carmelo papa.ppt
TRANSCRIPT
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Materials for the 2020 Challenges:
The view of industry
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Materials for the 2020 ChallengesEuropean Parliament Brussels. July 10 2012
Carmelo Papa
Executive ice President!
"ndustrial and Multisegment #eneral Manager
$TMicroelectronics
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%utline 2New materials can address societal challenges by:
&oosting performances of 'ey ena&ling technologies
introducing entirely new functions in systems and changing
manufacturing flow
Examples of new materials in semiconductor industry:
$iC and #a( for the new wave of power electronics
Polymers and flexi&le electronics for healthcare
Keep looking at advanced materials: e.g. graphene
Bridging the gap between material science and market
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From Materials todei!es to systems"
".andi!eersa# pro$lems
from appli!ations leadingto applied and fundamental %&'FundamentalMaterial studies
Early dei!eprototypes
'ei!e engineering
and industrialisation
(ppli!ations
( long path from materials to appli!ations
ele!tri!)hy$rid !ar
(l
*+,-iC
i/-iC2
0.0 0.5 1.0 1.5 2.0
10-12
10-11
10-10
10-9
10-8
10-7
10-6
10-5
10-4
10-3
10-2
10-1
Ni2Si/4H-SiC
T=25 K
473 K
98 K I(A)
Forward bias (V)
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$ocietal challenges calling for &etter power
actuators: energy efficiency and)
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il pri!e in!rease
3 456 of produ!ed energypresently deried fromhydro!ar$ons
7yoto proto!ol on redu!inggreenhouse gas emissions
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)*people concentration in megacities
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+
Healthcare spending is growing fast : currently !" of #$% for &'()
*" of #$% for Europe
#lobal Healthcare spending is more than ! +rillion $ollars per year
+his spending trend is unsustainable for the future economy
+o counter this trends) the Healthcare industry must change
( move towards %ersonal Home $iagnostic
'ocietal ,hallenges in Healthcare
Sensors around the body
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Emerging ,pplications re-uire $mart "ntegration :Moores Law and More than MooreMoores Law and More than Moore
More than Moore # 'iersifi!ation
Moore8s
9a:
#Miniaturi;ation
-oCand-iPmi
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From -i Po:er 'ei!es"".
he most re!ent -i M-FEat - Mi!roele!troni!s
0 um -i :afer pro!essingfor adan!ed >?Bs dei!es
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=.to 'i, and #aN power devices
/
$ource: ole veloppement!
3Better power density3/ower losses3Higher operation temperature3Higher operation fre>uency
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95! 'i, and #aN power device +(-:
?5.!B
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'i, and #aN power devices
$ource: ole veloppement! $TMicroelectronics
#aN %rogram#aN %rogram7!50 1 !( HE-+
7!50 1 955( HE-+
#aN +ransistor vs. 7!5 0 uency
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'i, and #aN in 2enewable Energy
$ource: i$uppli
%0
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'i, and #aN in Hybrid G Electric 0ehicles
$ource: ole veloppement! $TMicroelectronics
HE0 1 E0 958 'emiconductor +(-:?.6B
,(#2 95D958: 9*"
P7E: Plug8in 7y&rid Electric
ehicles
2ectifiers
%ower'witches@-'3E+)
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$mart $ystems are everywhere and re-uire
the introduction of a wealth of new materials
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Healthcare
& Fitness Automotive &
Transportation
AmbientIntelligence
WearableElectronics
Gaming &Leisure
Portable
Consumer 'le(i$le Conforma$le
Self Powered "utonomous
)ireless islocation
Cost #ffective isposa$le
*ight Porta$le
Human
Interface
ecurit! &
afet!
