automation systems at intel fab

8/10/2019 Automation systems at Intel fab

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Automation Systems & ITAutomation Systems & ITwithin Intelwithin Intel s High Volumes High Volume

ManufacturingManufacturing

2006 MIT Manufacturing Summit2006 MIT Manufacturing SummitBimal Dey / Anthony MaggiBimal Dey / Anthony Maggi


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AGENDAAGENDA IntelIntel s Manufacturing Environments Manufacturing Environment

Automation Drivers/DomainsAutomation Drivers/Domains Focus Topic: AutomatedFocus Topic: Automated MatMat ll HandlingHandling

Focus Topic: Process Control SystemsFocus Topic: Process Control Systems


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IrelandIreland

Fab 14/24Fab 14/24

IsraelIsrael

Fab 8/18/28Fab 8/18/28

OregonOregon

Dev D1C/D1DDev D1C/D1DFab 15/20Fab 15/20

CaliforniaCalifornia

Dev D2Dev D2

ColoradoColorado

Fab 23Fab 23

Ar izonaAr izona

Fab12/22/32Fab12/22/32

New MexicoNew Mexico

Fab 7/11/11XFab 7/11/11X

Mass.Mass.

Fab 17Fab 17

Costa RicaCosta RicaSan Jose A/TSan Jose A/T

A/T DevA/T Dev

MalaysiaMalaysia

Penang A/TPenang A/TKulim A/TKulim A/T

ChinaChina

Pudong/ChenduPudong/ChenduA/TA/T

PhilippinesPhilippines

Manila A/TManila A/TCavite A/TCavite A/T

WashingtonWashington

Systems MfgSystems Mfg

Board MfgBoard Mfg

Kulim Board/Module MfgKulim Board/Module Mfg

BrazilBrazilSub-con Mfg.Sub-con Mfg.

ThailandThailand

Sub-con MfgSub-con MfgVietnam-ATVietnam-AT

Sub-con MfgSub-con Mfg

TaiwanTaiwan



Environment: Highly GlobalEnvironment: Highly Global

Wafer FabWafer Fab

Systems/Sub-conSystems/Sub-con

Assembly/TestAssembly/Test

Challenge: Deploy CE! IT capabilities across the globe


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Manufacturing Environment VectorsManufacturing Environment Vectors

AutomationAutomation

reliabilityreliability

ComputingComputing

securitysecurity

TechnologiesTechnologies

SupplySupply

chainchainoptimizationoptimization

AffordabilityAffordability

18 month18 month

cyclescycles

GlobalGlobal

dispersiondispersion

QualityQuality

expectationsexpectations

Cost ofCost ofexcursionsexcursions

CompetitiveCompetitive

challengeschallenges

Each are drivers as well as opportunities for IT


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IT Infrastructure Challenges in MfgIT Infrastructure Challenges in MfgEnvironmental vectors are confound by keyEnvironmental vectors are confound by key

challenges includingchallenges including

ComplexityComplexity

Exploitation of security vulnerabilitiesExploitation of security vulnerabilities

Explosive usage growth of products andExplosive usage growth of products andservicesservices

Equates to continued cost pressures


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AGENDAAGENDA

IntelIntel s Manufacturing Environments Manufacturing Environment

Automation Drivers/DomainsAutomation Drivers/Domains

Focus Topic: AutomatedFocus Topic: Automated MatMat ll HandlingHandling



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WIP Matchedto Current

Needs

Error free

processing

Higher

People

Productivity

Zero set

up time

Rapid New

Product Switch

over

Lot sizereduction

Key Automation Drivers for MfgKey Automation Drivers for MfgRapid

Factory

Cycle Time

Optimized Space

Management

High

Equipment

Availability &

Utilization


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AGENDAAGENDA

IntelIntels Manufacturing Environments Manufacturing Environment

Automation Drivers/DomainsAutomation Drivers/Domains

Focus Topic: AutomatedFocus Topic: Automated MatMat ll HandlingHandling



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Automation/IT role in 300mm MfgAutomation/IT role in 300mm Mfg

