What is A5 processor?

0Systems-on-a-chip (SoCs)

0Designed by Apple Inc.

0Fabricated by Samsung to replace the AppleA4.

0Commercially debuted with the release ofApple's iPad 2 tablet.

0Also powers the iPhone 4S, and iPad (3rdgeneration).

Details of A5

0 Chip based upon the dual-core ARM Cortex-A9Core CPU.

0 CPU - twice as powerful asthe original iPad.

0NEON SIMD acceleratorand a dual core PowerVRSGX543MP2 GPU

0 Contains 512 MiB of low-power DDR2 RAM clockedat 533 MHz

GPU

0 Graphical Processing Unit (GPU):0 Circuit

0 Buffers images in a frame and sets it into motion

0 So the video or images can be viewed in the home screen ordisplay

0 GPU up to seven times as powerful as, the Apple A4.

0 Capacity to move 1 billion pixels per second

0 Image Signal Processor unit (ISP)0 Advanced image post-processing

0 Face detection, white balance and automatic imagestabilization

Processor view from

back of chip

Apple A5 (S5L8940)

0 1st version A5 chip-iPhone 4S and iPad 2.

0Manufacturing process: 45 nm having 122.2 mm2 ofdie area

0 Package on package (PoP) together with RAM.0 IC packaging technique

0 Combines discrete logic and memory ball grid arraypackages

0 Packages arranged one above the other

0 Standard interface for routing the signals in between

0 Main benefit - Motherboard space savings

Apple A5 (S5L8942)

0 2nd version of A5 chip - Apple TV (3rd generation),&iPad 2(2nd generation)

0Manufacturing process: 32 nm fabrication

0Measures nearly 41% smaller than 1st generation A5,at 69.6 mm² die area.

0 Package on package (PoP) together with RAM.

Apple A5X (S5L8945)

0A5X chip-iPad (3rd generation)

0Dual-core CPU at 1 GHz

0Quad-core PowerVR GPU

0Not packaged together with the RAM.

0 Lithography: 45 nm to 32 nm.

0 L1 cache =32KiB instruction+32KiB data

0 L2 cache =1MiB

0 Silicon die size: 165 mm2

0 210% larger than 53.3 mm2 die area of the original A4.