cemal basaran - ub electronic packaging laboratory
TRANSCRIPT
Cemal Basaran
Department of Civil, Structural
and Environmental Engineering
243 Ketter Hall
University at Buffalo, SUNY
Buffalo, NY 14260
Tel: (716) 645-4375
E-mail: [email protected]
Web page: www.packaging.buffalo.edu
Citizenship
United States of America.
Education
Ph.D. Dept. of Civil Engineering and Engineering Mechanics, University of Arizona,
Tucson, AZ, December 22, 1994. Cum. G.P.A. 4.00/4.00
M.S. Dept. of Civil Engineering, M.I.T., Cambridge, MA, May 27, 1988. Cum. G.P.A.
4.80/5.00
Honors and Awards
Department of Defense ONR Young Investigator Award, 1997, ($500,000.0). In 1997 one of the
29 junior faculty members and the only Civil Engineering faculty in the U.S. to receive the
award.)
Riefler Award, State University of New York at Buffalo, 1997.
ASME Journal of Electronic Packaging, Associate Editor of the Year, 2005.
Fellow of ASME, May 1, 2008
Journal Editorships
Associate Editor, IEEE, Trans. On Components, Packaging and Manufacturing Technology,
January 2011- present
Assoc. Editor, ASCE Journal of Nanomechanics and Micromechanics, March 2011 - present
Associate Editor, Trans. of ASME, Journal of Electronic Packaging, October 2003- present
Associate Editor, IEEE Transactions on Advanced Packaging, July 2003 –December 2010
Regional Editor for Americas, Int. Journal of Materials and Structural Integrity, 2006-present
Editorial Board, The Open Civil Engineering Journal, 2007 – present.
Editorial Board, Journal of Recent Patents On Electrical Engineering, January 2008 – present
Editorial Advisory Board, The Open Numerical Methods Journal, September 2, 2008 –present
Editorial Board, ISRN Mechanical Engineering, October 2010 - present
Guest Editor, International Journal of Damage Mechanics. (Special issues on Electronic
Packaging April 2001, July 2001
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Guest Co-Editor, International Journal of Materials and Production Technology, special issue on
Micro/Nano Electronics, NEMS and MEMS Packaging, vol. 34 No1/2, 2009
Guest-Editor, ASME Journal of Electronic Packaging, Special Issue on Carbon Nano Tube and
Graphene in Electronics, and NEMS, June 2011
Guest Editor, ASCE Journal of Nanomechanics and Micromechanics Inaugural issue on recent
Advances in Nanomechanics and Micromechanics, March 2011
Professional Experience (academia)
University at Buffalo, SUNY
Professor and Director 8/2005 – present
Electronic Packaging Lab
Assoc. Professor and Director 1/1999 – 7/2005
Electronic Packaging Lab
Assistant Professor 9/1995 - 12/1998
Visiting Assistant Professor 10/1994 - 9/1995.
University of Arizona
Research Assistant 1/1992 - 8/1994.
M.I.T.
Teaching Assistant 8/1986 - 6/1988
Ph.D. Dissertations Supervised as the Primary Advisor
1- Cheng-yong Yan, "A Damage Mechanics Based General Purpose
Interface/Contact Element," February, 1998, Senior Engineer, PICO Design
Corp., Detroit, MI.
2- Rumpa Chandaroy, "Damage Mechanics of Microelectronics Packaging Under
Combined Dynamic & Thermal Loading" August 1998, Project Engineer, Altair
Engineering, Detroit, MI.
3- Ying Zhao," Mechanics of Ball Grid Array Packages: Testing and Modeling,”
December 2000. Senior reliability Engineer, Analog Devices Inc., Norwood, MA.
4- Hong Tang, “A Thermodynamic Damage Mechanics Theory and Experimental
Verification: For Thermomechanical Fatigue Life Prediction of Microelectronics”
November 2002, Senior Mechanical Engineer, Honda Electronics, Detroit MI.
5- Heng Liu,”Phase Reconstruction of Phase Shifted Moire Interferograms Using
Continuous Wavelet Transforms,” July 2003, Senior Engineer, KLA-Tencor, San
Jose, CA.
6- Yujun Wen, “Thermomechanical Analysis of Multilayered Microelectronic
Packaging: Modeling and testing” December 2003, Vice-Chief Engineer,
Shanghai Shentong Holdings Co., Ltd.
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7- Hua Ye,”Mechanical Behavior of Microelectronics and Power Electronics Solder
Joints Under High Current Density: Analytical Modeling and Experimental
Investigation”, March 2004. Received International Microelectronics and
Packaging Society (IMAPS) 2002 Award, $15,000, for his PhD work. One of four
chosen internationally. Reliability and Component Engineer, Microsoft,
Redmond, WA.
8- Shihua Nie,” A Micromechanical Study on Damage Mechanics of Acrylic
Particulate Composites Under Thermomechanical Loadings” May 2005,
Structural Engineer, Skidmore Owings & Merrill, San Francisco, CA
9- Juan Gomez “A Thermodynamic Framework for Damage Mechanics of
Electronic Packaging Solder Joints Including Size Effects”, February, 2006.
Assist. Professor, Escuela De Ingenieria, University of EAFIT, Medellin,
Colombia.
10- Minghui Lin,” A Thermodynamic Framework for Damage Mechanics of
Electromigration and Thermomigration”, September, 2006, Structural Engineer,
L&W Engineering Group, Linden, NJ.
11- Mohammed Abdulhamid, “Thermomigration; An Experimental Damage
Mechanics Study on Nanoelectronics Lead-free Solder Alloys ”, May 2008.
Lecturer, Faculty of Mechanical Engineering, Universiti Teknologi, Johor,
Malaysia
12- Shidong Li, ” A Multi-Scale Damage Mechanics Framework for Nanoelectronics
Interconnects and Solder Joints”, May 2009, Staff Engineer/Scientist, IBM
Fishkill, NY.
13- Tarek Ragab, “A Multi-Scale Electro-Thermo-Mechanical Analysis of Single
Walled Carbon Nanotubes, May 2010, Assistant Professor, University of Tabuk,
Tabuk, Kingdom of Saudi Arabia.
14- Michael Sellers, “Atomistic Modeling Of The Microstructure And Transport
Properties Of Lead-Free Solder Alloys”, September 2010, Research Associate,
US Army National Labs, Aberdeen, MD.
15- Mustafa Eray Gunel, “ Large Deformation Micromechanics of Particle Filled
Acrylics at Elevated Temperatures” , September, 2010. Consultant, Terra
Technology, Norwalk, CT.
16- Bicheng Chen, “Nano Resolution Moire Interferometry” , May 2011,
Development Engineer III, Tyco Electronics, Harrisburg, PA.
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17- Yongchang Lee, “Multi-Scale Damage Mechanics of Power and Nanoelectronics
Under Time Varying Loads” expected graduation May 2012.
18- Wei Yao, ”Quantum Mechanics of Carbon Nanotube and Graphene Resistance
and Degradation under High Current Density”. expected graduation May 2012
19- Yanbiao Chu, “Quantum Mechanics of High Current Density Induced Damage in
Graphene “, May 2012
20- Pierre Gautreau, “Using Graphene and SWCNT for Next Generation Power
Electronics: A Multi-Scale Analysis Framework” expected graduation May 2013
21- Tingyue Lan, ”Graphene for Power Electronics” expected graduation May 2015
Ph.D. Dissertations Supervised as a Committee Member
1- Zongrong Liu, “Electrically Conductive and Thermally Conductive Materials for
Electronic Packaging” September 2004, Primary Advisor Prof. Deborah D.L.
Chung of MAE Dept.
2- Sang Kyu Kwak, “Studies of Point Defects in Strained Solids By Molecular
Simulation,” May 2005, Primary Advisor David Kofke of CBE
3- Chia-Ken Leong, “Improving Materials for Thermal Interface and electrical
Conduction by Carbon” May 2007, Primary Advisor Prof. Deborah D.L. Chung
of MAE Dept.
4- Dong Keon Kim,” A Cyclic Viscoplastic Damage Model with Application to
Seismic Response of Metallic Dampers,” May 2010, Primary Advisor, Prof. Gary
Dargush of MAE Dept.
Post-Doctoral Fellows Advised
1- Hale Ergun,PhD, Damage Mechanics of Infilled Composites, September 2004 -
August 2005.
MS Theses Supervised as the Primary Advisor
1- Rumpa Chandaroy, “Nonlinear Dynamic Analysis of Microelectronic Packaging
Interconnects “, 12/1996. (Senior Engineer, Altair Engineering, Detroit, MI.)
2- Joseph Ball, "3-D Building Design,” 12/97, (Staff Engineer, ATSI Inc. Buffalo, NY.)
3- Jianbin Jiang,”Size Effect for Pb/Sn Solder Alloys and Its Measurement by Nano
Indentation” May 2002, (PhD candidate Univ. of Tennessee at Knoxville)
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4- Minghui Lin, “Electromigration Caused Damage in Microelectronics Pb/Sn Solder
Joints”, May 2002, (PhD Candidate University at Buffalo, SUNY.)
5- Shihua Nie,”Fatigue Behavior of Particle Filled Composites, December 2002, (PhD
Candidate, University at Buffalo, SUNY)
MS Theses Supervised as a Committee Member
1- Mathew Blaczak,”Using Twyman-Green Interferometry for Measuring Material
Properties” Co-Advisor with Dr. Alex Cartwright of EE Dept, April 2001.
2- Kyu-Dong Kim, “Reliability of Soldered and Conductive Adhesive Joints in
Electronics,” April 2002, Primary Advisor Prof. D. L. Chung of MAE Dept.
3- Chia Ken Leong,”Development of Thermal Pastes for High Thermal Contact
Conductance,” May 2003, Primary Advisor, Prof. D.L. Chung of MAE
4- Bhanu Jaiswal,”Innovative Circuit Board-Level Routing Designs for BGA Packages,”
May 2003, Primary Advisor Prof. A. Titus of EE (Funding Advisor Prof. Basaran)
5 – Yuanbo Guo, “Development of a High Current High Temperature SiC MOSFET
Based Solid-State Power Controller” December 2010, Primary advisor, Prof. DC
Hopkins
Undergraduate Research Assistants
1- Stacey Serafin, (Physics major) “Optical Diffraction Grating Manufacturing
Methodologies,” Spring 2001.
2- Tom Downes, (EE major)” Digital Image Processing for Moiré Interferometry Fringes,”
Spring 2001.
3- Jigar Patel,(EE major)” Moiré Interferometry Grating Replication, Fall 2001.
4- Shun Wu, (EE major)“Optical Diffraction Grating Replication for Moiré Interferometry”
Fall 2001, Spring 2002, Summer 2002
5- Julia Johnson, (Park High School Senior) “Fatigue Testing Particle Infilled Composites”
Summer 2002. Sponsored by Minorities in Engineering Program (BEAM)
6- Frankie Jones, (EE major),” Moire Interferometry Grating Replication,” Summer 2002,
Fall 2002
7- Fanor Balderrama, (Computer Science major) Moire Interferometry Grating Replication,
Fall 2002, Spring 2003, Summer 2003
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8- Tushar Bansal, (CSE Major, Honors program),” Pathfinding in printed circuit boards,
Fall 2002
9- Jonathan Davis, (Park High School Senior), Testing Particle Infilled Composites,”
Summer 2003, Sponsored by Minorities in Engineering Program (BEAM).
10- Faaiza Ansari, (Biology and MAE major) Moire Interferometry Grating Replication,
Summer 2003, Fall 2003, Spring 2004, Fall 2004, Spring 2005.
11- Eli Dickinson (Computer Science and English major), Software Development, Fall 2003,
Spring 2004.
12- Maureen West (Buffalo City Honors Senior) Software Development, Summer 2006
13- Yiwei Jin, CSEE Senior Scholar) Deformation behavior of CarbonNanoTubes, Spring
2009
Funding (Not including Consulting)
1- "Unholtz-Dickie Vibration System", University at Buffalo Equipment Challenge
Grant Program, March 20, 1997, Principal Investigator/PD Cemal Basaran, $25,000.
2- "Damage Mechanics of Semiconductor Devices with Emphasis on Interfaces".
