CATALOGUE ELSOLD 2006

___________________________________________________________________ 20 rue du Petit Chantilly _ BP.05 Sarl au capital de 38 400 € 60510 BRESLES Siret 341 149 011 00031 ℡ : +33 (0)3 44 07 99 48 APE 518J

: +33 (0)3 44 07 99 68 TVA FR4534114901100031 RCS Beauvais sicomel@sicomel.fr http://www.sicomel.fr

ELSOLD' advantage by innovationSoft - Solders for special Soldering TechnologyIncreasing minialurizing and requirements lor long - term reliability of the entire electronics with extended effeclivepower require choice solder quality. Therefore ELSOLD€ solders are exclusively made of carefully sêlêcted High puitymetals of first melt.

ELSOLDo Wave Soldering Machines A oyt Melting point/ Operation temperatureMachine Solders Solder circulâtêd Systems Melting Rânge (recommended)

with and without inert gas S-Sn60 Pb40 P 'j83'C-190"C Z4O"C-260,Cphase S-Sn63 pb37 p tB3"C 24O"C-260.C

S-Sn64 Pb36 P 183'C-185"C 240.C-260"CS-Sn62 Pb36 Ag2 178"C'180'C 240.C-26O"C

'further alloys on inquiry

ELSOLD6 Dip Soldering A oys., t etting point / Operation temperatureHigh Temperâture Dip Tinning Melting Range (recommended)Solders High tempefarure S-Sn6O pbCup/HTF 183.C-190"C 240.C-3SO.C

range application S-Pb91 Sng Sb1 280"C"305'C 3S0.C-4S0"CS-Pb93 Sns Ag2 296'C-301"C ùbêr 450"CS-Pb95 Sn3 Ag2 304'C-310"C ùber 450"CS-Pb97 Ag3 305'C ûber 450"C

"as per intêrnal âlloy catalogue further alloys on inquiry

ELSOLDo Lêad{ree soft solders Suitable solders are avâilable lor application specific ând speci-Solders Special Low-melting alloys al manufacturing procêsses to meet your requirements. Further

solders lor static solder dètails lo be taken from the technical data sheêt.baths

ELSOLDo For optimum surface Advantages: minimized formatjon of oxides and solder bridges.Deoxidizing tension in the solder bath Furlhêr details to be taken from the technical data sheet.Tablets

Service Technicaladvice and process support. Problem relaied research and development. Relunand recycling of waste metal. Analysis report of solder baths and evâluation. Certificates ofconformance DIN / EN 10204.

Delivery Standard Width / Height mm Length mm Weigth kgSlandards

Triangular Bars 8x10 400 bundtes of 25 kg

Solder Blocks with 50x18 600 approx 4,3 kgSuspension Eye 50x20 490 approx 3,7 kg

Clippings lor start-up 8x10 ca. 40of Soldering l\rachines

Further Design Thick and Wide Bârs, Ftat Strips, Rods, Thin Bars, Threads,Solid Wires and so forth on inquiry.

Valid Stândards DIN 1707-100. DIN EN 29 453ln addition we are manufacturing in accordance with all common foreign standards. Beyondexisting standards specialalloys can be made availabe upon customer's spezification.

Fluxeslor Soft Soldering

No - clean

halide-free

resinJree

Solids Content

Special-

plâsticized

ELSOLD'

Soldering

I\,1âchine Soldeingof pdnled cùcuit boards

General applications

General applicalionsby Electfic Induslry

D€velopment, lesl and Optlmlzâllon olFluxes Accordlng to CustomeB Requlremsnts

Advice and Support of Users

Oplimum Solder and Wetling PropertiesFleduction oJ lcicie Bddge Formation

Low Solder Consumption

Data sheets are avâilable for lhe Indlvldual Fluxing Agents.

ELSOLD' soft sotd"r wires and Ftux cored wiresConlnuoLs Oualily demands a@ niluencing requ remenls on eeclronc lools and syslems consideraby.

