TOMEI DIAMONDCorporate Guidance

TOMEI DIAMOND

While it is a jewel of irresistible brilliance, Diamond reigns over every earthly substance with the fruit of 4.6 billion year-long dynamism: excellent properties in hardness, heat conductivity, electrical insulation and corrosion resistance.Such properties present many possibilities and offer great roles that diamond can play in various sectors of the industry: a new material for the 21st century indispensable to the industry, for machining ceramic and carbide materials and for electronic device material.Ever since we succeeded in the commercial production of diamond for the first time in Japan in 1961 we have been searching possibilities for a greater future we prospect in these tiny but pretty particles of diamond.

Prospecting Future Technology in Diamonds ...

Tomei Diamond for a Global ServiceOyama Plant, our production site for the diamond products

The Oyama plant is situated in Oyama, Tochigi (Japan), a city that is located about 80 km off from Tokyo and is accessed by a 45-minutes ride in Shinkansen. The city has grown and long has been flourishing as a hub in a northern Tokyo suburb at an important position for traffic where two major national highways intersect, one running south to north (Route 4) and the other west to east (Route 50). This is a very good place for us to steadily supply our customers in Japan and worldwide our diamond, indispensable material to the support nowadays advanced technology industry. Our researches are going on night and day with up to date equipment in order to supply quality diamond of various kinds and grades that customers need.

New Crystallization

model of graphite crystal structure

model of diamond crystal structure

mesh sizes diamond

You may know that diamond and graphite both are carbon crystals, so you may have wondered why diamond is colorless and transparent with the highest hardness in all the substance, while graphite is black and soft, even to be good for making pencil leads.It is because the crystals have different structures. The model of graphite crystal structure on the right (top) shows that carbon atoms are arranged in a layer of planar hexagonal honeycomb lattice. Since the bond between adjacent carbon atoms in each lattice is very strong, so much than that between neighboring planes that the stack, when a thrust is given in the direction of the planes causes a slippage between them, resulting in a deformation or chipping.The layer boundaries also block the passage of visible light to give a black appearance.Diamond, on the other hand, has a three-dimensional structure, in which adjacent carbon atoms are firmly bonded to each other with four hands to form a tetragonal arrangement with each atom at the center of gravity. The strong bonds give extreme resistance to deformation or high hardness.The diamond crystal does not absorb visible light waves and so develops no color.The hardest substance on the earth means that you can cut or grind every other substance with it, and gives expansive possibilities of applications to the industry.To give a few familiar examples diamond is used as or in a cutter for glasses, pavement and ceramic tiles, and dentist’s drills. Diamond has been and is working to the support of your everyday life by processing various materials including stones, plastics, ceramics and nonferrous metals, as a hidden hero at various occasions from work sites through the processing of IC materials sites, although you may not notice it in the everyday life.Diamond was for the first time synthesized by human in 1955, creating a high pressure and high temperature condition within a reaction cell that is close to that deep in the ground.Synthetic diamond consumption is increasing every year with the technology development and as applications expand, and accounts for the most part of diamond consumption in the industry these days.

Diamond Abrasives Production

SteelsDiamond Powder Carbide Substrate

Cutting

Polishing

Reaction Assembly Machining

Die

Hard AlloyMaterials

CeramicsMaterials Graphite Metal

Forming

Mixing

Firing

Reaction Assembly

Firing

Punch

Conversion to Diamond

HP, HT Reaction(6GPa, 1400℃)

Chemical Treatment

Density Separation

Sieving

Sieving

ShapeSeparation

Metal Coating

Elutriation

Micron-Sized DiamondSintered Diamond Tips Coated Diamond Mesh-Sized Diamond

Diamond Synthesis ProcessDiamond Sintering Process

Diamond ParticlesSintered Diamond (Polycrystalline Diamond(PCD))

