conference call 2015-05-18 wp2 : - news from partners - d2.5 & d2.6

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Conference Call 2015-05- 18 WP2 : - News from partners - D2.5 & D2.6

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Page 1: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

Conference Call 2015-05-18

WP2 : - News from partners- D2.5 & D2.6

Page 2: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

- 2 FZ cSi wafer (PI103) received. To test the RIE process on flat wafer.

at INL, the RIE recipes are under uptdate (new RIE set-up)

? Which RIE processes to be done? SF6/O2/CHF3 and/or SF6/Ar

- The expected photoresist for LIL @405nm is avalaible at INL

comparison between wet-dry etching on FZ wafer and PECVD-Si 4µm (PI64 samples) can go on

News from INL :

Page 3: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

- FZ cSi wafer (LY61) to test the passivation by ALD deposition

comparison between Al2O3 and SiN passivation layer made @INL

? Could we send some wafer @ IMEC for aSi:H passivation ?

News from INL :

- Pseudo-disordered structure done by E-Beam Lithography

2 samples of « small area » to test the new RIE set-up

The next sample would exhibit an area of few mm²

Page 4: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

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D2.5 Experimental non-periodic patterned films

confidential

Description: Report on the characteristics of optically optimized pseudo-periodic/random structures, on areas up to 50 x 50 mm2

[due month 24, delayed]

Update:- Template sent to partners, to be completed asap

- Samples were shipped to TOTAL by IMEC for tests of double texturation (NIL + plasma).

- Updates on epifree (IM94) and epifoil (IM67)(following slides)

Page 5: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

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D2.5: Epifree – Dry-HCL – size=270 nm

confidential

Batch IM94Uniformity and stability ok:“a” etched on different day than “b” and “c”

Page 6: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

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D2.5: Epifree – Wet-HCL – size=630 nm

confidential

Batch IM94- Comparable to Wet-NIL- Good uniformity- Higher R than dry

Page 7: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

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D2.5: Epifoil – Wet-HCL – 510 nm

confidential

Batch IM67On parent substrate:- Good uniformity- 4 min = optimal time for good topography

3 min 4 min5 min

Page 8: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

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D2.5: Epifoil – Wet-HCL – 510 nm

confidential

Batch IM67• On parent substrate: lower R for t= 4 min

• On glass: measurements pending…

Page 9: Conference Call 2015-05-18 WP2 : - News from partners - D2.5 & D2.6

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D2.6 Large-area patterned films

confidential

• IM101 (epifoils, 10 x 10 cm) received at Chalmers:to be patterned by HCL

• Samples to be prepared at IMEC:Epifoils and epifrees (15.6 x 15.6 cm) for NIL

• LPICM: epi-PECVD cSi to be deposited on 15.6 x 15.6 cm?