analytical modeling of forced convection in slotted plate fin heat sinks p. teertstra, j. r. culham...

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Analytical Modeling of Forced Analytical Modeling of Forced Convection in Slotted Plate Fin Convection in Slotted Plate Fin Heat Sinks Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory Department of Mechanical Engineering University of Waterloo Waterloo, Ontario, Canada http://www.mhtl.uwaterloo.ca Future Challenges in Electronic Packaging Future Challenges in Electronic Packaging International ME’99 Congress and International ME’99 Congress and Exposition Exposition Nashville, TN Nashville, TN November 17, November 17, 1999 1999

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Page 1: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

Analytical Modeling of Forced Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Convection in Slotted Plate Fin Heat

SinksSinks

P. Teertstra, J. R. Culham & M. M. Yovanovich

Microelectronics Heat Transfer LaboratoryDepartment of Mechanical Engineering

University of WaterlooWaterloo, Ontario, Canada

http://www.mhtl.uwaterloo.ca

Future Challenges in Electronic PackagingFuture Challenges in Electronic PackagingInternational ME’99 Congress and ExpositionInternational ME’99 Congress and Exposition

Nashville, TNNashville, TNNovember 17, 1999November 17, 1999

Page 2: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

22Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Introduction: Plate Fin Heat SinksIntroduction: Plate Fin Heat Sinks

• Heat transfer enhancement for air cooled applications:– increase effective surface area– decrease thermal resistance– control operating temperatures

• Plate fin heat sinks:– most common configuration– convection in channels between fins

Page 3: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

33Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Introduction: Slotted Fin Heat SinksIntroduction: Slotted Fin Heat Sinks

• Enhanced thermal performance:– new thermal boundary layers

initiated at each fin section– increase in average heat

transfer coefficient– decrease in surface area

• Performance of slotted fin heat sinks function of slot size and spacing

• Optimal slotted fin heat sink design balances enhancement of h with reduction of A

Page 4: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

44Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Introduction: Heat Sink SelectionIntroduction: Heat Sink Selection

• Heat sink selection depends on many factors:– performance– dimensional constraints– available airflow– cost

• Quick and accurate design tools are required:– predict performance early in design– perform parametric studies– alternative to numerical simulations,

experiments

Page 5: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

55Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

ObjectivesObjectives

• Develop analytical models for average heat transfer rate for slotted fin heat sinks:– laminar, forced convection flow– full range of developing and fully-developed

flow– non-isothermal fins

• Perform experimental measurements to validate proposed models:– range of slot sizes and spacing– inline and staggered slot arrangement

Page 6: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

66Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Problem Definition: Slotted Heat Problem Definition: Slotted Heat SinksSinks

• Uniformly sized and spaced slots in fins– fins slotted from tip to baseplate– fin sections connected only by baseplate

• Slot size and spacing described by dimensionless parameters:

– pitch,

– width,

• Slot arrangement:– inline– staggered

10 LPLP

10 PSPS

Page 7: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

77Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Problem Definition: Plate Fin Heat Problem Definition: Plate Fin Heat SinkSink

• Array of N plates on a single, flat baseplate

• Baseplate assumptions:– fins in perfect thermal contact– isothermal– adiabatic lower surface, edges

• Uniform velocity in all channels with no bypass:– shrouded heat sink– with flow bypass model for un-shrouded heat sinks

• Heat sink modeled as N-1 parallel plate channels

Page 8: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

88Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Problem Definition: Parallel Plate Problem Definition: Parallel Plate ChannelChannel

• Assume b << H– 2D channel flow– neglect baseplate, shroud

effects

• Isothermal boundary conditions

• Reynolds number:

• Nusselt number:

bUbRe

HLATTAk

bQ

asb 2,Nu

Page 9: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

99Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Parallel Plate Channel ModelParallel Plate Channel Model

• Composite solution of 2 limiting cases (Teertstra et al, 1999)

– Fully Developed Flow

L

bU

L

bbb

2

* ReRe

2

PrReNu

*b

b fd

21

*

31*

Re

65.31PrRe664.0Nu

b

bbdev

– Developing Flow

nn

bn

bi devfd

/1NuNuNu

Page 10: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1010Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Plate Fin Heat Sink ModelPlate Fin Heat Sink Model

• Fin effects included in heat sink model:– high aspect ratio heat sinks for power

electronics– dense arrays of tall, thin fins– increased surface area for convection– efficiency reduced

• Fin efficiency:

• Assume adiabatic condition at fin tip:

ib NuNu

b

kh

Ak

Phm

Hm

Hm fi

c Nu,,

tanh

Page 11: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1111Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Plate Fin Heat Sink ModelPlate Fin Heat Sink Model

• Model Summary

iasf

b

TTAkNQ Nu

31321

*

*3*

Re

65.31PrRe664.0

2

PrReNu

b

bb

i

1Nu2

1Nu2tanh

Lt

tH

bH

k

k

Lt

tH

bH

k

k

fi

fi

Page 12: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1212Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Slotted Fin Heat Sink - Model BoundsSlotted Fin Heat Sink - Model Bounds

• Complex problem where exact solution not possible• Upper and lower bounds from plate fin heat sink model:

Page 13: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1313Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Slotted Fin Heat Sink - Lower BoundSlotted Fin Heat Sink - Lower Bound

• No new boundary layers formed

• Modeled using equivalent fin length:

• Lower bound expressions:

PSLSNLL SLB 1

ib

LB PSNu

1

ReRe

**

PS

Lt

L

t

LB 1

Page 14: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1414Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Slotted Fin Heat Sink - Upper BoundSlotted Fin Heat Sink - Upper Bound

• New thermal boundary layer formed at each fin section with no upstream effects

• Modeled using equivalent fin length:

• Upper bound expressions:

PSLPLSPLUB 1

ib

UB PSLPNu

1

ReRe

**

PSLP

Lt

L

t

UB 1

Page 15: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1515Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Experimental ApparatusExperimental Apparatus

• High aspect ratio,

• Various slot configurations

• Back-to-back arrangement

• Mounted in Plexiglas shroud

• Approach velocity measured with hot wire anemometer

• Temperatures measured at 4 locations on baseplate

• Radiation losses measured in separate experiment

20bH LP PS Slots

0.059 0.54 inline

0.11 0.5 inline

0.22 0.5 inline

0.44 0.5 inline

0.22 0.5 staggered

0.44 0.5 staggered

Page 16: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1616Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Experimental ResultsExperimental Results

Page 17: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1717Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Model ValidationModel Validation

Page 18: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1818Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Model ValidationModel Validation

• Arithmetic mean of bounds within 12% RMS of data

2Nu UBLB

bNuNu

5.0

44.011.0

180Re40 *b

PS

LP

Page 19: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

1919Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

Summary and ConclusionsSummary and Conclusions

• Models developed for upper and lower bounds for slotted fin heat sinks

• Experimental data within bounds for full range of test conditions

• Arithmetic mean of bounds predicts within 12% RMS over range of test conditions

• Reliable optimization procedure cannot be determined from the limited range of values

• Additional study and data are required

bNu

PS

Page 20: Analytical Modeling of Forced Convection in Slotted Plate Fin Heat Sinks P. Teertstra, J. R. Culham & M. M. Yovanovich Microelectronics Heat Transfer Laboratory

2020Microelectronics Heat Transfer LaboratoryMicroelectronics Heat Transfer Laboratory

University of WaterlooUniversity of Waterloo

AcknowledgementsAcknowledgements

The authors gratefully acknowledge the continued financial support of R-Theta Inc. and Materials and Manufacturing Ontario.