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Datasheet

ZDB5304 Z-Wave Development Board

Document No.: DSH12468

Version: 2

Description: This datasheet is for the ZM5304 Z-Wave module based ZDB5304 Z-Wave development board.

Written By: MVITHANAGE;MVO;BBR

Date: 2018-03-08

Reviewed By: OPP;MVO;BBR;PNI

Restrictions: None

Approved by:

Date CET Initials Name Justification

2018-03-08 09:50:21 NTJ Niels Thybo Johansen

This document is the property of Silicon Labs. The data contained herein, in whole or in part, may not be duplicated, used or disclosed outside the recipient for any purpose. This restriction does not limit the recipient's right to use information contained in the data if it is obtained from another source without restriction.

DSH12468-2 ZDB5304 Z-Wave Development Board 2018-03-08

silabs.com | Building a more connected world. Page ii of iii

REVISION RECORD

Doc. Rev

Date By Pages affected Brief description of changes

1D 20131122 MVithanage §3.10,Figure 4.1

Removed blueprint section Removed caption

1C 20131118 MVithanage Table 3.4, Table 3.7, Figure 3.3, §3.9,§4,Figure 4.1

Removed clock divider and added ADC Changed GPIO to UART0 Clarified the viewing angle Tabularized the data Fixed font issue Increased the size of schematic slightly

1B 20131118 MVithanage Table 3.7, §3.7,§3.9

Removed extra numbered item Added a reference to the module datasheet Added a description to the naming convention

1A 20131113 MVithanage §All Initial draft

2 20180306 BBR All Added Silicon Labs template

https://www.silabs.com/


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Table of Contents

1 ABBREVIATIONS ................................................................................................................................. 1

2 INTRODUCTION ................................................................................................................................... 1

2.1 Purpose .............................................................................................................................................. 1 2.2 Audience and prerequisites ................................................................................................................ 1

3 ZDB5304 Z-WAVE DEVELOPMENT BOARD ..................................................................................... 2

3.1 HW Specifications .............................................................................................................................. 2 3.1.1 Application Connector Specification ........................................................................................ 2

3.2 EMC .................................................................................................................................................... 4 3.3 Z-Wave Module Programming ........................................................................................................... 4 3.4 ZM5304 Z-Wave Module Specification .............................................................................................. 4 3.5 RF Specification ................................................................................................................................. 4 3.6 Electrical Specification ....................................................................................................................... 4

3.6.1 Absolute Maximum Ratings ..................................................................................................... 5 3.6.2 DC Characteristics ................................................................................................................... 5

3.7 Physical Specification ......................................................................................................................... 6 3.8 Z-Wave Module Component Placement ............................................................................................ 7 3.9 Module Naming .................................................................................................................................. 7

4 REFERENCES ...................................................................................................................................... 8

Table of FiguresFigure 3.1: ZDB5304 Z-Wave Development Board ..................................................................................... 2 Figure 3.2: ZDB5304 PCB Outline (Top View) ............................................................................................ 6 Figure 3.3: Component Placement (Top View) ........................................................................................... 7

Table of Tables

Table 3.1: J1 Connector Layout .................................................................................................................. 2 Table 3.2: J2 Connector Layout .................................................................................................................. 3 Table 3.3: Application Connector Signal Descriptions ................................................................................ 3 Table 3.4: ZM5304 Z-Wave Module Specification ...................................................................................... 4 Table 3.5: RF Specifications ........................................................................................................................ 4 Table 3.6: Absolute Maximum Ratings ........................................................................................................ 5 Table 3.7: DC Characteristics ...................................................................................................................... 6 Table 3.8: Physical Specifications ............................................................................................................... 6



silabs.com | Building a more connected world. Page 1 of 9

1 ABBREVIATIONS

Abbreviation Explanation

API Application Programming Interface

D Differential

HW Hardware

I Input

NVM Non-Volatile Memory

O Output

PCB Printed Circuit Board

SMA Sub-Miniature A

SW Software

ZDB Z-Wave Development Board

ZDP Z-Wave Development Platform

2 INTRODUCTION

2.1 Purpose

The purpose of this datasheet is to describe the ZDB5304 Z-Wave Development Board containing a ZM5304 Z-Wave Module.

