cmos transistors
DESCRIPTION
CMOS Transistors. Outline. Qualitative Description of CMOS Transistor g m /I D Design Biasing a transistor Using g m /I D Approach Design Using Cadence. A Crude Metal Oxide Semiconductor (MOS) Device. V2 causes movement of negative charges, thus current. V1 can control the - PowerPoint PPT PresentationTRANSCRIPT
CMOS Transistors
Outline
• Qualitative Description of CMOS Transistor
• gm/ID Design
• Biasing a transistor Using gm/ID Approach
• Design Using Cadence
A Crude Metal Oxide Semiconductor (MOS) Device
P-Type Silicon is slightly conductive.
Positive charge attractnegative chargesto interface between insulator and silicon.
A conductive path is createdIf the density of electrons is sufficiently high.Q=CV.
V2 causes movement of negative charges,thus current.
V1 can control the resistivity of the channel.The gate
draws no current!
An Improved MOS Transistor
n+ diffusion allowselectrons movethrough silicon.
(provide electrons) (drain electrons)
Typical Dimensions of MOSFETs
These diode mustbe reversed biased.tox is made really thin
to increase C, therefore, create a strong control of Q by V.
A Closer Look at the Channel Formulation
Need to tie substrate to GNDto avoid current through PN diode.
Positive charges repel the holescreating a depletion region, a region free of holes.
Free electrons appear at VG=VTH.
VTH=300mV to 500 mV(OFF) (ON)
Channel Resistance
As VG increases, the density of electrons increases, the value ofchannel resistance changes with gate voltage.
Drain Current as a function of Drain Voltage
Resistance determined by VG.
Drain Current as a function of Gate Voltage
Higher VG leads to a lower channel resistance, therefore larger slope.
Length Dependence
The resistance of a conductor is proportional to the length.
Dependence on Oxide Thickness
Q=CVC is inversely proportional to 1/tox.
Lower Q implies higher channel resitsance.
Width Dependence
The resistance of a conductor is inversely proportional to the crosssection area.
A larger device also has a larger capacitance!
Channel Pinch Off• Q=CV– V=VG-VOXIDE-Silicon
• VOXIDE-Silicon can change along the channel! Low VOXIDE-Silicon implies less Q.
VG-VD is sufficiently largeto produce a channel
VG-VD is NOT sufficiently largeto produce a channel
No channel
Electronsare sweptby E to drain.
Drain can no longer affect the drain current!
Regions
No channel
(No Dependence on VDS)
Determination of Region
• How do you know whether a transistor is in the linear region or saturation region?– If VDS>(VGS-VTH) and VGS>VTH, then
the device is in the saturation region.– If VDS<(VGS-VTH) and VGS>VTH, then
the device is in the linear region.
Graphical Illustration
Limited VDS Dependence During Saturation
As VDS increase, effective L decreases, therefore, ID increases.
Pronounced Channel Length Modulation in small L
Transconductance• As a voltage-controlled current source, a MOS transistor
can be characterized by its transconductance:
• It is important to know that
What Happens to gm/ID when W and ID are doubled?
Body Effect
The threshold voltage will change when VSB=0!
Experimental Data of Body Effect
The threshold voltage will increase when VSB increases.
Small Signal Model for NMOS Transistor
PMOS Transistor
IV Characteristics of a PMOS
Small Signal Model of PMOS
Small Signal Model of NMOS
gm/ID Design Approach
gm/ID Design Flow
Specs
Design Equations(Analytical
)
gm/Id Data Set
(Emprical)
gm/ID Design Optimization
W/L Ratios
(F. Silveira, JSSC, 1996.)
Intuition
gm
gds
gm/IDgm/gds
2gm
2gds
gm/IDgm/gds
2gm
2gds
gm/IDgm/gds
gm/ID Data Set
• gm/gds
• gm/gmbs
• ID/W
• Cgd/Cgg
• Cgs/Cgg
• ….more
(F. Silveira, JSSC, 1996.)
Design Example
Calculation
(gm is determined)
Initially assume that gmro is large!
gm/gds
(50)
Current Density
Biasing an MOS Transistor Using gm/ID technique
Section 7.1
J.OuSonoma State Univeristy
Basic Analysis
Use 1.2 V
(Modified Ex 7.1)
Design Equations
Assumption: VDD=1.2 V
Transistor Information:Type: 120 nm Specify VDSNote var1_1 is ‘vsd’ if pmos is usedNote var2_1 is ‘vns’ if nmos is used.
In this example, is initially unknown, so we will assume that it is 0.0
Interpolation
Since the database basecan not be so large as to keep all possible values of vds/vsb, we have to interpolate based on existing values, which are availableOn 0.1 V interval.
Current release: need to enterinBias <= the minVar1 and maxVar1.
minVar=maxVar-0.1
Browse Database
dBrowse2D(25, 'pfet', '15.0u', 'vsd', 0.3, 0.4, 0.353, 'vns', 0.5, 0.6, 0.577, 'vth')
Variable name=dBrowse2D(gmoverid, type, length, var1, minVar1, maxVar1,inBias1,var2, minVar2, maxVar2,inBias2,‘parameter’)
Valid parameters:gmovergds, gmovergmbs, vth, ft, gmoveridft, idoverw, vod, region, fndbderivcgdovercgg,cddovercgg, cgsovercgg, csbovercgg, cdbovercgg, ron, vdsat, rseff, rdeff
type: nfet, pfetlength: {'120n' '180n' '250n' '350n' '600n' '800n' '1.0u' '2.0u' '3.0u' '4.0u' '5.0u' '6.0u' '7.0u' '8.0u' '9.0u' '10.0u' '15.0u' '20.0u'} (text string)
Iteration• Start with
– length=‘120nm’– gmoverid=20– VDS=VDD/2, VSB=0
• Calculate– vod_1– vth_– vgs_1– vx (gate voltage)– vs (source voltage)– ID– Idoverw– W– RD– Vd– Vds=Vd-Vs
Iteration Example
Design Iterations
Iteration
VS IDS W RD Vds
0 0.1 V 392uA 53.06 um
1.529Kohms
0.207 V
1 0.321 322 uA 45.16 um
1.89 Kohms
0.278 V
2 0.340 340.4 uA
46.86 um
1.762 Kohms
0.259
3 0.335 335 uA 46.44 1.788 Kohms
0.265
Matlab & Simulation
Parameters Matlab Cadence
W 46.56 um 46 um
Vx 0.857 V 0.857 V
ids 336.8 uA 339 uA
gm 6.7 mS 6.80 mS
gm/ids 19.94 20.05
Vs 0.336 V 0.339 V
Vd 0.6 V 0.593 V
Vds 0.263 V 0.257V
Vth 0.5 V 0.497 V
Circuit Design Using Cadence
J.Ou
Start Cadence
Start Cadence
Create New Cellview
Add Instance
Add a Resistor
Add Ground
Add Power
Add Wire
Done!
Start ADE L
Start DC Analysis
Netlist and Run
Annotate DC Node Voltages
Model Library Setup
DC Voltage Annotated
Component Display
Display DC Operating Point
Click on the device to displayvalues!
Save State