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Analysis of Airborne Molecular Contaminants (AMC) in the cleanroom for the semiconductor industry Christophe GALVEZ (Merck SA France)

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Page 1: Analysis of Airborne Molecular Contaminants (AMC) in … · Analysis of Airborne Molecular Contaminants (AMC) in the cleanroom for the semiconductor industry Christophe GALVEZ (Merck

Analysis of Airborne Molecular Contaminants (AMC) in the cleanroom for the semiconductor industryChristophe GALVEZ (Merck SA France)

Page 2: Analysis of Airborne Molecular Contaminants (AMC) in … · Analysis of Airborne Molecular Contaminants (AMC) in the cleanroom for the semiconductor industry Christophe GALVEZ (Merck

17/04/2002 © Merck Editor: AMC : Airborne Molecular Contaminants Page 2

Generality : NIOSH & OSHA

In the Unites States, the National Institute for Occupational Safety and Health (NIOSH)(NIOSH) and the

Occupational Safety and Health Administration (OSHA)(OSHA)offer, for many such substances, specific

recommendations on collecting (trapping) the contaminant.

Merck SA procedures are performed according to the NIOSH and OSHA methodologies.

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17/04/2002 © Merck Editor: AMC : Airborne Molecular Contaminants Page 3

Generality : SEMI F21-95 Standard

In response to this need, SEMI issued

SEMI F21SEMI F21--95 standard95 standard, “ Classification of Airborne Molecular Contaminant levels in Clean Environments”,

to classify clean environments with respect to 4 classes of molecular contaminants, including :

• Molecular Acids (MA)• Molecular Bases (MB)• Molecular Condensables (MC)• Molecular Dopants (MD)

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17/04/2002 © Merck Editor: AMC : Airborne Molecular Contaminants Page 4

Acids & Bases Condensables Dopants Metals

¤ Fab Corrosion ¤ Adhesion Failures ¤ Uncontrolled B, P doping ¤ Degradation of electrical

¤ Etch rate Shifts ¤ SiC formation (after preoxidation clean) ¤ Treshold Voltage Shifts

¤ Properties of Si substrate (E.g. : Carrier lifetime, Leakage currents)

¤ DUV Photoresist T-topping ¤ High contact resistance ¤ Resistivity Shifts ¤ High contact resistance

¤ Wafer and Optics Hazing ¤ Gate oxide integrity ¤ Nucleation irregularities ¤ Gate oxide integrity

¤ Metallization Corrosion ¤ Ineffective cleaning ¤ HEPA filter degradation or outgassing of B & P ¤ Treshold voltage shifts

AMC related Process issues

Page 5: Analysis of Airborne Molecular Contaminants (AMC) in … · Analysis of Airborne Molecular Contaminants (AMC) in the cleanroom for the semiconductor industry Christophe GALVEZ (Merck

17/04/2002 © Merck Editor: AMC : Airborne Molecular Contaminants Page 5

Sampling Methodology : 2 possibilities !!!

•• Airborne SamplingAirborne Sampling : Sampling of cleanroom air is conducted over 8-24 hours period using sampling systems

that have proven efficient for capturing acids, bases, dopants, salts, trace metals and organics.

•• Witness WaferWitness Wafer : Contaminants of cleanroom air is collected by a witness wafer exposed about 7 days period

for capturing acids, bases, dopants, salts and trace metals.

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17/04/2002 © Merck Editor: AMC : Airborne Molecular Contaminants Page 6

Sampling Pump System

Choice of the sampling pump system :

Connection

SUPELCOSUPELCOQ Q -- Max pump Max pump

Indicator

Control

Page 7: Analysis of Airborne Molecular Contaminants (AMC) in … · Analysis of Airborne Molecular Contaminants (AMC) in the cleanroom for the semiconductor industry Christophe GALVEZ (Merck

17/04/2002 © Merck Editor: AMC : Airborne Molecular Contaminants Page 7

Sampling Pump Characteristic

Choice of the sampling pump system :

•• Flow regulation from 0.5 à 3 L/mn.Flow regulation from 0.5 à 3 L/mn.•• Time meter.Time meter.•• Recalibration every 200 hours.Recalibration every 200 hours.•• Compensation of the pressure.Compensation of the pressure.•• If flow interrupted for 1.5 mn, break in the pumping and in If flow interrupted for 1.5 mn, break in the pumping and in

the time adding meter.the time adding meter.•• 220 V Mains or Electric battery (autonomy = 11.5 h.).220 V Mains or Electric battery (autonomy = 11.5 h.).