IMG IRM

IRV-3CPS

IMS-15

IMS

IRV-3

IRV-3NEP

IRV

IRV-NP

Thermal

ThermalProperties

Properties

ThermalProperties

AcousticProperties

Optical

Optical

Properties

Properties

Optical

PropertiesElectronic

Electronic

Properties

Properties

High EnergyHigh EnergyBeamBeam

ResistivityResistivity

Electronic

Properties

Chemical

Chemical

Properties

Properties

BiocompatibilityBiocompatibilitySurgical knife,Surgical knife,dentistdentist’’s tool materialss tool materials

CorrosionCorrosionResistanceResistanceEnvironment-resistantEnvironment-resistantsensors,sensors,container, pipescontainer, pipes

ChemicalChemicalResistanceResistanceChemical-resistantChemical-resistantsensors,sensors,container, pipescontainer, pipes

Chemical

Properties

Mechanical

Properties

TransparencyTransparencyOptical windowsOptical windowsLens protective filmLens protective filmLight Emitting DiodeLight Emitting DiodeLaserLaser

PhotoresistorPhotoresistorPhotoelectric sensorsPhotoelectric sensors

Color CenterColor Centervariable wavelengthvariable wavelengthsolid- state laserssolid- state lasersOptical memory elementOptical memory element

TransparencyOptical windowsLens protective filmLight Emitting DiodeLaser

Nuclear RadiationNuclear RadiationResistivityResistivity

Light ElementLight ElementConstructionConstructionX-ray permeable windowX-ray permeable windowX-ray maskX-ray mask

Nuclear RadiationResistivitySensor arrays for X-,γ-rays and Sensor arrays for X-,γ-rays and particle beamparticle beamRadiation ‒resistant elementRadiation ‒resistant elementRadiation sensorRadiation sensor

Sensor arrays for X-,γ-rays and particle beamRadiation ‒resistant elementRadiation sensor

Light ElementConstructionX-ray permeable windowX-ray mask

PiezoresistancePiezoresistanceHigh-temperature pressure sensorHigh-temperature pressure sensorUltrasound diaphragmUltrasound diaphragm

Wide Band GapWide Band GapHigh dielectric voltage diodeHigh dielectric voltage diodeHeat-resistant elementHeat-resistant element

PiezoresistanceHigh-temperature pressure sensorUltrasound diaphragm

Low DielectricityLow DielectricityLow DielectricityHigh electron mobilityHigh electron mobilitysemiconductorsemiconductorHF elementHF element

High electron mobilitysemiconductorHF element

BiocompatibilitySurgical knife,dentist’s tool materials

High RigidityHigh RigidityDiamond toolsDiamond tools

Wear ResistanceWear ResistanceProtective coating forProtective coating formagnetic storage mediummagnetic storage medium

Low Friction coefficientLow Friction coefficientParts of high-precision machineryParts of high-precision machinery

High RigidityDiamond tools

Wear ResistanceProtective coating formagnetic storage medium

Low Friction coefficientParts of high-precision machinery

CorrosionResistanceEnvironment-resistantsensors,container, pipes

ChemicalResistanceChemical-resistantsensors,container, pipes

Wide Band GapHigh dielectric voltage diodeHeat-resistant element

PhotoresistorPhotoelectric sensors

High ThermalHigh ThermalConductivityConductivityVLSI substratesVLSI substrates

Low ExpansibilityLow ExpansibilityShort wavelength radiationShort wavelength radiationoptical elementsoptical elements

Heat ResistanceHeat ResistanceVery heat resistant materialVery heat resistant materialin inert atmospherein inert atmosphere

High ThermalConductivityVLSI substrates

Low ExpansibilityShort wavelength radiationoptical elements

Heat ResistanceVery heat resistant materialin inert atmosphere

HF TransmissibilityHF Transmissibilitysurface acoustic-wavesurface acoustic-waveelement for mobileelement for mobilewireless communicatorwireless communicator

High Speed of SoundHigh Speed of SoundUltrasound generator/Ultrasound generator/transmitter elementtransmitter elementUltrasound diaphragmUltrasound diaphragm

HF Transmissibilitysurface acoustic-waveelement for mobilewireless communicator

High Speed of SoundUltrasound generator/transmitter elementUltrasound diaphragm

Color Centervariable wavelengthsolid- state lasersOptical memory element

Diamond provides various possibilities with its outstanding properties

Profile of Tomei's Diamond Abrasives for Wide-Ranging Tool ApplicationsWe are ready to serve our customers with a lot of grades of synthetic diamond by shapes, colors, coatings, etc. to meet their highest demands to satisfaction.