Doe lhe lrcreâsing use oi assembly eemenls wth more precise connêxons on lhe one sid€ ând relabiilyol lhe producl asked lor on lhe olher hand opl mLm so der ng capabi ity becomes more and more rnpodanl.Substantial crileions for this in contorm ly with env ronmenl and recyclng - âre choice of adequale so ders

Everybody having in ûrind lo parlicipâle n lhe lechnicallulure has to meel lhs lask.

JL Gosrar w lr assisr yoù tô lind your individuâlsôfi sôlder prodocr.

snlPb cu las orherc

lrelting

s-sn60Pb38cu260 38 2 183 190 Electr cal equipmenl, eleclron cs,

s-sf62Pb36Ag2

s-sr60Pb36Ag4

62

60

36

36

2 178 180

178 I80

8,4 sl\47

for capacilor coalngs, oscilaiing cryslâls,

Hl9h s-Pb60sn40

S-Sn70Pb30

S-Sn63Pb37

S-Sn60Pb40

S-Pb50Sn50

S-Sn90Pb10

40

70

63

60

50

90

60

30

37

40

50

1 0

183 235

183,192

183

183 r 90

183,215

183 215

9,3

8,4

8,5

Special so der, componenl labrication

Special so der, componenl labrication

prinled c rcLil boards, SMT

Fine solder linnng, pnnted ctcuit boards

tnned or copper - plaied parls

S-Sn50Pb32Cd18

S'Sn96Ag4

S Sn95Sb5

s'Pbg1Sn8Sbl

s'Pbg3snsAg2

s-Pbgssn3Ag2

s-Pb97Ag3

50

96

95

8

5

3

32

9 l

97

93

95

2

2

3

18Cd

5Sb

1 S b

221

234-240

280 30s

296 301

304-310

305

8,5

7,3

7,3

10,6

11,2

1 1 , 0

panicularly qenlle solderng on siver plaled

e eclrical induslry el€ctromolors

e eclrical induslry elecÛomolors

e ecl ca!indùslry êlectromotors

e eclrica induslry, electrornotors

ELSOLD'97

949

3

5

230-250

220-235

7,3

7,3

wilh high leâkage resistanceh gh resistance lo cenlrilugal iorces

Fuiher al loys special solders lor lead-l 'ee solder,ng and hrgh lenperature solder joints on i lquiry

Ffux-cored solders to DIN EN 29454-'l ELSOLD'DIN EN 29 454-1

Deslgnatlon

DtN EN tSO 9455-12

rype descdption and teâturês

1.1.1. (F-SW 31) 0 Pure naluE ros n WW

1.1.3. (F SW 32) c

Q2

c3

c5

FS 28

0

0

0

0

0

0

rosin wilh âdded organ c,halide-lree activator sùbslances

Specialrosin ilùx, ony suitable forELSOLD F iLxpor Soderwrc

on bas s of modified resines lof SMT

2.2.3. (F-SW 34) 105 0

1.1.2. (F-SW 26) A2 0,50

o,75

1,00

l',4ade lrom mod fied rosin wilh additivesol carboxylc acd and olganic, haide-conranng

2.1.3. (F,SW 24) 0 Made from urea wilh addedhaldenee orgânic âcids

2.1.2. (F-SW 2s) T 240 Produced on bâsis oi orgânic cârboxyiic acid

Flux content ol cored sode6

Selection irom 0,5% 4,5% in sleps oi 0,5o/o

This niormalion appies to solders witlr one llux core only

Delivery Slandardr one-wây plaslic rcelssell'supporling rinqs:othêr r€êls on app icâlion

Soft Solders to lnternational Standards

In addilion lo lhe soft solders and soder wircs to DIN EN 29 453 andDIN 1707 100 ând EN ISO 12224-1 we manufacrure ro lhe moslmportânt Intemational Slandards.