2.2 Audience and prerequisites

OEM customers that are familiar with the ZDP03A Z-Wave Development Platform. [1]




3 ZDB5304 Z-WAVE DEVELOPMENT BOARD

The ZDB5304 Z-Wave Development Board (ZDB) contains a ZM5304 Z-Wave Module and HW Interface protection circuitry. OEM customers, who want to evaluate the ZM5304 Z-Wave Module, can use the ZDB5304. The block diagram of the ZDB5304 is shown in Figure 3.1.

ZM5304

HW Interface Protection

Application Connectors

Figure 3.1: ZDB5304 Z-Wave Development Board

3.1 HW Specifications

3.1.1 Application Connector Specification

The Application Connectors (J1 and J2 in Appendix A) interfacing the ZDB5304 with the ZDP03A are 2x10 2mm pitch pin row connectors. The Application Connector signal names are shown in Table 3.2 and respectively.

Table 3.1: J1 Connector Layout

Pin No. Pin Name Pin Name Pin No.

1 GND GND 2

3 NC NC 4

5 NC NC 6

7 NC NC 8

9 NC NC 10

11 NC NC 12

13 NC NC 14

15 NC NC 16

17 NC NC 18

19 NC NC 20




Table 3.2: J2 Connector Layout

Pin No. Pin Name Pin Name Pin No.

1 NC NC 2

3 NC NC 4

5 NC NC 6

7 NC NC 8

9 USB_DM NC 10

11 USB_DP NC 12

13 GND NC 14

15 RESET_N UART0 TX 16

17 +3.3V UART0 RX 18

19 NC NC 20

Table 3.3: Application Connector Signal Descriptions

Name Pin# I/O Description

+3.3V J2-17 Power Module 3.3V supply input voltage.

GND J1-1, J1-2, J2-13

Power Ground signal

RESET_N J2-15 I Reset: Active low reset with integrated Power-On-Reset and Brown-out detection circuitry.

UART0 RX J2-18 I UART Receive Data: Supports up to 230.4kbps.

UART0 TX J2-16 O UART Transmit Data: Supports up to 230.4kbps.

USB_DP J2-11 D USB 2.0 full-speed positive differential signal.

USB_DM J2-9 D USB 2.0 full-speed negative differential signal.

NC J1-3, J1-4, J1-5, J1-6, J1-7, J1-8, J1-9, J1-10, J1-11, J1-12, J1-13, J1-14, J1-15, J1-16, J1-17, J1-18, J1-19, J1-20, J2-1, J2-2, J2-3, J2-4, J2-5, J2-6, J2-7, J2-8, J2-10, J2-12, J2-14, J2-19, J2-20

- Electrically not connected.

The UART0 signals in Table 3.3 are connected through a 1kohm resistor to the corresponding signals on the ZM5304 Z-Wave Module (U1 in Appendix A). A detailed description of these signals is given in the ZM5304 Z-Wave Module datasheet [2].




3.2 EMC

As default, a 1000R@100MHz Ferrite Bead is mounted between the Application Connector +3.3V and module +3.3V (L1 in Appendix A) to reduce noise from the Application Circuitry.

3.3 Z-Wave Module Programming

The ZDB5304 is programmed using the UART0 interface and the RESET_N signal or USB interface. For programming instructions and recommended programming tool(s) see [3].

3.4 ZM5304 Z-Wave Module Specification

Table 3.4: ZM5304 Z-Wave Module Specification

Item Description

MCU Type Optimized 8-bit 8051 MCU core.

MCU speed 32 MHz

Flash 128kByte Programmed through UART0 or USB interface.

SRAM 16kByte

SRAM (CPU) 256Byte

MCU Peripherals UART0, USB, Watch Dog Timer, Power-on Reset/Brown-Out Detector, ADC

Crystal System Clock: 32 MHz, 25ppm for -10C to +85C after 5 years.