Department of Defense, Office of Naval Research Young Investigator Award, June 1,
1997 – May 31, 2001. Principal Investigator/PD Cemal Basaran. The award amount
(not including the equipment grant and UB matching funds) is $350,000; including
the UB matching funds (cash plus in kind) but not including equipment grant the total
project budget is $724,400. 00
3- University at Buffalo, SEAS EngiNET Long Distance Learning Program Equipment
Grant, March 20, 1997, $950.0
4- Riefler Award, UB School of Engineering and Applied Sciences, June 1997, $1000.0
5- University of California SanDiego, Institute for Mechanics and Materials Fellowship
for Fifth Annual Meeting of IMM Young Investigators '97, $250.0+ conference
expenses.
6- University at Buffalo, PDQWL Individual Development Awards Program, $1,000.0
April 16, 1998.
7- University at Buffalo, PDQWL Individual Development Awards Program, $1,000.0
November 4, 1998.
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8- "Reliability of Interfaces in Microelectronics Packaging", National Science
Foundation-GOALI Program/ Intel Corporation, Principal Investigator/PD Cemal
Basaran, Co-PI, Alexander Cartwright and Dr. Terry Dishongh of Intel Corp.,
October 1, 1999, -September 30, 2003, $247,323.0 [including the matching money
from Intel Corporation and UB the total budget of the project is $602,000.0].
9- “An Explicit FEM Code for Damage Mechanics of Solder Joints”, Principal
Investigator/PD Cemal Basaran, Intel Corp. Hillsboro, OR, September 1999-
September 2000, $28,000.0 plus a four Xeon processor Intel server. (Approx. worth
$100,000.0)
10- “Thermomechanical Behavior of BGA Solder Joints “, Principal Investigator/PD
Cemal Basaran, Intel Corp. Hillsboro, OR, January 2000-September 2000, $30,000.0
11- “Laser Mechanics and Damage Imaging Laboratory” Defense University Research
Instrumentation grant DURIP, Department of Defense Co-PI, Alexander Cartwright
February 2000. $325,000.0 (including the UB equipment challenge matching funds)
12- “Grain Size Effect in Solder Joints,” Principal Investigator/PD Cemal Basaran, Intel
Corp. Hillsboro, OR, May 2000- April 2001, $25,000.0
13- “Reliability of Power Electronic Devices” Office of Naval Research, Principal
Investigator/PD Cemal Basaran, May 2000-April 2004. $300,000.0
14- Research Education for Undergraduates National Science Foundation Supplemental
Grant, May 2000-April 2001, $10,000.0
15- UUP Individual Development Awards Program, May 2000, $462.0
16- Unrestricted Grant, DuPont Corporation, September 2000, $15,000.0
17- “Thermomechanical Behavior of Flip Chip DRAM Packaging” Micron Technology,
November 2000-May 2002, $12,500.
18- IT Collaboratory, NY Science Technology and Research Office, $6,000,000.0, PI:
Paras Prasad, of Chemistry, Co-PIs: Cemal Basaran of Civil Engineering, Alex
Cartwright and Pao-Lo Liu of Electrical Engineering, Bruce McCombe and Hong
Luo of Physics, May 2002- May 2005 [This is an equipment grant]
19- “Damage Mechanics of BGA Solder Balls Under High Electrical Current Density”,
International Microelectronics And Packaging Society, Co-PI Doug Hopkins,
October 2001- September 2002. [Graduate student fellowship award], $15,000.0.
20- Reliability of Solder Joint-Metalization Interfaces, AG Communications, October
2001- December 2001, $9,000.0
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21- Equipment Donation, MTS 858 material characterization hydraulic grip components,
Dupont Corp, December 2001, $23,000.0.
22- Research Education for Undergraduates National Science Foundation Supplemental
Grant, December 2001-November 2002, $10,043.0
23- Evaluation of Alternate I/O Routing for Bumpless BGA-Printed Circuit Boards”,
Intel Corporation, Co-PI Alex Cartwright, and Albert Titus of EE, February 2002 –
August 2004, $86,092.0
24- Damage In BGA Solder Joints Under Vibrations, Intel Corporation, April 2002-
March 2003, $25,000.0
25- Damage Mechanics of Composite Structural Systems, Dupont Corporation, August
2002- July 2003, $25,000.0.
26- University at Buffalo, UUP Professional Development Award, June 2002, $510.0
27- Micromechanics of Particle Infilled Composites, Dupont Corporation, , July 2003-
January 2004. $22,000 (including $7,000 in Equipment)
28- Advanced SiC Converter for Embedded Applications, US Navy, PI Dr. D. Hopkins
of DC Hopkins & Assoc., February 2004 - September 2004, $76,000.0, Co-PI Dr. C.
Basaran.
29- Determination of Micromechanical Material Parameters for Particle Infilled
Composites, Dupont Corp., March 20004 - October 2004, $15,000.0
30- Experimental Validation of Damage Mechanics Models for Different Compositions
of Corian, Dupont Corp., October 2004- June 2004, $20,000.
31- Reliability of Next Generation Power Electronics Packaging Under Concurrent
Vibration, Thermal and High Power Loads,” ONR, $ 445,409.00 September 1, 2004
–October, 2007.)
32- Damage Mechanics of Next Generation Nanoelectronics and Power Electronics
Packaging, NY State CAT for Microelectronics Packaging, $40,000, July 1 2005 –
June 30, 2006.
33- Damage Mechanics of NanoElectronics Packaging Solder Joints , $284,500, NSF,
CO-PI David Kofke of Chemical and Biological Engineering, August 1, 2005 – July
31, 2009.
34- Material Properties of Acrylic Particle Filled Composites. DuPont Corporation,
$40,000.0 January 1, 2006- December 2006.
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35- Thermomechanical behavior of Inkjet MEMS, Kodak Corp., October 2006 –
December 2006., $5000.
36- Damage Mechanics of Particle Filled Composites During Thermoforming, DuPont,
Corp., $90,000, January 1, 2008, -December 31, 2010.
37- Solder Joint Quality Inspection, Northrop-Grumman, Amherst Systems, January,
2007, $2,500.
38- Multi-Scale Damage Mechanics of High Temperature and High Power Density
Power Electronics, May 2008- May 2011, ONR, $498, 678.00
39- Electromigration in lead-free solder joints for wireless systems, $17,500, April 2008-
June 2008, STMicroelectronics, Grenoble, France.
40- Extrusion in Al Interconnects in Analog Devices, Texas Instruments, Dallas, TX,
June 2008-December 2008, $34,000.
41- Multi-Scale Modeling of Electromigration and Thermomigration in Nanoelectronics and
Power Electronics, $200,826, May 2009-May 2012, Semiconductor Research Corporation.
42- Determination of Fatigue Life of Gull-Wing Solder Joints, WatchFireSigns, $3,900
December 2009
43- Nanotechnology Research Laboratory Setup, University of Tabuk, $40,000, January
2011
44- The Framework for Next Generation Power Electronics Using Nanomaterials, ONR,
$650,191.00 June 2011-June 2014.
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Books and Book Chapters:
1- Basaran, C, Nie, S and Gunel, E.M.” Damage Coupled Viscoplastic Modeling of
Particulate Composites With Imperfect Interphase”, Chapter in Encyclopedia of
Composites, John. Wiley & Sons, Inc., 2012.
Publications in Refereed Journals
Citations: 1200+ h-index: 19 (reference: Harzing’ s Publish or Perish)
1- Desai, C.S., Basaran, C., and Wu, Z. "Numerical Algorithms and Mesh
Dependence in the Disturbed State Concept," Int. Journal for Numerical Methods
in Engineering, Vol. 40, 3059-3083, 1997.
2- Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element
Analysis of Problems in Electronic Packaging Using the Disturbed State Concept
Part I: Theory and Formulation " Trans. of ASME, Journal of Electronic
Packaging, Vol. 120, No. 1, pp. 41-47, 1998.
3- Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element
Analysis of Problems in Electronic Packaging Using the Disturbed State Concept
Constitutive Models: Part II: Verification and Application ", Trans. of ASME,
Journal of Electronic Packaging, Vol. 120, No. 1, pp. 48-53, 1998.
4- Desai, C. S., Basaran, C., Dishongh, T. and Prince, J.,"Thermomechanical
Analysis in Electronic Packaging with Unified Constitutive Models for Materials
and Joints,” IEEE Trans. on Comp. Pack. And Manu. Tech, Part B, Trans. on
Advanced Packaging, Vol. 21, No. 1, 87-97, 1998.
5- Basaran, C., and Chandaroy, R.,"Finite Element Simulation of the Temperature
Cycling Tests," IEEE, Transactions on Components Packaging and Manufacturing
Technology -Part A, Vol. 20, No. 4, pp. 530-536, 1997.#3
6- Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount
Interconnects, Part I: Theory", Trans. of ASME, Journal of Electronic Packaging,
Vol. 121, Number 1, pp. 8-12, March 1999. #7a
7- Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount
Interconnects, Part II: Applications", Trans. of ASME, Journal of Electronic
Packaging, Vol. 121, No 1, pp. 12-17, March 1999. #7b
8- Basaran, C., and Chandaroy, R., "Mechanics of Pb40/Sn60 Near –Eutectic Solder
Alloys Subjected to Vibrations," Journal of Applied Mathematical Modeling, Vol.
22, pp. 601-627, 1998, #8.
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9- Basaran, C., and Yan. C.Y."A Thermodynamic Framework for Damage Mechanics
of Solder Joints,” Trans. of ASME, Journal of Electronic Packaging, Vol. 120,
379-384, 1998. #12
10- Chandaroy, R. and Basaran, C.,"Damage Mechanics of Surface Mount
Technology Solder Joints Under Concurrent Thermal and Dynamic Loadings,"
Trans. of ASME, Journal of Electronic Packaging, Vol. 121, pp. 61-68, 1999.
11- Basaran, C.,”Using Finite Element Analysis for Simulation of Reliability Tests on
Solder Joints in Microelectronics Packaging,” Computers & Structures, Vol. 74,
Issue 2, pp. 215-231, November, 1999. #9
12- Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated
Stacks,” Int. J. of Finite Elements in Analysis and Design, 32, pp.163-179, 1999.
#5
13- Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T.,”Thermomechanical
Behavior of Micron Scale Solder Joints: An Experimental Observation,” Journal of
the Mechanical Behavior of Materials, Vol. 10, No. 3, pp. 135-146, 1999. #13
14- Zhao, Y., Basaran, C. Cartwright, A. and Dishongh, T.,”Thermomechanical
Behavior of Micron Scale Solder Joints Under Dynamic Loads,” Mechanics of
Materials, Vol. 32, Issue 3, pp. 161-173, 2000. #14
15- Basaran, C., Zhao, Y., Cartwright, A. and Dishongh, T.,”Effects of
Thermodynamic Loading,” Advanced Packaging, Vol. 1, pp. 51-58, October 2000.
Review article.#17
16- Basaran, C.,” Disturbed State Concept for Metals and Alloys,” J. of Mechanical
Behavior of Materials Vol. 10, No. 5-6, pp. 279-311, 2000.
17- Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEA for Multilayered Electronic
Packaging,” Trans. of ASME, Journal of Electronic Packaging, Vol. 123, 3, pp.
218-224, September 2001. #22
18- Basaran, C., Cartwright, A. and Zhao, Y.,”Experimental Damage Mechanics of
Microelectronics Solder Joints Under Concurrent Vibration and Thermal
Loading,” Int. J. of Damage Mechanics, Vol. 10, No. 2 pp. 153-170, April 2001.
