cooling 5,114 kW
6,217 kW
IT Load
Total Load
Current PUE*
1.21 With 100% Free Cooling* Calculated
5,114 kW
1,103 kW
1 22
IT Load
Facility Load
Current PUEJFS1 1.22
0.812
Current PUE
Current DCIE
1.25
1.50
1.75
2 002.001.00
* April 12, 2013Source: US Energy Information Administration, http://www.eia.gov/consumption/commercial/census-maps.cfm
JFS1 Power Demand Forecast14
10
12
14
8
10
Customer Load Projections
75% of Customer Projections
and (
MW
)
4
6 50% of Customer Projections
PGE Demand Requirements
Actual Load Peak values TOTAL
Dem
a
0
2
-05
-07
-09
-11
Dec
-
Dec
-
Dec
-
Dec
-
Paul VaccaroData Center ArchitectIntel
David Seger, PE, LEED APPrincipal Mechanical TechnologistIDC Architects / CH2M HillIDC Architects / CH2M Hill
503.872.4492
Thank YouThank You
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