CHRIS LEONARD

Space Products Marketing

Challenges for Electronic

Circuits in Space Applications

10/12/2016

Agenda

► An Overview of the Harsh Environmental Conditions in Space

► A High Level View of the Satellite Industry and Applications Driving Growth in the Industry

► A Brief Outline of the Radiation Environment and Effects on Electronic Devices

► How Analog Devices is Supporting Designs for Space Level Applications

2

The Space Environment

► Noise and Vibration

► Out Gassing

► Satellite Charging

► High Temperature

Fluctuations

► Thermal Management

in a Vacuum

► Prohibited Materials

► Radiation

Supporting the Aerospace & Defense Industry

40+ year History Supplying High Reliability Products

4

5

A High Level View of the Satellite Market

and Applications Driving Growth in the

Industry

The Satellite Market

► Satellite Manufacturing

► Satellite Launch Industry

► Ground Based Equipment

► Satellite Services

NAVCOM

SATCOM

Earth Observation

Leisure

Vessel

Gen Aviation

Outdoor Rec

Personal LBS

Maritime

Rail

Commercial

Aviation

Environment

Monitoring

Agriculture

Forest

Energy

Water

Homeland Sec

Law Enforce

Humanitarian

Disaster

Management

Consumer

Services

Cartography

Land

Use

Transport

Coastal

Mgmt

Professional

Weather

Forecast

IP Direct

Access

Professional

Mobile Com

Messaging &

Asset Tracking

Corporate

Networks

Defense

Security

Rural Com

Telemedicine

DTH

Business TV

Education TV

Content Mgmt

In Flight

Government

Road

Professional

Consumer

Transport

Consumer

Broadband

Mobile Com

Satellite

Networks

Video

Distribution

Video

Contribution

Mobile

EntertainNatural

Resource

Management

Defense &

Security

Land

Monitoring

Oceanography

Meteorology

DefensePublic Safety

Fleet Mgmt

Telemetrics

Scientific

Agi/Fish

Asset Mgmt

Time & FreqSurveying

Traffic Mgmt

Satnav

Satcom

EO

Satellite Services – Driving New Payload Designs

Basic Elements of a Satellite

8

Aerospace and Defense Spectrum Usage

Complete Solutions for the Entire Spectrum

9

10

A Brief Outline of the Radiation

Environment and the Effects on

Electronic Devices

Space Radiation

Trapped Radiation

► Particles (protons/electrons) from Sun – Solar Wind

► Earths magnetic field deflects most particles

► Some become trapped in the Earth’s magnetic field

Transient Radiation

Galactic Cosmic Radiation (GCR):

► Ionized atoms originating outside the solar system

► Travel at close to the speed of light

► Earth’s magnetic field provides shielding for most except at the poles

Solar Particle Events:

► Particles created by solar flares and

coronal mass ejections

► Can travel from the sun to earth in minutes

11

Radiation Effects on IEEE Devices

Total Ionizing Dose (TID) HDR, LDR, ELDRS• Trapped Radiation (Krad)

• Accumulated charge over mission life time

• Creates leakage currents and Volt shifts

• Is, Ib, Vos, G degradation

• Threshold Shifts

• Leakage Current

• Timing Changes

Single Event Effects (SEE) • Galactic Cosmic Radiation and Solar Particle Events

Non-‐Destructive, Soft Errors, SET, SEU, SEFI, SEL• Changed states in memory cells or registers

• Device latch up, “stuck bits” in memory

• Transient signals….a voltage pulse

Destructive…Hard Errors…SEL, SEGR, SEB• Run away supply current from activated SCR effect

• Single event Gate Rupture and Single Event Burnout

12

Technology Trends and Radiation Effects

Payload w/ complex signal processing on board:

More opportunity for TID and SEE Radiation Effects

Increase in the use of commercial grade components:

COTS generally more sensitive to radiation effects

NanoSat & MicroSat provide less shielding from

the satellite structure

Finer Geometries of integrated circuits w/ higher levels of integration:

The scaling down of the gate oxide thickness decreases the TID effects.

SEE expand with scaling (less energy required to produce SEU)

Higher Frequency devices:

Single event transients translate into SEUs, increasing the number of

SEFI. Mitigation techniques to address transient voltages is more

challenging.

13

14

How Analog Devices is Supporting

Designs for Space Level Applications

QML V MIL-PRF-38535, SMC-S-010, 311-INST-001 Level 1

QML V w/ RHA Radiation Harness Assurance

Internal Space Flow Parallels MIL-PRF-38535

SCD Source Control Drawings

Total Dose - HDR Testing to 100 Krad. Can test higher

Total Dose - LDR 50 Krad RHA Designator and 100 Krad Data

SEE Available on New Product Releases

DD Capability via Contract

DLA SMC NASA

Processes

Design

Radiation

Leverage ADI Core Silicon

Modify ADI Core Silicon

Port ADI Core Silicon

Captive Proprietary SOI Processes

Partnership SOI Processes

Analog Devices Design, Processes & Radiation

15

Typical Semiconductor Device Categories

Product Type Package Temp Processing

Commercial Plastic 0 to 70 C OEM Specific

Industrial Plastic Varies by Model OEM Specific

Enhanced Product Plastic -40/-55 to 105/125 C AQEC

Automotive Plastic/Ceramic -40 to 125 C Auto/AEC-Q100

Military Grade Ceramic Hermetic -55 to 125 C MIL-PRF-38535 (QMLQ)