Com

municationBus

OHT

Process Equipment

Process Equipment

Litho Etch Films

Thermal Planar Metrology

Remote Command Centers

100% AMHS

Automated

Dispatching

Factory Wide User

Interfaces

Yield Analysis

CYBER SECURITY

Remote Diagnostics

Wafer/Unit Trace

New MES

Pervasive

FDC / SPC

Run to Run Control

with APCFramework

Tool Reliability Tracking

Real Time

Tool View


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Scheduler /

Dispatcher

Information Bus

Reticle

TrackingManufacturing Execution

System (MES)

Execution

Control (EC)

AMHS ComponentsAMHS Components

Process Equipment

I/Fs

E-5-SECS II

E-30-GEM

E-37 HSMS

E-87 Carrier Mgmt

E-90 Substrate Tracking

E-40 Process Job Mgmt

E-84 Parallel I/O forOHV

E-94 Control Job Mgmt

Process orMetrology

Equipment

Tool

Embedded

Controller

OHV

FOUP

Station

Controllers

Interbay

transport

AMHS Equipment I/Fs

E5 SECS II

E30 GEME37 HSMS

Stocker

Equipment

Interbay

controller

Intrabay

controller

Material Control

System (MCS)

E82 IBSEM

E84 Parallel I/OE88 Stocker SEM

Key Points:

1. Production Equipment standards and capabilities

were Critical to achieving 100% Intrabay

Automation

2. AMHS Standards enable mix and match of suppliertools to get Best In Class equipment

3. Major time focus was spent integrating software

capabil ities with Production and AMHS Equipment

4. All in-line process and metrology equipment must

be [and has been] connected to the AMHS


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Goal: Direct Tool to Tool WIPGoal: Direct Tool to Tool WIP

Movement without humanMovement without human

interventionintervention

300mm Automation300mm AutomationFully IntegratedFully Integrated

F11xF11x 2.6miles of track2.6miles of track


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Remote Operations Center in F11xRemote Operations Center in F11x


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AMHS SummaryAMHS Summary

Intel has achieved 100% Integrated IntrabayIntel has achieved 100% Integrated IntrabayAMHS in its 300mm FabsAMHS in its 300mm Fabs

100% integrated intrabay could not have been100% integrated intrabay could not have beenachieved in the same timeframe without openachieved in the same timeframe without openindustry standardsindustry standards

Rapid throughput AMHS transport systems areRapid throughput AMHS transport systems are

needed to meet demanding lot cycle times, fastneeded to meet demanding lot cycle times, fastrun rate production equipment, and complexrun rate production equipment, and complexprocess technology scenariosprocess technology scenarios

Future capabilities are planned to extend theFuture capabilities are planned to extend thecurrent technology to fully (near 100%)current technology to fully (near 100%)automated decision making for intrabayautomated decision making for intrabayscheduling and dispatchingscheduling and dispatching


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Overview of Process Control SystemsOverview of Process Control Systems

Metrology

Equipment

UI

Process

Equipment

UI

Metrology

Equipment

Step N-1 Step N+1Step N

Run to Run APC- Use feedback and feed forward

metrology and sensor data to adjust processing at the lot

and wafer level. Drive for multi -step control.

Various % - Decision is based on problem being solved

UI

FDC Monitor equipment

event and time series data.Stop tool when ranges or

profiles are exceeded

Pervasive Implementation

SPC Monitor statist ical

data and stop the tool if

trending to OOC

100% of the Fab

Essential Datastandards include SEMI

E40, E94, E90 for waferlevel control & tracking

Typical Usage of Process Control at a Process ToolTypical Usage of Process Control at a Process Tool

Sensors Use 3rd

party and embedded

sensors to provide

FDC & R2R APC data

Various % - Decision

is based on problembeing solved


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Evolution of Intel Process ControlEvolution of Intel Process Control