#15
19- Basaran, C., Tang, H., Dishongh, T. and Searls, D.,”Computer Simulations of
Solder Joint Reliability Tests,” Advanced Packaging, Vol. 1, pp. 17-22, May
2001.Review article. #27
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20- Basaran, C., Dishongh, T., and Zhao, Y.,” Selecting a Temperature Time History
for Predicting Fatigue Life of Microelectronics Solder Joints,” Journal of Thermal
Stresses, Vol. 24, No. 11, pp. 1063-1084, November, 2001. #20
21- Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints
Under Thermal and Vibrational Loading,” Tran. ASME Journal of Electronic
Packaging, Vol. 124, No 1, pp. 60-67, March 2002. #24
22- Basaran, C., Ye, H., Johnson, R. and Long, J., ”Moire Interferometry for
Inspecting BGA Solder Balls for Manufacturing Defects,” Journal of Global SMT
and Packaging, Vol. 2, No. 2, pp. 9-14, May 2002. #33
23- Tang, H. and Basaran, C.”Influence of Microstructure Coarsening on
Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints,” Int. Journal
of Damage Mechanics, Vol. 10, No 3, pp. 235-255, July 2001. #29
24- Basaran, C. and Tang, H.,”Implementation of a Thermodynamic Framework for
Damage Mechanics of Solder Interconnects in Microelectronic Packaging,”
International Journal of Damage Mechanics, Vol. 11, No. 1, pp. 87-108, January
2002. #17
25- Basaran, C., Ye, H., Bush, P., Johnson, R., and Long, J.,” Inspection of Under
Bump Metallization – Solder Ball Interfaces by SEM, EDX and Moire
Interferometry,” TAP Technology, Vol. 4, pp. 23-27, 2002, Review article.#31
26- Ye, H., Lin, M., and Basaran, C.,”Failure Modes and FEM Analysis of Power
Electronic Packaging,” Finite Elements in Analysis and Design, Vol. 38, Issue 7,
pp. 601-612, May 2002. #25
27- Basaran, C. and Jiang, J.,”Measuring Intrinsic Elastic Modulus of Pb/Sn Solder
Alloys,” Mechanics of Materials, 34, pp. 349-362, 2002, #26
28- Basaran, C., Cartwright, A., Zhao, Y. and Dishongh, T.”Reliability of Solder
Bumps”, Advanced Packaging, Vol. 1, pp. 47-56, July 2002, Review Article. #52
29- Dishong, T., Basaran, C., Cartwright, A., Zhao, Y., and Liu, H., “Impact of
Temperature Cycle Profile on Fatigue Life of Solder Joints,” IEEE Transactions on
Advanced Packaging, Vol. 25, No 3, pp. 433 –438, August 2002. #35
30- Tang, H. and Basaran, C.”A Damage Mechanics Based Fatigue Life Prediction
Model,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp.
120-125, March 2003. #21
31- Wen, Y. and Basaran, C.,”Thermal Stress Analysis of Multilayered
Microelectronic Packaging,” Trans. Of ASME, Journal of Electronic Packaging,
Vol. 125, No 1, pp. 134-138, March 2003. #23
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32- Ye, H., Basaran, C. and Hopkins, D., Thermomigration in Pb-Sn Solder Joints
Under Joule Heating During Electric Current Stressing, Applied Physics Letters,
Vol. 82, No 8, February 2003, #38.
33- Wen , Y.and Basaran, C. “Analysis of Multi-layered Microelectronic Packaging
Under Uniformly Distributed Loading”, vol 40/13-14, pp 3331 - 3345,
International. J. of Solids and Structures, May 2003, #45
34- Ye, H., Hopkins, D. and Basaran, C.”Measuring Joint Reliability: Applying the
Moire Interferometry Technique,” Advanced Packaging, Vol. 1, pp.17-20, May
2003, Review article. #46
35- Ye, H., Basaran, C. and Hopkins, D., Damage Mechanics of Microelectronics
Solder Joints Under High Current Densities,” International Journal of Solids and
Structures, Vol. 40, No. 15, pp. 4021-4032, July 2003. #34
36- Basaran, C. and Wen, Y.,”Coarsening in BGA Solder Balls: Modeling and
Experimental Evaluation,” Trans. Of ASME J. of Electronic Packaging , Vol 125,
No. 3, pp. 426-430, September 2003, #30
37- Liu, H., Cartwright, A. N. and Basaran, C.,” Sensitivity Improvement in Phase
Shifted Moiré Interferograms Using 1-D Continuous Wavelet Transform Image
Processing”, Optical Engineering 42(09), pp. 2646-2652, September 2003, #50
38- Ye, H., Hopkins, D. and Basaran, C.,”Measurement of High Electrical Current
Density Effects in Solder Joints,” Advanced Microelectronics, Vol. 30, No. 5, pp.
13-16, September 2003, Review Article.#69
39- Ye, H., Basaran, C. Hopkins, D.,”Numerical Simulation of Stress Evolution
During Electromigration in IC Interconnect Lines,” IEEE Trans. On Comp.
Packaging Tech. Vol. 26, No. 3 pp.673-681, September 2003.#43
40- Basaran, C., Lin, M. and Ye. H. “A Thermodynamic Model for Electrical Current
Induced Damage”, Int. Journal of Solids and Structures Vol. 40, No 26 pp. 7315-
7327, November 2003 #37
41- Ye, H., Basaran, C. and Hopkins, D.,”Mechanical Degradation of Microelectronics
Solder Joints Under Current Stressing,” Int. Journal of Solids and Structures, Vol
40 No 26, pp 7269-7284, November 2003 #40
42- Ye, H., Basaran, C. and Hopkins, D.,”Measurement of High Electrical Current
Density Effects in Solder Joints,” Microelectronics Reliability, Vol. 43, issue 12,
pp. 2021-2029, December 2003. #42
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43- Wen, Y. and Basaran, C.,”An Analytical Model for Thermal Stress Analysis of
Multi-layered Microelectronic Packaging,” Mechanics of Materials, 36, pp. 369-
385, 2004. #47
44- Liu, H., Basaran, C., Cartwright, A. and Casey, W.,” Application of Moiré
Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA
Packages, IEEE Transactions on Components and Packaging Technologies, Vol.
27, No 1, pp. 217- 223, March 2004. #28
45- Ye, H., Basaran, C. and Hopkins, D.,”Pb Phase coarsening in eutectic Pb/Sn flip
chip solder joint under electrical current stressing,,” Int. J. of Solids and Structures,
41, pp. 2743-2755, 2004. #48
46- Liu, H., Cartwright, A., and Basaran, C. Moiré interferogram Phase Extraction: A
Ridge Detection Algorithm Based on Continuous Wavelet Transform” Applied
Optics, Vol. 43, No. 4/1, pp.850-857, February 2004, #51.
47- Liu, H., Cartwright, A. and Basaran, C.,”Experimental Verification of
Improvement of Phase Shifting Moire Interferometry and Wavelet-Based Image
Processing,” Optical Engineering, 43 (05) pp. 1206-1214, May 2004, #56
48- Basaran, C. Tang, H. and Nie, S.,”Experimental Damage Mechanics of
Microelectronics Solder Joints Under Fatigue Loading,” Mechanics of Materials,
36, pp. 1111-1121, August 2004, #36
49- Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints
Under Current Stressing and Numerical Simulation I,” International Journal of
Solids and Structures, vol. 41, pp. 4939-4958, September 2004. #59
50- Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints
Under Current Stressing and Numerical Simulation II,” International Journal of
Solids and Structures, vol. 41, pp. 4959-4973, September 2004, #60
51- Basaran, C. and Nie, S.”An Irreversible Thermodynamic Theory for Damage
Mechanics of Solids,” International Journal of Damage Mechanics, vol. 13, No 3,
pp 205-224, July 2004, #41
52- Ye, H., Basaran, C., and Hopkins, D.,” Mechanical Implications of High Current
Densities in Flip Chip Solder Joints,” International Journal of Damage Mechanics,
Vol. 13, No. 4, pp 335-346, October 2004, #58
53- Gomez, J. and Basaran, C.”A Thermodynamics Based Damage Mechanics
Constitutive Model for Low Cycle Fatigue Analysis of Microelectronics Solder
Joints Incorporating Size Effect,” International Journal of Solids and Structures,
Vol. 42, issue 13, pp. 3744-3772, (2005) #67.
Cemal Basaran
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54- Nie, S., and Basaran, C. “A Micromechanical Model for Effective Elastic
Properties of Particulate Composites with Imperfect Interfacial Bonds,”
International Journal of Solids and Structures Vol. 42, pp 4179-4191, 2005, #62
55- Lin, M., and Basaran, C.”Electromigration Induced Stress Analysis Using Fully
Coupled Mechanical-Diffusion Equations With Nonlinear Material Properties,”
Computational Materials Science, Vol. 34/1 pp. 82-98, May 2005, #64
56- Basaran, C., Ye, H. Hopkins, D., Frear, D. and Lin, J.K.”Failure Modes of Flip
Chip Solder Joints Under High Electrical Current Density,” Trans. Of ASME J. of
Electronic Packaging, vol. 127, pp. 157-163, June 2005 #53
57- Basaran, C., Zhao, Y., Tang, H. and Gomez, J..”A Damage Mechanics Based
Unified Constitutive Model for Solder Alloys,” Trans of ASME, Journal of
Electronic Packaging, Vol. 127, issue 3, pp. 208-214, September 2005 . #18
58- Ye, H., Basaran, C. and Hopkins, D., ”Experimental Damage Mechanics of
Micro/Power Electronics Solder Joints Under Electrical Current Stresses,” Int. J. of
Damage Mechanics, vol. 15, pp. 41-68, January 2006, #65
59- Gomez, J. and Basaran, C. “ Nanoindentation of Pb/Sn Solder Alloys;
Experimental and Finite Element Simulation Results”, Int. J. of Solids and
Structures, vol. 43, (2006), pp. 1505-1527, 2006, #77
60- Gomez, J. and Basaran, C., ”Damage Mechanics Constitutive Model for Pb/Sn
Solder Joints Incorporating Nonlinear Kinematic Hardening and Rate Dependent
Effects Using a Return Mapping Integration Algorithm,” Mechanics of Materials,
38 (2006), 585-598. #72
61- Gomez, J, Lin, M. and Basaran, C. “Damage Mechanics Modeling of Concurrent
Thermal And Vibration Loading On Electronics Packaging” Multidiscipline
Modeling in Materials and Structures, Vol.2, No.3, pp. 309-326, July 2006. #71.
62- Nie, S., Basaran, C., Hutchins, S. and Ergun, H,” Failure Mechanisms in
PMMA/ATH Acrylic Casting Dispersion,” Journal of Mechanical Behavior of
Materials, Vol. 17, No 2, 2006, pp. 79-95, #39
63- Basaran, C. and Nie, S.“A Thermodynamics Based Damage Mechanics Model for
Particulate Composites,” International Journal of Solids and Structures, 44, (2007)
1099-1114. #63
64- Basaran, C. and Wen, Y., ”Analysis of Multilayered Microelectronic Packaging
Under Thermal Gradient Loading,” IEEE Trans. On Components and Packaging
Technologies, vol. 29, no 4, pp. 850-855, December 2006, #75.
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65- Basaran, C. and Wen, Y. “Influence of Interfacial Compliances on
Thermomechanical Stresses in Multilayered Microelectronic Packaging,” IEEE
Trans. On Advanced Packaging, vol. 29, No. 4, pp. 666-673, November 2006,#61
66- Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration in
Microelectronics Copper Interconnects,” International Journal of Materials and
Structural Integrity, vol. 1, Nos1/2/3, 16-39, 2007, #76
67- Basaran, C. and Lin, M. “Electromigration Induced Strain Field Simulations for
Nanoelectronics Lead-Free Solder Joints”, Int. J. of Solids and Structures, 44,
(2007), 4909-4924. #68.
68- Gomez, J., and Basaran, C., ”Determination of Strain Gradient Plasticity Length
Scale for Microelectronics Solder Alloys,” Trans. Of ASME Journal of Electronic
Packaging, ASME Journal of Electronic Packaging, Vo. 129, No. 2, pp-120-128,
June 2007. #66
69- Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration Induced
Failure,” Mechanics of Materials, 40 (2008) 66-79, #74
70- Basaran, C., Nie, S., Hutchins, S. and Ergun, H. ,”Influence of Interfacial Bond
Strength on Fatigue Life and Mechanical Behavior of a Particulate Composite: An
Experimental Study, Int. J. of Damage Mechanics, Vol. 17, No. 2, 123-148, March
2008 #54.
71- Chen, B. and Basaran, C. “Automatic Full Strain Field Moiré
Interferometry Measurement with Nano-scale Resolution” Experimental
Mechanics, vol. 48, no 5, October 2008, pp. 665-673. #83
72- Abdulhamid, M., Li, S., Basaran, C. “Thermomigration in lead-free solder joints,
Int. J. of Materials and Structural Integrity, Vol. 2, Nos 1 / 2, pp. 11-34, 2008, #87
73- Basaran, C., Li, S., Abdulhamid, M.,” Thermomigration Induced Degradation in
Solder Alloys,”, Journal of Applied Physics, 103, 123520 (2008), # 86
74- Basaran, C., Nie, S. and Hutchins, C., Time Dependent Behavior of a Particle
Filled Composite PMMA/ATH at Elevated Temperatures” Journal of Composite
Materials, Vol. 42, No. 19, pp. 2003-2025, 2008, #55
75- Li, S., Abdulhamid, M. and Basaran, C. “Simulating Damage Mechanics of
Electromigration and Thermomigration,” Simulation: Transactions of the Society
for Modeling and Simulation International Vol. 84, Number 8/9, pp. 391-401,
August/September 2008 #91
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76- Gomez, J. and Basaran, C. “Computational Implementation of Cosserat
Continuum,”, International Journal of Materials and Production Technology, Vol.