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Particular Metals Monitoring (NIOSH 7300)(NIOSH 7300)

1. Witness Wafers 8"1. Witness Wafers 8" ::–– Time of Exposure = 7 daysTime of Exposure = 7 days–– VPD ICPVPD ICP--MS analysesMS analyses–– QL < 10QL < 109 9 -- 10101010 At/cm² depends on the elementAt/cm² depends on the element

2.2. AirborneAirborne Sampling :Sampling :–– Time = 8 Time = 8 -- 24 hours24 hours–– Cassette + FilterCassette + Filter–– ICPICP--OES AnalysisOES Analysis–– Limit < 1 µg/mLimit < 1 µg/m33

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17/04/2002 © Merck Editor: AMC : Airborne Molecular Contaminants Page 9

Acids Monitoring (NIOSH 7903)(NIOSH 7903)

1. Witness Wafers 8"1. Witness Wafers 8" ::–– Time of Exposure = 7 daysTime of Exposure = 7 days–– ILC Analysis (Dionex DX 500)ILC Analysis (Dionex DX 500)–– QL : Anions/cm²,QL : Anions/cm², depends on the elementdepends on the element

ClCl-- / F/ F-- / NO/ NO33-- / NO/ NO22

-- / Br/ Br-- / SO/ SO4422-- / PO/ PO44

33-- / CH/ CH33COOCOO--

Elements Chloride Fluoride Nitrate Nitrite Bromide Sulfate Phosphate Acetate

QL ( E12 Anions/cm²) 1,7 6,3 1,9 2,6 2,2 2,5 2,5 210

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Acids Monitoring (NIOSH 7903)(NIOSH 7903)

2.2. Airborne sampling :Airborne sampling :–– Time = Either 8 hours or 24 hoursTime = Either 8 hours or 24 hours–– impinger for eluent NaHCOimpinger for eluent NaHCO33 / Na/ Na22COCO33

–– ILC Analysis (DX 500 / DX 120)ILC Analysis (DX 500 / DX 120)–– QL : < 1µg/mQL : < 1µg/m33

ClCl-- / F/ F-- / NO/ NO33-- / NO/ NO22

-- / Br/ Br-- / SO/ SO4422--

/ PO/ PO4433-- / CH/ CH33COOCOO--

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17/04/2002 © Merck Editor: AMC : Airborne Molecular Contaminants Page 11

Bases Monitoring (NIOSH 6016)(NIOSH 6016)

1. Witness Wafers 8"1. Witness Wafers 8" ::–– Time of exposure = 7 days Time of exposure = 7 days –– Liquid extraction & ILC Analysis (Dionex DX 500)Liquid extraction & ILC Analysis (Dionex DX 500)–– QL < 1.3 10QL < 1.3 101313 Ion/cm²Ion/cm²

2.2. AirborneAirborne Sampling :Sampling :–– Time = 24 hoursTime = 24 hours–– Impinger eluent sulfonic AcidImpinger eluent sulfonic Acid–– ILC Analysis (Dionex DX 500)ILC Analysis (Dionex DX 500)–– QL : < 1 µg/mQL : < 1 µg/m33

Ammonium Total Ammonium Total NHNH44

++

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Specific Condensables Monitoring

Benzen Benzen -- Toluen Toluen -- Xylen Xylen –– Ethyl Benzen Ethyl Benzen -- IPA IPA –– Ethyl Lactate Ethyl Lactate -- HMDS HMDS -- PGMEA PGMEA --

Cyclohexanon Cyclohexanon -- Anisole Anisole -- MEKMEK

Airborne Sampling :Airborne Sampling :–– Time = Either 3 hoursTime = Either 3 hours

–– Desorbtion selective tubesDesorbtion selective tubes–– ATD ATD -- GC GC --FID (Perkin Elmer)FID (Perkin Elmer)–– Unit : < µg/mUnit : < µg/m33

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Elements QL* (µg/m3)

Benzen < 0,7

Toluen < 1,2

P-Xylen < 1,1

Ehtyl Benzen < 1,2

Isopropyl Alcohol < 10

Ethyl Lactate Improvement

HMDS < 10,2

PGMEA Improvement

Cyclohexanon < 3,2

Anisole < 1,1

Mehtyl Ethyl Keton < 4,5

* : calculated with 1 Liter of air

Performance : Limit of quantification

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Total Condensables Monitoring (NIOSH 2549)(NIOSH 2549)

Gas Chromatography - MS

+ Thermal desorbtion

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Dopants Monitoring

Boron & PhosphorusBoron & Phosphorus

1. Witness Wafers 8"1. Witness Wafers 8" ::–– Time of exposure = 7 days Time of exposure = 7 days –– Liquid extraction & ILC Analysis (Dionex DX 500)Liquid extraction & ILC Analysis (Dionex DX 500)–– QLQLBoronBoron < 6.9 10< 6.9 10+12+12 At/cm²At/cm²–– QLQLPhosphorusPhosphorus < 8.9 10< 8.9 10+11+11 At/cm²At/cm²

2.2. AirborneAirborne Sampling Sampling (Particular B & P contaminants)(Particular B & P contaminants) ::–– Time = 24 hoursTime = 24 hours–– Cassette + FilterCassette + Filter–– ICPICP--OES AnalysisOES Analysis–– Limit < 1 µg/mLimit < 1 µg/m33

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Merck SA France Laboratory :Electronic Chemicals Department