J - STD - 004/ 005 /006ASTlv lB32-00ESA PSS - 01 ,708 / ECSS Q 70 - 08AE C S S ' O - 7 0 - 3 8 AJ|s 2 3282 ,99

ELSOLD'soft sode6 have also proved then valùe in space. Alspace vêhices aunched by lhe EUROPEAN SPACE AGENCY(ECSS)are soldered wth ELSOLOeSon solders to rhe ECSS solderstandard and hâve won â cam fôr lheir great relabiity and ong

Upon reqLesl solderwûes wth 3 4, or 5flux cores can bê supplled,

lrom 0,25 mm and upwards

100q 2509l00g 25095kg 10kg

rxs1ks

20kg

5009500915kg

ELSOLD' sotd", PastesContinuous innovations for optimum applictiontechnique in the field of micro electronics

Wlth continuous development oi SIVID components, as well âs speciai lypes of construction requirements lor structuralcomponents manufacture are increasing- lvosi important for the first operation step is the optimum choice of solderpasle for the enure process qualily and produciion result. JL Goslar experienced in production and dêvelopment ol highquality solder pastes for years wil assist you to select lhe best suitable solder paste.

Solder al loys Composit ion in % Melt ing Point in'C UseDescription Sn Pb Ag In Solidus Liquidus

S-Sn 62 Pb 36 Ag2 62 36 2 179 179 Hybrid circuits

S-Sn 63 Pb 37 63 37 183 183 S[/D-Circui ls

S-Sn 54 Pb 26 In 20 54 26 20 132 149 Temperature-sensilive componenls

S-Sn 96,5 Ag 3,5 96,5 3,5 221 221 Eulectic lead{ree alloys

Reaction solder pastes for lead{ree soldering ând heal resistant solders.

Further aloys olr nquiry.

Method of application Metal conlent in % Viscosity in Pa.s Powder Type Metal particle size

Dispenser 88 200-400 2 45-75 pm

Screen printing 88-90 400-600 3 20-45 pm

l\,4ask pr nting 88-90 600-900 4 15-25 pm

The paste-types 2, 3 and 4 are available in the previously listed application forms.

Activaiion varianiELSOLD" solder pasles are available with the following flux formulations:

Flux Type/Numbers Description

RMA / 1.1.3. Pure natural rosin with organic, halide-free aclivator additives, without amines,{F-SW 32) diamines or urea. The llux residues are non-corrosive and can remaln

al the solder joinl.

RA / 1.1.2. Pure natural rosin to which organic halide-containing activators have been(F SW 26) added. Fluxes can remain al the solder joinls.

No Clean / 2.2.3. Low residue flux on basis of halide{ree organic acids with naiural rosin{F-SW 34) but withoul amines. diamines or urea.

Packing OrderingInformation

AiFtight glassjârs with

Dispensercartridges

Soldering

109 309 1009 10009

1009 2509 500q

Reflow solderingand / or nihogen

Shelt llfe / StofageProcessingDirections

ELSOLD electronic solder pasles with guaranteedshelf life of 6 month min. if stored in sealed originalglass jars / dispenser carlridges at room lempera-ture. upright storage of cartridges. Procêssing tem-perature 20-25 "C. Solder paste to be well tempe-red and mixed prior to use.

by means of lR, convection, airand vapoÊphase soldering a.s.o.

Results Excellênt solderjng ând wetting properties, low residues, oulstanding pressure and dosing, lcicleBridge Foamation.

Seruice Individual optimization of solder pâstes to custo-mers requirements.

Advice and support of users.

Analysis of soldered joint by means ol metallogra-phy, scannjng electron microscope, cathode beamm|cro probe.

Quality / Reliability Control of electronic compo-nents

Chemical analytic

Fâult and process analysis in the solderingtechn ique

Ouality Guafantee Conlinuous quality controls by means of latest ana-tytic methods guârantee a constant product qualjtyof each single charge of solder paste.

Quality System DtN EN tSO 9001