3.5 RF Specification

Table 3.5: RF Specifications

RF Parameter1

Description

RF Data Rate 9.6 kbps

40 kbps

100 kbps

Typical RF receiver sensitivity -103dBm @ 9.6 kbps

-99dBm @ 40 kbps

-93dBm @ 100 kbps

Typical RF Output Power -26dBm to +4dBm

Typical Range Indoor > 40 meters line of sight, in unobstructed environment

Outdoor > 100 meters line of sight

RF regulatory ACMA Compliance

CE Compliance

FCC Compliance

IC Compliance

MIC Compliance

1. Test Conditions: ZDB5304 on ZDP03A Z-Wave Development Platform.

3.6 Electrical Specification

The “Absolute Maximum Ratings” specifies the conditions in which the ZDB5304 is guaranteed not to be damaged, but correct operations are not guaranteed. Exceeding the “Absolute Maximum Ratings” may destroy the ZDB5304. See “DC Characteristics” for guaranteed operation limits.




3.6.1 Absolute Maximum Ratings

Table 3.6: Absolute Maximum Ratings

Electrical Value

Operating Temperature -10C to +85C

Main Supply Voltage -0.3V to +3.6V

Minimum Voltage Applied On Any I/O -0.3V

Maximum Voltage Applied On Any I/O +3.6V

3.6.2 DC Characteristics

The following DC characteristics are for the ZDB5304 at an Ambient Temperature = 25C and Supply Voltage = 3.3V (unless otherwise noted).




Table 3.7: DC Characteristics

Symbol Parameter Condition Min Typ Max Units

+3.3V Main Supply voltage

2.3 3.3 3.6 V

RAC Application Connector Serial Resistor

UART0 signals 0.9 1.0 1.1 k

IC(1)

Continuous Output Current

Single UART0 pin -8.0 +8.0 mA

ICTOT(1)

Total continuous output source/sink current

Both UART0 pins -16.0 +16.0 mA

ICC Transmitting(2)

RFPOW Setting: 01

RFPOW Setting: 63

27.7

42.7

mA

Receiving(3)

32.7 mA

Power Down(4) 1.7 A

TOP Operating Temperature

-10.0 +85.0 C

(1) (2) (3) (4)

If serial 1K ohm resistor is replaced with 0 ohm resistor. The transceiver is in transmit mode with the MCU running. The transceiver is in receive mode with the MCU running. The transceiver, MCU and flash are shut down. The chip can be woken by brownout or an external reset pulse. POR cannot be disabled.

3.7 Physical Specification

Table 3.8: Physical Specifications

Physical Description

Dimension (H x W x D) 8 mm x 50 mm x 40 mm

Figure 3.2: ZDB5304 PCB Outline (Top View)




The Application Connector is a standard 2mm pitch 2x10 pin-row. The pin hole is a Ø0.8mm plated hole. When developing with the ZDB5304, any metallic objects should be placed away from the helical antenna. Refer to [2] for more information.

3.8 Z-Wave Module Component Placement

(a) ZDB5304 (b) ZM5304

Figure 3.3: Component Placement (Top View)

The ZM5304 Z-Wave Module footprint on the ZDB5304 contains 48 pads as shown in Figure 3.3b. The signals used for interconnection between ZDB5304 and ZM5304 Z-Wave Module are shown in the schematic in Appendix A.

3.9 Module Naming

The following naming convention is used by Silicon Labs:

Z-Wave Module Z-Wave Development Board

ZMGVSS

ZM – Z-Wave Module

G – Z-Wave Generation

V – Module Variant

SS – Size in cm2

e.g.: ZM5304

ZDBGVSS

ZDB – Z-Wave Development Board

Mounted Module:

G – Z-Wave Generation

V – Module Variant

SS – Size in cm2

e.g.: ZDB5304




4 REFERENCES

[1] DSH11243, Datasheet, “ZDP03A, Z-Wave Development Platform” [2] DSH12461, Datasheet, “ZM5304” [3] INS11681, Instruction, “500 Series Z-Wave Chip Programming Mode” [4] BOM12402, Bill of Material, ZDB5304 EU, BOM-370101680 [5] BOM12476, Bill of Material, ZDB5304 US, BOM-370101870 [6] BOM12477, Bill of Material, ZDB5304 HK, BOM-370101880




APPENDIX A SCHEMATIC


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DisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.

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