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Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@c ern.ch

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Page 1: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

Apr, 2014

TE-EPC-CCE Radiation Tests2012-2013

[email protected]

Page 2: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013

Outline

2

Summary

1. H4IRRAD 20121. May: ADS1281, DS18B20, DS2401, SPLargeUHD92. Jul: MAX5541, MIC373023. Nov: MIC37302, FGClite

2. ANDI Batch Tester 1. ADS1271B (PSI – Apr/Oct 2013, TRIUMF – Dec 2013)2. ADS1281 (PSI –Oct 2013)3. MAX5541 (PSI –Oct 2013)

3. HIDE Batch Tester1. R1LV1616R Renesas SRAM (PSI – Oct 2013, TRIUMF – Dec 2013)2. A3P250, A3P400, A3P1000, A3PE1500 (PSI –Oct 2013)3. FGClite Analogue Filter Design (PSI –Oct 2013)

RadWG Oct 2012

Page 3: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013

H4IRRAD Nov 2012 – MIC37302

3

Components Identification and test setup description

Results

DUT name DUT type Test Type

Samples tested

Package Date code Lot code

MIC37302 Low-dropout voltage

regulator

TID, SEE 15 S-Pak-5 unknown unknown

Test time (min)

Outp

ut V

olta

ge (V

)

-1.5

-1.49

-1.48

-1.47

-1.46

-1.45

-1.44

0 5000 10000 15000 20000 25000 30000

DUT1 1V5DUT2 1V5DUT3 1V5DUT4 1V5DUT5 1V5

Test time (min)

Outp

ut V

olta

ge (V

)

-3.3

-3.27

-3.24

-3.21

-3.18

-3.15

0 5000 10000 15000 20000 25000 30000

DUT1 3V3DUT2 3V3DUT3 3V3DUT4 3V3DUT5 3V3

Test time (min)

Outp

ut V

olta

ge (V

)

-1.25

-1.2

-1.15

-1.1

-1.05

-1

0 5000 10000 15000 20000 25000 30000

DUT1 1V5 1.24ADUT2 1V5 0.91ADUT3 1V5 0.38ADUT4 1V5 0.64ADUT5 1V5 0.83A

Low cost COTS adjustable low-dropout voltage regulator (RadDIM project)SEE and TID test for different output voltages 1V5 and 3V3 and different loads 0.1-1.2A

No SEL detected: SEL cross-section upper level (90%) < 6.6e-13 cm2

Voltage out degradation as a function of dose (irradiated up to ~90Gy/component): 0.360mV/Gy (1V5, 183mA of load)0.920mV/Gy (3V3, 100mA of load)0.160mV/Gy (1V5, variable load)

PSI tests Sep 2013 done by EN-STI confirmed these results(no SEL detected, regulation ok until 300Gy, enable pin fails at 150Gy)

Page 4: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013

H4IRRAD Nov 2012 – FGClite Prototype

4

FGCµlite

GPI

B co

mm

unic

tatio

n Power SupplyAgilent 3633A

Power+measurement

GatewayKontron cfc-866-rfip8

≈ 40m

≈ 40m

H4IRRAD AreaHall

Test Barrack

Power SupplyAgilent 3633A

Power SupplyAgilent 3633A

PCABPC11505

Ethernet TN

Ethernet GPN

0887 R-R001 outlet 0808/01

0887 R-001 outlet 0708/02

5V

15V

-15V

Test setup

No SEL detected: SEL cross-section upper level (90%) < 1.6e-11 cm2

No radiation-induced effect were identified. No observable TID power consuption increase.System has shown significant level of noise, Spikes in measurements >550ppm (spec <50ppm), not correlated with the

beam (we suspect the EMC-induced noise)

Results

Page 5: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013

CERN

[email protected] 5Monthly 2013

ANDI Batch Tester (1/4)

1. ADS12812. MAX55413. ADS1271B4. Others…

1. Generates input for DUTs2. Analyses the outputs from DUTs3. Actively performs the power cycle (SEL)4. Records all measurements from DUTs

Allows the real time data analysis during the test

PCTEPC23114

LOW RADIATION AREA

4x Cards16x DUTs

3x digital

FGC2H4IRRAD tests (boot program)