34, No 1 / 2, pp 3-36, January 2009, #78
77- Abdulhamid, M , Basaran, C,” Influence Of Thermomigration On Lead-Free
Solder Joint Mechanical Properties”. Trans of the ASME Journal of Electronic
Packaging,, March 2009, Vol. 131 / 011002-1-011002-12, #80
78- Li, S. and Basaran, C. “A Computational Damage Mechanics Model for
Thermomigration,” Mechanics of Materials, vol. 41, issue 3, pp. 271-278, March
2009, #82
79- Li, S., Abdulhamid, M., Basaran, C. and Lai, Y.S. “Damage Mechanics of Low
Temperature Electromigration and Thermomigration” IEEE Trans. On Advanced
Packaging, Vol. 32, No 2, pp., 478-485, May 2009, #85
80- Li, S., Sellers, Basaran, C., M. Schultz, A.,. and Kofke, D., ”Lattice Strain Due to
an Atomic Vacancy,” Int. J. of Molecular Sciences, 2009, 10, 2798-2808, #81
81- Basaran, C. , Li, S. ,Hopkins D.C. and Veychard, D.”Electromigration Time To
Failure of SnAgCuNi Solder Joints” Journal of Applied Physics, 106, 013707,
(2009) # 92
82- Abdulhamid, M., Basaran, C., and Lai, Y.S., ”Thermomigration vs.
Electromigration in Microelectronics Solder Joints” IEEE Transactions on
Advanced Packaging, Vol. 32, No 3, pp. 627-635, August 2009, #79
83- Ragab, T. and Basaran, C. “A Framework for Stress Computation in Single-Walled
Carbon Nanotubes Under Uniaxial Tension” Computational Material Science, 46,
1135-1143, (2009) #89
84- Ragab, T. and Basaran, C.,” Joule heating in single-walled carbon nanotubes,”
Journal of Applied Physics, 106, 063705, (2009), #95
85- Basaran, C., Abdulhamid, M.” Low Temperature Electromigration and
Thermomigration in Lead-Free Solder Joints,” Mechanics of Materials, 41, (2009)
1223-1241, #88
86- Ragab, T., Basaran, C. “A Quantum Mechanical Formulation of Electron
Transport Induced Wind Forces in Metallic Single Walled Carbon Nanotubes:”
Carbon 48 ( 2010) 47-53, #96
87- Li, S. and Basaran, C.”Effective Diffusivity of Lead-Free Solder Alloys”
Computational Materials Science 47, (2009) 71-78, #90
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88- Gunel, E.M., Basaran, C. Micro-deformation mechanisms in thermoformed
alumina trihydrate reinforced poly (methyl methacrylate)
Materials Science and Engineering: A, 523 (2009) 160-172, #99
89- Seller, M. Schultz, A. Basaran, C. and Kofke, D, "Atomistic Modeling of beta-Sn
Surface Energies and Adatom Diffusivity" , Applied Surface Science, 256, (2010)
4402-4407. #93
90- Ragab, T. and Basaran, C. “Semi-classical transport for predicting joule heating in
carbon nanotubes" Physics Letters A, Vol.374 Issue 24 (2010) pp. 2475-2479,
#102
91- Seller, M., Schultz, A., Basaran, C. and Kofke, D., “Sn Grain Boundary Structure
and Self-Diffusivity via Molecular Dynamics Simulation” Physical Review B, 81,
134111 (2010) #103
92- Gunel, E.M., and Basaran, C. “Stress Whitening Quantification in Thermoformed
of Mineral Filled Acrylics”, ASME Journal of Engineering Materials and
Technology, July 2010, Vol. 132, 031002-11, #100
93- Ragab, T and Basaran, C. “The prediction of the effective charge number in single
walled carbon nanotubes using Monte Carlo simulation " Carbon, 49, (2011) 425-
434, #104
94- Chen, B. and Basaran, C. “Statistical Phase Shifting Step Estimation Algorithm
Based on the Continuous Wavelet Transform for High Resolution Interferometry
Metrology” Applied Optics, Vol. 50, No 4, 586-593, February 2011 # 98
95- Sellers, M., Schultz, A. J., Kofke, D., and Basaran , C ” Solute Effects on Sn
Grain Boundary Energy and Shear Stress,” ASCE J. of Nanomechanics and
Micromechanics ,Vol. 1, Number 1, pp. 41-50, March 2011, #109
96- Chen, B. and Basaran, C. Measuring Joule Heating and Strain Induced by
Electrical Current with Moiré Interferometery” Applied Physics Journal , 109,
074908 (2011) # 97
97- Ragab, T. and Basaran, C. “The Unraveling of Open-Ended Single Walled Carbon
Nanotubes Using Molecular Dynamics Simulation,” ASME Journal of Electronic
Packaging, June 2011, Vol. 133, 020903-1- 7, #107
98- Lee, Y. and Basaran, C. “A viscoplasticity model for solder alloys” Trans. Of
ASME, J. of Electronic Packaging, vol. 133, issue 4, December 2011,#101
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Papers Accepted for Publication
99- Gunel, E. and Basaran, C.,”Influence of Filler Content and Interphase properties
onLarge Deformation Micromechanics of particle Filled Acrylics,” July 20, 2010)
Int. J. of Materials and Structural Integrity #108
100- Sellers, M., Schultz, A. J., Basaran , C. and Kofke, D.,” Effect of Cu and Ag Solute
Segregation on Sn Grain Boundary Diffusivity,” (accepted, May 15, 2011)
Journal of Applied Physics, #110
101- Chen, B. and Basaran, C.,”Near Field Modeling of the Moire Interferometer for
Nanoscale Strain Measurment,” (accepted April 4, 2011) ASCE Journal of
Nanomechanics and Micromechanics, #111.
102- Chen, B. and Basaran, C., ”Far-Field Modeling of Moire Interferometry using
Scalar Diffraction Theory,” (accepted August, 2011) Journal of Optics and Lasers
in Engineering, #112
103- Gunel, E.M. and Basaran, C. “Damage Characterization in Non-Isothermal
Stretching of Acrylics: Part I Theory” Mechanics of Materials (accepted
September 26, 2011) #105
104- Gunel, E.M. and Basaran, C. “Damage Characterization in Non-Isothermal
Stretching of Acrylics: Part II Experimental Validation, Mechanics of Materials
(accepted September 26, 2011) #106
Papers Submitted for Review
105- Yao, W. and Basaran, C. “Electromigration of Lead-free Solder Bump under
Pulsed DC”, IEEE CPMT, April 2010. #113
106- Lee, Y. and Basaran, C.,”A Multi-scale Modeling Approach for Bridging
Molecular Dynamics with Finite Element Analysis,”(submitted September 21,
2011) J. of Computational Physics, #114
107- Yao, W. and Basaran, C., ”Electromigration Analysis of Solder Joints under
Alternating Current” #115
Publications: Refereed Archival Pamphlet and Monograph Papers
1- Chandaroy, R., and Basaran, C., "Damage Mechanics of a SMT Package Under
Thermal & Dynamic Loading," 97-WA/EEP-7, ASME publication individual paper.
2- Basaran, C, Yan, Y., and Zhao, Y. ,”Entropy as a Damage Metric for Fatigue Life
Predictions,", 98-WA/EEP-13, ASME publication individual paper.
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3- Basaran, C., Chandaroy, R., and Zhao, Y.,”Influence of Grain Size and
Microstructure on Dynamic Response of Solder Joints,” 98-WA/EEP-12 ASME
publication individual paper.
4- Desai, C.S., Chia, J., Kundu, T., Basaran, C. and Prince, J., "Unified Constitutive
Modeling of Interfaces and Materials in Semiconductor Devices", in Structural
Analysis in Microelectronics and Fiber Optics, editor E. Suhir, Vol.7, 113-126, 1993,
Trans. of ASME-EEP.
5- Basaran, C., Desai, C., Kundu, T. and Prince, J., "Computer Simulation of the
Temperature Cycling Tests,” in Structural Analysis in Microelectronics and Fiber
Optics, editor E. Suhir, Vol.12, 77-82, 1995, Trans. of ASME-EEP.
6- Basaran, C.,"A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn
Solder Alloys," in Structural Analysis in Microelectronics and Fiber Optics, editor E.
Suhir, Vol.16, pp.149-153, 1996, Trans. of ASME-EEP.
7- Basaran, C., and Chandaroy, R.,"Material Nonlinear Dynamic Analysis of a
Pb40/Sn60 Solder Joint," in Structural Analysis in Microelectronics and Fiber
Optics, editor E. Suhir, Vol. 21, pp.227-242, 1997, Trans. of ASME-EEP.
8- Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under
Concurrent Dynamic and Thermal Loading,” Advances in Electronic Packaging
Editors Agonafer, G, Saka, M. and Lee, Y.C. ASME-EEP-Vol. 26-1, pp. 419-439,
1999.
9- Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEM Modeling for Multilayered
Stacks,” Advances in Electronic Packaging Editors Agonafer, G, Saka, M. and Lee,
Y.C. ASME-EEP-Vol. 26-1, pp1147-1154, 1999.
10- Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C. “Creep Behavior of BGA
During Thermal Cycling by Moiré Interferometry”, Advances in Electronic
Packaging Editors Agonafer, G, Saka, M. and Lee, Y.C. ASME-EEP-Vol. 26-1, pp
685-691, 1999.
Publications: Book Review
1- Basaran, C., Solving Large-Scale Problems In Mechanics: The Development and
Application of Computational Solution Methods, editor Papadrakakis, P., John Wiley
& Sons, Int. J. for Numerical and Analy. Meth. In Geomechanics, Vol.18, 139-140,
1994.
Publications: Conference Papers Published in Proceedings
Cemal Basaran
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1- Erdik, M., Basaran, C. and Guler, F., "Soil-Structure Interaction Effects on Recorded Strong
Ground Motion Data," Proc. of the Seventh European Conference on Earthquake
Engineering September 7 - 12, 1986, Lisbon, Portugal.
2- Desai, C.S., Chia, J., Kundu, T., Basaran, C., and Prince, J., "Constitutive Modeling for
Thermomechanical Response of Semiconductor Chip-Substrate Systems," Proc. of the Joint
ASCE-ASME-SES Meeting on Applied Mechanics in Electronic Packaging, Charlottesville,
Virginia, June 1993.
3- Desai, C.S., Chia, J., Basaran, C., Kundu, T. and Prince, J., "Constitutive Modeling of
Mechanical Response of Semiconductor Devices with Emphasis on Interface Behavior,"
Proc. of the NSF Design and Manufacturing Systems Conference, Charlotte, NC, December
1993.
4- Basaran, C., "A Constitutive Model for Sand," Proc. of the IACMAG 94 - VIII International
Conference on Computer Methods and Advances in Geomechanics, May 22-28, 1994,
Morgantown, West Virginia.
5- Desai, C.S., Basaran, C., Chia, J. and Kundu, T., "Disturbed State Constitutive Models for
Thermo-Viscoplastic Behavior of Solids and Interfaces - Computational Aspects," Invited
Key Note Paper, Proc. of the III World Congress on Computational Mechanics, Chiba, Japan,
1 - 5 August, 1994.
6- Desai, C.S., Chia, J., Basaran, C., and Kundu, T., "Disturbed State Concept for Cycling
Behavior: Computer Implementation," Invited Key Note Paper, Proc. of the Int. Conf. on
Computational Methods in Structural and Geotechnical Engineering, Hong Kong, December
12-14, 1994.
7- Desai, C., Kundu, T., Chia, J., Basaran, C. and Prince, J. ,"Unified Constitutive Modeling,
Testing and Computer Design of Semiconductor Devices with Emphasis on Interface
Behavior," Proc. of the National Science Foundation Manufacturing and Industrial
Innovation Conf., University of California San Diego, CA, January 4-6, 1995.
