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An Overview of US Display An Overview of US Display Consortium Activity in Flexible Consortium Activity in Flexible
and Printed Electronicsand Printed Electronics
Mark HartneyMark HartneyCTO, USDCCTO, USDC
IMAPS SymposiumIMAPS SymposiumSan Jose, CASan Jose, CA
November 15, 2007November 15, 2007
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ABOUT USDCABOUT USDC
NonNon--profit, Chartered in 1993profit, Chartered in 1993Industry consortium focused on preIndustry consortium focused on pre--competitive competitive R&D for the flat panel display (FPD) and flexible R&D for the flat panel display (FPD) and flexible microelectronics industriesmicroelectronics industries110 companies form the USDC with federal support from 110 companies form the USDC with federal support from the U.S. Army Research Laboratory (ARL) the U.S. Army Research Laboratory (ARL)
Display developers and manufacturersEquipment, materials and component suppliersDisplay integrators
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USDC’s MISSIONThe The missionmission of the USDC is to support member of the USDC is to support member companies and affiliates to companies and affiliates to build a world class, build a world class, competitive, display industrycompetitive, display industry..
USDC accomplishes this mission by USDC accomplishes this mission by supporting presupporting pre--competitive R&Dcompetitive R&D for our member companies, providing for our member companies, providing timely market and technical information, and forming timely market and technical information, and forming user groups with common goals.user groups with common goals.
Programs are Programs are directed toward the supply chain:directed toward the supply chain:equipment, materials & manufacturing technologies.equipment, materials & manufacturing technologies.
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USDC TECHNICAL PROGRAM SCOPE
USDCUSDC’’s recent projects enhance manufacturing capability for:s recent projects enhance manufacturing capability for:Flexible substrate technologyFlexible substrate technology--tools tools Flexible substrate technologyFlexible substrate technology--materialsmaterialsOrganic light emitting diodes (OLEDs)Organic light emitting diodes (OLEDs)
All three tiers of industry are represented in consortium activiAll three tiers of industry are represented in consortium activitytydisplay usersdisplay usersdisplay manufacturers display manufacturers equipment, materials and components suppliersequipment, materials and components suppliers
Technical Program awards are costTechnical Program awards are cost--shared with the selected company shared with the selected company at a minimum of a 50/50 level at a minimum of a 50/50 level
Over $250M in development activity funded through this program tOver $250M in development activity funded through this program to o datedate
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ANNUAL EVENTS7th Annual Flexible
Microelectronics and Displays Conference Phoenix, AZ, January 21-24, 2008Objective:
Present the latest developments in technology and product applications Identifies technology gaps Constructs roadmaps, andProposes key technology development activities.
*NEW! 3-D Biz-ExSan Francisco, CA, September 18-19,2007Objective:
Address common industry needsPresent latest industry data (Insight Media)Latest innovations
Proceedings available from USDC
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41 Active R&D Projects - 62% Industry Cost Share
43%
40%
4%12% 1%
Specific Materials &Components / OLEDs
Flex Substrate Processing
Proj. & Microdisplay Tools& Components
Military User Group
Industry Data & Studies
USDC TECHNICAL PROGRAM SUMMARY
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R2R sputter sourceR2R sputter source$0.6M$0.6MCompleteCompleteKurt LeskerKurt Lesker
Organic passivation dielectricOrganic passivation dielectric$1.0M$1.0MUnderwayUnderwayHoneywellHoneywell
Linear area gate dielectric source & Linear area gate dielectric source & demonstrationdemonstration
$5.0M$5.0MCompleteCompleteSenceraSencera
Stainless Steel substrates for OLEDStainless Steel substrates for OLED$0.6M$0.6MCompleteCompleteECDECD