High EnergyBeam

Resistivity

Here are a few examples of how diamond and CBN abrasives are used:Tools using diamond and CBN

metal-bond wheel

resin-bond wheel

vitrified bond wheel

segment wheel

electroplated wheel

diamond wire saw

diamond drill bit

diamond core drill

others

Tools with sintered diamond or CBN are used in/for:

grinding of non-ferrous and ferrous metals, wood, ceramics,plastics, hard-grinding materials, and as die and otherwear-resistant part materials

Diamond and CBN Tools Production in Japan (2013)

(source: "Statistics on Diamond and CBN Tools", IDAJ)

Transition in Production of Diamond and CBN Tools in Japan

as separate particlesand held in a tool body

Nanometer diamondparticles are used in/for

Tools with sintereddiamond orCBN are used in/for:

machinery, metal workinghard alloy workingcamera and watch makingglass and ceramic industrieselectronics industy

stone, ceramics and construction materials

sapphire, silicon, SiC and quartz working

mining, engineering, construction, boring, etc.

mining, engineering; glass, fire bricks and concrete working

abrasive paste preparation, hard alloy works and die polishing

jig and other tools grinding, semiconductor polishingelectronics industry and metal working

（M.Yen）

40,0002011 2012 20132010200920082007

110,000

100,000

90,000

80,000

70,000

60,000

50,000

Diamond griding Wheels 33%

Diamond Turning &Milling 12%

Diamond Segmented Tools 9%

Diamond dressers 7%

Diamond Others 7%

Diamond Slicing Blades 6%

CBN Tools Total 26%

Diamond and CBN Abrasive Products

MD500 (Avg. Size: 500 nm)

CBN Abrasive Products

cumul. freq. (%)

Particle Size (µm)

rel. freq. (%) cumul. freq. (%)

Particle Size (µm)

rel. freq. (%)100

80

60

40

20

0

20

16

12

8

4

00.1 0 10 100 1000

100

80

60

40

20

0

25

20

15

10

5

00.001 0.01 0.1 1.0 10.0

IRM 8-16 (Avg. Size: 9.2 µm)

ISBN-RISBN

ISBN-V2ISBN-V

CBN (cubic boron nitride), second hardest substance after diamond, effectively cuts and grinds ferrous materials,which erode diamond.

Diamond Particles: Micrographs and Size Distribution

Diamond and CBN Abrasive Powder Products

Uses, such as:

Diamond Powders

CBN Powders

with micron size diamond:dicing blades

with micron size diamond:pastes

with micron size diamond:diamond wires

coated mesh size:diamond wheels

mesh size diamond:electroplated mounted wheels

mesh size CBN:cup-type wheel

IRM

IRM - Fmicron sizes

submicronsizes

mesh sizes

IMM -H

HM

TED-MⅡ

IMM-HE

IMS -10

TMS

IMS -15

IMS -20

mesh sizes above, Ti coated

IMS -H

IMS

IMG

TED

TED - II

TED -S

IRV

IRV -3

IRM -NPIRM -NP30IRM -CPSIRM -Ti2

IMM -HNP30IMM -HTi2

IMG-NPIMG-NP30

IRV-NPIRV-NP30IRV-NEP

IRV-3NPIRV-3NP30IRV-3NEP

IMS -25

MD

PMISBN -Mmicron sizes

mesh sizes

ISBN -MNPISBN -MTi2

ISBN -NP

ISBN -RNP

ISBN -VNP

ISBN

ISBN -R

ISBN -V

ISBN -V2

ISBN -E

ISBN -P

mesh sizes above, Ti coated

PCD

PCBN grades

EM・EⅡM・HM・SM・GM・98FⅡM・FM・VM・WC seriesTDC grades

cut shapes (of the above grade materials)

special products with increased/decreased abrasive/overall thickness (cone and IDD grades)