Military Grade Ceramic Hermetic -55 to 125 C MIL-PRF-38534 (QMLH)

(Hybrid/MCM)

Space Grade Ceramic Hermetic -55 to 125 C MIL-PRF-38535 (QMLV)

Space Grade Ceramic Hermetic -55 to 125 C MIL-PRF-38534 (QMLK)

(Hybrid/MCM)

16

MIL-PRF-38535 QMLV Screening & QCI

Screen 100% or sample Test Method___________

Wafer Lot Acceptance All Lots TM-5007

Nondestructive Bond Pull 100% Eliminated effective 4/15/03

Internal Visual 100% TM-2010, Condition A

Temperature Cycle 10 Cycles (reduced from 100) TM-1010, Condition C

Constant Acceleration 100% TM-2001, condition E

External Visual Inspection 100% TM-2009

Particle Impact Noise 100% TM-2020, Condition A

Serialization 100%

Burn-In 100% TM-1015 to 240 hours

Post Burn-In electrical 100% IAW Device Datasheet

Reverse Bias (RB) Burn-In 100% (if applicable) TM-1015, to 72 hours

Post RB Burn-in electrical 100%

17

MIL-PRF-38535 QMLV Screening & QCI cont.

Screen 100% or Sample Test Method .

Percent Defective Allowable All Lots 5% - Overall, 3% - Catastrophic

Final Electrical Test 100% IAW Device Datasheet

Fine Leak Inspection 100% TM-1014

Gross Leak Inspection 100% TM-1014

X-Ray 100% TM-2012

External Visual 100% TM-2009

Quality Conformance Inspection - QCI Testing .

Group A Electrical test Each inspection lot

Group B Assembly related test Each inspection lot or sub-lot

Group C Die related test TCI - Each Fab lot

Group D Package related test Each package-family type every 6 months

Group E Radiation hardness Each wafer/wafer lot

18

Integrated Solutions & Space Product Types

Hybrid/Module• Standard…

Connectorized Packages

• DC – 45 GHz

• Custom Configurations

Packaged Monolithic• DIP, CAN, LCC, FLAT PACK

• 2 – 52 I/O, MMIC I/O

G7, G8, G16, G24

& G32 up to 4GHz

LH5 & LH250 up to 20GHz

LSHx up to 40GHz, 3 Watts

Die• Standard Product

• Source Control Drawings

• Custom Product/Test

Enhance Product (EP/EP+)• Die process qualified over full Mil

temp range

• Assembly

-Commercial Overmold

-NiPdAu lead finish

-No copper wire bonds

• Parts guaranteed from -55C to

+105 or +125C

• Controlled Baseline

-One assembly site

-One test site

-One fab site

• Limited PEMs screen (EP+)

• Radiation benchmarking (EP+)

19

Enhance Product (EP) & EP+ Market Summary

► Enhance Product (EP) High Reliability Application Market requirements

UAV / Avionics Market for extended temp

EP devices now mandated by US Army for Missile programs Commercial Off the Shelf Solutions

Designed to meet high performance, mission critical High Reliability Applications

Controlled Manufacturing Baseline – One Assembly Site, One Test Site, One Fab site

Extended temperature to meet needs of Aerospace and Defense applications

Address concerns over Tin Whiskering … NiPdAu lead finish…

Enhanced Product Change Notification process

DLA Vendor Items Drawings (VID or V62) device part numbers

► Enhance Product Plus (EP+) Addressing Space Market requirements

Low Earth Orbit Systems

High Altitude Applications Provide additional screening to standard Enhance Product (EP) devices

Standard Screening Flow TBD…currently available as Source Control Drawings.

20

A New Device Concept for Space - EP+ Devices

► Emerging low cost satellite applications and high altitude

applications

are looking for lower cost space solutions for shorter

mission profiles

► EP+ is envision to be everything that EP is + rad qualified

die + some additional screening as defined with the

customer as it significantly affects price

21

$

Class SCommercial 883BEP EP+

Starting Material Radiation Qualified Die

Thermal Cycle

Electrical Test

Life Test

Electrical Test Min,25,Max

External Visual

Unbiased Hast

Final Electrical Min,25,Max

External Visual

Serialization

Visual

Thermal Cycle

CSAM

X-Ray

Electrical Test

Burn-In

Electrical Test

DPA

Visual

Characterization

Unit Screening► EP+ is available only via SCD (source control drawing) today

as we work with customer to define the optimal screening flow.