Flex substrate lamination adhesivesFlex substrate lamination adhesives$0.5M$0.5MUnderwayUnderwayNational National StarchStarch
Metallic powders for ink jetMetallic powders for ink jet$2.5M$2.5MUnderwayUnderwayCabotCabot
DescriptionCost*StatusCompany
$1.8M$1.8M
$0.7M$0.7M
HIL material develop & scaleHIL material develop & scale--upupCompleteCompleteDow Dow CorningCorning
HIL material develop & scaleHIL material develop & scale--upupCompleteCompletePlextronicsPlextronics
MATERIALS – SAMPLE OF USDC PROJECTS
FDC
FDC
FDC
CA
MM
FDC
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PROCESS – SAMPLE OF USDC PROJECTS
R2R Patterned conductive layersR2R Patterned conductive layers$1.0M$1.0MCompleteCompleteMicrocontinMicrocontinuumuum
R2R factory layout & cost modelR2R factory layout & cost model$0.2M$0.2MCompleteCompleteAbbie Abbie GreggGregg
DescriptionCost*StatusCompany
$1.7M$1.7M
$2.8M$2.8M
High Temp TFT on Clear PlasticHigh Temp TFT on Clear PlasticUnderwayUnderwayPrincetonPrinceton
SAIL process development SAIL process development UnderwayUnderwayHPHP
FDC
CA
MM
CA
MM
CA
MM
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METROLOGY –SAMPLE OF USDC
PROJECTS
R2R defect inspection toolR2R defect inspection tool$1.3M$1.3MUnderwayUnderwayECDECD
High Temperature WV Permeation High Temperature WV Permeation MeasurementMeasurement
$0.7M$0.7MCompleteCompleteGeneral General AtomicsAtomics
Demonstrate high sensitivity O2 Demonstrate high sensitivity O2 permeation measurement permeation measurement capabilitycapability
$0.3M$0.3MCompleteCompleteDukeDuke
DescriptionDescriptionCost*Cost*StatusStatusCompanyCompany
CA
MM
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Install USDC tool set at CAMMInstall USDC tool set at CAMM$3.8M$3.8MUnderwayUnderwayBinghamton Binghamton UniversityUniversity
Production scale, precision ink Production scale, precision ink jet printing system & materialsjet printing system & materials
$5.7M$5.7MCompleteCompleteLitrex,Spectra, Litrex,Spectra, AveciaAvecia
aa--Si Laser crystallizationSi Laser crystallization$3.8M$3.8MCompleteCompletePotomac Potomac PhotonicsPhotonics
Laser cutting toolLaser cutting tool$0.61$0.61CompleteCompleteApplied Applied PhotonicsPhotonics
Lithography aligner for webLithography aligner for web--based mfg. on plasticbased mfg. on plastic
$4.1M$4.1MUnderwayUnderwayAzoresAzores
Web coating platformWeb coating platform$6M$6MUnderwayUnderwayCHACHA
DescriptionCost*StatusCompany
EQUIPMENT – SAMPLE OF USDC PROJECTS
FDC
CA
MM
CA
MM
FDC
CA
MM
FDC
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Why RollWhy Roll--toto--Roll Manufacturing?Roll Manufacturing?
Supply Roll Take-Up Roll
Thin Film Deposition& Laser Processing Photolithography
Supply Roll Take-Up Roll
Wet ChemicalEtching & Cleaning
CoolingDrumLaser
R2R can lead to reductions in cost.R2R can enable new applications:
Inexpensive displaysLarge area displaysLow cost RFIDRemote sensors for military and commercial “Smart” fabricsLarge area lighting
Azores Photolithography
CHA High Vacuum Coater
Northfield R2R Handlers
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SelfSelf--Aligned Imprint LithographyAligned Imprint Lithography
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Princeton Princeton –– DuPont ProgramDuPont Program
•Higher Temperature Plastic Substrates
•Better transparency for visible spectrum
•Process optimization for a-Si TFTs
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Sigma Sigma -- NanoflakesNanoflakes
Novel approach to nanomaterials
Produces thin flakes of conductive material
Goal is to achieve high conductivity without losing optical transparency
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USDC Initiative onUSDC Initiative onFlexible, Large Area Electronics:Flexible, Large Area Electronics:
Transformational Technology Transformational Technology for Life Systemsfor Life Systems
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Flexible Large Area Electronics on the Flexible Large Area Electronics on the Human ScaleHuman Scale
The goal:The goal: produce high performance materials and devicesproduce high performance materials and devicesusing low cost manufacturing processesusing low cost manufacturing processes
MATERIALS
DEVICES
APPLICATIONS
Ubiquitous electronics on large sheets of plastic or other materials integrated into textiles, internal and external surfaces,