8- Desai, C.S. and Basaran, C.,"Disturbed State Modeling of Materials and Interfaces and
Computer Implementation," Invited Key Note Paper, Proc. of the Int. Conf. on Comp. Eng.
Science, Mauna Lani, Hawaii, July 30-August 3, 1995.
9- Basaran, C., and Yan, C.Y.,"An Interface Constitutive Model for Surface Mount
Interconnects," Proc. 1997 Joint ASME/ASCE/SES Summer Meeting, Northwestern
University June 29- July 2.
10- Basaran, C. and Chandaroy, R.,"Concurrent Dynamic and Thermal Analysis of Surface
Mount Solder Joints,” Proc. 1997 Joint ASME/ASCE/SES Summer Meeting, Northwestern
University June 29- July 2, 1997.
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11- Henry, D., Basaran, C., and Banerjee, P.K.," A Boundary Element Analysis of Multilayered
Structures in Electronics Packaging," Proc. 1997 Joint ASME/ASCE/SES Summer Meeting,
Northwestern University June 29- July 2, 1997.
12- Basaran, C. and Yan, C.Y.,"A Damage Criterion Based on Entropy," Proc. of 12th ASCE
Engineering Mechanics Conference, SanDiego, CA, May 17-20, 1998.
13- Basaran, C., and Zhao, Y.,”Numerical Analysis of Stacks with Very Thin and Very Thick
Layers,”13th
US National Congress of Applied MechanicsUniversity of Florida, Gainsville,
FL, June 21-June26, 1998.
14- Basaran, C. and Yan, C.Y., "A Damage Criterion Based on Entropy for Pb40/Sn60 Solder
Alloys," ASME, Int. Mechanical Engineering Congress and Exposition, Anaheim, CA
November 15-20, 1998.
15- Basaran, C., and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under
Concurrent and Dynamic Loading,” ASME, Int. Mechanical Engineering Congress and
Exposition, Anaheim, CA November, 15-20, 1998.
16- Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under
Concurrent Dynamic and Thermal Loading,” ASME/IEEE InterPACK 99 June 13-19, 1999
Maui, Hawaii.
17- Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEM Modeling for Multilayered Stacks,”
ASME/IEEE InterPACK 99 June 13-19, 1999 Maui, Hawaii.
18- Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C. “Creep Behavior of BGA During
Thermal Cycling by Moiré Interferometry”, ASME/IEEE InterPACK 99 June 13-19, 1999
Maui, Hawaii.
19- Basaran, C., and Yan, C.Y.,”A Damage Mechanics Based Interface Element for Multilayered
Packages,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN
November 14-19, 1999.
20- Basaran, C. and Chandaroy, R.,” A Damage Mechanics Based Constitutive Model for Pb/Sn
Solder Alloys,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville,
TN November 14-19, 1999.
21- Basaran, C., and Zhao, Y., Mechanical Behavior of BGA During Vibrations by Moiré
Interferometry,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville,
TN November 14-19, 1999.
22- Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated Stacks in
Electronic Packaging,” ASME, Int. Mechanical Engineering Congress and Exposition,
Nashville, TN November, 14-19, 1999.
Cemal Basaran
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23- Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C.,”Inelastic Behavior of
Microelectronics Solder Joints Under Concurrent Vibration and Thermal Cycling,” proc.
Itherm 2000, VIIth Thermal and Thermomechanical Phenomena in Electronic Systems, Vol.
II, pp. 349-355, Las Vegas, NV May 23-26, 2000.
24- Zhao, Y., Dishongh, T., Cartwright, A. and Basaran, C.,”Thermomechanical Behavior of
BGA Solder Joints Under Vibrations; An Experimental Observation,” Proc. Itherm 2000,
VIIth Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. I, pp.174-
180, Las Vegas, NV May 23-26, 2000.
25- Basaran, C. and Zhao, Y.,”A Constitutive Model for Pb/Sn Solder alloys,”Proc. SMTA
International Assembly Technology Expo., Sept. 24-28, 2000, Rosemont, IL.
26- Wen, Y. and Basaran, C.,”Analysis of Multilayered Electronic Packaging,” InterPACK 2001,
July 8-13 Kauai, Hawaii.
27- Tang, H. Basaran, C. Dishongh, T. and Searls, D.,”Thermomechanical Analysis of Solder
Joints using Thermodynamics,” InterPACK 2001, July 8-13 Kauai, Hawaii.
28- Basaran, C. and Jiang, J.”Selecting Elastic Modulus for Pb/Sn Solder Joints; Is it Art or
Science? ” InterPACK 2001, July 8-13 Kauai, Hawaii.
29- Ye, H., Lin M. and Basaran, C.,”Failure Modes in Power Electronic Packaging,” InterPACK
2001, July 8-13 Kauai, Hawaii.
30- Zhao, Y. and Basaran, C. A Constitutive Model for Eutectic Pb/Sn Solder, InterPACK 2001,
July 8-13 Kauai, Hawaii.
31- Basaran, C., Zhao, Y., Cartwright, A., Dishongh, T.”Evaluating Solder Joint Fatigue
Reliability by Moiré Interferometry,” Proc. Of Advanced Packaging Technologies in the
Electronics Industry, SMTA, June 12-13, 2001 Boston, MA
32- Basaran, C. “Reliability of BGA Under Vibrations”, Proc. Of the Surface Mount Technology
International Conference September 30 – October 4 2001. Chicago, IL
33- Heng, Liu, Basaran, C. Cartwright, A. and Casey, A,”Moiré Interferometry for
Microelectronics Packaging Interface Fatigue Reliability” ManTech 2002, San Diego, April
8-11 2002
34- Ye, H. Basaran, C., Hopkins, D.,”Experimental Study on Reliability of Solder Joints Under
Electrical Stressing,” ICAPS, Int. Conf. On Adv. Packag. Systems March 10-13, 2002, Reno,
NV
35- Basaran, C. Tang, H. and Dishong, T.,” Experimental Characterization of Material
Degradation of Solder Joint under Fatigue Loading,” Proc. Of the VIIIth Intersociety
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Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May 29
June1 2002, San Diego, CA.
36- Wen. Y. and Basaran, C. “Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints”,
Proc. Of the VIIIth Intersociety Conference on Thermal and Thermomechanical Phenomena
in Electronic Systems, May 29 June1 2002, San Diego, CA.
37- Ye, H., Basaran, C and Hopkins, D. Reliability of Solder Joints Under Electrical Stressing,
Proc. Of the VIIIth Intersociety Conference on Thermal and Thermomechanical Phenomena
in Electronic Systems, May 29 June1 2002, San Diego, CA.
38- Nie, S., Basaran, C. and Hutchins, C. Experimental Study of Failure Mechanics in Particle
Filled Acrylic Composites,” VIIIth Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego, CA.
39- Ye, H., Hopkins, D., Basaran, C. “Measurement and Effects of High Electrical Current
Stress in Solder Joints,” International Microelectronics and Packaging Society, Symposium,
Denver, Colorado September 4-6, 2002. IMAPS 2002 Best Student Paper Honorable
Mention.
40- Basaran, C,”A Damage Mechanics Theory Without a Potential Surface,” Society of
Engineering Science 39th
Annual Meeting, Penn State, October 13-16, 2002 (Abstract only)
41- Ye, H., Basaran, C., and Hopkins, D.,”Damage Mechanics of Microelectronics Solder Joints
Under High Current Density,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.
42- Basaran, C., Nie, S.,” Irreversible Thermodynamics for Damage Mechanics of Elastic-Brittle
Materials,” ,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.
43- Basaran, C., Tang, H.,”Experimental Damage Mechanics of Microelectronics Solder Joints,”
,” ASME IMECE, New Orleans, LA, November, 17-22, 2002.
44- Basaran, C., and Tang, H.”Implementation of a Thermodynamic Framework for Damage
Mechanics of Solder Interconnects,”” ASME IMECE, New Orleans, LA, November, 17-22,
2002.
45- Basaran, C. and Jiang, J.,”Elastic Modulus of Pb/Sn Solder Joints in Microelectronics,” ,”
ASME IMECE, New Orleans, LA, November, 17-22, 2002.
46- Ye, H., Basaran. C and Hopkins, D.,”Damage Mechanics of Microelectronics Solder Joints
Under High Current Density,” The 54th
Electronic Components and Technology Conf. June
1-4, 2004, Las Vegas, NV.
47- Wen, Y. and Basaran, C.,”Influence of Interfacial Compliance on Thermomechanical
Stresses in Multilayered Microelectronic Packaging,” The 54th
Electronic Components and
Technology Conf. June 1-4, 2004, Las Vegas, NV.
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48- Basaran, C., Lin, M. and Ye, H.,”Thermodynamic Model for Electrical Current Induced
Damage in Microelectronics Solder Joints,” The 54th
Electronic Components and Technology
Conf. June 1-4, 2004, Las Vegas, NV.
49- Basaran, C. Ye, H.and Hopkins D.,”Deformation of Solder Joints Under Current Stressing:
Experimental Measurement and Numerical Simulation” 21st International Congress of
Theoretical and Applied Mechanics, August 15-21, 2004, Warsaw, Poland.
50- Gomez, J. and Basaran, C.”A Damage Mechanics Based Constitutive Model for Low Cycle
Fatigue Analysis,” Proc. Of the IMAPS Congress 2004, Anaheim, CA
51- Ye, H., Basaran, C. and Hopkins, D.C. “Measuring and Modeling the Deformation of BGA
Lead-free Solder Joints under High Current Density,” Proc. Of the IMAPS Congress 2004,
Anaheim, CA
52- Lin, M. and Basaran, C.,” Electromigration Induced Strain Field Simulation for
Microelectronic Lead Free Solder Joints,” Proc. Of the IMAPS Congress 2004, Anaheim, CA
53- Nie, S. and Basaran, C. and Tang, H.,” Experimental Damage Mechanics of Microelectronics
Solder Joints Under Fatigue Loading,” The 55th
Electronic Components and Technology
Conference May 31- June 3, 2005 Lake Buena Vista, Florida
54- Gomez, J. and Basaran, C. “Low Cycle Fatigue Analysis of Microelectronics Solder Joints
Incorporating Damage and Size Effects Using a Thermodynamic Based Rate Dependent
Constitutive Model,” The 55th
Electronic Components and Technology Conference May 31-
June 3, 2005 Lake Buena Vista, Florida
55- Basaran, C. Ye, H, and Hopkins, D. “Modeling Deformation in Microelectronics BGA
Solder Joints Under High Current Density: Simulation and Testing,” The 55th
Electronic
Components and Technology Conference May 31- June 3, 2005 Lake Buena Vista, Florida
56- C.Basaran, S.Nie, C.S. Hutchins ve H.Ergun, " An Experimental Study on the influence of
Filler-Matrix Interfacial Bond Strength and Temperature in a Composite Material", XIV.
National Mechanics Congress, 12-16 September 2005, Antakya, Turkey.
57- Hopkins, D., Kellerman, D., Wunderlich, R.,Basaran, C and Gomez, J.”High Temperature
High Density Packaging of a 60kW Converter for 200C Embedded Operation,” IEEE Power
Electronics Conference (APEX), Dallas, TX March 19-23, 2006.
58- Basaran, C. and Lin, M. abstract “Electrical Current Induced Stress Analysis in Nanowires,”
15th
US National Congress of Theoretical and Applied Mechanics, Boulder, CO 25-30 June
2006,
59- Abdulhamid, M., Basaran, C., Hopkins, H. Experimental Study of Thermomigration in Lead-
Free nanoelectronics Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL.
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60- Li, S., Lin., M., Abdulhamid, M. and Basaran, C. Thermomigration Induced Strain Field
Simulation for Microelectronics Lead Free Solder Joints, ASME IMECE November 5-10,
2006 Chicago, IL.
61- Gomez, J. and Basaran. C., Length Scale in Solder Joints, ASME IMECE November 5-10,
2006 Chicago, IL.
62- C. Basaran, Key Note Paper, Damage Mechanics of Solder Joints Under High Current
Density, Proc. Of the 10th
Int. Conf. The Mechanical Behavior of Materials, May 27-
30,2007, Busan , Korea., Key Engineering Materials, vols. 345-346, pp. 1403-1410, 2007.
