phill mai, jem america corp. (presenter) shin …swtw 2002 probing for the 21st century memoryfine...

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Probing for the 21st centurySWTW 2002

Phill Mai, JEM America Corp. (Presenter)Shin Kozaki, JEM JapanTeru Sakata, JEM JapanKaz Okubo, JEM America Corp.

Probing for the 21st centurySWTW 2002

Roadmap HAWK Concept Electrical and Mechanical Data Maintenance Specifications Summary

Probing for the 21st centurySWTW 2002

Memory Fine Pitch

Area Array

HF 1-10 GHz

Para-metric

Wafer- level

burn-in

Epoxy

VSCC

HAWK

VCPC

Coax Probe

Probing for the 21st centurySWTW 2002

50

70

90

110

130

150

2001 2002 2003 2004

Year

Pitc

h (

m)

VCPC (64 Die)

Epoxy (32 Die)

HAWK (128 Die)

Probing for the 21st centurySWTW 2002

Smaller pitch Lower probe force Individually-replaceable probes Improved DUT layout flexibility Fewer cleanings Higher bandwidth

Probing for the 21st centurySWTW 2002

Probing for the 21st centurySWTW 2002

PCBTop Stiffener

Guide Plate Bottom StiffenerSpace Transformer

Planarization Spring

Probe

Probing for the 21st centurySWTW 2002

10 um

Probing for the 21st centurySWTW 2002

Release

Over Drive

Probing for the 21st centurySWTW 2002

0

1

2

3

4

OD25 OD50 OD75

Overdrive (µm)

Prob

e Fo

rce

(gf)

MaxMinAvg

Probing for the 21st centurySWTW 2002

22

10

28

11

50 µm OD 70 µm OD

Probing for the 21st centurySWTW 2002

-20

-15

-10

-5

0

5

10

15

20

-20 -15 -10 -5 0 5 10 15 20X-Deviation (µm)

Y-D

evia

tion

( µm

) 1K300K

TEST CONDITIONS

Temp : 100oCOD : 70 umLoad : 50mA; 10 msPad : Al-Cu

Probing for the 21st centurySWTW 2002

-30-20-10

0102030

0 25 50 75 100Pin No.

Plan

arity

(µm

) INT300K TEST CONDITIONS

Temp : 100oCOD : 70 umLoad : 50mA; 10 msPad : Al-Cu

Probing for the 21st centurySWTW 2002

0

5

10

15

0 20 40 60 80 100

Overdrive (µm)

CR

ES ( Ω

) TEST CONDITIONS

Temp : 100oCOD : 10 - 80 umLoad : 50mA; 10 msPad : Al-Cu

max

avg.

min

Probing for the 21st centurySWTW 2002

0

2

4

6

8

10

0 2000 4000 6000 8000 10000

Touchdowns

CR

ES

)

MAXMINAVG

TEST CONDITIONS

Temp. : 90 °COD : 60 umLoad : 50mA; 10 msPad : Al-CuNo cleaning

Probing for the 21st centurySWTW 2002

0

1

23

4

5

6

78

9

10

1 2500 5000 2500 5000 2500 5000 2500 5000 2500 5000

Touchdowns

CR

ES

)

Cleaning

Probing for the 21st centurySWTW 2002

5K TD Clean 5K TD70µm OD / 85 °C / Al-Cu

Clean 5K TD Clean 5K TD Clean

Probing for the 21st centurySWTW 2002

INT 500TD 1000TD 5000TD

One cycle of 10 touchdowns on the cleaning sheet is repeated 500 times.

==> Probe tip wear is relatively little.

Probing for the 21st centurySWTW 2002

Minimum Pitch : 80 µm

Probe Force : 2.8 gf @ 70 µm OD

Max. Scrub Mark : 30 µm

Alignment : ±10 µm

Planarity : ±10 µm

Tip Shape : Flat-top pyramid

Tip Size : 10±5 µm

Tip to Guide Plate : 750 µm

Max. Current : 250 mA (continuous)

Probing for the 21st centurySWTW 2002

New solution for highly-parallel memory.

Fine pitch.

Easy to repair.

Uniform probe shape.

In use at multiple production sites.

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