200mm

Gen 1

200mm Wafers

1st Generation

(1993)

Capabilityand

Efficiency

Time axis

200mmGen 3

Factory wide systems &usage of SPC & FDC

Point Solutions for Runto Run APC

Basic FDC & APCControl & Yield Analysis

300mm

Gen 4

200mm Wafers

3rdGeneration

(1999)

300mm Wafers

4thGeneration

(2007)

300mm Wafers

2ndGeneration

(2006)

Point solutions for SPCspread across the factory

Ad hoc and limi ted FDCand Run to Run APCControl Systems

Rudimentary ControlAnalytics

300mm

Gen 2

Factory wide systems &usage of SPC & FDC

Maturing FDC & APCControl Analytics

Reusable Run to RunAPC Framework withlitho coverage

Advanced YieldAnalysis and Analyt ics

Factory wide systems

and usage of PCS (SPC+ FDC + APC)

Advanced FDC & APCControl Analytics

Advanced YieldAnalysis and Analyt icsmoving towardpredictive models


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SUMMARYSUMMARY High Volume manufacturing in SemiHigh Volume manufacturing in Semi

industry presents many uniqueindustry presents many unique

challengeschallenges Advances in AMHS and PCS has beenAdvances in AMHS and PCS has been

key to addressing some of thesekey to addressing some of these

challengeschallenges Continued advances needed in theseContinued advances needed in these

two areas to keep pace with thetwo areas to keep pace with the

MooreMoores laws law and rapid pace of theand rapid pace of the

Semi technologySemi technology


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QuestionsQuestions


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ReferencesReferences

J. Wu, O. Rozmarin and B. Li,J. Wu, O. Rozmarin and B. Li, A Flexible Execution Control Framework forA Flexible Execution Control Framework for300mm Factory Automation300mm Factory Automationin Semiconductor Manufacturing, 2003in Semiconductor Manufacturing, 2003

Nimish Shah ,Nimish Shah , ASMC Keynote Presentation 2005ASMC Keynote Presentation 2005

E. Bass, D. Pillai, J. Dempsey,E. Bass, D. Pillai, J. Dempsey, 300mm Full-Factory Simulations for 90nm300mm Full-Factory Simulations for 90nmand 65nm IC Manufacturingand 65nm IC Manufacturingin Proceedings of the International Symposiumin Proceedings of the International Symposiumof Semiconductor Manufacturing (ISSM), 2003of Semiconductor Manufacturing (ISSM), 2003

B. Li and J. Wu,B. Li and J. Wu, Factory Throughput Improvement Through IntelligentFactory Throughput Improvement Through IntelligentIntegrated Delivery in 300mm Wafer ManufacturingIntegrated Delivery in 300mm Wafer Manufacturingin Proceedings of thein Proceedings of theInternational Symposium of Semiconductor Manufacturing (ISSM), 2003International Symposium of Semiconductor Manufacturing (ISSM), 2003

J. Wu and R. Madson,J. Wu and R. Madson, APF in IntelAPF in Intels 300mm Execution Control Strategys 300mm Execution Control StrategyininBrooks Worldwide Automation and Performance Symposium, 2002Brooks Worldwide Automation and Performance Symposium, 2002

J. Pettinato and M. Honma,J. Pettinato and M. Honma, Factory Integration RoadmapFactory Integration Roadmapat theat theInternational Technology Roadmap for Semiconductors (ITRS) Conference,International Technology Roadmap for Semiconductors (ITRS) Conference,20022002

B. Sohn, D. Pillai, N. Acker,B. Sohn, D. Pillai, N. Acker, 300mm Factory Design for Operational300mm Factory Design for Operational

EffectivenessEffectiveness, IEEE/ASMC Conference, SEMICON, IEEE/ASMC Conference, SEMICON EuropaEuropa, Munich,, Munich,Germany, April 2000eGermany, April 2000e

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