63- C. Basaran, M. Lin and S. Li, “ Computational Simulation of Electromigration Induced
Damage in Copper Interconnects” Proc. Of the Summer Simulation Multiconference 2007,
Organized by Society for Modeling and Simulation July 14-18, 2007, San Diego, CA
64- C. Basaran, J. Gomez, M. Lin, and S. Li , Damage Mechanics Modeling of Concurrent
Thermal and Vibration Loading On Electronics Packaging, Proc. Of the Summer Simulation
Multiconference 2007, Organized by Society for Modeling and Simulation July 14-18, 2007,
San Diego, CA
65- M. S. Sellers, A. J. Schultz, D. A. Kofke, C. Basaran, “Molecular Dynamics Modeling of
Grain Boundary Diffusion in Sn-Ag-Cu Solder” AIChe Annual Meeting, Salt Lake City,
Utah, November 4-9, 2007.
66- Kevin E. Enser, Douglas C. Hopkins, Cemal Basaran Techniques for Investigation of Solder
interconnect Electromigration under Time Varying Current Stressing, IMAPS 2007
November 13-15, 2007 San Jose CA
67- Abdulhamid, M. F. and Basaran, C.”Low Temperature Electromigration and
Thermomigration in Lead Free Solder Alloy,” 33rd
Int. Electronics Manufacturing
Technology Conference, Penang, Malaysia, 4-6 November, 2008.
68- C. Basaran and M. Lin “Electromigration Damage Mechanics of Interconnects”, Proc. Of the
ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of
Electronics and Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23, 2009 San
Francisco, CA
69- C. Basaran and T. Ragab, “Damage Mechanics of Carbon Nano Tubes under Unaixial
Tension,” ASME/Pacific Rim Technical Conference and Exhibition on Packaging and
Integration of Electronics and Photonic Systems, MEMS and NEMS, InterPACK ’09, July
19-23, 2009 San Francisco, CA
70- Chen, B., Basaran, C. Statistical Phase Shifting Step Estimation Based on Continous
Wavelet Transform For High resolution Interferometry Metrology,” Proc. Of the Itherm Int.
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic
Systems Conf. 2010, Las Vegas NV
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71- Lee, Y and Basaran, C. A Viscoplasticity Model for Solder Alloys, Proceedings of the
ASME 2010 International Mechanical Engineering Congress & Exposition IMECE2010
November 12-18, 2010 Vancouver, British Columbia, Canada
Publications: Technical Reports
1- Basaran, C., and Desai, C.S., Finite Element Thermomechanical Analysis of Electronic
Packaging Problems Using Disturbed State Constitutive Models, Report to the National
Science Foundation, Dept. of Civil Engineering and Engineering Mechanics, University
of Arizona, 9/1994
2- Basaran, C. Zhao, Y. and Yan, C. Experimental and Analytical Damage Mechanics of
BGA Packaging, Office of Naval Research, May 2001.
3- Basaran, C. and Ye, H. Reliability of Power Electronics Building Block Packaging,
Office of Naval Research, May 2004.
4- Basaran, C. Reliability of Next Generation Power Electronics Packaging Under
Concurrent Vibration, Thermal and High Power Loads, Office of Naval Research, April
2008
Invited Lectures and Key Note Presentations
1- "Disturbed State Concept", VIII International Conference on Computer Methods and
Advances in Geomechanics, Prof. C.S. Desai Honorary Session, May 22-28, 1994,
University of West Virginia, Morgantown, WV.
2- “Disturbed State Concept Constitutive Models for Surface Mount Technology
Interconnects", Dept. of Mechanical Engineering, University of Maryland, at College
Park, September 9, 1994.
3- “Damage Mechanics of Semiconductor Interconnects" Dept. of Mechanical Engineering,
Virginia Commonwealth University, Richmond, VA, June 2, 1997.
4- “Damage Mechanics of Surface Mount Technology Solder Joints”, Dept. of Mechanical
Engineering, Texas A&M University, College Station, TX, April 13, 1998.
5- “Damage Mechanics of Solder Joints in Surface Mount Technology Microelectronics
Packaging,” Dept. of Mechanical Engineering, Aeronautical Engineering and Mechanics,
Rensselaer Polytechnic Institute, Troy, NY, May 11, 1998.
6- “Damage Mechanics of Solder Joints in Surface Mount Technology Microelectronics
Packaging,” Dept. of Aerospace Engineering and Engineering Mechanics, Iowa State
University at Ames, September 21, 1998.
Cemal Basaran
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7- “Damage Mechanics of Solder Joints in Surface Mount Technology Microelectronics
Packaging,” Dept. of Mechanical Engineering and Applied Mechanics, University of
Michigan at Ann Arbor, September 30, 1998.
8- “Experimental Mechanics of Electronic Packaging Using Moiré Interferometry”, Dept. of
Mechanical Engineering, Polytechnic University, Brooklyn, NY November 4, 1999.
9- “A Thermodynamic Framework for Damage Mechanics of Microelectronics”, Dept. of
Civil and Environmental Engineering, Cornell University, Ithaca, NY April 2, 2002.
10- “Damage Mechanics of Next Generation Electronics”, Dept. of Mechanical Engineering,
Florida State University, Tallahassee, FL, February 16, 2004.
11- “Damage Mechanics of Nanoelectronics”, Dept of Mechanical Engineering, Northeastern
University, Boston, MA March,2, 2007.
12- “Multi-Scale Damage Mechanics of Nanoelectronics Solder Joints”, POSTECH, Pohang
University of Science and Technology, Dept. of Mechanical Engineering, Pohang, South
Korea, May 29, 2007
13- Key Note Paper, Damage Mechanics of Solder Joints under High Current Density, 10th
Int. Conf. On Mechanical Behavior of Materials, May 27-30, 2007, Busan, South Korea.
14- Key Note Lecture, Modeling Damage Mechanics of Particle Filled Composites: with
Micromechanics and Thermodynamics,” 15th
Int. Symposium on Plasticity & Its Current
Applications, St Thomas, U.S. Virgin islands, January 3-8, 2009.
15- Key Note Lecture, Using Single Walled Carbon Nano Tubes for Electronics, ASME Int.
Mechanical Engineering Congress and Exposition IMECE 2009, Orlando, FL November
13-19, 2009.
16- “Electromigration and Thermomigration in Nanoelectronics” Dept. of Chemical
Engineering, University of Massachusetts, at Lowell April 15, 2011.
17- “Electromigration and Thermomigration in Nanoelectronics” Binghamton University,
The Center of Excellence, Small Scale Systems Integration and Packaging (S³IP), June
22, 2011
Conference and Workshop Presentations
18- "A Constitutive Model for Sand,” IACMAG 94 - VIII International Conference on
Computer Methods and Advances in Geomechanics, May 22-28, 1994, Morgantown,
West Virginia.
Cemal Basaran
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19- Computer Simulation of the Temperature Cycling Tests,” ASME, International
Mechanical Engineering Congress and Exposition, San Francisco, CA, Nov 12-17, 1995.
20- "A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder
Alloys," ASME, Int. Mechanical Engineering Congress and Exposition, Atlanta, GA,
November 17-22, 1996.
21- "An Interface Constitutive Model for Surface Mount Interconnects,” 1997 Joint
ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2, 1997.
22- "Concurrent Dynamic and Thermal Analysis of Surface Mount Solder Joints,” 1997 Joint
ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2, 1997.
23- "Material Nonlinear Dynamic Analysis of a Pb40/Sn60 Solder Joint,” ASME, Int.
Mechanical Engineering Congress and Exposition, Dallas, TX, November 16-21, 1997.
24- "Damage Mechanics of a SMT Package Under Thermal & Dynamic Loading,” Symp. on
Mechanics of Surface Mount Assemblies, ASME, Int. Mechanical Engineering Congress
and Exposition, Dallas,TX, November, 16-21, 1997.
25- "Power Electronics Module Reliability," Office of Naval Research PEBB Conference,
Wilkes-Barre, PA, October 21-23, 1997.
26- "A Damage Criterion Based on Entropy,” 12th ASCE Engineering Mechanics
Conference, SanDiego, CA, May 17-20, 1998.
27- "A Thermodynamic Framework for Determination of Solder Fatigue Life," ASME, Int.
Mechanical Engineering Congress and Exposition, Anaheim, CA November 15-20, 1998.
28- ”Mechanics of Solder Joints Under Concurrent and Dynamic Loading,”“ Int. Mechanical
Engineering Congress and Exposition, Anaheim, CA November, 15-20, 1998.
29- ”Thermomechanical Analysis of Solder Joints Under Concurrent Dynamic and Thermal
Loading,” ASME- InterPACK ’99 International Electronic & Photonic Packaging
Conference Lahaina, Hawai’I, June 12-18, 1999.
30- ,”Mesh Sensitivity and FEM Modeling for Multilayered Stacks,” ASME- InterPACK ’99
International Electronic & Photonic Packaging Conference Lahaina, Hawaii, June 12-18,
1999.
31- “A Damage Mechanics Based Constitutive Model for Pb/Sn Solder Alloys”, ASME, Int.
Mechanical Engineering Congress and Exposition, Nashville, TN November 14-19,
1999.
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32- ”Mechanical Behavior of BGA During Vibrations by Moiré Interferometry and FEM
Simulation,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville,
TN November 14-19, 1999.
33- “Closed Form vs. Finite Element Analysis of Laminated Stacks in Electronic Packaging,”
ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN November,
14-19, 1999.
34- Damage Mechanics of BGA Solder Joints under Combined Loading and Mini Temp
Cycles” Intel Corporation, Hillsboro, OR March 16, 2000.
35- ”A Constitutive Model for Pb/Sn Solder Alloys,” Surface Mount Technology Assoc.
International Assembly Technology Expo. Sept. 24-28, 2000, Rosemont, IL.
36- “A Damage Mechanics Based Constitutive Model for Pb/Sn Solder Alloy,” ASME, Int.
Mechanical Engineering Congress and Exposition, November 2000 Orlando, FL.
37- ”Influence of Minicyles on Fatigue Life,”“ASME, Int. Mechanical Engineering Congress
and Exposition, Orlando, FL, November 2000.
38- A Damage Mechanics based Approach to Fatigue Life Prediction of Electronic Packaging,
Micron Technology, Q&R Engineering, Boise, ID, May 2001.
39- A Moiré Interferometry Technology for Thermomechanical Fatigue Reliability of Solder
Joints, SMTA Advanced Packaging Technologies Conference, Boston, MA June 12,
2001.
40- Using Moiré Interferometry for Fatigue Reliability of Solder Joints, ASME/ASCE/SES
Mechanics and Materials Conference, San Diego, CA June 26-29 2001.
41- A Moiré Interferometry Technique for Fatigue Reliability of Microelectronics Interfaces,
Inter. Mechanical Engineering Congress and Exposition, November 11, 2001, NY City,
NY.
42- ” Experimental Characterization of Material Degradation of Solder Joint under Fatigue
Loading,” Proc. Of the VIIIth Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego,
CA.
43- “Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints”, Proc. Of the VIIIth
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic
Systems, May 29 June1 2002, San Diego, CA.
44- “Reliability of Solder Joints Under Electrical Stressing, Proc. Of the VIIIth Intersociety
Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May
29 June1 2002, San Diego, CA.
Cemal Basaran
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45- “Experimental Study of Failure Mechanics in Particle Filled Acrylic Composites,” VIIIth
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic
Systems, May 29 June1 2002, San Diego, CA.
46- “A Damage Mechanics Theory without a Potential Surface” Society of Engineering
Science 39th
Annual Meeting, Penn State, October 13-16, 2002.
47- Thermo-Electro-Mechanical Reliability of Microelectronics”, Delphi-Delco Electronics
Inc., Kokomo, IN October 18, 2002.
48- Damage Mechanics of Microelectronics Solder Joints Under High Current Density,
ASME IMECE, New Orleans, LA, November, 17-22, 2002.
49- Irreversible Thermodynamics for Damage Mechanics of Elastic-Brittle Materials, ASME
IMECE, New Orleans, LA, November, 17-22, 2002.
50- Experimental Damage Mechanics of Microelectronics Solder Joints, ASME IMECE,
New Orleans, LA, November, 17-22, 2002.
51- Implementation of a Thermodynamic Framework for Damage Mechanics of Solder
Interconnects, ASME IMECE, New Orleans, LA, November, 17-22, 2002.