health care and consumer products
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Trends In Electronics SystemsTrends In Electronics Systems
Electronics products are Electronics products are becoming larger becoming larger –– no longer just no longer just ““micromicro”” or or ““nanonano””
Performance requirements Performance requirements (ruggedness, low(ruggedness, low--weight, power weight, power savings, shape) demand that savings, shape) demand that products be products be flexible and flexible and deformabledeformable
Transistors on plastictransparent substrate
(Penn State University)
Flexible solar cells on ultra-thin steel foil(Energy Conversion Devices)
Millions of transistors made on glass surface to control
display pixels
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Printed Electronics - TodayPrinted circuitryPrinted circuitry
ScreenScreenStencilStencil
Printed solder interconnectsPrinted solder interconnectsScreenScreenStencilStencilMicroMicro--dispensingdispensingJettingJetting
Microelectronics encapsulation Microelectronics encapsulation and flux dispensingand flux dispensing
MicroMicro--dispensingdispensingJettingJetting
Printed Flex Circuitry
Solder Interconnects
Encapsulation and Fluxing
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Intel 4044 ProcessorIntel 4044 Processor
Image courtesy: Intel website
• Introduced in Nov, 1971 • 2300 transistors• 10µm channel length• Composed of 5 layers• Four-bit microprocessor,
• Four-bit adder for doing additions• An accumulator for keeping track of partial sums• 16 registers for temporary storage
Image courtesy: Technologyevalngelist.com
Image courtesy: Intel website
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Circuit Performance Circuit Performance Semi Ink Mobility vs. Device FeaturesSemi Ink Mobility vs. Device Features
0.1
10
1000
10 5
10 7
10 9
10 -5 0.0001 0.001 0.01 0.1 1 10
Freq
uenc
y (H
z)
Mobility (cm2/V-s)
L= 50 um
L=100 um
L=10 um
L=1 um
FET Channel Dimensions
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Printed Electronics - TomorrowPrinted Energy Sources
Printed energy sourcesPrinted energy sourcesScreen Screen Flexo Flexo LithoLitho
Printed displaysPrinted displaysScreen Screen InkjetInkjetLaser induced forward Laser induced forward transfertransfer
Printed lightingPrinted lightingScreenScreen
Printed RFID antennaPrinted RFID antennaScreenScreenFlexoFlexoLithoLitho
Printed Lighting Printed RFID Antenna
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Convergence of Two WorldsConvergence of Two WorldsBirth of a New IndustryBirth of a New Industry
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Flexible Large Area Electronics on the Flexible Large Area Electronics on the Human ScaleHuman Scale
MaterialsNon-Crystalline MaterialsNanomaterialsFlexible substrates
Devices/Integration
MembranesSensors/DetectorsThin-film transistors
ProductsSmart Bandages & ClothingNeuro Prosthetic DevicesSensor Networks Solar Cells
ProcessesR2R Manufacturing Printing and PatterningPolymer/Organic Synthesis
MarketsMilitary/First RespondersMedicalAgriculture/Civil InfrastructureEnergy
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USDC Project SolicitationUSDC Project Solicitation2008 solicitation will be published this week 2008 solicitation will be published this week ––see our website www.see our website www.usdcusdc.org.org
White papers are due January 11, 2008White papers are due January 11, 2008Open on any topic, but specifies some topics of Open on any topic, but specifies some topics of interest to member companies, including:interest to member companies, including:
Web based multi-layer alignment tools and processing
• Web based coating and patterning technologies
• Non-lithographic patterning technology for roll to roll substrates
• In-line characterization tools
• Deposition and etch process for roll to roll.
• Flexible functional transparent films
• Stretchable Electronics Technologies
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Contact PointsContact Pointswww.www.usdcusdc.org.org
www.fpoelectronics.orgwww.fpoelectronics.org
Flexible Electronics and Display Conference,Flexible Electronics and Display Conference,Phoenix, AZPhoenix, AZ
Jan 21Jan 21--24, 200824, 2008