quarterly technical report iii for pittsburgh digital greenhouse

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Quarterly Technical Report III for Pittsburgh Digital Greenhouse. High Speed CMOS A/D Converter Circuit for Radio Frequency Signal. Kyusun Choi. Computer Science and Engineering Department. The Pennsylvania State University. Project Goals for This Quarter. - PowerPoint PPT Presentation

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1

Quarterly Technical Report IIIfor

Pittsburgh Digital Greenhouse

Kyusun Choi

The Pennsylvania State UniversityComputer Science and Engineering Department

High Speed CMOS A/D Converter Circuitfor Radio Frequency Signal

2

Project Goals for This Quarter

Design and Fab 2nd Prototype chip

1. Design 6 and 8 bit TIQ ADC Circuits

2. Design 6 and 8 bit ADC Layouts

3. Design 2nd Prototype Chip

4. Fabricate 2nd Prototype Chip

3

Accomplished Project Milestones

1. Total 10 ADCs are designed (0.18um)• 6bit ADC with L=0.18um and ROM Decoder• 6bit ADC with L=0.50um and ROM Decoder• 6bit ADC with L=1.00um and ROM Decoder• 6bit ADC with L=1.00um and FAT Decoder• 6bit ADC with L=1.00um and Pipeline, ROM• 6bit ADC with L=1.00um and S&H, ROM• 8bit ADC with L=0.50um and ROM Decoder• 8bit ADC with L=1.00um and ROM Decoder• 9bit ADC with L=1.00um and ROM Decoder• 9bit ADC with L=1.50um and ROM Decoder

4

Accomplished Project Milestones

2. Layout Design for 10 ADCs, Complete

3. 2nd Prototype Chip Design, Complete

4. Chip Fabrication, Submitted:• Submission date: 10/8/2001• Vendor: MOSIS with TSMC 0.18 m foundry• Expected delivery date: December 2001

5

2nd Prototype Chip Summary

1. Die Size: 2.64mm X 2.64mm

2. 0.18um Digital CMOS Process

3. Total 56,069 Transistors

4. 84 Pins, 18 Power pins

6

Chip Layout

7

Chip Block Diagram

8

Chip Layout Dimension

ADCs Size (W*H) um Area (mm2)

6bit 0.18um ROM 188.840 * 194.700 0.0368

6bit 0.50um ROM 188.980 * 239.500 0.0453

6bit 1.00um ROM 255.020 * 290.700 0.0742

6bit 1.00um FAT 251.850 * 272.300 0.0686

6bit 1.00um Pipe 294.530 * 290.710 0.0857

6bit 1.00um S/H 251.850 * 316.490 0.0798

8bit 0.50um ROM 202.250 * 815.550 0.1650

8bit 1.00um ROM 266.400 * 1019.780 0.2717

9bit 1.00um ROM 438.660 * 1225.100 0.5375

9bit 1.50um ROM 375.630 * 1583.500 0.5949

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Layout : 6bit, L=0.18um, ROM

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Layout : 6bit, L=1.00um, FAT

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Layout : 8bit L=0.5 um & 9bit, L=1.00um

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Block Diagram : 6bit ADCs

ADCs

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Block Diagram : 8bit ADCs

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Block Diagram : 6bit, Pipe & S/H

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Block Diagram : Pads

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Simulation: Speed and Power

1. Maximum Speed• Designed with TSMC_TT parameter• With linear step from 0.5V to 1.1V• Other processes

- MOSIS parameters (5)- TSMC parameters (4)

2. Power• Analog• Digital

17

Simulation Results

ADCs

Max. speed

(MSPS)

Max.Speed

(process)

Analog Power

(mW)

6bit 0.18um ROM 2000 1250 149.198

6bit 0.50um ROM 1667 1000 62.03

6bit 1.00um ROM 1111 667 54.47

6bit 1.00um FAT 1111 714 36.41

8bit 0.50um ROM 2000 1000 181.12

8bit 1.00um ROM 1667 714 151.13

9bit 1.00um ROM 667 476 269.53

9bit 1.50um ROM 500 400 153.89

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Simulation Results

Worst-case delay

19

Simulation Results

Worst-case delay (input swing: 0 V to 1.8 V)• TSMC_TT (nSec)