Potential EP+ Product Flow

The amount of selected

screening affects the price curve

Operational Amplifiers

60 600

Low Offset

High Speed /

Low Noise

Low Input Bias

Wide BW

High Speed /

Differential

Instrumentation

AD8629S

AD8351SAD8138S

AD8671S

AMP01SAD524S

PM156S AD648SPM108S

OP42S PM155SOP12S

OP16SSOP43S

OP15S OP215S

OP200S

OP27SOP07S

OP77S

OP270S

OP400SOP484S

AD8041S AD8001S

OP4671S OP470S OP471S

OP227S

OP207S

OP37S

OP22SuV400 300 270 175 125 100 80 60 60 60 50 30 10uV

nAnA 20 7.5 5 5 3 3 0.3 0.3 0.2 .01

nV/rt HznV/rt Hz 57

160 880 GBW- MHzGBW-MHz

BW- MHzBW- MHz 350 500

nV/rt HznV/rt Hz 6.5 6. 3

Log Amp

VGA

AD8306S ADL5513S

BW- MHz BW- MHz400 4000

BW- MHz BW- MHz

AD8367S

500

AD8229S

1

ADA4610

.005

Shunt MonitorAD8212SAD8210S

Common Mode Voltage - V -2 to 65 7 to 65Common Mode Voltage - V

Micro PowerADA4096S

Supply I / Amp - uAADA4084S, Dual

Supply I / Amp - uA

ADA4077S

ADA4084S, Quad

Available Portfolio

Recent Release

In Development/Planned22

ADA4084-2S – Dual Op Amp

Key Benefits

Low Noise and Low Power for Precision Applications

Wide BW and Low Noise for Filters and Instrumentation

Wide Rail-to-Rail I/O range for Buffers and Sensors

Rail-to-Rail I/O for multi stage filters and SNR maintenance

Temperature Package

–55°C to +125°C 10 Pin Flat Pack

Sampling Final Release

Now Now

23

Key Specifications

Noise: 3.9 nV/√Hz

Power: 0.625mA/ch

GBW: 15.9 MHz (G=1)

UGC: 9.9 MHz (G=1)

Supply: 3-30 V Rail-to-Rail I/O

Radiation: TID to 100Krad

Radiation: No SEL at ( Vs=5V, 125C, <=80.7MeV )

Part Number: 5962R1324501VXA (ADA4084-2AF/QMLR)

ADA4610-2S – Dual Channel Precision, Very Low Noise, Low Input Bias

Current, Wide Bandwidth JFET

Key Benefit

Low Offset and Drift

High CMRR and PSRR

Low Noise Improves Signal-to-Noise Ratio

Rail-to-Rail Output Maximizes Dynamic Range

Low Power for improved SWaP

Temperature Package

–55°C to +125°C 10-Lead Flat Pack

Sampling Final Release

Now Now

24

Key Specifications

Low Offset voltage: 1mV max

Low Noise: 7.3 nV/√Hz at 1 kHz typical

Low Bias Current : 1.5nA max at Vsy = ±15v

Low TcVos: 8uV/°C maximum

Low distortion: 0.00006%

Low Isy: 1.85mA

Radiation: 100KRad

Part Number: 5962R1420701VXA (ADA4610-2BF/QMLR)

ADL6010S – In Development

Envelope Detector

Temperature Package

–55°C to +125°C 2 RF Ports, 6 DC Pads

Sampling Final Release

DEC - 2016 JAN - 2017

25

Key Specifications

Input Frequency: 500 MHz – 40 GHz

Input Range: -30 to +15 dBm (referred to 50 ohm)

Temp Stability: <0.5dB

Slope: 2.3 V/VPEAK

Power: 1.6 mA (5V)

Radiation: 100 KRad

Part Number: ADL6010R703LSH6

Key Benefit

Schotty diode front end with on-chip linearization

Linear in V/V average power measurement

Accurate response with minimal slope variation

Excellent Temperature stability

Isolation & Interface

Why Digital Isolators?

• 4x improvement in data rate and timing specifications

• Integrates multiple isolation channels with other functions to reduce size

--and cost

• Operates at power levels up to 90% lower than optocouplers

• Minimizes external components needed to connect to other digital ---------

--devices

• Increases reliability by eliminating LEDs used in optocouplers

25

Recently Released

In Development

Under ConsiderationIsolated Error Amp

Digital Isolator

Mbps Mbps

ADuM141ADuM7442S

Quad Ch.

100

ADuM3190

isoPower

USB 2.0 Compatible

Isolated Gate Drivers

Isolated I2C Isolators

Linear Isolators

Isolated CAN

Isolated RS-485

Isolated RS-232

Isolated A/D Converters

ADI Isolator Family

150

26

Goal: Deliver a “Compete Product” Not Just Components

► Industries most comprehensive portfolio w/ Industry Leading Device Reliability

► Single Lot Date Code Procurement

► Advanced packaging and characterization to meet environmental challenges

► Gold and Tin-Lead Hot Solder Dip Lead finishes

► No prohibited materials certification

► Comprehensive Certificates of Conformance w/ Material Traceability

► Comprehensive QMLV Flight Unit Test Report

► Electrical performance production tested over extended temp ranges (-55 to 125C)

► Fully Qualified QMLV Devices w/ 100% Screening & Quality Conformance Inspection

► Radiation Qualified Devices…HDR, LDR, SEE (single event effects)

► Long Product Life Cycles Are a Cornerstone of ADI’s Business Strategy

► A Dedicated Aerospace & Defense Team

27

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