8x Det +/-15V8x Ctrl4x Det +5V

1x analogue

TARGET AREA

~12m

FPGAMicroSemi P3A1500

SEL Detector2x Bipolar +/-15V

SEL DetectorUnipolar +5V

PSUAgilent E3631A

PSUAgilent E3631A

DataLoggerAgilent 34970A

Mlt-Lnk & Buffer Card

~20m

CONTROL

8x +5V, 8x +15V, 8x -15V

1x Analogue IN (DAC)

8x Digital OUT (M0/M1)

4x Digital IN (RST)

3 x digital IN (DATA/CS/CLK)

RS232

RS232

RS232 DataLoggerAgilent 34970A

DB-25 #1

DB-25 #2

coax

DB-25 #2

coax

PC ABPC11505

4x Cards

EthernetLocal

Page 6: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013 6

PSI Apr/Oct 2013 & TRIUMF Dec 2013 – ADS1271B (2/4)

Context

Test results

SEL study and influence of high-Z materials on SEL cross-section Significance of cross-section increase with energy

Margins to be applied on the 230MeV data when assessing the error rate in the LHC

1E-13

1E-12

0 100 200 300 400 500

SEL c

ross

-sec

tion

(cm

2/de

v)

Energy (MeV)

XS

XS LL

XS UL

Measurable SEL cross-section in range 1e-13 to 1e-12 cm2

Increase of the cross-section with energy attributed to tungstenSEL current between 50 to 300mA (16mA nominal)

TID limit >2kGy

Page 7: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013 7

PSI Oct 2013 – ADS1281 (3/4)

Context

Test results

High precision delta-sigma ADC for FGCliteCERN Batch yielded from 3 Si wafers (4500 IC)

0.00E+00

1.00E+00

2.00E+00

3.00E+00

4.00E+00

0.00E+00 2.00E+02 4.00E+02 6.00E+02 8.00E+02 1.00E+03 1.20E+03

Curr

ent c

onsu

mpti

on (A

)

Dose (Gy)

DUT1 I_AVDD (A)

DUT1 I_DVDD (A)

DUT2 I_AVDD (A)

DUT2 I_DVDD (A)

DUT3 I_AVDD (A)

DUT3 I_DVDD (A)

DUT4 I_AVDD (A)

DUT4 I_DVDD (A)

No SEL detected: SEL cross-section upper level (90%) < 7.2e-14 cm2

Modulator SEFI cross-section = 8.1e-13 cm2 TID limit > 1kGy

Test Set DUT name DUT type Test Type

Samples tested Package Date/lot code

#1 ADS1281x4

DUT 1 High-Res

ADC SEL, SEFI

4x packaged TSSOP-24 CERN reference

#2 ADS1281x4

DUT 2 High-Res

ADC SEL, SEFI

4x packaged TSSOP-24 CERN reference

#3 ADS1281x4

DUT 3 High-Res

ADC SEL, SEFI

4x packaged TSSOP-24 CERN reference

#4 ADS1281x4

DUT 4 High-Res

ADC SEL, SEFI

4x packaged TSSOP-24 CERN reference

Page 8: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013 8

Test Set DUT name DUT type Test Type

Samples tested Package Date/lot code

#1 MAX5541x4

DUT 1 DAC

SEL, SEFI

4x packaged 8-SO 1592369

#2 MAX5541x4

DUT 2 DAC

SEL, SEFI

4x packaged 8-SO 1592369

#3 MAX5541x4

DUT 3 DAC

SEL, SEFI

4x packaged 8-SO 1592369

#4 MAX5541x4

DUT 4 DAC

SEL, SEFI

4x packaged 8-SO 1592369

PSI Oct 2013 – MAX5541 (4/4)

Context

Test results

16-bit DAC for FGClite

No SEL detected: SEL cross-section upper level (90%) < 7.2e-14 cm2

No SEFI detected: SEFI cross-section upper level (90%) < 7.2e-14 cm2

TID limit > 1kGy-1.20E-02

-1.00E-02

-8.00E-03

-6.00E-03

-4.00E-03

-2.00E-03

0.00E+000 200 400 600 800 1000 1200

Curr

ent c

onsu

mpti

on (A

)

Dose (Gy)

120 (VDC)

210 (VDC)

220 (VDC)

110 (VDC)

Page 9: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013

CERN

[email protected] 9Monthly 2013

HIDE Batch Tester (1/4)

1. FPGA2. Memories (SRAM)3. Others…

1. Generates input for DUTs2. Analyses the outputs from DUTs3. Actively performs the power cycle (SEL)4. Records all measurements from DUTs

