confidential 3cems dms r&d service introduction dms rd dept. updated date: may, 2012
TRANSCRIPT
ConfidentialConfidential
3C3CEMSEMS DMS DMS R&DR&D Service Service IntroductionIntroduction
DMS RD Dept. Updated Date: May, 2012
Overview
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DMS Team has over 10 years of experience in DMS Team has over 10 years of experience in Industrial PC Field.Industrial PC Field.
We provide industrial grade products and solutions to meet We provide industrial grade products and solutions to meet
the different extreme and tough environmental conditions.the different extreme and tough environmental conditions. We specialize in We specialize in fanlessfanless and wide temperature and wide temperature solutions.solutions. Our heat dissipation Our heat dissipation structure has U.S. patent. structure has U.S. patent. (Patent No. US7,468,555 B2)(Patent No. US7,468,555 B2)
It makes our products It makes our products 100% Fanless.100% Fanless.
Top-grade Top-grade Products DesignProducts Design
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Wide Temperature Design
Layout
Requirements
P.C.B
Requirements
Signal
Measure
System Design
System Test
OthersMaterial
Requirements
Design OverviewDesign Overview
• Components selection• Layout • PCBA Conformal Coating
– Silicone for Anti-vibration, Wide Temp in Vehicle Computer
• Wide Temperature Design • Wide Voltage Design (9-32V)• Water /Dust/ Salt Fog
Resistance(Environmental)– Passed MIL-STD-810G Tests
• Sunlight Readable Solution• Fanless / Cableless Embedded System Design• Anti-shock & Vibration Embedded System
Design
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Wide temperature components selection (-30~+70)
Passive parts Active parts Peripheral Others
Resistor Diode Memory Cable
Inductor Transistor Flash Connector
Capacitor MOSFET HDD/SSD Switch
CPU & ASIC PANEL
Design phase
Material Requirements Quality Improvment
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Ensures all of the components can work in a wide-temp environment
Easy
Easy
Easy
Easy
Easy
Easy
Selection
Selection
Selection Selection
SelectionPOSCAP/TAN Selection
Selection
Wide Temperature DesignWide Temperature Design
High efficient PWM design
Sensitive PLL circuit design
Hi-speed circuit design
Balance performance and power consumption
Talented Engineer
Wide Temperature Design
Quality Improvment
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Design phase
Make PCB phase
Checks all of the impedance to fit requirements
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P.C.B RequirementQuality Improvment
Slice PCB
Anti-Vibration, Removable HDD Design
Anti-Vibration, Anti-Shock System Design
FanlessFanless(Wide Temp.)(Wide Temp.)
Anti-VibrationAnti-Vibration(Rugged/IP)(Rugged/IP)
Anti-vibration & DropAnti-vibration & DropDesignDesign
MIL-SDT-810F C3 MIL-SDT-810F C3 PassPass(Operational (Operational Vibration)Vibration)
Core Technology (Increase Contrast Ratio)
Increase LCD Brightness Normally, the utilization rate from light bar to surface is only 5%
Increase light bar brightness Change materials
Decease the sunlight reflection Add Anti-Reflection and ¼ lambda Films Change materials
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Sunlight Readable
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IR camera: FLIR Thermal CAM SC2000
Hot spots identified as the monitor points in system thermal test
Hot spots are all under
the components thermal specs
IR Thermal Image Scan
To simulate the worst environmental conditions with regard to temperature, humidity, etc.
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Climatic Stressing
Safety pre-test
Dielectric Withstand/Insulation Resistance Test (Hi-Pot test)
Ground Bond Tester limited power sources test Touch current test Steady force test Reflection test Enclosure opening test Accessibility test Impact test Stability test
283CEMS Confidential
To simulate transportation impact to provide system /device within good condition during shipping
Vibration
Shock impact
Handling impact
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Transprotation Simulation
Advanced Process Technology
Surface Mounting Technology Process
Large Scale SMT Capacity
Double Side Component Capability
VAD & RAD Capabilities High Speed & Efficient
Machine
Multiple & Flexible M/C Combination
Circuit Board Fabrication
Material Bar-Coding System
Automated & Manual Insertion
Automated Conformal Coating
Clean & Lead-Free (RoHS) Process
Specific Testing Service tailored for customers
Full System Assembly
Manufacturing Capabilities
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World-Class Production Facilities
State-of-the-ArtTest Equipment
Top-Grade Products+
Manufacturing Capabilities
=Latest ManufacturingTechniques
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DMS Design Capability – ID & ME Embedded Computer / Controller
Mobile DVR
Rugged Fanless Embedded Computer
Digital Signage
Rugged Fanless I/O Controller
Design Design Capability for Rugged, Capability for Rugged, Fanless, Cable less, Industrial Fanless, Cable less, Industrial Embedded I/O Controller & Embedded I/O Controller & Computers. Computers.
DMS Design Capability – ID & MEPanel PC / POS / IPC Monitor
Design capability Design capability for Rugged, for Rugged, Industrial Panel PCIndustrial Panel PC, POS , POS System & IPC MonitorSystem & IPC Monitor
Panel PC Product
Robust Panel PC/POS, Monitor, ARM HCI Mobile handheld for Mission Critical in Military, Medical, Outdoors.
12” - 15” 8” - 10”
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Maritime Panel PC For Offshore, Cruise, Oil drill platform applications.
Use for Sea Map, Navigation Monitors or Bridge Controller display
Applications: River Cruise
Panel Size : 17”
Panel PC Product
External HDD Enclosure External HDD Enclosure
Multimedia Door Phone Door Phone
DMS Design – ID Design
DMS Design Capability – ID & MEPanel PC/POS/IPC Monitor
Strong R&D experiences to fulfill customize needs
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On-going Project – 12” Panel PC On-going Project – 12” Panel PC (ODM)(ODM)
One Stop Service• Design Quality Assurance • Fast and quick response• Testing Labs, Verifications• Tooling Molding benefits• Local supply chain links• One stop manufacturing
Delicate experienced R&D center locate in Taiwan
System Design Capability:SAVE Manpower resources = SAVE COST
Changeable Decoration Front Bezel
Medical Equipment
Direct phone in emergency
With fingerprint module, control board, batteries, motor and mechanical linkage structure
DMS Design – ID & ME Design