E III M・HMIDC grades

cut shapes (of the above grade materials)

350・GX90・GX80・GX60・FX50・GX40TBC grades

cut shapes (of the above grade materials)

special products with increased/decreased abrasive/overall thickness

Poly Crystalline Diamond and Poly Crystalline CBN Products

Uses, such as;

TDC -HMCNGA120408

TDC -V60MCNMX120408

TDC -CONElathe center

TDC-H specialty product(workrest)

IDC - HMTipsaw for woodworking

TDC -Gdrill

TBC -GX60TPGW110304

TBC-GX40CNGA120408-2

TBC -GX90TPGN110308

Established Quality Assurance SyetemAs Japan's longest experienced diamond abrasive manufacturer we have been performing an established secure quality assurance , so that Tomei industrial diamond products meet severe and various demands in precision of every customer .

NamePresidentEstablishmentLocation

Line of BusinessCapitalBanks

Account closing dayNumber of employeesPlant scale

：：：：

：：：

：：：

Tomei Diamond Company, Ltd.Hiroaki IshizukaApril, 1953Head Office／Akasaka-mitsuke Kitayama Building 8th floor　　　　　　　9-18 Akasaka 3-chome, Minato-ku　　　　　　　Tokyo 107-0052, JapanOyama Plant／5-1 Joto 4-chome, Oyama, Tochigi 323-0807, Japan 　　　　　　　 (2 km north of Japan Railway Oyama Station on　　　　　　　　Tohoku Trunk Line and Utsunomiya Line)Production, processing and sale of diamonds for industry and gem usesJPY 200,000,000Mizuho Bank , The Bank of Yokohama , The Bank of Tokyo-Mitsubishi UFJMitsubishi UFJ Trust and Banking Corporation , The Ashikaga Bank , Sumitomo Mitsui Banking Corporation , Shoko Chukin BankMarch 31st170Land 25,500 m2 / Building sites 15,400 m2

Company Profile

1961, May:

1962, March:1966, July:

1972, March:

1984, July:

1985,January:

1988, April:

2004, April:

2009,December:

2010, April:

2012, May:

The Ishizuka Research Institute (IRI, represented by Mr. Hiroshi Ishizuka)succeeded in Japan’s first synthesis of diamond. He was also the pioneer researcher in the technology of producing high purity metal of zirconium,titanium and silicon.IRI started the mass production of its synthetic diamond.IRI succeeded in the development of a large scale diamond synthesis apparatus, in order to steadily supply economical diamonds and meet the increasing demands in Japan in the period of rapidly growing economy.Tomei Diamond Company was established; IRI licensed to produce and sell industrial diamond products.Osaka Tomei Diamond was established, in order to promote the sales of diamond to western Japan.For the promotion of production and sales business a second Tomei Diamond was established and licensed to produce diamonds and sell to the first, which was to specialize its sales.Tomei Corporation of America (TCA) was established in NJ, USA., in order specially to meet the demands in entire America.Tomei Dia International was established for export business, which was separated and transferred from the first Tomei Diamond.Tomei Diamond Company, first and second, Osaka Tomei Diamond and Tomei Dia International were merged together and inherited the name“Tomei Diamond Company, Ltd”.Tomei Diamond (2009) was merged with IRI. The whole entity was then renamed Tomei Diamond Company, Ltd. (current).We got approved by Business Innovation Plan of Tokyo Metropolitan Government.

Brief History of Group Companies

2014.04

Oyama plant

4-chome, 5-1, Joto, Oyama, Tochigi

323-0807, JAPAN

Tel.(+81)285-22-5821 Fax.(+81)285-22-5827

Sales department

Akasaka-Mitsuke KITAYAMA Bldg. 8th Fl.,

3-chome, 9-18, Akasaka, Minato-ku, Tokyo

107-0052, JAPAN

Tel.(+81)3-3585-7981 Fax.(+81)3-3585-3282

tomeidiamond@nifty.com