52- Elastic Modulus of Pb/Sn Solder Joints in Microelectronics, ASME IMECE, New
Orleans, LA, November, 17-22, 2002.
53- Microstructural Evolution in Microelectronics Solder Joints Under High Electrical
Current Densities, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ
June 17-20 2003
54- A Thermodynamic Model for Damage Mechanics of Solids Under High Current
Densities, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June 17-20
2003
55- Damage Mechanics of Particle Infilled Composites: Model and Experimental
Verification, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June 17-
20 2003
56- An Analytical Model for Thermomechanical Analysis of Layered Microelectronic
Packaging,” ,” ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June
17-20 2003
57- Damage Mechanics of Microelectronics Solder Joints: Modeling and Experimental
Verification,” ,” ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June
17-20 2003
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58- Improvement on moiré interferometry with phase shifting technique and wavelet
transform image processing,” ASME, 2003 Mechanics and Materials Conference,
Scottsdale, AZ June 17-20 2003.
60- Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered
Microelectronic Packaging,” The 54th
Electronic Components and Technology Conf.
June 1-4, 2004, Las Vegas, NV.
61- Thermodynamic Model for Electrical Current Induced Damage in Microelectronics
Solder Joints,” The 54th
Electronic Components and Technology Conf. June 1-4, 2004,
Las Vegas, NV. Poster session.
62- ,”Damage Mechanics of Microelectronics Solder Joints Under High Current Density,”
The 54th
Electronic Components and Technology Conf. June 1-4, 2004, Las Vegas, NV.
63- ”Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered
Microelectronic Packaging,” The 54th
Electronic Components and Technology Conf.
June 1-4, 2004, Las Vegas, NV.
64- ”Thermodynamic Model for Electrical Current Induced Damage in Microelectronics
Solder Joints,” The 54th
Electronic Components and Technology Conf. June 1-4, 2004,
Las Vegas, NV.
65- ,”Deformation of Solder Joints Under Current Stressing: Experimental Measurement and
Numerical Simulation” 21st International Congress of Theoretical and Applied
Mechanics, August 15-21, 2004, Warsaw, Poland.
66- “Failure Modes of Micro/Nano Electronics Solder Joints Under High Current Density”,
ASME International Mechanical Engineering Congress and Expo, Orlando , FL
November 6-11, 2005
67- Modeling Deformation in Micro/Nano Electronics Solder Joints Under High Current
Density: Simulation and Testing,”, ASME International Mechanical Engineering
Congress and Expo, Orlando , FL November 6-11, 2005.
68- Electrical Current Induced Stress Analysis in Nanowires,” 15th
US National Congress of
Theoretical and Applied Mechanics, Boulder, CO 25-30 June 2006.
69- Experimental Study of Thermomigration in Lead-Free nanoelectronics Solder Joints,
ASME IMECE November 5-10, 2006 Chicago, IL.
70- Thermomigration Induced Strain Field Simulation for Microelectronics Lead-Free Solder
Joints, ASME IMECE November 5-10, 2006 Chicago, IL.
71- Length Scale in Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL
Cemal Basaran
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72- “ Computational Simulation of Electromigration Induced Damage in Copper
Interconnects” Proc. Of the Summer Simulation Multiconference 2007, Organized by
Society for Modeling and Simulation July 14-18, 2007, San Diego, CA
73- Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading On
Electronics Packaging, Proc. Of the Summer Simulation Multiconference 2007,
Organized by Society for Modeling and Simulation July 14-18, 2007, San Diego, CA
74- “Strain energy change due to an atomic defect in solder alloy lattice,” Summer
Simulation Multiconference 2007, Organized by Society for Modeling and Simulation
July 14-18, 2007, San Diego, CA, (Poster Session)
75- “Modeling High Current Density Induced Strain Field in Led Free Solder Joints” ASME
Int. Mechanical Engineering Congress and Expo Seattle, Washington, November 10-15,
2007.
76- ” Atomistic Modeling of Grain Boundary Diffisuon in Lead Free Solder Alloys,” ASME
Int. Mechanical Engineering Congress and Expo Seattle, Washington, November 10-15,
2007.
77- “Deterministic Calculations of Lattice Strain Due to Atomistic Defect in Solder Alloys,”
ASME Int. Mechanical Engineering Congress and Expo Seattle, Washington, November
10-15, 2007
78- “Thermomigration in Lead-Free Solder Joints,” ASME Int. Mechanical Engineering
Congress and Expo Seattle, Washington, November 10-15, 2007
79- ” A Micromechanics Based Damage Mechanics Model for Particle Filled Composites,”
ASME Int. Mechanical Engineering Congress and Expo Seattle, Washington, November
10-15, 2007
80- Simulating Degradation in High Density Power Electronics Packaging,,Int. Simulation
Conference, Edinburgh, Scotland, June 16-19, 2008
81- Molecular Dynamic Simulations of an Atom Vacancy in FCC Metal, ,,Int. Simulation
Conference, Edinburgh, Scotland, June 16-19, 2008
82- Simulating Low Temperature Electromigration and Thermomigration in Power
Electronics Packaging, ,,Int. Simulation Conference, Edinburgh, Scotland, June 16-19,
2008.
83- “Low Temperature Electromigration and Thermomigration in Lead Free Solder Joints,
ASME Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA.
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84- C. Basaran and Mohd F. AbdulHamid, ”Low Tempertaure Electromigrationand
Thermomigration in Lead-Free Solder Joints,” ASME Int. Mech Engineering Congress
and Expo, November 1-6, 2008, Boston, MA.
85- “Automatic Full Strain Field Moire Interferometry measurement with Nanoscale
Resolution, ASME Int. Mech Engineering Congress and Expo, November 1-6, 2008,
Boston, MA.
86- “Quantitative Plane Strain Field measurement of Solder Joint under Electrical Field with
Quasi-Isothermal Condition using Automatic Moire Interferometery,” ASME Int. Mech
Engineering Congress and Expo, November 1-6, 2008, Boston, MA
87- “Thermomigration Induced Degradation Analysis with Fully Coupled
Thermomechanical-Diffusion Equations using Nonlinear Material Properties,” ASME
Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA
88- “Thermomigration in Lead Free Solder Joints, ASME Int. Mech Engineering Congress
and Expo, November 1-6, 2008, Boston, MA
89- Atomistic Modeling of Grain Boundary Diffusion in Sn-Ag-Cu Solder Alloys,” ASME
Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA
90- “Stress Calculations in CarbonNanoTunes,” Atomistic Modeling of Grain Boundary
Diffusion in Sn-Ag-Cu Solder Alloys,” ASME Int. Mech Engineering Congress and
Expo, November 1-6, 2008, Boston, MA
91- “Multi-Scale Electromigration and Thermomigration Analysis of Nanoelectronics and
Power electronics” Semiconductor Research Corporation Summer review, Georgia Tech,
Atlanta, GA June 16-18, 2009
92- “Electromigration Damage Mechanics of Interconnects”, ASME/Pacific Rim Technical
Conference and Exhibition on Packaging and Integration of Electronics and Photonic
Systems, MEMS and NEMS, Inter PACK ’09, July 19-23, 2009 San Francisco, CA
93- “An Empirical Electromigration Time to Failure Equation for Lead-Free Solder Joints”,
ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration
of Electronics and Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23,
2009 San Francisco, CA
94- “Damage Mechanics of Carbon nano Tubes under Uniaxial Tension”, ASME/Pacific Rim
Technical Conference and Exhibition on Packaging and Integration of Electronics and
Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23, 2009 San Francisco,
CA
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95- Quantum Mechanical Formulation For the Joule Heating in Single-walled Carbon
Nanotubes, ASME International Mechanical Engineering Congress and Exposition,
November 13-196, 2009, Orlando, FL
96- Prediction of Current-induced Forces in Single-walled Carbon Nanotubes , ASME
International Mechanical Engineering Congress and Exposition, November 13-196, 2009,
Orlando, FL
97- An Experimental Electromigration Study on SnAgCuNi Solder Joints, ASME
International Mechanical Engineering Congress and Exposition, November 13-196, 2009,
Orlando, FL
98- Simulating Single Walled Carbon NanoTube Failure Under Tension, ASME
International Mechanical Engineering Congress and Exposition, November 13-196, 2009,
Orlando, FL
99- A Computational Damage Mechanics Model for Thermomigration, ASME International
Mechanical Engineering Congress and Exposition, November 13-196, 2009, Orlando, FL
100- Full Field Joule Heating Measurement of Copper Plate using Phase Shifting
Moiré Interferometry in Microscopic Scale, ASME International Mechanical Engineering
Congress and Exposition, November 13-19, 2009, Orlando, FL
101- Statistical Phase shifting Step Estimation based on Continuous Wavelet
Transform for High Resolution Interferometry Metrology, ASME International
Mechanical Engineering Congress and Exposition, November 13-196, 2009, Orlando, FL
102- Modeling of the Moiré Interferometer for the Applications of Nano-scale
Measurement in the Reliability Testing of the Electronic Packaging, ASME International
Mechanical Engineering Congress and Exposition, November 13-19, 2009, Orlando, FL
103- Atomistic Modeling of Tin Surface and Grain Boundary Diffusion, ASME
International Mechanical Engineering Congress and Exposition, November 13-19, 2009,
Orlando, FL
104- A Study on Stress Whitening in Thermoformed Mineral Filled Acrylics , ASME
International Mechanical Engineering Congress and Exposition, November 13-19, 2009,
Orlando, FL
105- Damage Mechanics of Next generation Power Electronics, Summer Simulation
Multi-Conference, July 11-14, 2010 Ottawa, Canada
106- A Viscoplatic Model For Solder Alloys , ASME International Mechanical
Engineering Congress and Exposition, November 12-18, 2010, Vancouver, B.C., Canada
Cemal Basaran
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107- Electromigration Behavior of Solder under Single Pulsed Load, ASME
International Mechanical Engineering Congress and Exposition, November 12-18, 2010,
Vancouver, B.C., Canada
108- The effect of Temperature on the Mechanical Behavior of Defected Single-
Walled Carbon Nanotubes Using Molecular Dynamics Simulations , ASME International
Mechanical Engineering Congress and Exposition, November 12-18, 2010, Vancouver,
B.C., Canada
109- Molecular Dynamics Simulations of the Unraveling of Carbon Nanotubes due
Field Emission Forces, ASME International Mechanical Engineering Congress and
Exposition, November 12-18, 2010, Vancouver, B.C., Canada
110- Damage Mechanics of electronic packaging solder joints under AC, ASME
International Mechanical Engineering Congress and Exposition, November 12-18, 2010,
Vancouver, B.C., Canada
111- Modeling of Moiré Interferometer for the Applications of Nano-scale
Measurement in Reliability Testing of Electronic Packaging, ASME International
Mechanical Engineering Congress and Exposition, November 12-18, 2010, Vancouver,
B.C., Canada
112- Near Field Multi-physics Modeling of the Moiré Interferometer for the
Applications of High Resolution for Thermomechanical Testing of Electronic Packaging
, ASME International Mechanical Engineering Congress and Exposition, November 12-
18, 2010, Vancouver, B.C., Canada
113- Damage Evolution in Non-Isothermal Stretching of Acrylics across Glass
Transition , ASME International Mechanical Engineering Congress and Exposition,
November 12-18, 2010, Vancouver, B.C., Canada
114- Non-Isothermal Stretching of Acrylics across Glass Transition , ASME
International Mechanical Engineering Congress and Exposition, November 12-18, 2010,
Vancouver, B.C., Canada
115- Atomistic Modeling of Copper Dopant Grain Boundary Stabilization in Tin,
ASME International Mechanical Engineering Congress and Exposition, November 12-18,
2010, Vancouver, B.C., Canada
116- Theory Of Entropy Based Damage Mechanics, ASME International Mechanical
Engineering Congress and Exposition, November 12-18, 2010, Vancouver, B.C., Canada
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117- A Multiscale Analyis Method to Connect MDS with FEA, Society for
Engineering Sciences Annual Conference, Northwestern University October 12-14, 2011
118- Unraveling in Field Emitter SWCNT, Society for Engineering Sciences Annual
Conference, Northwestern University October 12-14, 2011
119-
Professional Affiliations
Fellow, American Society of Mechanical Engineers
Member, IEEE
Member, IEEE Components, Packaging and Manufacturing Technology Society
Member, Society for Modeling and Simulation
Technical Reviewer
Nature
Acta Materialia
Journal of the Mechanics and Physics of Solids
Mechanics of Materials
Geophysical Journal International
Engineering Fracture Mechanics
Experimental Mechanics
Materials Science and Engineering A
International Journal of Solids & Structures
International Journal of Damage Mechanics
International Journal for Numerical Methods in Engineering
International Journal of Mechanical Sciences
Journal of Engineering Mechanics, Trans. Of ASCE
Journal of Electronic Packaging, Trans. Of ASME
Journal of Comp. Pack. Manuf. Tech. Part A, Trans. Of IEEE
Journal of Advanced Packaging, Trans. Of IEEE
Journal of Electronic Materials
Mechanics Research Communication
Journal of Alloys and Compounds
Microelectronics Reliability
Engineering Fracture Mechanics
Fatigue and Fracture of Engineering Materials and Structures
AWS, Welding Journal
Prentice Hall, Engineering Text Books.