ADCs t_comp t_gb t_rom t_out

6bit 0.18um ROM 0.084 0.358 0.893 1.030

6bit 0.50um ROM 0.237 0.521 1.200 1.320

6bit 1.00um ROM 0.540 0.837 2.170 2.330

6bit 1.00um FAT 0.540 0.784 1.670 1.690

8bit 0.50um ROM 0.240 0.525 0.935 1.040

8bit 1.00um ROM 0.538 0.836 1.940 2.070

9bit 1.00um ROM 0.549 0.932 2.610 2.780

9bit 1.50um ROM 0.984 1.380 2.900 3.030

20

Simulation Results

Worst-case delay (input swing: 0.5 V to 1.1 V)• TSMC_TT (nSec)

ADCs t_comp t_gb t_rom t_out

6bit 0.18um ROM 0.122 0.395 0.969 1.090

6bit 0.50um ROM 0.338 0.623 1.470 1.580

6bit 1.00um ROM 0.867 1.160 3.750 3.890

6bit 1.00um FAT 0.867 1.110 1.960 1.980

8bit 0.50um ROM 0.340 0.624 1.090 1.210

8bit 1.00um ROM 0.868 1.170 2.810 2.950

9bit 1.00um ROM 0.896 1.280 3.540 3.720

9bit 1.50um ROM 1.660 2.060 4.720 4.860

21

Simulation Results

DNL and INL• TSMC_TT: 8bit 0.50um

22

Simulation Results

DNL and INL (LSB)

ADCs TSMC_TT TSMC_FS

DNL INL DNL INL

6bit 0.18um 0.003 0.003 0.023 0.226

6bit 0.50um 0.005 0.007 0.082 0.271

6bit 1.00um 0.008 0.006 0.035 0.351

8bit 0.50um 0.090 0.076 0.209 1.119

8bit 1.00um 0.084 0.077 0.199 1.450

9bit 1.00um 0.150 0.104

23

Simulation Results

DNL and INL (LSB)

ADCs T12K_LO_EPI T16X_LO_EPI

DNL INL DNL INL

6bit 0.18um 0.032 0.177 0.056 0.729

6bit 0.50um 0.115 1.016 0.115 1.689

6bit 1.00um 0.156 1.313 0.150 1.813

8bit 0.50um 0.259 4.349 0.291 6.923

8bit 1.00um 0.257 5.461 0.241 7.500

9bit 1.00um 0.436 11.501 0.446 15.338

24

Simulation Summary

1. High-speed with 0.18 um• Approximately 50% higher speed than 0.25um• Process variation problems

2. Power consumption• Lower power consumption

3. Chip area• Higher circuit density

25

1. Report III• http://www.cse.psu.edu/~chip/pdg/report3.html• Slide : http://www.cse.psu.edu/~chip/pdg/p3.ppt

2. Report II• http://www.cse.psu.edu/~chip/pdg/report2.html• Slide : http://www.cse.psu.edu/~chip/pdg/p2.ppt

3. Report I• http://www.cse.psu.edu/~chip/pdg/rp1/report.html• Slide : http://www.cse.psu.edu/~chip/pdg/rp1/p1.ppt

URLs for The Reports

26

Publications

1. New Paper Accepted• “Design Method and Automation of Comparator

Generation for Flash A/D Converter”, ISQED 2002 (March)

2. Previous Paper Published• “A 1-GSPS CMOS Flash Analog-to-Digital

Converter for System-on-Chip Applications”, WVLSI 2001

• “Future-Ready Ultrafast 8bit CMOS ADC for System-on–Chip Applications”, 14th ASIC/SOC 2001

27

CONCLUSIONAccomplished Milestones:

• Total 10 ADCs Designed: 6 bit, 8 bit, and 9 bit ADCs

• 2nd Prototype Chip Design

• Chip Fabrication, Submitted• MOSIS 10/8/2001• 0.18 m Digital CMOS• Return: December 2001

• Speed Increased Over 1st Proto Chip

• More ADCs on 2nd Proto Chip

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