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This material is confidential and the property of TOWA CORPORATION Company introduction

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This material is confidential and the property of TOWA CORPORATION

Company introduction

This material is confidential and the property of TOWA CORPORATION 2

Molding ~ Encapsulation Technology ~

660x660mm (Outer Size)

Singulation ~ Cutting technology ~

320x320mm Panel Mold Cut Sample

LED Cut Sample

Large Panel

Wafer Level Mold

Compression Mold

LED

IPM

ECU Module

Transfer Mold

100x300mm

Transfer Mold

100×300mm MAP QFN

100×300mm MAP BGA

P r o d u c t P o r t f o l i o

This material is confidential and the property of TOWA CORPORATION

Established : 1979

First in the world with automated multi plunger molding technology (Semicon USA 1982)

Total number of Employees ww: about 1100

Headquarter Kyoto, Japan

Machine assembly, up to 30 systems per month toolshop capacity up to 200 molds per month

R&D facility, Bandoh Memorial Research Laboratory

TOWA Europe PDC established in 2013

Company profile

4

Former

generation New

generation

1980 1990 2000

Str

uc

ture

P

ac

ka

ge

Tre

nd

A

ss

em

bly

Sty

le

SOP/TSOP

DIP

QFP/TQFP

PBGA

FBGA

CSP

FC BGA

WL CSP

Matrix

Cavity

Map

Cavity Single

Cavity

Matrix

Cavity

Chip stack

Package

stack

2014 - 2016

POP

Single

Cavity

Future

mainstream

Large

Substrate

Through Silicon

Via

High end SIP

Map Unit

Cavity

WL CSP

Large Frame

Package Road Map and TOWA Mold Solutions

This material is confidential and the property of TOWA CORPORATION

o Transfer molding

o Compression molding:

o Strip / Panel or wafer level

o Exposed device molding

o Liquid molding ( LED )

o Top and bottom release film

o Mechatronic design

o Large area molding

5

Driven by technology

660 x 660

18”

Φ450 mm

This material is confidential and the property of TOWA CORPORATION

TOWA Europe PDC (Packaging Development Center )

This material is confidential and the property of TOWA CORPORATION

7

Production and development

Product

development

and low volume

production Product

development

and low volume

production

Mid and high

volume production

This material is confidential and the property of TOWA CORPORATION

o Execution of product development projects in Europe:

o Advise on product design

o TOWA Europe has full capability

o to provide engineering services for system and tool modifications

o part manufacturing locally in Europe by qualified suppliers

o Frequent contacts with material suppliers on their latest

developments

o Close cooperation with suppliers for other needed proces steps

o Cooperation with most of the European research instutes

o Manufacturing of test tools,

o Test and prototyping of products.

o Full equipped test laboratory available.

8

TOWA Europe PDC

This material is confidential and the property of TOWA CORPORATION 9

TOWA PDC Europe

This material is confidential and the property of TOWA CORPORATION 10

Compression Mold Applications

Single Cap type Multi Cap type

LED(Lens or Flat type)

Wafer Level

660 x 660

18”

Φ450 mm