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;lexi&le Electronics: a new material for $mart $ystems
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***adding material 'nowledge for ;lexi&le < isposa&le Electronics
BioDmaterials
-etal=(on ferrose 4,l! Ti! Cu! ,g! Tg! ,u! (i6
Polimers ((on Metal=%rganics=Thermoplastic6
3 Polimmide
3 PC
3 C%P
3 PET
3 PE(
Cerami!s ((on Metal = "norganics6
(dvantages tenacity
low specific weight
wor'a&ility
'isadantages low mechanic resistance
degradation over time
deformation over time
Polymers
(dvantages mechanical characteristics
higher resistance to the use
ductility
'isadantages >ow &iocompati&ility
?igidity
7igh specific height
Corrosion in physiological environment
Metals
(dvantages #ood &iocompati&ility
Chemical inert
7igh resistance to compression
?esistance to corrosion
'isadantages >ow resistance to traction
7igh specific weight ;ragility
>ow wor'a&ility
Ceramics
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The pro@ect challenge is the development of interconnection technologies for
autonomous! flexi&le and smart system:3"nterconnection technologies &etween flexi&le components and flexi&le foils as well as
&etween functional foils*3Three dimensional functional foil integration to achieve multi8foil &ased systems! i*e*
system8in8foil*
Technical Demonstrator
Energy autonomous indoor air quality sensing system capable of wirelesscommunication of the measured data
"ncreasing complexity &y multi8foil 9
integration on flexi&le su&strates
1+
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;lexi&le Electronics at $TMicroelectronics,pplication fields:
3 Printed sensors = ;lexi&le "Cs
3 Multifunctional systems on foil3 $mart disposa&les for healthcare
and am&ient intelligence
Technologies:
3 ;rom litho8&ased on wafer carriers
) to printed electronics carrier8less
3 To 7y&rid system integration 4e*g* multi8foil6
!ireless Strain "auge Modulesfor pressure and temperature
Sensors around the body
Examples:
3 'ensors on plastic: strain1pressure)temperature) gas and biosensors
3 'mart obects with 23 harvesting andwireless communication
3 +ransparent and 3lexible electronics) incl.printed organics and oxides
3
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(pplication: Contact >ens for non8invasive earlydiagnosis and personaliAed treatment of #laucoma
4customer: $E($"ME ,#6 $T $ensor is a strain gauge G antennaem&edded in
a silicone contact lens
The $ensor is capa&le of measuring corneadeformations due to
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Example:Dia!etes Management with implanta!le !iosensors
,pplication: Continuous #lucose
Monitoring 4C#M6
!or-ing )eference Counter
Source: $medtronic$com
.s of /010 about 245 million people around the world2 areaffected by Type / Diabetes Mellitus disease Complicationsarising from diabetes can be both .cute and long term andinclude hypoglycemia2 3etoacidosis2 coma2 renal failure2amputations2 neuropathy2 and retinal damage
*n the last decade "lucose sensing technology became themaor research focus in diabetes management area2 and 406of $iosensor maret are the glu!ose sensors
%ver the next 10 years the cost of dia&etes! heart disease!
and stro'e will ta'e a tremendous toll on the national
incomes of developing world countries*
(ccording to IH) diabetes) heart disease) and stroketogether will cost about ?!!!.J billion in lost nationalincome in ,hina) ?454.9 billion in the 2ussian 3ed.?447.7 billion in
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Example: "iosensors for healthcare # fitness
,mperometric sensors: from #lucose to >actate
monitoring /actate levels are related to the
anaero&ic meta&olism associated
with muscle contraction: 0*+ 2 millimoles in resting
up to 20 or 90 mM during activity
,thletes have to stop physical activity when they reach their lactate threshold* (im: to avoid metabolic disorders and inured tissues during sport
activities* -onitoring of several pathologic conditions! such as the case of patients
with cardiac disease and diabetes*
Multisensing of &iological functions Biological chemical sensors associated with other physical
and mechanical sensors! such as EC#! accelerometers!gyroscopes! temperature! pressure! light! etc*)
"t re-uires dedicatedelectronics a&le to ac-uire the signalsfrom sensor! process them and transmit to a porta&le remoteunit 20
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;rom 7ealthcare to ,m&ient "ntelligence
3 Multifunctional systems em&edded in
everyday o&@ects:
a6 Direless sensor networ's3 Network of sensors em&edded with lowDcost
electronics with 23 G analog processing capa&ility
3 %pportunities:3 Multi8sensors integration at each sensor node3 >ow power 4either with &attery or &attery8less! where
possi&le6
&6 $mart o&@ects in pac'aging < textile
3 7igh volume 4existing mar'et for ?;"63 %pportunities:
3 Electronics on plastics) paper) textile3 #as and chemical sensors in smart obects3 3lexible G streatchable electronics
associated with other functions and technology drivers:e*g* displays) energy harvesting) &/% radios
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Thinnest material sheetimaginable5yet the strongest6
(7 times stronger than steel and much lighter6
"raphene is a semimetal# it conducts as good (in factbetter6 than the best metals2 yet its electrical properties canbe modulated (it can be switched ,9 and :,;;4$8 m.?m2 e@uivalent to 10A.?cm/
Superb heat conductor (B'40 than Si
)ecord electron and hole mobilities (B100 than Si
#raphene has the potential to revolutioniAe numerous fields:
Electronics! materials science! chemistry! &io8sensors)
.pplications# new devices due to ambipolar transport2 e'cellent electrostaticconfinement2 integration with Si andwith fle'ible?transparent substrates
eep watching new materials! e*g* graphene
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Market
Technological
developmentPilot deployment
Pilot line
European three pillars bridge to pass across the valley
Knowledge
The valley of death
+lo$ally competitive
manufacturing facilities