Allows the real time data analysis during the test

PCTEPC23114

LOW RADIATION AREA

TCC8x Det +/-15V8x Ctrl4x Det +5V

TARGET AREA

~12m

FPGAMicroSemi P3A1500

SEL Detector2x Bipolar +/-15V

SEL DetectorUnipolar +5V

PSUAgilent E3631A

PSUAgilent E3631A

DataLoggerAgilent 34970A

Mlt-Lnk & Buffer Card

~20m

CONTROL

8x +5V, 8x +15V, 8x -15V

4x digital coax (RS485)

RS232

RS232 DataLoggerAgilent 34970A

PC ABPC11505

4x Cards

EthernetLocal

8x DUTManchesterLocal power

Page 10: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013 10

PSI Apr/Oct 2013 & TRIUMF Dec 2013 R1LV1616R (2/4)

Context

Test results

16-Mbit SRAM memory for the FGCliteTFT + DRAM bit cell architecture

No SEL possible, very low SEU cross-section

1E-19

1E-18

1E-17

1E-16

0 200 400 600

SEU

cro

ss-s

ectio

n (c

m2/

bit)

Energy (MeV)

TRIUMF CERN

PSI CERN

IUCF NASA

1.00E-18

1.00E-17

1.00E-16

1.00E-15

1.00E-14

50 500 5000

Prot

on S

EU c

ross

-sec

tion

(cm

²/bi

t)

Energy (MeV)

ExperimentalSim:Std. SRAMSim:TFTSim:TFT+DRAM230MeV

Test Set DUT name DUT type

Test Type Package Lot Date Code (MSC batch)

#1 R1LV1616R

DUT 1 SRAM SEU/MBU 48-pin

TSOP 1343

(2013430001)

#2 R1LV1616R

DUT 2 SRAM SEU/MBU 48-pin

TSOP 1328

(2013280004)

#3 R1LV1616R

DUT 3 SRAM SEU/MBU 48-pin

TSOP 1343

(2013430002)

#4 R1LV1616R

DUT 4 SRAM SEU/MBU 48-pin

TSOP 1343

(2013430002)

#5 R1LV1616R

DUT 5 SRAM SEU/MBU 48-pin

TSOP 1328

(2013280003)

#6 R1LV1616R

DUT 6 SRAM SEU/MBU 48-pin

TSOP 1343

(2013430001)

Page 11: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013 11

PSI Oct 2013 ProASIC-3 (3/4)

Context

Test results

Well-known ProASIC-3 radiation data (A3PE3000L published by ESA)Different FPGA sizes = Same radiation response?FF/block RAM SEU cross-section measurement

FF tests: 90% of all FF in each FPGA was used (shift registers)Test pattern influence <30% (all‘0’ most sensitive, all‘1’ least sensitive)

Size influence <20% (250 most sensitive, A3PE1500 least sensitive)Frequency influence <15% (1kHz most sensitive, 1Hz least sensitive)

DUT FPGA Package

1 A3P250 VQ100

2 A3P250 VQ100

3 A3P250 VQ100

4 A3P250 VQ100

5 A3P400 PQ208

6 A3P400 PQ208

7 A3P1000 PQ208

8 A3PE1500 PQ208

1.00E-14

1.00E-13

0 50 100 150 200 250

SEU

cro

ss-s

ectio

n (c

m2/

bit)

Proton Energy (MeV)

PSI RAM CERNPSI RAM ESAPSI FF CERNPSI FF ESA

RAM tests: 100% of all blocks in each FPGA was usedTest pattern influence <40% (all‘0’ most sensitive, all‘1’ least sensitive) Size influence <30% (250 most sensitive, A3PE1500 least sensitive)

Page 12: Apr, 2014 TE-EPC-CCE Radiation Tests 2012-2013 slawosz.uznanski@cern.ch

CERN

[email protected] CERN 2013 12

FGClite Analogue Filter (4/4)

Context

DUT number Size DesignRun1

1e11 p/cm2Run2

5e12 p/cm2DUT0 1000 noTMRDUT1 1000 TMRDUT2 1500E noTMR 1DUT3 1500E TMRDUT4 400 noTMR 1 2DUT5 400 TMRDUT6 400 noTMR 4DUT7 400 TMR 1 2

Design Logic Cells Usage (A3P400)3 CHs 3,937 42.72 %

3 CHs w/ TMR 6,642 72.07 %

Test results

We observed errors with TMR : Test setup limitation, TMR failing due to latching of SET, TID limit of components (400-500Gy)Further irradiations needed!