application processor for smartphone · ©2016 system plus consulting | 2016 comparison of...
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©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Application Processor for SmartphonePackaging Technology & Cost ReviewAdvanced Packaging report by Stéphane ELISABETHNovember 2016
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o AP I/O count & Footprint
o AP I/O count & L/S width
o Reverse Costing Methodology
Company Profile 10
o Apple, Huawei, Samsung, Qualcomm
o Apple, Huawei, Samsung, Qualcomm AP history
o Apple, Huawei, Samsung, Qualcomm Supply Chain History
o iPhone 7 Plus, Huawei P9, Samsung Galaxy S7 Teardown
o PoP Packaging Technology
Physical Analysis 32
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o A10, Kirin 955, Exynos 8, Snapdragon 820 Package 34
Package Views & Dimensions
Package Opening
Package Opening Comparison
o PoP Cross-Section 47
Package Details Cross-Section
Package Cross-Section Comparison
o Die & Land-Side Decoupling Capacitor Comparison 66
Die View & Dimensions
LSC Capacitor View & Dimensions
LSC Capacitor Footprint
Embedded LSC Capacitor Cross-Section
Soldered LSC Capacitor Cross-Section
o Summary of the physical Data 72
Manufacturing Process Flow 73
o Global Overview
o Package Fabrication Unit
Cost Analysis 76
o Synthesis of the cost analysis
o Main Steps of Economic Analysis
o Yields Explanation & Hypotheses
o Die cost 81
Front-End Cost
Wafer & Die Cost
o Package Manufacturing Cost 83
A10 Package Cost Breakdown
Kirin 955 Package Cost Breakdown
Exynos 8 Package Cost Breakdown
Snapdragon 820 Package Cost Breakdown
o Component Cost 88
Wafer/Panel & Component Cost
Component Cost Breakdown
Company services 91
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
• Located under the DRAM chip on the main board, the application processors (AP) are packaged using PoPtechnology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in theHuawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the SamsungGalaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for theExynos).
• In this report, we highlight the differences and the innovations of the packages chosen by the end-userOEMs. Whereas some AP provider like for HiSilicon or Samsung choose to consider conventional PoP withembedded land-side capacitor (LSC), others like Apple or Qualcomm used innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. Thedetailed comparison between the four players will give the pros and the cons of the packagingtechnologies.
• This report also compares the costs of the different approaches and includes a detailed technicalcomparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8,the HiSilicon Kirin 955 and the Apple A10.
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 4
Overview / Introduction
Company Profile & Supply Chain o InvenSenseo ICG-20660L Characteristics
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Smartphones Teardown
Apple iPhone 7 Plus Main Board (Top view)
Huawei P9 Main Board (Top view)
Samsung Galaxy S7 Edge Main Board (Top view)
USA Version
EU Version
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package View & Dimensions
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Opening
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Opening
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Opening Comparison
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Cross-Section
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Cross-Section
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section Comparison
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Dies Comparison
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Packages Land-Side Decoupling Capacitor
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Summary of the physical Data
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo MEMS Front-End Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
A10 Wafer & Die Cost
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo MEMS Front-End Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Manufacturing Cost
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Contact
Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
America Sales OfficeSteve [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi [email protected]
Mavis WANGGREATER [email protected]
NANTESHeadquarter
FRANKFURT/MAINEuropa Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Legal
DISCLAIMER
System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic componentsand systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in thereport. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of thisreport. The quoted trademarks are property of their owners.
Reverse Costing® is a deposed brand, by System Plus Consulting.
SERVICES
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed byindustry experts.
These results are open for discussion. We can reevaluate this circuit with your information.