Physics. Status Solidi B
Journal of Composites : A
Proceedings of the Royal Society: A
Cemal Basaran
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International Journal of Reliability and Safety
Materials Chemistry and Physics
ASCE J of Nanomechanics and Micromechanics
International Professional Service
Expert Advisor to Canada Foundation for Innovation for $65 million microelectronics
and photonics research infrastructure grants, September 13-14, 2001, Toronto, Canada.
Proposal Reviewer for Northern Ireland, UK Higher Education Authority, North South
Research Program, June 2003,
Proposal Reviewer Hong Kong Science and Technology Commission, Research Grants
Council, May 2000, March 2003, October 2005, February 2009.
Proposal Reviewer for, Science Foundation Ireland, Republic of Ireland, February 2004.
Reviewer, Chateaubriand Fellowship, French Embassy, Office for Science and
Technology, March 2007
Proposal Reviewer, U.S. State Department, International Science and Technology Center,
Nonproliferation Program for non-weapons opportunities for scientists and engineers in
the New Independent States (NIS) of the former Soviet Union, January 2008.
Proposal Reviewer for Department of Defense SERDP Weapons Systems and Platforms
program, April 2009.
University and Community Service
Dept. of Civil, Structural and Environmental Engineering
Director of Graduate Studies, July 2004 –July 2007.
Chair, Dept. of CSEE Computer Committee, March 2003-September 2004.
Member, Construction Engineering Faculty Search Committee, 2000-2001.
Member, Structures Faculty Search Committee, 1999-2000.
Coordinator, Geotechnical Division Master of Engineering Program, 1996-1997, 1997-
1998.
Member, Graduate Studies Committee, 1995-1999, 2002-present
Member, Master of Engineering Committee, 1997-1998.
Coordinator, Geotechnical and Computational Mechanics Divisions Graduate
Admissions, 1996-1997, 1997-1998, 1998-1999.
Member, Computer Committee, 1995 to 2004.
Member, Geotechnical Faculty Search Committee, Spring 1996.
Coordinator, Dept. of Civil Engineering Weekly Seminar Series, Spring 1996.
Faculty Advisor, Civil Engineering Dept. Graduate Student Association, 1996 to present.
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Freshmen Academic Advisor to SEAS Students 2000- present
Member, Structural Mechanics Faculty Search Committee, 1998-1999.
Faculty mentor, mentoring one junior faculty member, Prof. Aref. 1999-2002.
Coordinator, Dept. of Civil Engineering Computational Simulation Group Weekly
Seminar Coordinator, Spring 2004
School of Engineering and Applied Sciences
Director, Electronic Packaging Laboratory, 1997-present.
National Society of Black Engineers UB chapter Volunteer, Oratorical Contest Judge,
Fall 1996.
Advisor and host for NSF- SUNY Alliance for Minority Participation Research
Internship Program. Mr. Emanuel St. Pierre, Summer 1997.
Member, Provost Advisory Committee for Doubling Research Dollars at UB, 2000.
BEAM/SEAS Honors Research Summer Program Faculty Advisor since 1996-present
University at Buffalo
Member, Faculty Senate Executive Committee, 2004-2005, 2005-2006.
Member, Schomburg Minority Graduate Fellowship Review Committee, Spring 2005
Senator, University at Buffalo, Faculty Senate, July 1, 2004 – June 30, 2006.
Alternate Senator, University at Buffalo, Faculty Senate 1998-1999, 2003-2004.
SUNY Alliance for Graduate Education and Professoriate NSF Grant Advisory
Committee Member, 2000-2004
National Level Service
1. Member, ASME Electronic Packaging Division, 1995 to present.
2. Member, American Society of Mechanical Engineers, Electrical & Electronic
Packaging Division, Manufacturing Subcommittee 11/1995-11/1996.
3. Vice-Chair, Session EEP-11: Stress/Strain Modeling in Microelectronics, ASME
International Mechanical Engineering Winter Annual Congress & Exposition,
November 12-17, 1995.
4. Chair, session on Applications of FEM and BEM to Electronic Packaging 1997
Joint ASME/ASCE/SES Meeting June 29 - July 2, 1997 Northwestern University,
Evanston, IL
5. Chair, Track 3/ Session 3.2 Modeling of Solder Solidification and Fatigue, ASME
InterPACK Conference Maui, Hawaii, June 13-17, 1999.
6. Member, ASME Materials and Applied Mechanics Divisions Joint Constitutive
Modeling Executive Committee 1999 to present.
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7. Invited Panelist, National Science Foundation- SUNY Alliance for Minority
Participation Minority Graduate School Awareness Conference, Buffalo, NY,
October 11, 1997, and October 30, 1999 and October 14, 2000. November 2002.
8. National Science Foundation CAREER Award Panel, 1999, 2000.
9. National Science Foundation, Unsolicited Proposal Reviewer, 2000.
10. Chair, Symposium on Plasticity at Small Scale for Emerging Technologies, ASME
Int. Congress and Exposition, November 5-10, 2000 Orlando, FL.
11. Chair, Symposium on Advances in Applied Mechanics for New Technologies,
International Mechanical Engineering Congress and Exposition November 12-16,
2001, NY City, NY
12. Chair, session on Failure Mechanics,” VIIIth Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San
Diego, CA.
13. Chair, Symposium (8 sessions) on Recent Advances Damage Mechanics, ASME,
International Congress and Expo, November, 18-22, 2002, New Orleans, LA.
14. Lead Reviewer & Panelist, NSF, Division of Materials Research, Major Research
Instrumentation (MRI) infrastructure funding program, May 7- 8, 2003,
15. Panel Chair, NSF, Division of DMII Materials Processing and Manufacturing
Program, Unsolicited Proposals, December 15, 2003.
16. Chair, Symposium on Reliability, Electronics Packaging Division, ASME
International Mechanical Engineering Congress and Expo, Orlando , FL November 6-
11, 2005
17. NSF, Panelist, Division of DMII Materials Processing and Manufacturing Program
Unsolicited Proposals, January 10, 2006.
18. Chair, Session on Mechanics of Next generation Nanoelectronics and Power
Electronics, 15th
US National Congress of Theoretical and Applied Mechanics,
Boulder, CO 25-30 June 2006.
19. Chair, Session on Mechanical Behavior of Joints, 10th
Int. Conf. On the Mechanical
Behavior of Materials, Busan, Korea, May 27-30 2007.
20. External faculty mentor, Prof. Rashid Abu Al-Rub, Zachary Dept. of Civil
Engineering, Texas A&M University, College Station, TX
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21. Topic Co-Organizer, Symposium on Multi-Physics Issues in Electronic/Photonic
Packaging, Symposium Quality and Reliability of Electronic/Photonic Packaging,
Symposium Organizer on Multi-Scale Constitutive Modeling, ASME Int.
Mechanical Engineering Congress and Exposition, October 31- November 6, 2008,
Boston, MA
22. Chair, Session on Packaging Reliability I and Failure Mechanisms-II, ASME/Pacific
Rim Technical Conference and Exhibition on Packaging and Integration of
Electronics and Photonic Systems, MEMS and NEMS, InetrPACK ’09, July 19-23,
2009 San Francisco, CA
23. Chair, Symposium on Atomistic Level Modeling, ASME ASME International
Mechanical Engineering Congress and Exposition 2009
24. Co-Chair, ASME International Mechanical Engineering Congress and Exposition
2010 Electronic & Photonic Packaging Track Co-Chair, Vancouver, Canada
25. Chair, ASME International Mechanical Engineering Congress and Exposition 2011
Electronic & Photonic Packaging Track, Denver, Colorado.
Community Service
1- Volunteer Interpreter and Translator at the International Institute of Buffalo, which is
a nonprofit organization providing assistance to refugees, and new immigrants.
2- Volunteer Consultant Civil Engineer "Westfield Cooperative Farm" Construction,
1996.
3- Volunteer 4-H Leader Cornell Cooperative Extension in Chautauqua County, 1997,
1998.
4- Volunteer Speaker at Albion Central Schools, 2002.
5- Vice-President, Empower Orleans December 2006 – February 2008
6- Chairman, Orleans County Legislature’s Citizens Advisory Board, August 2008 –
present
Professional Experience (industry)
Cygna Energy Services, Boston, MA
Staff Engineer 6/1988-1/1992.
Group leader for structural analysis.
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Started the computer aided design tradition by initiating the use of MathCAD and
AutoCAD for designing nuclear pipe supports and steel structures. Initiated the tradition
of using Databases for power plant structural component inventory control. Trained
engineers on using finite element packages.
Worked as a consultant structural engineer in the nuclear industry. Some of the
consulting projects undertaken are;
1-Toledo Edison's Davis Besse Nuclear Station, seismic analysis of piping systems, ( 6
months in 1991)
2- New York Consolidated Edison's Indian Point 2, seismic analysis for snubber
reduction effort for the auxiliary coolant lines, (3 months in 1990)
3- Boston Edison Pilgrim Nuclear Power Plant Unit 1 Independent Design Review of the
main steam piping stress analysis, (2 months in 1988)
4- Toledo Edison's Davis-Besse Nuclear Power Plant, seismic analysis of the
demineralized water transfer and storage piping system (4 months in 1990)
5- Yankee Rowe Nuclear Station, seismic analysis of bleed drain piping system. (4
months, in 1989)
6- California Transportation Authority' (CALTRANS), seismic analysis and evaluation of
the Interstate 280 Highway China Basin section (San Francisco) viaduct soil-structure
system. (4 months in 1990)
7- CALTRANS, parametric study of finite element modeling of the two level elevated
highways for seismic analysis. (3 months in 1989)
8- Toledo Edison Davis-Besse Nuclear Power Plant, station blackout diesel generator
building, equipment, piping and pipe supports seismic analysis. (4 months in 1991)
9- Grand Gulf Nuclear Power Station, Drywell Valve Handling crane seismic analysis. (2
months in 1988)
10- Toledo Edison's Davis-Besse Nuclear Power Plant, seismic analysis of existing/new
pipe support associated with auxiliary and main steam cooling piping systems. (3 months
in 1989)
11- System Energy Resources Grand Gulf Nuclear Power Plant Unit 1, standby service
water piping nonstandard pipe supports and penetrations load reconciliation/evaluation
project.(2 months in 1988)
12- Boston Edison Pilgrim Nuclear Power Station, TIP room platform seismic analysis.(2
months in 1988)
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13- System Energy Resources, Grand Gulf Nuclear Station Unit-1, the seismic design of
instrument air system filter station.(3 months in 1989)
14- System Energy Resources Grand Gulf Nuclear Power Station Unit-1, seismic
analysis. (3 months in 1991)
15- Boston Edison's Pilgrim Nuclear Station, finite element analysis of the main steam
piping gangways.(2 months in 1988)
16- Tennessee Valley Authorities Browns Ferry Nuclear Power Plant for motor control
center enclosure design and seismic analysis. (2 months in 1989)
Workshops and Institutes Attended
American Society for Engineering Education, The National Effective Teaching Institute,
Milwaukee, WI, June 12-14, 1997.
American Society for Engineering Education/National Science Foundation Visiting Scholars
Effective Teaching Workshop, Buffalo, NY, February, 16 & 17, April 27 1998.
Power Electronics Packaging, University at Buffalo, SUNY, May 17, 2007
National and International Press Coverage of Research Contributions
http://www.packaging.buffalo.edu/news.html